1N6373 - 1N6381 Series (ICTE-5 - ICTE-36) 1500 Watt Peak Power Mosorbt Zener Transient Voltage Suppressors http://onsemi.com Unidirectional* Mosorb devices are designed to protect voltage sensitive components from high voltage, high-energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. These devices are ONSemiconductor's exclusive, cost‐effective, highly reliable Surmetict axial leaded package and are ideally‐suited for use in communication systems, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications, to protect CMOS, MOS and Bipolar integrated circuits. Cathode Anode AXIAL LEAD CASE 41A PLASTIC MARKING DIAGRAMS Specification Features •Working Peak Reverse Voltage Range - 5.0 V to 45 V •Peak Power - 1500 Watts @ 1 ms •ESD Rating of Class 3 (>16 KV) per Human Body Model •Maximum Clamp Voltage @ Peak Pulse Current •Low Leakage < 5 mA Above 10 V •Response Time is Typically < 1 ns •Pb-Free Packages are Available* A 1N 63xx YYWWG G A ICTE -xx YYWWG G Mechanical Characteristics CASE: Void‐free, transfer‐molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: 260°C, 1/16″ from the case for 10 seconds POLARITY: Cathode indicated by polarity band MOUNTING POSITION: Any A = Assembly Location 1N63xx = JEDEC Device Code ICTE-xx = ON Device Code YY = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† 1N63xx, G Axial Lead (Pb-Free) 500 Units/Box 1N63xxRL4, G Axial Lead (Pb-Free) 1500/Tape & Reel ICTE-xx, G Axial Lead (Pb-Free) 500 Units/Box ICTE-xxRL4, G Axial Lead (Pb-Free) 1500/Tape & Reel Device *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007 July, 2007 - Rev. 5 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: 1N6373/D 1N6373 - 1N6381 Series (ICTE-5 - ICTE-36) MAXIMUM RATINGS Symbol Value Unit Peak Power Dissipation (Note 1) @ TL ≤ 25°C Rating PPK 1500 W Steady State Power Dissipation @ TL ≤ 75°C, Lead Length = 3/8″ Derated above TL = 75°C PD 5.0 20 W mW/°C Thermal Resistance, Junction-to-Lead RqJL 20 °C/W Forward Surge Current (Note 2) @ TA = 25°C IFSM 200 A TJ, Tstg -65 to +175 °C Operating and Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Nonrepetitive current pulse per Figure 5 and derated above TA = 25°C per Figure 2. 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 3.5 V Max. @ IF (Note 3) = 100 A) I Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IT QVBR IF Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM VC VBR VRWM Breakdown Voltage @ IT V IR VF IT Test Current Maximum Temperature Variation of VBR IF Forward Current VF Forward Voltage @ IF IPP Uni-Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 3.5 V Max. @ IF (Note 3) = 100 A) JEDEC Device† (ON Device) Device Marking VRWM (Note 4) IR @ VRWM Breakdown Voltage VC @ IPP (Note 6) VBR (Note 5) (Volts) @ IT VC IPP VC (Volts) (Note 6) QVBR (Volts) (mA) Min Nom Max (mA) (Volts) (A) @ IPP = 1A @ IPP = 10 A 1N6373, G 1N6373 5.0 300 6.0 - - 1.0 9.4 160 7.1 7.5 (mV/°C) 4.0 1N6374, G 1N6374 8.0 25 9.4 - - 1.0 15 100 11.3 11.5 8.0 1N6375, G 1N6375 10 2.0 11.7 - - 1.0 16.7 90 13.7 14.1 12 1N6376, G 1N6376 12 2.0 14.1 - - 1.0 21.2 70 16.1 16.5 14 1N6377, G 1N6377 15 2.0 17.6 - - 1.0 25 60 20.1 20.6 18 1N6380, G 1N6380 36 2.0 42.4 - - 1.0 65.2 23 50.6 54.3 50 1N6381, G 1N6381 45 2.0 52.9 - - 1.0 78.9 19 63.3 70 60 ICTE-5RLG ICTE-10RLG ICTE-12RLG ICTE-5 ICTE-10 ICTE-12 5.0 10 12 300 2.0 2.0 6.0 11.7 14.1 - - 1.0 1.0 1.0 9.4 16.7 21.2 160 90 70 7.1 13.7 16.1 7.5 14.1 16.5 4.0 8.0 12 ICTE-15RLG ICTE-18, G ICTE-36RLG ICTE-15 ICTE-18 ICTE-36 15 18 36 2.0 2.0 2.0 17.6 21.2 42.4 - - 1.0 1.0 1.0 25 30 65.2 60 50 23 20.1 24.2 50.6 20.6 25.2 54.3 14 18 26 3. Square waveform, PW = 8.3 ms, non-repetitive duty cycle. 4. A transient suppressor is normally selected according to the maximum working peak reverse voltage (VRWM), which should be equal to or greater than the dc or continuous peak operating voltage level. 5. VBR measured at pulse test current IT at an ambient temperature of 25°C and minimum voltage in VBR is to be controlled. 6. Surge current waveform per Figure 5 and derate per Figures 1 and 2. †The “G'' suffix indicates Pb-Free package or Pb-Free packages are available. http://onsemi.com 2 100 PPK , PEAK POWER (kW) NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 5 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C 1N6373 - 1N6381 Series (ICTE-5 - ICTE-36) 100 10 1 80 60 40 20 0 0.1ms 1ms 10ms 1 ms 100ms 10 ms 0 25 50 tP, PULSE WIDTH Figure 1. Pulse Rating Curve 75 100 125 150 175 200 TA, AMBIENT TEMPERATURE (°C) Figure 2. Pulse Derating Curve 10,000 MEASURED @ ZERO BIAS C, CAPACITANCE (pF) 1000 MEASURED @ VRWM 100 10 1 10 100 1000 VBR, BREAKDOWN VOLTAGE (VOLTS) 3/8″ 3/8″ 5 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP. tr ≤ 10 ms IPP, VALUE (%) PD , STEADY STATE POWER DISSIPATION (WATTS) Figure 3. Capacitance versus Breakdown Voltage 4 3 PEAK VALUE - IPP 100 HALF VALUE - IPP 2 50 2 tP 1 0 0 0 25 50 75 100 125 150 175 TL, LEAD TEMPERATURE (°C) 200 0 1 2 3 t, TIME (ms) Figure 4. Steady State Power Derating Figure 5. Pulse Waveform http://onsemi.com 3 4 1N6373 - 1N6381 Series (ICTE-5 - ICTE-36) TL=25°C tP=10ms 1 0.7 0.5 VBR(MIN)=6.0 to 11.7V 19V 42.4V 21.2V 200 0.3 100 DERATING FACTOR IT , TEST CURRENT (AMPS) 1000 500 50 20 10 5 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 100 ms 0.02 2 10 ms 1 0.01 0.1 0.3 0.5 0.7 1 2 3 5 7 10 20 30 DVBR, INSTANTANEOUS INCREASE IN VBR ABOVE VBR(NOM) (VOLTS) 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 Figure 7. Typical Derating Factor for Duty Cycle Figure 6. Dynamic Impedance APPLICATION NOTES RESPONSE TIME circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitance effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 8. The inductive effects in the device are due to actual turn‐on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 9. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. These devices have excellent response time, typically in the picosecond range and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper DUTY CYCLE DERATING The data of Figure 1 applies for non‐repetitive conditions and at a lead temperature of 25°C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 7. Average power must be derated as the lead or ambient temperature rises above 25°C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 7 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 ms pulse. However, when the derating factor for a given pulse of Figure 7 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend. http://onsemi.com 4 1N6373 - 1N6381 Series (ICTE-5 - ICTE-36) TYPICAL PROTECTION CIRCUIT Zin LOAD Vin V V Vin (TRANSIENT) VL OVERSHOOT DUE TO INDUCTIVE EFFECTS Vin (TRANSIENT) VL VL Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t t Figure 8. Figure 9. http://onsemi.com 5 1N6373 - 1N6381 Series (ICTE-5 - ICTE-36) PACKAGE DIMENSIONS MOSORB CASE 41A-04 ISSUE D B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. LEAD FINISH AND DIAMETER UNCONTROLLED IN DIMENSION P. 4. 041A-01 THRU 041A-03 OBSOLETE, NEW STANDARD 041A-04. D K P P DIM A B D K P A INCHES MIN MAX 0.335 0.374 0.189 0.209 0.038 0.042 1.000 ----0.050 MILLIMETERS MIN MAX 8.50 9.50 4.80 5.30 0.96 1.06 25.40 ----1.27 K Mosorb and Surmetic are trademarks of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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