CAT3200 D

CAT3200, CAT3200-5
Low Noise Regulated
Charge Pump DC-DC
Converter
Description
The CAT3200 and CAT3200−5 are switched capacitor boost
converters that deliver a low noise, regulated output voltage. The
CAT3200−5 gives a fixed regulated 5 V output. The CAT3200 has
an adjustable output using external resistors. The constant
frequency 2 MHz charge pump allows small 1 mF ceramic capacitors
to be used.
Maximum output loads of up to 100 mA can be supported over a
wide range of input supply voltages (2.7 V to 4.5 V) making the device
ideal for battery−powered applications.
A shutdown control input allows the device to be placed in
power−down mode, reducing the supply current to less than 1 mA.
In the event of short circuit or overload conditions, the device is
fully protected by both foldback current limiting and thermal overload
detection. In addition, a soft start, slew rate control circuit limits inrush
current during power−up.
The CAT3200−5 is available in a 6−lead, 1 mm max thin SOT23
package. The CAT3200 is available in an 8−lead MSOP package.
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1
1
MSOP−8
Z SUFFIX
CASE 846AD
PIN CONFIGURATIONS
CAT3200
MSOP
1
CPOS
IN
CNEG
PGND
Features
•
•
•
•
•
•
•
•
•
•
OUT
FB
SHDN
SGND
CAT3200−5
SOT23
1
• Constant High Frequency (2 MHz) Operation
• 100 mA Output Current
• Regulated Output Voltage (5 V Fixed CAT3200−5, Adjustable
CAT3200)
Low Quiescent Current (1.7 mA Typ.)
Input Voltage Operation down to 2.7 V
Soft Start, Slew Rate Control
Thermal Overload Shutdown Protection
Low Value External Capacitors (1 mF)
Foldback Current Overload Protection
Shutdown Current less than 1 mA
CAT3200−5 in Low Profile (1 mm Thin) 6−lead TSOT−23 Package
CAT3200 in MSOP−8 Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
TSOT−23
TD SUFFIX
CASE 419AF
OUT
CPOS
GND
IN
CNEG
SHDN
(Top Views)
ORDERING INFORMATION
Device
CAT3200TDI−GT3
CAT3200ZI−GT3
Package
Shipping
TSOT23−6*
(Pb−Free)
3,000 / Tape &
Reel
MSOP−8*
(Pb−Free)
3,000 / Tape &
Reel
* NiPdAu lead finish
Applications
•
•
•
•
•
•
3 V to 5 V Boost Conversion
White LED Driver
USB On−The−Go 5 V Supply
Local 5 V Supply from Lower Rail
Battery Backup Systems
Handheld Portable Devices
© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 16
1
Publication Order Number:
CAT3200/D
CAT3200, CAT3200−5
MARKING DIAGRAMS
ABRU
YMR
ABRU = CAT3200ZI-GT3
VA = CAT3200TDI-GT3
Y = Production Year (Last Digit)
M = Production Month (1-9, O, N, D)
R = Production Revision
VAYM
Typical Application
1 mF
1 mF
CNEG
IN
VIN
CPOS
OUT
CAT3200−5
ON OFF
+
3.3 V
−
5V
1 mF
VOUT
CAT3200
ON
+
GND
CPOS
OUT
100 mA
100 mA
SHDN
1 mF
CNEG
IN
VIN
VOUT
3.3 V
−
OFF
1 mF
VOUT = 5 V
IOUT ≤ 50 mA, for VIN ≥ 2.8 V
IOUT ≤ 90 mA, for VIN ≥ 3 V
R1
FB
SHDN
GND
V OUT + 1.27 V
Figure 1. Typical Application − 5 V Output
R2
1 mF
ǒ
Ǔ
R
1) 1
R2
Figure 2. Typical Application − Adjustable Output
Table 1. PIN DESCRIPTIONS
Designation
Description
OUT
Regulated output voltage.
GND
Ground reference for all voltages.
SHDN
Shutdown control logic input (Active LOW)
CNEG
Negative connection for the flying capacitor.
IN
CPOS
FB
Input power supply.
Positive connection for the flying capacitor.
Feedback to set the output voltage.
PGND
Power ground.
SGND
Signal ground.
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameters
VIN, VOUT, SHDN, CNEG, CPOS Voltage
VOUT Short Circuit Duration
Ratings
Units
−0.6 to +6.0
V
Indefinite
Output Current
200
mA
ESD Protection (HBM)
2000
V
Junction Temperature
150
°C
−65 to +160
°C
Lead Soldering Temperature (10 sec)
300
°C
Power Dissipation (SOT23−6)
0.3
W
Power Dissipation (8−MSOP)
0.5
W
Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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CAT3200, CAT3200−5
Table 3. RECOMMENDED OPERATING CONDITIONS
Parameters
VIN
Ratings
Units
2.7 to 4.5
V
1
mF
0 to 100
mA
−40 to +85
°C
CIN, COUT, CFLY
ILOAD
Ambient Temperature Range
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 4. ELECTRICAL SPECIFICATIONS
(Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1 mF ceramic capacitors and VIN is set to 3.6 V.)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
4.8
5.0
5.2
V
VOUT
Regulated Output
ILOAD ≤ 40 mA, VIN ≥ 2.7 V
ILOAD ≤ 100 mA, VIN ≥ 3.1 V
VLINE
Line Regulation
3.1 V ≤ VIN ≤ 4.5 V, ILOAD = 50 mA
VLOAD
Load Regulation
ILOAD = 10 mA to 100 mA, VIN = 3.6 V
FOSC
Switching Frequency
VR
Output Ripple Voltage
ILOAD = 100 mA
CAT3200−5 Only
30
mVp−p
Efficiency
ILOAD = 50 mA, VIN = 3 V, CAT3200−5
80
%
IGND
Ground Current
ILOAD = 0 mA, SHDN = VIN
1.6
ISHDN
Shutdown Input Current
ILOAD = 0 mA, SHDN = 0 V
VFB
FB Voltage
CAT3200 Only
1.22
IFB
FB Input Current
CAT3200 Only
−50
ROL
Open−Loop Resistance
ILOAD = 100 mA, VIN = 3 V (Note 1)
10
W
TON
VOUT Turn−on time (10% to 90%)
ILOAD = 0 mA, VIN = 3 V
0.5
ms
VIHSHDN
High Detect Shutdown Threshold
VILSHDN
Low Detect Shutdown Threshold
h
IROUT
6
mV
20
1.3
2.0
1.27
0.8
mV
2.6
MHz
4
mA
1
mA
1.32
V
50
nA
1.3
0.4
V
V
30
mA
Reverse Leakage into OUT pin
VOUT = 5 V, Shutdown mode (Note 2)
15
ISC
Short−circuit Output
VOUT = 0 V
80
mA
TSD
Thermal Shutdown
160
°C
THYST
Thermal Hysteresis
20
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. ROL = (2VIN − VOUT)/IOUT
2. In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor feedback
network. This will cause a small level of reverse current to flow back into the device to ground.
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CAT3200, CAT3200−5
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200−5)
(TAMB = 25°C, CIN = COUT = CFLY = 1 mF, VIN = 3.3 V unless specified otherwise.)
2.2
1.1
GROUND CURRENT (mA)
SHUTDOWN THRESHOLD (V)
1.2
1.0
0.9
0.8
0.7
0.6
1.8
1.6
1.4
0.5
0.4
1.2
2.7
3.0
3.3
3.6
3.9
4.2
4.5
2.7
3.0
3.3
3.6
3.9
4.2
4.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 3. Shutdown Input Threshold vs.
Supply Voltage
Figure 4. Ground Current vs. Supply Voltage
(No Load)
5.2
OUTPUT VOLTAGE (V)
5.2
OUTPUT VOLTAGE (V)
2.0
5.1
20 mA Load
5.0
100 mA Load
4.9
5.1
5.0
VIN = 3.2 V
4.9
VIN = 3.0 V
2.7
3.0
3.3
3.6
3.9
4.2
0
4.5
50
100
INPUT VOLTAGE (V)
LOAD CURRENT (mA)
Figure 5. Line Regulation
Figure 6. Load Regulation
150
100
2.6
VIN = 2.7 V
90
2.4
EFFICIENCY (%)
OSCILLATOR FREQUENCY (MHz)
VIN = 2.7 V
4.8
4.8
2.2
2.0
1.8
80
VIN = 3.2 V
70
VIN = 3.7 V
60
50
VIN = 4.5 V
40
30
1.6
2.7
3.0
3.3
3.6
3.9
4.2
1
4.5
10
INPUT VOLTAGE (V)
LOAD CURRENT (mA)
Figure 7. Oscillator Frequency vs. Supply
Voltage
Figure 8. Efficiency vs. Load Current
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100
CAT3200, CAT3200−5
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200−5)
(TAMB = 25°C, CIN = COUT = CFLY = 1 mF, VIN = 3.3 V unless specified otherwise.)
Figure 9. Soft Start Power Up
(90 mA Load, 3.3 V Input)
Figure 10. Load Step Response (3.3 V Input)
CURRENT LIMIT (mA)
250
200
150
100
50
0
2.7
3.0
3.3
3.6
3.9
4.2
4.5
INPUT VOLTAGE (V)
Figure 11. Output Ripple
(100 mA Load, 3.3 V Input)
Figure 12. Short Circuit Current vs. Supply
Voltage
4
FREQUENCY CHANGE (%)
OUTPUT VOLTAGE CHANGE (%)
2
1
10 mA Load
0
−1
−2
−40
−20
0
20
40
60
80
2
0
−2
−4
−40
100
−20
0
20
40
60
80
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 13. Output Voltage Change vs.
Temperature
Figure 14. Oscillator Frequency Change vs.
Temperature
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100
CAT3200, CAT3200−5
Block Diagram
CNEG
CPOS
2 MHz
Voltage
Doubler
IN
CNEG
2VIN
2 MHz
Voltage
Doubler
IN
SHDN
CPOS
2VIN
SHDN
+
1.25 V
EN
+
−
5 V / 100 mA
OUT
1.25 V
FB
−
5V
100 k
SGND
EN
300 k
100 mA
OUT
GND
PGND
Figure 15. CAT3200 Adjustable Output
Figure 16. CAT3200−5 5 V Fixed Output
Pin Functions
IN is the power supply. During normal operation the device
draws a supply current which is almost constant. A very
brief interval of non−conduction will occur at the switching
frequency. The duration of the non−conduction interval is
set by the internal non−overlapping “break−before−make”
timing. IN should be bypassed with a 1 mF to 4.7 mF low
ESR (Equivalent Series Resistance) ceramic capacitor
For filtering, a low ESR ceramic bypass capacitor (1 mF)
in close proximity to the IN pin prevents noise from being
injected back into the power supply.
SHDN is the logic control input (Active LOW) that places
the device into shutdown mode. The internal logic is CMOS
and the pin does not use an internal pull−down resistor. The
SHDN pin should not be allowed to float.
CPOS, CNEG are the positive and negative connections
respectively for the charge pump flying capacitor. A low
ESR ceramic capacitor (1 mF) should be connected between
these pins. During initial power−up it may be possible for the
capacitor to experience a voltage reversal and for this reason,
avoid using a polarized (tantalum or aluminum) flying
capacitor.
OUT is the regulated output voltage to power the load.
During normal operation, the device will deliver a train of
current pulses to the pin at a frequency of 2 MHz. Adequate
filtering on the pin can typically be achieved through the use
a low ESR ceramic bypass capacitor (1 mF to 4.7 mF) in close
proximity to the OUT pin. The ESR of the output capacitor
will directly influence the output ripple voltage.
When the shutdown mode is entered, the output is
immediately isolated from the input supply, however, the
output will remain connected to the internal feedback
resistor network (400 kW). The feedback network will result
in a reverse current of 10 mA to 20 mA to flow back through
the device to ground.
Whenever the device is taken out of shutdown mode, the
output voltage will experience a slew rate controlled
power−up. Full operating voltage is typically achieved in
less than 0.5 msec.
GND is the ground reference for all voltages on CAT3200−5
devices.
FB (CAT3200 Only) is the feedback input pin. An output
divider should be connected from OUT to FB to program the
output voltage.
PGND (CAT3200 Only). Is the same as GND for the
CAT3200−5 except for the internal reference connection to
SGND.
SGND (CAT3200 Only) Ground pin for the internal
reference. The CNEG connection is switched to this pin
during the normal charge pump operation.
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CAT3200, CAT3200−5
Device Operation
The CAT3200/CAT3200−5 use a switched capacitor
charge pump to boost the voltage at IN to a regulated output
voltage. Regulation is achieved by sensing the output
voltage through an internal resistor divider (CAT3200−5)
and modulating the charge pump output current based on the
error signal. A 2−phase non−overlapping clock activates the
charge pump switches. The flying capacitor is charged from
the IN voltage on the first phase of the clock. On the second
phase of the clock it is stacked in series with the input voltage
and connected to OUT. The charging and discharging the
flying capacitor continues at a free running frequency of
typically 2 MHz.
In shutdown mode all circuitry is turned off and the
CAT3200/CAT3200−5 draw only leakage current from the
VIN supply. OUT is disconnected from IN. The SHDN pin
is a CMOS input with a threshold voltage of approximately
0.8 V. The CAT3200/CAT3200−5 is in shutdown when a
logic LOW is applied to the SHDN pin. The SHDN pin is a
high impedance CMOS input. SHDN does not have an
internal pull−down resistor and should not be allowed to
float and. It must always be driven with a valid logic level.
The CAT3200 and CAT3200−5 will cycle in and out of
thermal shutdown indefinitely without latch−up or damage
until a short−circuit on OUT is removed.
Programming the CAT3200 Output Voltage (FB Pin)
The CAT3200−5 version has an internal resistive divider
to program the output voltage. The programmable CAT3200
may be set to an arbitrary voltage via an external resistive
divider. Since it employs a voltage doubling charge pump,
it is not possible to achieve output voltages greater than
twice the available input voltage. Figure 17 shows the
required voltage divider connection. The voltage divider
ratio is given by the formula:
R1 + V OUT * 1
R2
1.27 V
Typical values for total voltage divider resistance can
range from several kWs up to 1 MW.
1
CPOS
2
Short−Circuit and Thermal Protection
IN
3
CNEG
OUT
VOUT
8
R1
The CAT3200 and CAT3200−5 have built−in
short−circuit current limiting and over temperature
protection. During overload conditions, output current is
limited to approximately 225 mA. At higher temperatures,
or if the input voltage is high enough to cause excessive chip
self heating, the thermal shutdown circuit shuts down the
charge pump as the junction temperature exceeds
approximately 160°C. Once the junction temperature drops
back to approximately 140°C, the charge pump is enabled.
FB
PGND
6
SHDN
SGND
1.27 V
7
ǒ1 ) R1
Ǔ
R2
COUT
4
R2
5
Figure 17. Programming the Adjustable CAT3200
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CAT3200, CAT3200−5
Thermal Management
Application Information
For higher input voltages and maximum output current
there can be substantial power dissipation in the CAT3200/
CAT3200−5. If the junction temperature increases to 160°C,
the thermal shutdown circuitry will automatically turn off
the output.
A good thermal connection to the PC board is
recommended to reduce the chip temperature. Connecting
the GND pin (Pins 4/5 for CAT3200, Pin 2 for CAT3200−5)
to a ground plane, and maintaining a solid ground plane
under the device reduces the overall thermal resistance.
The overall junction to ambient thermal resistance (qJA)
for device power dissipation (PD) consists primarily of two
paths in series. The first path is the junction to the case (qJC)
which is defined by the package style, and the second path
is case to ambient (qCA) thermal resistance which is
dependent on board layout. The final operating junction
temperature for any set of conditions can be estimated by the
following thermal equation:
Ceramic Capacitors
Ceramic capacitors of different dielectric materials lose
their capacitance with higher temperature and voltage at
different rates. For example, a capacitor made of X5R or
X7R material will retain most of its capacitance from – 40°C
to 85°C whereas a Z5U or Y5V style capacitor will lose
considerable capacitance over that range.
Z5U and Y5V capacitors may also have voltage
coefficient causing them to lose 60% or more of their
capacitance when the rated voltage is applied. When
comparing different capacitors it is often useful consider the
amount of achievable capacitance for a given case size rather
than discussing the specified capacitance value. For
example, over rated voltage and temperature conditions, a
1 mF, 10 V, Y5V ceramic capacitor in an 0603 case may not
provide any more capacitance than a 0.22 mF, 10 V, X7R
available in the same 0603 case. For many CAT3200/
CAT3200−5 applications these capacitors can be considered
roughly equivalent.
The capacitor manufacturer’s data sheet should be
consulted to determine what value of capacitor is needed to
ensure the desired capacitance at all temperatures and
voltages. Below is a list of ceramic capacitor
manufacturers and how to contact them:
TJUNC = TAMB + PD (QJC) + PD (QCA)
TJUNC = TAMB + PD (QJA)
The CAT3200 in SOT23 package, when mounted on
printed circuit board with two square inches of copper
allocated for “heat spreading”, will result with an overall θJA
of less than 150°C/W.
For a typical application operating from a 3.8 V input
supply, the maximum power dissipation is 260 mW
(100 mA x 3 V). This would result if a maximum junction
temperature of:
Table 5. CERAMIC CAPACITOR MANUFACTURERS
Capacitor
Manufacturer
Web
Phone
Murata
www.murata.com
814.237.1431
AVX/Kemet
www.avxcorp.com
843.448.9411
Vishay
www.vishay.com
Kemet
www.kemet.com
408.986.0424
Taiyo Yuden
www.t−yuden.com
408.573.4150
TJUNC = TAMB + PD (qJA)
TJUNC = 85°C + 0.26 W (150°C/W)
TJUNC = 85°C + 39°C = 124°C
The use of multi−layer board construction with power
planes will further enhance the overall thermal performance.
In the event of no dedicated copper area being used for heat
spreading, a multi−layer board will typically provide the
CAT3200 with an overall qJA of 200°C/W. This level of
thermal conduction would allow up to 200 mW be safely
dissipated within the device.
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CAT3200, CAT3200−5
Typical Applications
1 mF
4
5 IN
1 mF
6
OUT 1
4 V ≤ VIN ≤ 5 V
4
5
3.3 V ± 10%
3
SHDN
1 mF
3
VOUT
5 V ± 4%
100 mA
1 mF
CAT3200−5
1 mF
6
IN
OUT
SHDN
CAT3200−5
GND
2
1
1 mF
VOUT
5 V ± 4%
GND
2
Figure 18. 3.3 V Supply to 5 V
Figure 19. USB Port to Regulated 5 V Power Supply
1 mF
4
6
C−
5
3 V to 4.4 V
Li−ion
Battery
ON
+
Drive up to 5 LEDs
1
1 mF
CAT3200−5
3
Apply PWM Waveform for
Adjustable Brightness Control
OUT
IN
1 mF
OFF
C+
SHDN
SGND
VSHDN
100 Ω
100 Ω
100 Ω
100 Ω
2
t
Figure 20. Lithium−Ion Battery to 5 V White or Blue LED Driver
1 mF
1
3
C+
2
+
IN
1 mF
3 V to 4.4 V
Li−ion
Battery
C−
OUT
1 mF
CAT3200
FB
PGND
ON
OFF
Apply PWM Waveform for
Adjustable Brightness Control
6
SHDN
VSHDN
Up to 6 LEDs
8
SGND
7
5
82 Ω
4
82 Ω
82 Ω
t
Figure 21. White or Blue LED Driver with LED Current Control
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9
82 Ω
82 Ω
100 Ω
CAT3200, CAT3200−5
PACKAGE DIMENSIONS
TSOT−23, 6 LEAD
CASE 419AF−01
ISSUE O
SYMBOL
D
MIN
NOM
A
e
E1
MAX
1.00
A1
0.01
0.05
0.10
A2
0.80
0.87
0.90
b
0.30
c
0.12
E
0.45
0.15
D
2.90 BSC
E
2.80 BSC
E1
1.60 BSC
e
0.95 TYP
L
0.30
L1
0.40
0.20
0.50
0.60 REF
L2
0.25 BSC
0º
θ
8º
TOP VIEW
A2 A
b
q
L
A1
c
L1
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-193.
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L2
CAT3200, CAT3200−5
PACKAGE DIMENSIONS
MSOP 8, 3x3
CASE 846AD−01
ISSUE O
SYMBOL
MIN
NOM
MAX
A
E
1.10
A1
0.05
0.10
0.15
A2
0.75
0.85
0.95
b
0.22
0.38
c
0.13
0.23
D
2.90
3.00
3.10
E
4.80
4.90
5.00
E1
2.90
3.00
3.10
E1
e
L
0.65 BSC
0.40
0.60
0.80
L1
0.95 REF
L2
0.25 BSC
θ
0º
6º
TOP VIEW
D
A
A2
A1
DETAIL A
e
b
c
SIDE VIEW
END VIEW
q
L2
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-187.
L
L1
DETAIL A
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11
CAT3200, CAT3200−5
3.
4.
5.
6.
All packages are RoHS−compliant (Lead−free, Halogen−free).
The standard lead finish is NiPdAu.
For Matte−Tin package option, please contact your nearest ON Semiconductor Sales office.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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