NUF2030XV6 D

NUF2030XV6, NUF2042XV6
USB Upstream Terminator
with ESD Protection
These devices are designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. They are intended
for use in upstream USB ports, cellular phones, wireless equipment
and computer applications. These devices offer an integrated solution
in a small package (SOT−563) reducing PCB space and cost.
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CIRCUIT DESCRIPTION
Features:
• Provides USB Line Termination, Filtering and ESD Protection
• Single IC Offers Cost Savings
• Bidirectional EMI Filtering Prevents Noise from Entering/Leaving
•
•
•
the System
Compliance with IEC61000−4−2 (Level 4)
8 kV (Contact)
15 kV (Air)
ESD Ratings: Machine Model = C
:
Human Body Model = 3B
These are Pb−Free Devices
D1(0)
VBUS
D2(0)
6
5
4
RS
Benefits:
C1
RS
C1
1
2
3
D1(i)
GND
D2(i)
• SOT−563 Package Minimizes PCB Space
• Integrated Circuit Increases System Reliability versus Discrete
•
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
• USB Hubs
• Computer Peripherals Using USB
Symbol
Value
Unit
PD
225
mW
TJ(max)
125
°C
Operating Temperature Range
TJ
−55 to +125
°C
Storage Temperature Range
Tstg
−55 to +125
°C
Lead Solder Temperature
(10 second duration)
TL
260
°C
Steady State Power
Maximum Junction Temperature
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2
1
SOT−563
CASE 463A
MARKING DIAGRAM
MAXIMUM RATINGS (TA = 25°C)
Rating
6
1
1
xx M G
G
xx = Specific Device Code
(see table on page 5)
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Publication Order Number:
NUF2030XV6/D
NUF2030XV6, NUF2042XV6
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
VBR @ 1 mA
(V)
Line Capacitance
Vdc = 2.5 V
f = 1 MHz
(pF) (Note 1)
IR @ 3.3 V
(nA)
VRWM
(V)
Min
Typ
Max
Min
Typ
Max
NUF2030XV6T1
5.25
5.6
6.8
8.0
−
10
NUF2042XV6T1
5.25
5.6
6.8
8.0
−
10
Device
Min
Typ
100
−
100
37.6
Max
Min
Typ
Max
30
36
17.6
22
26.4
42
56.4
17.6
22
26.4
1. Measured between pins 1, 3, 4, 6 and ground with pin 5 also grounded.
2. For other resistance value (e.g. 33 W), please contact your local ON Semiconductor sales representative.
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2
Series Resistor
RS (W)
NUF2030XV6, NUF2042XV6
TYPICAL CHARACTERISTICS
0
0
−10
−5
−20
−30
S41 (dB)
S21 (dB)
−10
−15
−20
−40
−50
−60
−25
−70
−30
1.E+06
1.E+07
1.E+08
1.E+09
−80
1.E+06
1.E+10
1.E+07
FREQUENCY (Hz)
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
Figure 2. Analog Cross−Talk (NUF2030)
Figure 1. Insertion Loss Characteristics
(NUF2030)
0
0
−10
−5
−20
−30
S41 (dB)
S21 (dB)
−10
−15
−20
−40
−50
−60
−25
−70
−30
1.E+06
1.E+07
1.E+08
1.E+09
−80
1.E+06
1.E+10
1.E+07
FREQUENCY (Hz)
1.E+10
Figure 4. Analog Cross−Talk (NUF2042)
80
60
70
CAPACITANCE (pF)
50
CAPACITANCE (pF)
1.E+09
FREQUENCY (Hz)
Figure 3. Insertion Loss Characteristics
(NUF2042)
40
30
20
10
0
1.E+08
60
50
40
30
20
10
0
1
2
3
4
0
5
0
REVERSE VOLTAGE (V)
1
2
3
4
REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance (NUF2042)
Figure 5. Typical Capacitance (NUF2030)
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3
5
NUF2030XV6, NUF2042XV6
24.5
RS = Typical
24.0
RS (W)
23.5
23.0
22.5
22.0
21.5
−20
−10
0
10
20
30
40
50
TEMPERATURE (°C)
Figure 7. RS versus Temperature
(NUF2030 and NUF2042)
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4
60
70
NUF2030XV6, NUF2042XV6
ORDERING INFORMATION
Device
Marking
Package
Shipping †
NUF2030XV6T1
30
SOT−563*
4000 / Tape & Reel
NUF2030XV6T1G
30
SOT−563*
4000 / Tape & Reel
NUF2042XV6T1
22
SOT−563*
4000 / Tape & Reel
NUF2042XV6T1G
22
SOT−563*
4000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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5
NUF2030XV6, NUF2042XV6
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE E
D
−X−
6
5
1
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
A
L
4
3
E
−Y−
DIM
A
b
C
D
E
e
L
HE
HE
b 65 PL
0.08 (0.003)
C
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
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6
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NUF2030XV6/D