TEMD5510FX01 Datasheet

TEMD5510FX01
www.vishay.com
Vishay Semiconductors
Ambient Light Sensor
FEATURES
• Package type: surface mount
• Package form: top view
• Dimensions (L x W x H in mm): 5 x 4.24 x 1.12
• Radiant sensitive area (in mm2): 7.5
• AEC-Q101 qualified
• High photo sensitivity
• Adapted to human eye responsivity
• Supression filter for near infrared radiation
• Angle of half sensitivity: ϕ = ± 65°
• Floor life: 72 h, MSL 4, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
TEMD5510FX01 ambient light sensor is a PIN photodiode
with high photo sensitivity in a miniature surface mount
device (SMD). The detector chip has 7.5 mm2 sensitive area.
It is sensitive to visible light much like the human eye and
has peak sensitivity at 540 nm.
APPLICATIONS
• Automotive sensors
• Ambient light sensors
• Backlight dimmers
• Notebooks
• Computers
PRODUCT SUMMARY
COMPONENT
TEMD5510FX01
Ira (μA)
ϕ (deg)
λ0.5 (nm)
1
± 65
430 to 610
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
TEMD5510FX01
Tape and reel
MOQ: 1500 pcs, 1500 pcs/reel
Top view
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Power dissipation
Tamb ≤ 25 °C
Junction temperature
SYMBOL
VALUE
VR
16
UNIT
V
PV
215
mW
Tj
100
°C
Operating temperature range
Tamb
-40 to +100
°C
Storage temperature range
Tstg
-40 to +110
°C
Acc. reflow solder profile fig. 5
Tsd
260
°C
Soldered on PCB with pad dimensions: 4 mm x 4 mm
RthJA
350
K/W
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.6, 25-Jun-14
Document Number: 81293
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD5510FX01
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
Breakdown voltage
IR = 100 μA, E = 0
V(BR)
16
Reverse dark current
Diode capacitance
Reverse light current
Temperature coefficient of Ira
TYP.
MAX.
UNIT
V
VR = 10 V, E = 0
Iro
2
VR = 0 V, f = 1 MHz, E = 0
CD
1600
pF
VR = 3 V, f = 1 MHz, E = 0
CD
730
pF
30
nA
Ee = 1 mW/cm2, λ = 550 nm, VR = 5 V
Ira
Ev = 100 lx, CIE illuminant A, VR = 5 V
Ira
Ev = 100 lx, CIE illuminant A, VR = 5 V
TKIra
0.2
%/K
26
0.8
μA
1
1.4
μA
Angle of half sensitivity
ϕ
± 65
deg
Wavelength of peak sensitivity
λp
540
nm
Range of spectral bandwidth
λ0.5
430 to 610
nm
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1.0
Relative Spectral Sensitivity
100
10
VR = 10 V
0.8
human eye
0.6
0.4
0.2
1
20
40
60
Tamb - Ambient Temperature (°C)
94 8403
0.0
400
100
80
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
Photodiode
600
0°
10
CIE Illuminant A
VR = 5 V
1
Srel - Relative Sensitivity
100
1000
Fig. 3 - Relative Spectral Sensitivity vs. Wavelength
1000
Ira - Photocurrent (µA)
800
Wavelength (nm)
20047
10
°
20
°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
Iro - Reverse Dark Current (nA)
1000
80°
0.1
10
100
1000
0.6
10000
0.4
0.2
0
94 8406_1
20080
Ev - Illuminance (lx)
Fig. 2 - Reverse Light Current vs. Irradiance
Rev. 1.6, 25-Jun-14
Fig. 4 - Relative Radiant Sensitivity vs. Angular Displacement
Document Number: 81293
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD5510FX01
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
Drawing-No.: 6.541-5060.01-4
Issue: 3; 05.02.08
Not indicated tolerances ± 0.1
20536
Rev. 1.6, 25-Jun-14
Document Number: 81293
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD5510FX01
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters
20537
REEL DIMENSIONS in millimeters
20874
Rev. 1.6, 25-Jun-14
Document Number: 81293
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD5510FX01
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
DRYPACK
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
max. 30 s
150
Moisture sensitivity: level 4
max. 100 s
max. 120 s
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Floor life: 72 h
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
Conditions: Tamb < 30 °C, RH < 60 %
DRYING
0
0
19841
50
100
150
200
250
300
Time (s)
Fig. 5 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020D
Rev. 1.6, 25-Jun-14
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
Document Number: 81293
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000