Download Product Data Sheet

High Performance LGA Cooling
Solutions
ATS PART # ATS-57003-C1-R0
D
Features & Benefits
»
Provides high capacity cooling for high power LGAs
»
Unique attachment minimizes mechanical stress on the
device
»
Includes spring-loaded, push pin mounts for direct
attachment to the PCB
C
A
B
Thermal Performance
*Image above is for illustration purposes only.
Air Velocity
Thermal Resistance
FT/MIN
M/S
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
200
1.0
1.38
0.8
300
1.5
0.87
400
2.0
0.7
500
2.5
0.6
600
3.0
0.55
700
3.5
0.5
800
4.0
0.45
Product Details
DIMENSION A
DIMENSION B
DIMENSION C
DIMENSION D
INTERFACE MATERIAL
FINISH
94 mm
94 mm
27 mm
N/A mm
NO TIM
BLACK-ANODIZED
Notes:
1)
2)
3)
4)
Dimension C = heat sink height from bottom of the base to the top of the fin field.
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV1_0908
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