SMF5.0AT1 D

SMF5.0AT1G Series,
SZSMF5.0AT1G Series
200 W Transient
Voltage Suppressor
SOD-123 Flat Lead Package
The SMF5.0AT1G Series is designed to protect voltage sensitive
components from high voltage, high energy transients. Excellent
clamping capability, high surge capability, low zener impedance and
fast response time. Because of its small size, it is ideal for use in
cellular phones, portable devices, business machines, power supplies
and many other industrial/consumer applications.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Stand−off Voltage: 5 − 58 Volts
Peak Power − 200 Watts @ 1 ms (SMF5.0A − SMF58A)
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
ESD Rating of Level 4 (8 kV Contact Discharge) per IEC61000−4−2
EFT (Electrical Fast Transients) Rating of 40 A per IEC61000−4−4
Low Profile − Maximum Height of 1.0 mm
Small Footprint − Footprint Area of 8.45 mm2
Supplied in 8 mm Tape and Reel − 3,000 Units per Reel
Cathode Indicated by Polarity Band
Lead Orientation in Tape: Cathode Lead to Sprocket Holes
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
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PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSOR
5 − 58 VOLTS
200 WATT PEAK POWER
SOD−123FL
CASE 498
1
1: CATHODE
2: ANODE
MARKING DIAGRAM
1
CATHODE
xx
M
G
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
2
xx M G
G
2
ANODE
= Device Code (Refer to page 3)
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
Package
Shipping†
SMFxxxAT1G
SOD−123FL
(Pb−Free)
3,000 /
Tape & Reel
SZSMFxxxAT1G
SOD−123FL
(Pb−Free)
3,000 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 7
1
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
SMF5.0AT1/D
SMF5.0AT1G Series, SZSMF5.0AT1G Series
MAXIMUM RATINGS
Symbol
Value
Unit
Maximum Ppk Dissipation (PW−10/1000 ms) (Note 1) SMF5.0A − SMF58A
Rating
Ppk
200
W
Maximum Ppk Dissipation @ TA = 25°C, (PW−8/20 ms) (Note 2)
Ppk
1000
W
DC Power Dissipation
@ TA = 25°C (Note 3)
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 3)
°PD°
385
4.0
325
°mW
mW/°C
°C/W
RqJcathode
26
°C/W
TJ, Tstg
−55 to +150
°C
RqJA
Thermal Resistance, Junction−to−Lead (Note 3)
Operating and Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current pulse at TA = 25°C, per waveform of Figure 2.
2. Non−repetitive current pulse at TA = 25°C, per waveform of Figure 3.
3. Mounted with recommended minimum pad size, DC board FR−4.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless
I
otherwise noted, VF = 3.5 V Max. @ IF (Note 4) = 12 A)
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IF
Parameter
VC VBR VRWM
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
IR VF
IT
Breakdown Voltage @ IT
IT
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
IPP
Uni−Directional TVS
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms,
duty cycle = 4 pulses per minute maximum.
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2
V
SMF5.0AT1G Series, SZSMF5.0AT1G Series
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
VRWM (V)
VBR @ IT (V) (Note 6)
IT
IR @ VRWM
VC(Max)
IPP(Max) (A)
Marking
(Note 5)
Min
Nom
Max
(mA)
(mA)
(V)
(Note 7)
SMF5.0AG
KE
5
6.4
6.7
7
10
400
9.2
21.7
SMF6.0AG
KG
6
6.67
7.02
7.37
10
400
10.3
19.4
SMF6.5AG
KK
6.5
7.22
7.6
7.98
10
250
11.2
17.9
SMF7.0AG
KM
7
7.78
8.2
8.6
10
100
12
16.7
SMF7.5AG
KP
7.5
8.33
8.77
9.21
1
50
12.9
15.5
SMF8.0AG
KR
8
8.89
9.36
9.83
1
25
13.6
14.7
SMF9.0AG
KV
9
10
10.55
11.1
1
5
15.4
13.0
SMF10AG
KX
10
11.1
11.7
12.3
1
2.5
17
11.8
SMF11AG
KZ
11
12.2
12.85
13.5
1
2.5
18.2
11.0
SMF12AG
LE
12
13.3
14
14.7
1
2.5
19.9
10.1
SMF13AG
LG
13
14.4
15.15
15.9
1
1
21.5
9.3
SMF14AG
LK
14
15.6
16.4
17.2
1
1
23.2
8.6
SMF15AG
LM
15
16.7
17.6
18.5
1
1
24.4
8.2
SMF18AG
LT
18
20
21
22.1
1
1
29.2
6.8
SMF20AG
LV
20
22.2
23.35
24.5
1
1
32.4
6.2
SMF22AG
LX
22
24.4
25.6
26.9
1
1
35.5
5.6
SMF24AG
LZ
24
26.7
28.1
29.5
1
1
38.9
5.1
SMF26AG
ME
26
28.9
30.4
31.9
1
1
42.1
4.8
SMF28AG
MG
28
31.1
32.8
34.4
1
1
45.4
4.4
SMF30AG
MK
30
33.3
35.1
36.8
1
1
48.4
4.1
SMF33AG
MM
33
36.7
38.7
40.6
1
1
53.3
3.8
SMF36AG
MP
36
40
42.1
44.2
1
1
58.1
3.4
SMF48AG
MX
48
53.3
56.1
58.9
1
1
77.4
2.6
SMF51AG
MZ
51
56.7
59.7
62.7
1
1
82.4
2.4
SMF58AG
NG
58
64.4
67.8
71.2
1
1
93.6
2.1
Device*
5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater
than the DC or continuous peak operating voltage level.
6. VBR measured at pulse test current IT at ambient temperature of 25°C.
7. Surge current waveform per Figure 2 and derate per Figure 3.
*Include SZ-prefix devices where applicable.
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3
SMF5.0AT1G Series, SZSMF5.0AT1G Series
TYPICAL PROTECTION CIRCUIT
Zin
LOAD
Vin
PP, PEAK POWER (WATTS)
10,000
VALUE (%)
RSM
I
HALF VALUE − RSM
2
50
100
tP
1.0
100
10
1000
3
4
Figure 2. 10 X 1000 ms Pulse Waveform
60
160
140
120
100
HALF VALUE IRSM/2 @ 20 ms
50
40
tP
10
0
2
Figure 1. Pulse Rating Curve
70
0
1
t, TIME (ms)
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
20
0
tP, PULSE WIDTH (ms)
80
30
0
10,000
PEAK VALUE IRSM @ 8 ms
tr
90
100
20
40
PEAK PULSE DERATING IN % OF
PEAK POWER OR CURRENT @ TA = 25°C
10
% OF PEAK PULSE CURRENT
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE PEAK
tr
CURRENT DECAYS TO 50%
OF IRSM.
tr ≤ 10 ms
PEAK VALUE − I
100
1000
VL
60
80
80
60
40
20
0
0
t, TIME (ms)
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Pulse Derating Curve
Figure 3. 8 X 20 ms Pulse Waveform
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4
150
1
0.7
DERATING FACTOR
0.5
0.3
0.2
PULSE WIDTH
10 ms
0.1
0.07
0.05
1 ms
0.03
100 ms
0.02
0.1 0.2
0.5
1
2
5
10
20
50 100
400
350
300
250
200
150
100
50
0
0
25
50
75
100
125
150
D, DUTY CYCLE (%)
T, TEMPERATURE (°C)
Figure 5. Typical Derating Factor for Duty Cycle
Figure 6. Steady State Power Derating
175
1000
1.2
1.0
C, CAPACITANCE (pF)
V F, TYPICAL FORWARD VOLTAGE (VOLTS)
0.01
10 ms
P D , MAXIMUM POWER DISSIPATION (mW
SMF5.0AT1G Series, SZSMF5.0AT1G Series
0.8
0.6
0.4
MEASURED @ ZERO BIAS
100
MEASURED @ 50% VRWM
10
0.2
0
−55
25
85
1
150
1
10
100
1000
WORKING PEAK REVERSE VOLTAGE (VOLTS)
T, TEMPERATURE (°C)
Figure 7. Forward Voltage
Figure 8. Capacitance versus Working Peak
Reverse Voltage
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5
SMF5.0AT1G Series, SZSMF5.0AT1G Series
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
E
D
1
q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
2
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
END VIEW
TOP VIEW
DIM
A
A1
b
c
D
E
L
HE
q
A1
q
HE
SIDE VIEW
2X
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
RECOMMENDED
SOLDERING FOOTPRINT*
c
2X
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
L
b
2X
BOTTOM VIEW
1.22
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
4.20
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
2X
1.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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6
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SMF5.0AT1/D