MC34164 D

MC34164, MC33164,
NCV33164
Micropower Undervoltage
Sensing Circuits
The MC34164 series are undervoltage sensing circuits specifically
designed for use as reset controllers in portable microprocessor based
systems where extended battery life is required. These devices offer
the designer an economical solution for low voltage detection with a
single external resistor. The MC34164 series features a bandgap
reference, a comparator with precise thresholds and built−in hysteresis
to prevent erratic reset operation, an open collector reset output
capable of sinking in excess of 6.0 mA, and guaranteed operation
down to 1.0 V input with extremely low standby current. The MC
devices are packaged in 3−pin TO−92 (TO−226AA), micro size
TSOP−5, 8−pin SOIC−8 and Micro8™ surface mount packages. The
NCV device is packaged in SOIC−8.
Applications include direct monitoring of the 3.0 V or 5.0 V
MPU/logic power supply used in appliance, automotive, consumer,
and industrial equipment.
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1
12
3
STRAIGHT LEAD
BULK PACK
•
•
Temperature Compensated Reference
Monitors 3.0 V (MC34164−3) or 5.0 V (MC34164−5) Power Supplies
Precise Comparator Thresholds Guaranteed Over Temperature
Comparator Hysteresis Prevents Erratic Reset
Reset Output Capable of Sinking in Excess of 6.0 mA
Internal Clamp Diode for Discharging Delay Capacitor
Guaranteed Reset Operation With 1.0 V Input
Extremely Low Standby Current: As Low as 9.0 A
Economical TO−92 (TO−226AA), TSOP−5, SOIC−8 and Micro8
Surface Mount Packages
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Pb−Free Packages are Available
Input
5
8
1
TSOP−5
SN SUFFIX
CASE 483
8
1
SOIC−8
D SUFFIX
CASE 751
1
Micro8
DM SUFFIX
CASE 846A
PIN CONNECTIONS
Reset 1
8 N.C.
Input 2
7 N.C.
N.C. 3
6 N.C.
Ground 4
5 N.C.
(Top View)
TSOP−5
Pin 1.
2.
3.
4.
5.
Reset
3
BENT LEAD
TAPE & REEL
AMMO PACK
TO−92 (TO−226AA)
P SUFFIX
CASE 29
Features
•
•
•
•
•
•
•
•
•
2
Ground
Input
Reset
NC
NC
TO−92
Pin 1. Reset
2. Input
3. Ground
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
1.2 Vref
= Sink Only
Positive True Logic
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
GND
Figure 1. Representative Block Diagram
This device contains 28 active transistors.
© Semiconductor Components Industries, LLC, 2009
April, 2009 − Rev. 18
1
Publication Order Number:
MC34164/D
MC34164, MC33164, NCV33164
MAXIMUM RATINGS
Symbol
Value
Unit
Power Input Supply Voltage
Rating
Vin
−1.0 to 12
V
Reset Output Voltage
VO
−1.0 to 12
V
Reset Output Sink Current
ISink
Internally
Limited
mA
IF
100
mA
PD
RJA
700
178
mW
°C/W
PD
RJA
700
178
mW
°C/W
PD
RJA
520
240
mW
°C/W
Operating Junction Temperature
TJ
+150
°C
Operating Ambient Temperature Range
MC34164 Series
MC33164 Series, NCV33164
TA
Storage Temperature Range
Tstg
Clamp Diode Forward Current, Reset to Input Pin (Note 1)
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
°C
0 to +70
− 40 to +125
− 65 to +150
ESD
°C
V
4000
200
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
MC34164−3, MC33164−3 SERIES, NCV33164−3
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 2 & 3], unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
VIH
VIL
VH
2.55
2.55
0.03
2.71
2.65
0.06
2.80
2.80
−
−
−
0.14
0.1
0.4
0.3
6.0
12
30
−
−
0.02
0.02
0.5
1.0
VF
0.6
0.9
1.2
Operating Input Voltage Range
Vin
1.0 to 10
−
−
Quiescent Input Current
Vin = 3.0 V
Vin = 6.0 V
Iin
Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
V
RESET OUTPUT
VOL
Output Sink Saturation
(Vin = 2.4 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
Output Sink Current (Vin, Reset = 2.4 V)
ISink
IR(leak)
Output Off−State Leakage
(Vin, Reset = 3.0 V)
(Vin, Reset = 10 V)
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA)
V
mA
A
V
TOTAL DEVICE
−
−
9.0
24
15
40
1. Maximum package power dissipation limits must be observed.
2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Thigh = +70°C for MC34164
3. Tlow = 0°C for MC34164
= − 40°C for MC33164, NCV33164
= +125°C for MC33164, NCV33164
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2
V
A
MC34164, MC33164, NCV33164
MC34164−5, MC33164−5 SERIES, NCV33164−5
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 5 & 6], unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
VIH
VIL
VH
4.15
4.15
0.02
4.33
4.27
0.09
4.45
4.45
−
−
−
0.14
0.1
0.4
0.3
7.0
20
50
−
−
0.02
0.02
0.5
2.0
VF
0.6
0.9
1.2
V
Operating Input Voltage Range
Vin
1.0 to 10
−
−
V
Quiescent Input Current
Vin = 5.0 V
Vin = 10 V
Iin
−
−
12
32
20
50
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
V
RESET OUTPUT
VOL
Output Sink Saturation
(Vin = 4.0 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
Output Sink Current (Vin, Reset = 4.0 V)
ISink
IR(leak)
Output Off−State Leakage
(Vin, Reset = 5.0 V)
(Vin, Reset = 10 V)
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA)
V
mA
A
TOTAL DEVICE
A
4. Maximum package power dissipation limits must be observed.
5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Thigh = +70°C for MC34164
6. Tlow = 0°C for MC34164
= − 40°C for MC33164, NCV33164
= +125°C for MC33164, NCV33164
7. NCV prefix is for automotive and other applications requiring site and change control.
10
RL = 82 k to Vin
TA = 25°C
8.0
VO , OUTPUT VOLTAGE (V)
VO , OUTPUT VOLTAGE (V)
10
6.0
4.0
2.0
RL = 82 k to Vin
TA = 25°C
8.0
6.0
4.0
2.0
0
0
0
2.0
4.0
6.0
8.0
10
0
2.0
4.0
6.0
8.0
Vin, INPUT VOLTAGE (V)
Vin, INPUT VOLTAGE (V)
Figure 2. MC3X164−3 Reset Output
Voltage versus Input Voltage
Figure 3. MC3X164−5 Reset Output
Voltage versus Input Voltage
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3
10
5.0
5.0
4.0
4.0
V O , OUTPUT VOLTAGE (V)
V O , OUTPUT VOLTAGE (V)
MC34164, MC33164, NCV33164
3.0
2.0
1.0
3.0
2.0
1.0
RL = 82 k to Vin
TA = 25°C
RL = 82 k to Vin
TA = 25°C
0
2.62
2.66
2.70
2.74
0
4.22
2.78
4.26
Vin, INPUT VOLTAGE (V)
4.36
Upper Threshold
High State Output
V in , THRESHOLD VOLTAGE (V)
V in , THRESHOLD VOLTAGE (V)
4.38
Figure 5. MC3X164−5 Reset Output
Voltage versus Input Voltage
2.76
2.72
2.68
2.64
Lower Threshold
Low State Output
2.60
-50
-25
0
25
50
75
100
Upper Threshold
High State Output
4.32
4.28
4.24
Lower Threshold
Low State Output
4.20
-50
125
-25
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 6. MC3X164−3 Comparator Threshold
Voltage versus Temperature
Figure 7. MC3X164−5 Comparator Threshold
Voltage versus Temperature
50
50
TA = 25°C
40
I in, INPUT CURRENT ( μA)
I in, INPUT CURRENT ( μA)
4.34
Vin, INPUT VOLTAGE (V)
Figure 4. MC3X164−3 Reset Output
Voltage versus Input Voltage
30
TA = 0°C
20
TA = 70°C
10
0
4.30
0
2.0
4.0
6.0
8.0
40
20
TA = 0°C
TA = 70°C
10
0
10
TA = 25°C
30
0
2.0
4.0
6.0
8.0
Vin, INPUT VOLTAGE (V)
Vin, INPUT VOLTAGE (V)
Figure 8. MC3X164−3 Input Current
versus Input Voltage
Figure 9. MC3X164−5 Input Current
versus Input Voltage
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4
10
MC34164, MC33164, NCV33164
4.0
Vin = 2.4 V
3.0
V OL, OUTPUT SATURATION (V)
V OL, OUTPUT SATURATION (V)
4.0
TA = 70°C
TA = 25°C
2.0
TA = 0°C
TA = 25°C
TA = 0°C
1.0
TA = 70°C
0
TA = 25°C
Vin, Reset = 4 V
TA = 70°C
TA = 0°C
3.0
TA = 25°C
2.0
TA = 0°C
1.0
TA = 70°C
0
0
4.0
8.0
12
20
16
0
4.0
8.0
12
16
VSink, SINK CURRENT (mA)
ISink, SINK CURRENT (mA)
Figure 10. MC3X164−3 Reset Output
Saturation versus Sink Current
Figure 11. MC3X164−5 Reset Output
Saturation versus Sink Current
I F , FORWARD CURRENT (mA)
32
Vin = 5.0 V to 4.0 V
RL = 43 k
TA = 25°C
Reset
Vin = 0 V
TA = 25°C
24
90%
Vin
5.0 V
16
4.0 V
Vin
8.0
10
%
43k
5.0V
4.0V
Reset
Ref
0
0
0.4
0.8
1.2
5.0 s/DIV
1.6
VF , FORWARD VOLTAGE (V)
Figure 12. Clamp Diode Forward Current
versus Voltage
Figure 13. Reset Delay Time
(MC3X164−5 Shown)
R
Input
Power
Supply
Reset
Microprocessor
Circuit
Reset
CDLY
1.2 Vref
tDLY = RCDLY In
GND
ǒ
1−
1
Vth(MPU)
Vin
A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power
supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. Vth(MPU) is
the microprocessor reset input threshold.
Figure 14. Low Voltage Microprocessor Reset
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5
Ǔ
20
MC34164, MC33164, NCV33164
Test Data
RH
Iin
Vin
RL
Power
Supply
Microprocessor
Circuit
Reset
1.2 Vref
MC3X164-5
VH ≈
4.3 RH
+ 0.06
RL
Vth(lower) ≈ 10 RH x 10-6
GND
where: RH ≤ 1.0 k
43 k ≥ RL ≥ 4.3 k
VH
(mV)
Vth
(mV)
RH
()
RL
(k)
60
103
123
160
155
199
280
262
306
357
421
530
0
1.0
1.0
1.0
2.2
2.2
2.2
4.7
4.7
4.7
4.7
4.7
0
100
100
100
220
220
220
470
470
470
470
470
43
10
6.8
4.3
10
6.8
4.3
10
8.2
6.8
5.6
4.3
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current
Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 10 A at 4.3 V. The
equations are accurate to ±10% with RH less than 1.0 k and RL between 4.3 k and 43 k.
Figure 15. Low Voltage Microprocessor Reset With Additional Hysteresis
(MC3X164−5 Shown)
Input
1.0 k
Input
Power
Supply
Reset
Reset
Solar
Cells
1.2 Vref
1.2 Vref
GND
GND
Figure 16. Voltage Monitor
Figure 17. Solar Powered Battery Charger
VCC
RL
MTP3055EL
270
4.3V
Input
Reset
Overheating of the logic level power MOSFET due to insufficient
gate voltage can be prevented with the above circuit. When the
input signal is below the 4.3 V threshold of the MC3X164-5, its
output grounds the gate of the L2 MOSFET.
1.2 Vref
GND MC3X164-5
Figure 18. MOSFET Low Voltage Gate Drive Protection Using the MC3X164−5
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6
MC34164, MC33164, NCV33164
ORDERING INFORMATION
Package
Shipping†
MC33164D−3G
SOIC−8
(Pb−Free)
98 Units / Rail
MC33164D−3R2G
SOIC−8
(Pb−Free)
NCV33164D−3R2*
SOIC−8
Device
NCV33164D−3R2G*
2500 Units / Tape & Reel
SOIC−8
(Pb−Free)
MC33164DM−3R2
Micro8
4000 Units / Tape & Reel
MC33164DM−3R2G
Micro8
(Pb−Free)
MC33164P−3G
TO−92
(Pb−Free)
2000 Units / Box
MC33164P−3RAG
TO−92
(Pb−Free)
2000 Units / Tape & Reel
MC33164P−3RPG
TO−92
(Pb−Free)
2000 Units / Pack
MC33164D−5G
SOIC−8
(Pb−Free)
98 Units / Rail
MC33164D−5R2
SOIC−8
MC33164D−5R2G
SOIC−8
(Pb−Free)
NCV33164D−5R2G*
SOIC−8
(Pb−Free)
MC33164DM−5R2G
Micro8
(Pb−Free)
4000 Units / Tape & Reel
MC33164P−5G
TO−92
(Pb−Free)
2000 Units / Box
MC33164P−5RAG
TO−92
(Pb−Free)
2000 Units / Tape & Reel
MC33164P−5RPG
TO−92
(Pb−Free)
2000 Units / Pack
MC34164D−3G
SOIC−8
(Pb−Free)
98 Units / Rail
MC34164D−3R2G
SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
MC34164DM−3R2G
Micro8
(Pb−Free)
4000 Units / Tape & Reel
MC34164P−3G
TO−92
(Pb−Free)
2000 Units / Box
MC34164P−3RPG
TO−92
(Pb−Free)
2000 Units / Pack
MC34164D−5G
SOIC−8
(Pb−Free)
98 Units / Rail
MC34164D−5R2G
SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
MC34164DM−5R2G
Micro8
(Pb−Free)
4000 Units / Tape & Reel
MC34164SN−5T1G
TSOP−5
(Pb−Free)
3000 Units / Tape & Reel
MC34164P−5G
TO−92
(Pb−Free)
2000 Units / Box
MC34164P−5RAG
TO−92
(Pb−Free)
2000 Units / Tape & Reel
MC34164P−5RPG
TO−92
(Pb−Free)
2000 Units / Pack
2500 Units / Tape & Reel
*NCV33164: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring
site and change control.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MC34164, MC33164, NCV33164
PIN CONNECTIONS AND MARKING DIAGRAMS
TSOP−5
SN SUFFIX
CASE 483
SOIC−8
D SUFFIX
CASE 751
8
5
SRCAYWG
G
1
1
Micro8
MC33164DM
CASE 846A
8
Micro8
MC34164DM
CASE 846A
8
MIy0
AYWG
G
3x164
ALYWy
G
1
SRC
x
y
A
L
Y
W, WW
G
MCy0
AYWG
G
TO−92
MC3x164P−yRA
MC3x164P−yRP
MC3x164P−y
CASE 29
MC3x1
64P−y
YWW
1
= Device Code
= Device Number 3 or 4
= Suffix Number 3 or 5
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free
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8
123
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
TO−92 (TO−226AA)
P SUFFIX
CASE 29−11
ISSUE AM
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
SEATING
PLANE
K
D
X X
G
J
H
V
C
SECTION X−X
N
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
--0.250
--0.080
0.105
--0.100
0.115
--0.135
---
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
--6.35
--2.04
2.66
--2.54
2.93
--3.43
---
N
A
R
BENT LEAD
TAPE & REEL
AMMO PACK
B
P
T
SEATING
PLANE
G
K
D
X X
J
V
1
C
N
SECTION X−X
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9
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
J
K
N
P
R
V
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.40
0.54
2.40
2.80
0.39
0.50
12.70
--2.04
2.66
1.50
4.00
2.93
--3.43
---
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
CASE 483−02
ISSUE H
D 5X
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
M
5
1
4
2
L
3
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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10
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
CASE 751−07
ISSUE AJ
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE H
D
HE
PIN 1 ID
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
E
e
b 8 PL
0.08 (0.003)
T B
M
S
A
S
SEATING
−T− PLANE
0.038 (0.0015)
A
A1
MILLIMETERS
NOM
MAX
−−
1.10
0.08
0.15
0.33
0.40
0.18
0.23
3.00
3.10
3.00
3.10
0.65 BSC
0.40
0.55
0.70
4.75
4.90
5.05
DIM
A
A1
b
c
D
E
e
L
HE
MIN
−−
0.05
0.25
0.13
2.90
2.90
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.016
0.021
0.187
0.193
MIN
−−
0.002
0.010
0.005
0.114
0.114
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
L
c
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
8X
3.20
0.126
6X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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12
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MC34164/D