1PMT5920B D

1PMT5920B Series
3.2 Watt Plastic
Surface Mount
POWERMITE® Package
This complete new line of 3.2 Watt Zener Diodes are offered in
highly efficient micro miniature, space saving surface mount with its
unique heat sink design. The POWERMITE package has the same
thermal performance as the SMA while being 50% smaller in
footprint area and delivering one of the lowest height profiles
(1.1 mm) in the industry. Because of its small size, it is ideal for use
in cellular phones, portable devices, business machines and many
other industrial/consumer applications.
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PLASTIC SURFACE MOUNT
3.2 WATT ZENER DIODES
6.2 - 47 VOLTS
Features
•Zener Breakdown Voltage: 6.2 - 47 V
•DC Power Dissipation: 3.2 W with Tab 1 (Cathode) @ 75°C
•Low Leakage < 5 mA
•ESD Rating of Class 3 (> 16 kV) per Human Body Model
•Low Profile - Maximum Height of 1.1 mm
•Integral Heat Sink/Locking Tabs
•Full Metallic Bottom Eliminates Flux Entrapment
•Small Footprint - Footprint Area of 8.45 mm2
•Supplied in 12 mm Tape and Reel
•Lead Orientation in Tape: Cathode (Short) Lead to Sprocket Holes
•POWERMITE is JEDEC Registered as DO-216AA
•Cathode Indicated by Polarity Band
•Pb-Free Packages are Available
1
2
1: CATHODE
2: ANODE
POWERMITE
CASE 457
PLASTIC
1
2
MARKING DIAGRAM
Mechanical Characteristics
CASE: Void‐free, transfer‐molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MOUNTING POSITION: Any
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1
CATHODE
M
xxB G
2
ANODE
260°C for 10 Seconds
M
xxB
G
= Date Code
= Specific Device Code
(See Table on Page 2)
= Pb-Free Package
ORDERING INFORMATION
Device
Package
Shipping†
1PMT59xxBT1G POWERMITE 3000/Tape&Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2007
October 2007 - Rev. 4
1
Publication Order Number:
1PMT5920B/D
1PMT5920B Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
°PD°
RqJA
500
4.0
248
°mW
mW/°C
°C/W
RqJanode
35
°C/W
°PD°
RqJcathode
3.2
23
W
°C/W
TJ, Tstg
-55 to +150
°C
DC Power Dissipation @ TA = 25°C (Note 1)
Derate above 25°C
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Lead (Anode)
Maximum DC Power Dissipation (Note 2)
Thermal Resistance from Junction-to-Tab (Cathode)
Operating and Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Mounted with recommended minimum pad size, PC board FR-4.
2. At Tab (Cathode) temperature, Ttab = 75°C
ELECTRICAL CHARACTERISTICS (TL = 25°C unless
I
otherwise noted, VF = 1.5 V Max. @ IF = 200 mAdc for all types)
Symbol
IF
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
VZ VR
V
IR VF
IZT
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
Zener Voltage (Note 3)
VZ @ IZT (Volts)
IZT
IR @ VR
VR
ZZT @ IZT
(Note 4)
ZZK @ IZK
(Note 4)
IZK
Device*
Device
Marking
Min
Nom
Max
(mA)
(mA)
(V)
(W)
(W)
(mA)
1PMT5920BT1G
20B
5.89
6.2
6.51
60.5
5.0
4.0
2.0
200
1.0
1PMT5921BT1G
21B
6.46
6.8
7.14
55.1
5.0
5.2
2.5
200
1.0
1PMT5924BT1G
24B
8.64
9.1
9.56
41.2
5.0
7.0
4.0
500
0.5
1PMT5927BT1G
27B
11.4
12
12.6
31.2
1.0
9.1
6.5
550
0.25
1PMT5929BT1G
29B
14.25
15
15.75
25
1.0
11.4
9.0
600
0.25
1PMT5933BT1G
33B
20.9
22
23.1
17
1.0
16.7
17.5
650
0.25
1PMT5934BT1G
34B
22.8
24
25.2
15.6
1.0
18.2
19
700
0.25
1PMT5935BT1G
35B
25.65
27
28.35
13.9
1.0
20.6
23
700
0.25
1PMT5941BT1G
41B
44.65
47
49.35
8.0
1.0
35.8
67
1000
0.25
3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C.
4. Zener Impedance Derivation ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The
specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz.
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2
1PMT5920B Series
3.5
100
3
IZ, ZENER CURRENT (mA)
P D , MAXIMUM POWER DISSIPATION (W)
TYPICAL CHARACTERISTICS
2.5
2
TL
1.5
1
10
1
0.5
0
0.1
25
50
75
100
125
150
175
5
6
9
10
7
8
VZ, ZENER VOLTAGE (VOLTS)
T, TEMPERATURE (°C)
Figure 2. VZ to 10 Volts
IZ , ZENER CURRENT (mA)
100
50
30
20
10
5
3
2
1
0.5
0.3
0.2
0.1
0
10
20
30
40
50
60
70
80
VZ, ZENER VOLTAGE (VOLTS)
90
100
qVZ, TEMPERATURE COEFFICIENT (mV/°C)
Figure 1. Steady State Power Derating
10
8
VZ @ IZT
6
4
2
0
-2
-4
2
4
6
8
10
VZ, ZENER VOLTAGE (VOLTS)
12
Figure 4. Zener Voltage - To 12 Volts
Figure 3. VZ = 12 thru 47 Volts
200
200
Z Z , DYNAMIC IMPEDANCE (OHMS)
qVZ, TEMPERATURE COEFFICIENT (mV/°C)
11
VZ @ IZT
100
70
50
30
20
10
10
20
30
50
70
100
VZ, ZENER VOLTAGE (VOLTS)
IZ(dc) = 1mA
100
70
50
30
20
10
7
5
10 mA
20 mA
3
2
5
200
Figure 5. Zener Voltage - 14 To 47 Volts
7
iZ(rms) = 0.1 IZ(dc)
10
20
30
50
VZ, ZENER VOLTAGE (VOLTS)
Figure 6. Effect of Zener Voltage
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3
70
100
1PMT5920B Series
Z Z, DYNAMIC IMPEDANCE (OHMS)
1k
TJ = 25°C
iZ(rms) = 0.1 IZ(dc)
500
200
100
50
20
10
5
22 V
2
12 V
1
0.5 1
6.8 V
2
5
10
20
50 100 200
500
IZ, ZENER TEST CURRENT (mA)
Figure 7. Effect of Zener Current
C, CAPACITANCE (pF)
10,000
1000
MEASURED @ 0 V BIAS
MEASURED @ 50% VR
100
10
1
10
VZ, REVERSE ZENER VOLTAGE (VOLTS)
Figure 8. Capacitance versus Reverse
Zener Voltage
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4
100
1PMT5920B Series
PACKAGE DIMENSIONS
POWERMITE)
CASE 457-04
ISSUE D
F
0.08 (0.003)
C
-A-
J
M
T B
S
C
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
TERM. 1
DIM
A
B
C
D
F
H
J
K
L
R
S
-BK
TERM. 2
R
L
J
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
D
H
-T-
0.08 (0.003)
M
T B
S
C
S
SOLDERING FOOTPRINT*
0.635
0.025
2.67
0.105
0.762
0.030
2.54
0.100
1.27
0.050
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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5
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
1PMT5920B/D
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