STF202 22T1 D

STF202-22T1G
USB Filter with ESD
Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for
use in upstream USB ports, Cellular phones, Wireless equipment and
computer applications. This device offers an integrated solution in a
small package (TSOP−6, Case 318G) reducing PCB space and cost.
CIRCUIT DESCRIPTION
Features:
• Provides USB Line Termination, Filtering and ESD Protection
• Single IC Offers Cost Savings by Replacing 3 Resistors,
•
•
•
•
•
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2 Capacitors, and 5 TVs diodes
Bi−directional EMI Filtering Prevents Noise from Entering/Leaving
the System
IEC61000−4−2 ESD Protection for USB Port
Flexible Pull−down or Pull−up Line Termination to Meet USB 1.1
Low Speed and High Speed Specification
ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
This is a Pb−Free Device
Benefits:
GND
D(OUT)
D(OUT)
6
5
4
C
Rup
2
3
VBUS
D(IN)
D(IN)
6
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
5
3
MARKING DIAGRAM
6
Symbol
Value
Unit
PD
225
mW
TJ(max)
125
°C
Operating Temperature Range
TJ
−55 to +125
°C
Storage Temperature Range
Tstg
−55 to +125
°C
Lead Solder Temperature
(10 second duration)
TL
260
°C
5
4
S22 MG
G
MAXIMUM RATINGS (TA = 25°C)
Maximum Junction Temperature
2
TSOP−6
CASE 318G
STYLE 8
• USB Hubs
• Computer Peripherals Using USB
Steady State Power
4
1
Typical Applications:
Rating
Rs2
1
• TSOP−6 Package Minimizes PCB Space
• Integrated Circuit Increases System Reliability versus Discrete
•
C
Rs1
1
2
3
S22
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device
Package
Shipping†
STF202−22T1G
TSOP−6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
September, 2012 − Rev. 9
1
Publication Order Number:
STF202−22T1/D
STF202−22T1G
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Device
Device
Marking
VRWM
(Volts)
Min
Max
Max IR
@ VRWM
= 5.25 V
VBUS to
GND
(mA)
STF202−22T1G
S22
5.25
6.0
8.0
5.0
VBR @
1 mA
(Volts)
Max IR
@ VRWM
= 3.3 V
I/O Pin
(mA)
Typical Line
Capacitance
(pF)
(Notes 2, 3)
Min
Nom
Max
Min
Nom
Max
1.0
68
20
22
24
1.35
1.5
1.65
Series Resistor
RS (W) (Note 1)
Pull−up Resistor
Rup (kW)
1. For other RS values (i.e. RS = 30 W) contact your local ON Semiconductor sales representative.
2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.
3. For other capacitance values contact your local ON Semiconductor sales representative.
TYPICAL CHARACTERISTICS
10
50
0
40
−10
−20
30
P = −25 dBm
Vdc = 0 V
20
10
(dB)
(dB)
−30
−40
0
−50
−10
−60
−20
−70
−30
−80
−40
−90
0.1
1
10
(MHz)
100
−50
1000
Figure 1. Analog Cross−talk (D+ to D−)
0.1
1
10
(MHz)
100
1000
Figure 2. Insertion Loss Characteristics
1540
22.2
RS− TARGET
1530
22.0
TARGET
1520
Rup (Ohms)
21.8
RS (Ohms)
P = −25 dBm
Vdc = 0 V
21.6
21.4
1510
1500
1490
1480
1470
21.2
1460
21.0
−30 −20 −10
0
10 20 30 40 50
TEMPERATURE (°C)
60
70
1450
−30 −20 −10
80
Figure 3. RS versus Temperature
0
10 20 30 40 50
TEMPERATURE (°C)
60
Figure 4. Rup versus Temperature
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2
70
80
STF202−22T1G
APPLICATIONS BACKGROUND
What Is USB?
The USB is not a serial port, it is a serial bus, a fact that
enables a single port on the computer to be a link for a myriad
of devices, (up to 127 devices in a USB system). We can
easily chain one device to another and use one port as a
connecting point of many devices by using a hub. All these
enables us to look at the USB system as a small network of
devices.
The Universal Serial Bus (USB) makes connecting
devices to your computer faster, easier and virtually
limitless. High−Speed USB devices are capable of
communicating at speeds up to 12 megabits without shutting
down and without having to open your computer.
MONITOR
TELEPHONE
COMPUTER PC
CPU
PLOTTER
KEYBOARD
MOUSE
SCANNER
HUB
PRINTER
Figure 5. Typical USB System
or more USB functions. Most of the devices provide only
one function but there may be some, which provides more
than one and called compound devices. We refer to two
kinds of devices − self powered or bus powered devices. A
device that gets its power from the bus is called bus powered
and on the other hand a device which supplies its own power
is called self powered. There are two kinds of devices:
Full−speed devices − operates in 12 Mb/s
Low−speed devices that work in 1.5 Mb/s
STF202 Device Information
The Universal Serial Bus (USB) specification revision 1.1
requires EMI Filtering and line termination for the USB I/O
lines. The STF202 device from ON Semiconductor
provides upstream termination, EMI Filtering and ESD
Protection to IEC61000−4−2 (Level 4) in an integrated
solution placed in a small and single package (TSOP−6,
Case 318G). The equivalent circuit of this device is shown
in the Figure 6.
Typically the USB system consists of one host, hubs and
devices.
The Host in the USB system, is responsible to the whole
complexity of the protocol (simplifies the designing of USB
devices). The host controls the media access, therefore, no
one can access the bus unless it got an approval required
from the host.
The Hub provides an interconnect point, which enables
many devices to connect to a single USB port. The logical
topology of the USB is a star structure, all the devices are
connected (logically) directly to the host. It is totally
transparent to the device what is its hub tier (the number of
hubs the data has to flow through). The hub is connected to
the USB host in the upstream direction (data flows “up” to
the host) and is connected to the USB device in the
downstream direction (data flows “down” from the host to
the device). The hub’s main functionality is the
responsibility of detecting an attachment and detachment of
devices, handling the power management for devices that
are bus−powered (get power from the bus), and
responsibility for bus error detection and recovery. Another
important role of the hub is to manage both full and low
speed devices. When a device is attached to the system the
hub detects the speed, which the device operates in, and
through the whole communication on the bus prevents from
full speed traffic to reach low speed device and vice versa −
prevent from low speed traffic to reach full speed device.
The Device is defined as everything in the USB system,
which is not a host (including hubs). A device provides one
D
Rpu
RS1
C
GROUND
D
RS2
Figure 6.
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3
C
STF202−22T1G
5V
As previously mentioned, there are two types of
configurations for the USB port which are upstream and
downstream. If your port connects to the host either in a
direct way or through a hub, you are upstream (data flows
“up” to the host) and in the other hand, if you are the host or
your port provides access to the host then you are
downstream (data flows “down” from the host to the
device). In the case of the STF202 device, it provides
upstream termination. The Figure 7 represents the
termination for an upstream USB port.
Peripheral
1
D+
3
STF202
5
D−
4
D+
Figure 8.
Low−Speed Devices
The Pull up resistor (Rpu) is connected to the D− Line. The
terminal 1 is connected to the Voltage Supply Line (VBUS)
while the terminal 6 is connected to ground. The input of the
D− line is connected in the terminal 3 which outputs from the
terminal 4. Finally, the input of the D+ line is connected in
the terminal 2 which outputs from the terminal 5. The Figure
9 shows the connections of the STF202 device for
“Low−Speed devices”.
Rpu
C
2
USB
Controller
GND
VCC
C
D−
6
RS
RS
5V
Peripheral
1
6
USB
Controller
D+
2 STF202
5
D+
D−
3
4
D−
Figure 7.
The USB Line termination is reached through the series
resistors placed in the D+ and D− lines. These resistors
insure the proper termination to maintain the integrity of the
signal. The Pull up Resistor of 1.5 kW on either the D+ or D−
data lines is used to identify the equipment as either
full−speed or low−speed device.
GND
Figure 9.
Connection for Full−Speed
and Low−Speed Devices
As mentioned before, there are two kinds of port devices:
Full−Speed devices − operates in 12 Mb/s
Low−Speed devices that work in 1.5 Mb/s
The STF202 device can be shaped to be used for either
Full−Speed or Low−Speed devices which is achieved as
described below:
Full−Speed Devices
The Pull up resistor (Rpu) is connected to the D+ Line.
The terminal 1 is connected to the Voltage Supply Line
(VBUS) while the terminal 6 is connected to ground. The
input of the D+ line is connected in the terminal 3 which
outputs from the terminal 4. Finally, the input of the D− line
is connected in the terminal 2 which outputs from the
terminal 5. The Figure 8 shows the connections of the
STF202 device for “Full−Speed devices”.
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4
STF202−22T1G
addition to the Line termination and EMI Filtering, it is also
needed to protect the USB I/O Lines against ESD
conditions, so TVS devices must be added for these
purposes.
The Figure 10 describes in a simplified way what the USB
port components are. As shown in this diagram, there are
signals for upstream and downstream ports which must be
provided with Line Termination and EMI Filtering to meet
the requirements of the USB specification revision 1.1. In
CLK
CRISTAL
To
Upstream
Ports
XTAL1
VCC
XTAL2
GND
REGULATOR
DPO
DP1−DP4
D+
DMO
DM1−DM4
D−
OC1−OC4
VBUS
POWER
SWITCHING
PWR1−PWR4
USB Data Lines
and Power to
Downstream
Ports
GND
Figure 10.
As mentioned before, the ON Semiconductor STF202
device provides “upstream termination”, EMI Filtering and
ESD Protection to IEC61000−4−2 in an integrated solution
placed in a small and single package (TSOP−6, Case 318G).
The typical application for the STF202 device is shown in
the Figure 11.
VBUS
VBUS
D+
D−
DOWNSTREAM
TERMINATION
D+
D−
D1D+
D1D−
TVS
6
5
4
STF202
GND
1
POWER
SWITCH
OC
OC
PWR
PWR
VBUS
D+
D−
GND
2
3
DOD+
DOD−
REGULATOR
DOWNSTREAM
TERMINATION
D2D+
D2D−
TVS
USB CONTROLLER
Figure 11.
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5
GND
STF202−22T1G
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
D
ÉÉ
ÉÉ
6
E1
1
NOTE 5
5
2
H
L2
4
GAUGE
PLANE
E
3
L
b
C
DETAIL Z
e
0.05
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
SEATING
PLANE
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
c
A
A1
DETAIL Z
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
STYLE 8:
PIN 1.
2.
3.
4.
5.
6.
Vbus
D(in)D(in)+
D(out)+
D(out)GND
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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For additional information, please contact your local
Sales Representative
STF202−22T1/D