CM1402 D

CM1402
SIM Card EMI Filter Array
with ESD Protection
Product Description
The CM1402 is an EMI filter array with ESD protection, which
integrates three pi filters (C−R−C) and two additional channels of ESD
protection. The CM1402 has component values of 20 pF − 47 −
20 pF, and 20 pF − 100 − 20 pF. The parts include avalanche−type
ESD diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes connected to the
filter ports are designed and characterized to safely dissipate ESD
strikes of ±10 kV, beyond the maximum requirement of the IEC
61000−4−2 international standard. Using the MIL−STD−883 (Method
3015) specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±25 kV.
The ESD diodes on pins A4 and C4 ports are designed and
characterized to safely dissipate ESD strikes of ±10 kV, well beyond
the maximum requirement of the IEC 61000−4−2 international
standard.
This device is particularly well suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers) because of its small
package format and easy−to−use pin assignments. In particular, the
CM1402 is ideal for EMI filtering and protecting data lines from ESD
for the SIM card slot in mobile handsets.
The CM1402 incorporates OptiGuardt coating which results in
improved reliability at assembly. The CM1402 is available in a
space−saving, low−profile Chip Scale Package.
Features
•
•
•
•
•
•
•
•
•
•
Functionally and Pin−Compatible with CSPEMI400 Device
OptiGuardt Coated for Improved Reliability at Assembly
Three Channels of EMI Filtering, Each with ESD Protection
Two Additional Channels of ESD−Only Protection
±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on
All Pins
±25 kV ESD Protection (HBM)
Greater than 30 dB of Attenuation at 1 GHz
10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package
(CSP)
Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
These Devices are Pb−Free and are RoHS Compliant
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WLCSP10
CP SUFFIX
CASE 567BL
MARKING DIAGRAM
CE MG
G
CE
= CM1402−03CP
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
CM1402−03CP
CSP−10
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
• SIM Card Slot in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 4
1
Publication Order Number:
CM1402/D
CM1402
ELECTRICAL SCHEMATIC
R1
R2
A1
C1
C
A2
C2
C
C
C
GND
R1
A3
A4
C3
C
C4
C
C
C
R1 = 100 R2 = 47 B1,B2
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
Top View
(Bumps Down View)
10−bump CSP Package
Type
Pin
Description
EMI Filter
A1
EMI Filter with ESD Protection for RST
Signal
C1
EMI Filter with ESD Protection for RST
Signal
A2
EMI Filter with ESD Protection for CLK
Signal
C2
EMI Filter with ESD Protection for CLK
Signal
Device
Ground
B1
Device Ground
B2
Device Ground
EMI Filter
A3
EMI Filter with ESD Protection for DAT
Signal
C3
EMI Filter with ESD Protection for DAT
Signal
ESD Channel
A4
ESD Protection Channel − VCC Supply
ESD Channel
C4
ESD Protection Channel
A
1
2
+
3
4
CE
B
C
Bottom View
(Bumps Up View)
Orientation
Marking
A1
EMI Filter
Orientation
Marking
A4
A3
A2
B2
C4
A1
B1
C3
C2
C1
CM1402
CSP Package with OptiGuard coating
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
–65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
CM1402
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Min
Typ
Max
Units
R1
Resistance of R1
80
100
120
R2
Resistance of R2
38
47
56
C
Capacitance
VIN = 2.5 VDC, 1 MHz, 30 mV ac
16
20
24
pF
Stand−off Voltage
I = 10 A
6.0
ILEAK
Diode Leakage Current
VBIAS = 3.3 V
0.1
1.0
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
6.8
–0.8
9.0
−0.4
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per IEC 61000−4−2
(Notes 2 and 4)
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2, 3 and 4)
fC1
Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50 R = 100 , C = 20 pF
fC2
Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50 R = 47 , C = 20 pF
VSTANDOFF
VCL
Parameter
Conditions
5.6
−1.5
V
A
V
kV
±25
±10
V
+12
−7
77
85
MHz
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
4. Unused pins are left open.
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3
CM1402
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. A1−C1 EMI Filter Performance
Figure 2. A2−C2 EMI Filter Performance
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4
CM1402
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 3. A3−C3 EMI Filter Performance
Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)
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5
CM1402
APPLICATION INFORMATION
The CM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber
identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card
readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are
exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all
high−frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that
interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram
for the SIM Card Interface.
Note: One channel of the CM1402 with a zener diode is
not shown on the diagram.
Figure 5. Typical Application Diagram for the SIM Card Interface
For best filter and ESD performance, both GND bumps (B1, B2) of the CM1402 should be directly connected to the
Ground plane. A small capacitor of about 1 F is required next to the VCC pin of the SIM connector in order to improve
stability of the SIM card supply rail.
For information on the assembly of the CM1402 to the PCB (printed circuit board), please refer to the Chip Scale Package
(CSP) Application Note AP217, or contact factory at 800−282−9855 for technical support.
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CM1402
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 m
Solder Ball Side Coplanarity
±20 m
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 6. Recommended Non−Solder Mask Defined Pad Illustration
Figure 7. Lead−free (SnAgCu) Solder Ball Reflow Profile
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7
260°C
CM1402
PACKAGE DIMENSIONS
WLCSP10, 1.96x1.33
CASE 567BL−01
ISSUE O
PIN A1
REFERENCE
2X
ÈÈ
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
ÉÉÉÉÉÉ
OptiGuard Option
0.05 C
A2
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05 C
NOTE 3
A1
SIDE VIEW
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.40 REF
0.29
0.35
1.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
C
0.25
SEATING
PLANE
A1
0.25
PACKAGE
OUTLINE
eD
10X
0.05 C A B
0.03 C
0.87
eD/2
b
eE
C
0.44
B
0.50
PITCH
A
1 2 3
4 5 6
10X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1402/D
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