MC100EL91 D

MC100EL91
5 V Triple PECL Input to
-5 V ECL Output Translator
Description
The MC100EL91 is a triple PECL input to ECL output translator.
The device receives standard voltage differential PECL signals,
determined by the VCC supply level, and translates them to differential
−5 V ECL output signals. (For translation of LVPECL to −3.3 V ECL
output, see MC100LVEL91.)
To accomplish the level translation, the EL91 requires three power
rails. The VCC supply should be connected to the positive supply, and
the VEE pin should be connected to the negative power supply. The
GND pins are connected to the system ground plane. Both VEE and
VCC should be bypassed to ground via 0.01 mF capacitors.
Under open input conditions, the D input will be biased at VCC/2
and the D input will be pulled to GND. This condition will force the Q
output to a low, ensuring stability.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
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SO−20 WB
DW SUFFIX
CASE 751D
MARKING DIAGRAM*
20
100EL91
AWLYYWWG
Features
•
•
•
•
•
•
•
•
•
•
•
670 ps Typical Propagation Delay
ESD Protection: >2 kV Human Body Model
The 100 Series Contains Temperature Compensation
Operating Range:VCC = 4.75 V to 5.5 V;
VEE = −4.2 V to −5.5 V; GND = 0 V
Internal Input Pulldown Resistors
Q Output will Default LOW with Inputs Open or at GND
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Pb = Level 1
Pb−Free = Level 3
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 282 devices
Pb−Free Package is Available*
1
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 7
1
Publication Order Number:
MC100EL91/D
MC100EL91
VCC
Q0
Q0
GND
Q1
Q1 GND
20
19
18
17
16
15
ECL
1
2
3
VCC
D0
D0
4
5
6
PECL VBB
PECL
PECL
D1
D1
Q2
VCC
13
12
11
14
Table 1. PIN DESCRIPTION
ECL
PIN
FUNCTION
PECL
Dn, Dn
Qn, Qn
PECL VBB
VCC
VEE
GND
PECL Inputs
ECL Outputs
PECL Reference Voltage Output
Positive Supply
Negative Supply
Ground
7
8
9
10
PECL VBB
ECL
Q2
D2
D2
VEE
**All VCC pins are tied together on the die.
Warning: All VCC, VEE, and GND pins must be externally
connected to Power Supply to guarantee proper operation.
Figure 1. 20−Lead Pinout (Top View) and Logic Diagram
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Power Supply
GND = 0 V
8 to 0
V
VEE
NECL Power Supply
GND = 0 V
−8 to 0
V
VI
PECL Input Voltage
GND = 0 V
6 to 0
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
PECL VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−20 WB
SOIC−20 WB
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−20 WB
30 to 35
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Pb
Pb−Free
VI VCC
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
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2
MC100EL91
Table 3. PECL INPUT DC CHARACTERISTICS VCC= 5.0 V; VEE= −5.0 V; GND= 0 V (Note 1)
−40°C
Symbol
Min
Characteristic
Typ
25°C
Max
Min
85°C
Typ
Max
6
11
Typ
Max
Unit
11
mA
ICC
VCC Power Supply Current
VIH
Input HIGH Voltage (Single−Ended)
3835
4120
3835
4120
3835
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3190
3525
3190
3525
3190
3525
mV
PECL VBB
Output Voltage Reference
3.62
3.74
3.62
3.74
3.62
3.74
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 2)
VPP < 500 mV
VPP y 500 mV
IIH
Input HIGH Current
IIL
Input LOW Current
11
Min
V
1.3
1.5
4.8
4.8
1.2
1.4
4.8
4.8
150
0.5
1.2
1.4
4.8
4.8
150
0.5
150
0.5
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
1. Input parameters vary 1:1 with VCC. VCC = +4.75 V to +5.2 V, VEE = −4.20 V to −5.5 V.
2. VIHCMR min varies 1:1 with GND. VIHCMR max varies 1:1 with VCC.
Table 4. NECL OUTPUT DC CHARACTERISTICS VCC= 5.0 V to 5.0 V; VEE= −5.0 V; GND= 0 V (Note 3)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
28
85°C
Typ
Max
22
28
Min
Typ
Max
Unit
30
mA
IEE
VEE Power Supply Current
VOH
Output HIGH Voltage (Note 4)
−1085
−1005
−880
−1025
−955
−880
−1025
−955
−880
mV
VOL
Output LOW Voltage (Note 4)
−1830
−1695
−1555
−1810
−1705
−1620
−1810
−1705
−1620
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Output parameters vary 1:1 with GND. VCC = +4.75 V to +5.2 V, VEE = −4.20 V to −5.5 V.
4. Outputs are terminated through a 50 W resistor to GND − 2.0 V
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MC100EL91
Table 5. AC CHARACTERISTICS VCC= 5.0 V; VEE= −5.0 V; GND= 0 V (Note 8).
−40°C
Min
Characteristic
Symbol
fmax
Maximum Toggle Frequency
tPLH
tPHL
Propagation Delay D to Q
tSKEW
Skew
Differential
Single−Ended.
Typ
25°C
Max
Min
700
540
490
Output−to−Output (Note 5)
Part−to−Part (Differential) (Note 5)
Duty Cycle (Differential) (Note 6)
Random Clock Jitter @ 700 MHz
VPP
Input Swing (Note 7)
200
tr
tf
Output Rise/Fall Times Q
(20% − 80%)
270
85°C
Max
Min
700
640
640
740
790
40
100
200
25
tJITTER
Typ
570
520
1.2
770
820
40
100
200
610
560
400
200
530
270
400
810
860
40
100
200
1.2
1000
200
530
270
400
Unit
MHz
710
710
25
1.2
1000
Max
700
670
670
25
Typ
ps
ps
pS(RMS)
1000
mV
530
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Skews are valid across specified voltage range, part−to−part skew is for a given temperature.
6. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.
7. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈40.
8. VCC = +4.75 V to +5.2 V, VEE = −4.20 V to −5.5 V. Outputs are terminated through a 50 W resistor to GND − 2.0 V.
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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4
MC100EL91
ORDERING INFORMATION
Package
Shipping†
MC100EL91DW
SO−20 WB
38 Units / Rail
MC100EL91DWG
SO−20 WB
(Pb−Free)
38 Units / Rail
MC100EL91DWR2
SO−20 WB
1000 / Tape & Reel
MC100EL91DWR2G
SO−20 WB
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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MC100EL91
PACKAGE DIMENSIONS
SO−20 WB
DW SUFFIX
CASE 751D−05
ISSUE G
A
20
q
X 45 _
E
h
H
M
10X
0.25
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
1
10
20X
B
B
0.25
M
T A
S
B
S
L
A
18X
e
A1
SEATING
PLANE
C
T
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
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MC100EL91/D