MC14555B D

MC14555B, MC14556B
Dual Binary to 1-of-4
Decoder/Demultiplexer
The MC14555B and MC14556B are constructed with
complementary MOS (CMOS) enhancement mode devices. Each
Decoder/Demultiplexer has two select inputs (A and B), an active low
Enable input (E), and four mutually exclusive outputs (Q0, Q1, Q2,
Q3). The MC14555B has the selected output go to the “high” state,
and the MC14556B has the selected output go to the “low” state.
Expanded decoding such as binary−to−hexadecimal (1−of−16), etc.,
can be achieved by using other MC14555B or MC14556B devices.
Applications include code conversion, address decoding, memory
selection control, and demultiplexing (using the Enable input as a data
input) in digital data transmission systems.
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1
SOIC−16
D SUFFIX
CASE 751B
Features
•
•
•
•
•
•
•
•
Diode Protection on All Inputs
Active High or Active Low Outputs
Expandable
Supply Voltage Range = 3.0 Vdc to 18 Vdc
All Outputs Buffered
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
1
SOEIAJ−16
F SUFFIX
CASE 966
PIN ASSIGNMENTS
EA
1
16
VDD
EA
1
16
VDD
AA
2
15
EB
AA
2
15
EB
BA
3
14
AB
BA
3
14
AB
Q0A
4
13
BB
Q0A
4
13
BB
Q1A
5
12
Q0B
Q1A
5
12
Q0B
Q2A
6
11
Q1B
Q2A
6
11
Q1B
Q3A
7
10
Q2B
Q3A
7
10
Q2B
VSS
8
9
Q3B
VSS
8
9
Q3B
MC14555B
MC14556B
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Value
Unit
VDD
−0.5 to +18.0
V
Vin, Vout
−0.5 to VDD
+ 0.5
V
Input or Output Current (DC or Transient)
per Pin
Iin, Iout
±10
mA
Power Dissipation, per Package (Note 1)
PD
500
mW
Ambient Temperature Range
TA
−55 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (8−Second Soldering)
TL
260
°C
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/°C From 65°C To 125°C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
MARKING DIAGRAMS
16
1455xBG
AWLYWW
1
SOIC−16
16
MC1455xB
ALYWG
1
SOEIAJ−16
x
A
WL, L
YY, Y
WW, W
G
= 5 or 6
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 11
1
Publication Order Number:
MC14555B/D
MC14555B, MC14556B
TRUTH TABLE
Inputs
Enable
BLOCK DIAGRAM
MC14555B
Outputs
Select
MC14555B
MC14556B
E
B
A
Q3 Q2 Q1 Q0 Q3 Q2 Q1 Q0
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
1
1
1
0
1
1
0
1
1
0
1
1
0
1
1
1
1
X
X
0
0
0
0
1
1
1
1
X = Don’t Care
2
A
3
B
1
E
14
A
13
B
15
E
MC14556B
Q0
Q1
Q2
Q3
4
5
6
7
2
A
3
B
1
E
Q0
Q1
Q2
Q3
12
11
10
9
14
A
13
B
15
E
Q0
Q1
Q2
Q3
4
5
6
7
Q0
Q1
Q2
Q3
12
11
10
9
VDD = PIN 16
VSS = PIN 8
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55°C
Symbol
Characteristic
Output Voltage
Vin = VDD or 0
25°C
125°C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
–3.0
–0.64
–1.6
–4.2
−
−
−
−
–2.4
–0.51
–1.3
–3.4
–4.2
–0.88
–2.25
–8.8
−
−
−
−
–1.7
–0.36
–0.9
–2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
±0.1
−
±0.00001
±0.1
−
±1.0
mAdc
Input Capacitance, (Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current (Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (Notes 3, 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
Vin = 0 or VDD
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
IT = (0.85 mA/kHz) f + IDD
IT = (1.70 mA/kHz) f + IDD
IT = (2.60 mA/kHz) f + IDD
mAdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25°C.
4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF,
V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
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2
MC14555B, MC14556B
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25°C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time − A, B to Output
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 62 ns
tPLH, tPHL = (0.5 ns/pF) CL + 45 ns
tPLH,
tPHL
Propagation Delay Time − E to Output
tPLH, tPHL = (1.7 ns/pF) CL + 115 ns
tPLH, tPHL = (0.66 ns/pF) CL + 52 ns
tPLH, tPHL = (0.5 ns/pF) CL + 40 ns
tPLH,
tPHL
VDD
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
220
95
70
440
190
140
5.0
10
15
−
−
−
200
85
65
400
170
130
Unit
ns
ns
ns
5. The formulas given are for the typical characteristics only at 25°C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
INPUT E LOW
20 ns
INPUT A HIGH, INPUT E LOW
20 ns
20 ns
A INPUTS
(50% DUTY CYCLE)
1
2f
90%
50%
10%
VDD
VSS
INPUT B
VDD
tPHL
VSS
B INPUTS
(50% DUTY CYCLE)
VOH
OUTPUT Q1
20 ns
VOL
90%
50%
10%
OUTPUT Q3
MC14556B
tTHL
tPLH
OUTPUT Q3
MC14555B
VOH
VOL
Figure 2. Dynamic Signal Waveforms
*
Q0
A
*
Q1
B
*
Q2
*
Q3
E
3
V
tTLH OL
tTHL
LOGIC DIAGRAM
(1/2 of Dual)
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VOH
tPHL
90%
50%
10%
tTLH
*Eliminated for MC14555B
VSS
tPLH
All 8 outputs connect to respective CL loads.
f in respect to a system clock.
Figure 1. Dynamic Power Dissipation Signal Waveforms
VDD
90%
50%
10%
MC14555B, MC14556B
ORDERING INFORMATION
Package
Shipping†
MC14555BDG
SOIC−16
(Pb−Free)
48 Units / Rail
MC14555BDR2G
SOIC−16
(Pb−Free)
2500 / Tape & Reel
NLV14555BDR2G*
SOIC−16
(Pb−Free)
2500 / Tape & Reel
MC14555BFELG
SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
MC14556BDR2G
SOIC−16
(Pb−Free)
2500 / Tape & Reel
NLV14556BDR2G*
SOIC−16
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC14555B, MC14556B
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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5
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14555B, MC14556B
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966
ISSUE A
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
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Sales Representative
MC14555B/D