INTERSIL CD4502BMS

CD4502BMS
CMOS Strobed Hex Inverter/Buffer
December 1992
Features
Pinout
• High Voltage Type (20V Rating)
CD4502BMS
TOP VIEW
• 2 TTL Load Output Drive Capability
• 3 State Outputs
D3
1
16 VDD
Q3
2
15 D6
D1
3
14 Q6
3 STATE
4
OUTPUT DISABLE
Q1 5
13 D5
D2
6
11 Q5
Q2
7
10 D4
VSS
8
9 Q4
• Common Output Disable Control
• Inhibit Control
• 100% Tested for Quiescent Current at 20V
• 5V, 10V and 15V Parametric Ratings
• Maximum Input Current of 1µA at 18V Over Full Package Temperature Range; 100nA at 18V and +25oC
• Noise Margin (Over Full Package/Temperature Range)
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of
‘B’ Series CMOS Devices”
12 INHIBIT
Functional Diagram
Applications
• 3 State Hex Inverter for Interfacing ICs with Data
Buses
• COS/MOS to TTL Hex Buffer
3 STATE 4
OUTPUT DISABLE
12
INHIBIT
3
D1
Description
D2
CD4502BMS consists of six inverter/buffers with 3 state
outputs. A logic “1” on the OUTPUT DISABLE input
produces a high impedance state in all six outputs. This
feature permits common busing of the outputs, thus
simplifying system design. A Logic “1” on the INHIBIT input
switches all six outputs to logic “0” if the OUTPUT DISABLE
input is a logic “0”. This device is capable of driving two
standard TTL loads, which is equivalent to six times the
JEDEC “B” series IOL standard.
The CD4502BMS is supplied in these 16-lead outline packages:
Braze Seal DIP
Frit Seal DIP
Ceramic Flatpack
H4T
H1F
H6W
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
7-473
D3
D4
D5
D6
6
1
10
13
15
5
7
2
9
11
14
Q1
Q2
Q3
Q4
Q5
Q6
VDD = 16
VSS = 8
File Number
3334
Specifications CD4502BMS
Absolute Maximum Ratings
Reliability Information
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC
Package Types D, F, K, H
Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC
At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for
10s Maximum
Thermal Resistance . . . . . . . . . . . . . . . .
θja
θjc
Ceramic DIP and FRIT Package . . . . . 80oC/W
20oC/W
Flatpack Package . . . . . . . . . . . . . . . . 70oC/W
20oC/W
o
Maximum Package Power Dissipation (PD) at +125 C
For TA = -55oC to +100oC (Package Type D, F, K) . . . . . . 500mW
For TA = +100oC to +125oC (Package Type D, F, K) . . . . . Derate
Linearity at 12mW/oC to 200mW
Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Supply Current
Input Leakage Current
Input Leakage Current
SYMBOL
IDD
IIL
IIH
CONDITIONS (NOTE 1)
VDD = 20V, VIN = VDD or GND
LIMITS
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
1
+25oC
-
2
µA
2
+125 C
-
200
µA
VDD = 18V, VIN = VDD or GND
3
-55oC
-
2
µA
VIN = VDD or GND
1
+25oC
-100
-
nA
2
+125oC
-1000
-
nA
VDD = 18V
3
-55oC
-100
-
nA
VDD = 20
1
+25oC
-
100
nA
2
+125oC
-
1000
nA
3
-55oC
-
100
nA
-
50
mV
VIN = VDD or GND
VDD = 20
VDD = 18V
o
Output Voltage
VOL15
VDD = 15V, No Load
1, 2, 3
+25oC,
+125oC,
-55oC
Output Voltage
VOH15
VDD = 15V, No Load (Note 3)
1, 2, 3
+25oC, +125oC, -55oC 14.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1
+25oC
3.06
-
mA
Output Current (Sink)
IOL10
VDD = 10V, VOUT = 0.5V
1
+25oC
7.8
-
mA
Output Current (Sink)
IOL15
VDD = 15V, VOUT = 1.5V
1
+25oC
20.4
-
mA
Output Current (Source)
IOH5A
VDD = 5V, VOUT = 4.6V
1
+25oC
-
-0.53
mA
Output Current (Source)
IOH5B
VDD = 5V, VOUT = 2.5V
1
+25oC
-
-1.8
mA
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1
+25oC
-
-1.4
mA
mA
Output Current (Source)
IOH15
VDD = 15V, VOUT = 13.5V
1
+25oC
-
-3.5
N Threshold Voltage
VNTH
VDD = 10V, ISS = -10µA
1
+25oC
-2.8
-0.7
V
P Threshold Voltage
VPTH
VSS = 0V, IDD = 10µA
1
+25oC
0.7
2.8
V
VDD = 2.8V, VIN = VDD or GND
7
+25oC
VDD = 20V, VIN = VDD or GND
7
+25oC
VDD = 18V, VIN = VDD or GND
8A
+125oC
VDD = 3V, VIN = VDD or GND
8B
-55oC
Functional
F
VOH > VOL <
VDD/2 VDD/2
V
Input Voltage Low
(Note 2)
VIL5
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
+25oC, +125oC, -55oC
-
1.5
V
Input Voltage High
(Note 2)
VIH5
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
+25oC, +125oC, -55oC
3.5
-
V
Input Voltage Low
(Note 2)
VIL15
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3
+25oC, +125oC, -55oC
-
4
V
Input Voltage High
(Note 2)
VIH15
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3
+25oC, +125oC, -55oC
11
-
V
Tri-State Output
Leakage
IOZL
VIN = VDD or GND
VOUT = 0V
1
+25oC
-0.4
-
µA
Tri-State Output
Leakage
IOZH
VIN = VDD or GND
VOUT = VDD
VDD = 20V
2
+125oC
-12
-
µA
VDD = 18V
3
-55oC
-0.4
-
µA
VDD = 20V
1
+25oC
-
0.4
µA
2
+125oC
-
12
µA
3
-55oC
-
0.4
µA
VDD = 18V
NOTES: 1. All voltages referenced to device GND, 100% testing being
implemented.
2. Go/No Go test with limits applied to inputs.
7-474
3. For accuracy, voltage is measured differentially to VDD. Limit
is 0.050V max.
Specifications CD4502BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Propagation Delay
Data or Inhibit to Output
SYMBOL
TPHL1
Propagation Delay
Data or Inhibit to Output
TPLH1
Propagation Delay
Inhibit to Output
TPHL2
Propagation Delay
Inhibit to Output
TPLH2
Propagation Delay
Disable to Output
TPHZ
Propagation Delay
Disable to Output
TPZH
Propagation Delay
Disable to Output
TPLZ
Propagation Delay
Disable to Output
TPZL
Transition Time
TTHL
Transition Time
GROUP A
SUBGROUPS TEMPERATURE
CONDITIONS
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
VDD = 5V, VIN = VDD or GND
(Note 2, 3)
VDD = 5V, VIN = VDD or GND
(Note 2, 3)
VDD = 5V, VIN = VDD or GND
(Note 2, 3)
VDD = 5V, VIN = VDD or GND
(Note 2, 3)
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
TTLH
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
LIMITS
MIN
MAX
UNITS
-
270
ns
-
365
ns
-
380
ns
-
513
ns
-
270
ns
-
365
ns
-
380
ns
-
513
ns
-
120
ns
-
162
ns
-
220
ns
-
297
ns
-
250
ns
-
338
ns
-
250
ns
-
338
ns
-
120
ns
-
162
ns
-
200
ns
-
270
ns
NOTES:
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
2. -55oC and +125oC limits guaranteed, 100% testing being implemented.
3. VDD = 5V, CL = 50pF, RL = 1K, Input TR, TF < 20ns.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
Supply Current
SYMBOL
IDD
CONDITIONS
NOTES
VDD = 5V, VIN = VDD or GND
1, 2
TEMPERATURE
-55oC,
+25oC
+125oC
VDD = 10V, VIN = VDD or GND
1, 2
-55oC,
+25oC
+125oC
VDD = 15V, VIN = VDD or GND
Output Voltage
VOL
VDD = 5V, No Load
1, 2
1, 2
MIN
MAX
UNITS
-
1
µA
-
30
µA
-
2
µA
-
60
µA
-
2
µA
+125oC
-
120
µA
+25oC, +125oC,
-
50
mV
-55oC,
+25oC
-55oC
Output Voltage
VOL
VDD = 10V, No Load
1, 2
+25oC, +125oC,
-55oC
-
50
mV
Output Voltage
VOH
VDD = 5V, No Load
1, 2
+25oC, +125oC,
-55oC
4.95
-
V
Output Voltage
VOH
VDD = 10V, No Load
1, 2
+25oC, +125oC,
-55oC
9.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1, 2
+125oC
2.16
-
mA
-55oC
3.84
-
mA
7-475
Specifications CD4502BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
LIMITS
PARAMETER
Output Current (Sink)
Output Current (Sink)
Output Current (Source)
Output Current (Source)
Output Current (Source)
Output Current (Source)
SYMBOL
IOL10
IOL15
IOH5A
IOH5B
IOH10
IOH15
CONDITIONS
VDD = 10V, VOUT = 0.5V
VDD = 15V, VOUT = 1.5V
NOTES
TEMPERATURE
1, 2, 4
+125oC
5.4
-
mA
-55oC
9.6
-
mA
1, 2, 4
VDD = 5V, VOUT = 4.6V
1, 2
VDD = 5V, VOUT = 2.5V
1, 2
VDD = 10V, VOUT = 9.5V
1, 2
VDD =15V, VOUT = 13.5V
1, 2
MIN
MAX
UNITS
+125oC
14.4
-
mA
-55oC
25.2
-
mA
+125oC
-
-0.36
mA
-55oC
-
-0.64
mA
+125oC
-
-1.15
mA
-55oC
-
-2.0
mA
o
+125 C
-
-0.9
mA
-55oC
-
-1.6
mA
+125oC
-
-2.4
mA
-55oC
-
-4.2
mA
Input Voltage Low
VIL
VDD = 10V, VOH > 9V,
VOL < 1V
1, 2
+25oC, +125oC,
-55oC
-
3
V
Input Voltage High
VIH
VDD = 10V, VOH > 9V,
VOL < 1V
1, 2
+25oC, +125oC,
-55oC
+7
-
V
Propagation Delay
Data to Output
TPHL1
VDD = 10V
1, 2, 3
+25oC
-
120
ns
VDD = 15V
1, 2, 3
+25oC
-
80
ns
VDD = 10V
1, 2, 3
+25oC
-
180
ns
VDD = 15V
1, 2, 3
+25oC
-
130
ns
VDD = 10V
1, 2, 3
+25oC
-
120
ns
VDD = 15V
1, 2, 3
+25oC
-
80
ns
VDD = 10V
1, 2, 3
+25oC
-
180
ns
VDD = 15V
1, 2, 3
+25oC
-
130
ns
VDD = 10V
1, 2, 4
+25oC
-
80
ns
VDD = 15V
1, 2, 4
+25oC
-
60
ns
VDD = 10V
1, 2, 4
+25oC
-
100
ns
VDD = 15V
1, 2, 4
+25oC
-
80
ns
VDD = 10V
1, 2, 4
+25oC
-
130
ns
VDD = 15V
1, 2, 4
+25oC
-
110
ns
VDD = 10V
1, 2, 4
+25oC
-
110
ns
VDD = 15V
1, 2, 4
+25oC
-
80
ns
VDD = 10V
1, 2, 3
+25oC
-
60
ns
VDD = 15V
1, 2, 3
+25oC
-
40
ns
VDD = 10V
1, 2, 3
+25oC
-
100
ns
VDD = 15V
1, 2, 3
+25oC
-
80
ns
1, 2
+25oC
-
7.5
pF
Propagation Delay
Data to Output
Propagation Delay
Inhibit to Output
Propagation Delay
Inhibit to Output
Propagation Delay
Disable to Output
Propagation Delay
Disable to Output
Propagation Delay
Disable to Output
Propagation Delay
Disable to Output
Transition Time
Transition Time
Input Capacitance
TPLH1
TPHL2
TPLH2
TPHZ
TPZH
TPLZ
TPZL
TTHL
TTLH
CIN
Any Inputs
NOTES:
1. All voltages referenced to device GND.
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized
on initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
4. CL = 50pF, RL = 1K, Input TR, TF < 20ns.
7-476
Specifications CD4502BMS
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
MIN
MAX
UNITS
IDD
VDD = 20V, VIN = VDD or GND
1, 4
+25oC
-
7.5
µA
1, 4
+25oC
-2.8
-0.2
V
VDD = 10V, ISS = -10µA
1, 4
+25oC
-
±1
V
VSS = 0V, IDD = 10µA
1, 4
+25oC
0.2
2.8
V
1, 4
+25oC
-
±1
V
1
+25oC
VOH >
VDD/2
VOL <
VDD/2
V
1, 2, 3, 4
+25oC
-
1.35 x
+25oC
Limit
ns
Supply Current
N Threshold Voltage
VNTH
N Threshold Voltage
Delta
∆VTN
P Threshold Voltage
VTP
P Threshold Voltage
Delta
∆VTP
Functional
F
VDD = 10V, ISS = -10µA
VSS = 0V, IDD = 10µA
VDD = 18V, VIN = VDD or GND
VDD = 3V, VIN = VDD or GND
Propagation Delay Time
TPHL
TPLH
VDD = 5V
3. See Table 2 for +25oC limit.
NOTES: 1. All voltages referenced to device GND.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
4. Read and Record
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25oC
PARAMETER
SYMBOL
DELTA LIMIT
Supply Current - MSI-1
IDD
± 0.2µA
Output Current (Sink)
IOL5
± 20% x Pre-Test Reading
IOH5A
± 20% x Pre-Test Reading
Output Current (Source)
TABLE 6. APPLICABLE SUBGROUPS
MIL-STD-883
METHOD
GROUP A SUBGROUPS
Initial Test (Pre Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 1 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 2 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
100% 5004
1, 7, 9, Deltas
CONFORMANCE GROUP
PDA (Note 1)
Interim Test 3 (Post Burn-In)
100% 5004
1, 7, 9
100% 5004
1, 7, 9, Deltas
100% 5004
2, 3, 8A, 8B, 10, 11
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Subgroup B-5
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroup B-6
Sample 5005
1, 7, 9
Sample 5005
1, 2, 3, 8A, 8B, 9
PDA (Note 1)
Final Test
Group A
Group B
Group D
READ AND RECORD
IDD, IOL5, IOH5A
Subgroups 1, 2, 3, 9, 10, 11
Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
Group E Subgroup 2
TEST
READ AND RECORD
MIL-STD-883
METHOD
PRE-IRRAD
POST-IRRAD
PRE-IRRAD
POST-IRRAD
5005
1, 7, 9
Table 4
1, 9
Table 4
7-477
Specifications CD4502BMS
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
OSCILLATOR
FUNCTION
OPEN
GROUND
VDD
Static Burn-In 1
Note 1
2, 5, 7, 9, 11, 14
1, 3, 4, 6, 8, 10, 12,
13, 15
16
Static Burn-In 2
Note 1
2, 5, 7, 9, 11, 14
8
1, 3, 4, 6, 10, 12,
13, 15, 16
Dynamic BurnIn Note 1
-
8
16
2, 5, 7, 9, 11, 14
8
1, 3, 4, 6, 10, 12,
13, 15, 16
Irradiation
Note 2
9V ± -0.5V
50kHz
25kHz
2, 5, 7, 9, 11, 14
4
1, 3, 6, 10, 12, 13,
15
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V
Logic Diagram
INVERTER/BUFFER NO. 1
TRUTH TABLE
VDD
DI *
3-STATE
OUTPUT *
DISABLE
DISABLE
INHIBIT
Dn
Qn
0
0
0
1
0
0
1
0
0
1
X
0
1
X
X
Z
Q1
INHIBIT *
VSS
VDD
TO 5 OTHER
INVERTER/BUFFERS
Logic 0 = Low
Logic 1 = High
* ALL INPUTS ARE PROTECTED
Z = High Impedance
BY CMOS PROTECTION
NETWORK
X = Don’t Care
VSS
FIGURE 1. LOGIC DIAGRAM OF 1 OF 6 IDENTICAL INVERTER/BUFFERS
Test Circuit and Waveform
VDD
D3
Q3
D1
PULSE
GENERATOR
DISABLE
Q1
D2
Q2
VSS
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VDD
0.01kµF
D6
1kΩ
Q6
A
D5
CL
INHIBIT
Q5
50%
50%
D4
Q4
tPZL
90%
tPLZ
10%
VOL
90%
VOH
TEST CONDITIONS
TEST
PIN 15
POINT A
tPHZ
VSS
VSS
tPLZ
VDD
VDD
tPZL
VDD
VDD
tPZH
VSS
VSS
tPHZ
FIGURE 2. DISABLE DELAY TIMES TEST CIRCUIT AND WAVEFORMS
7-478
VDD
10%
tPZH
VSS
30
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
25
20
15
10V
10
5
5V
0
AMBIENT TEMPERATURE (TA) = +25oC
15.0
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
12.5
10.0
10V
7.5
5.0
2.5
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
5V
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-15
-10
-5
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-15
-10
-5
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
-5
-10
-15
-10V
-20
-25
-15V
-30
-5
-10V
DISSIPATION PER INVERTER/BUFFER (PD) (µW)
OUTPUT VOLTAGE (VO) (V)
15
10V
10
5V
5
105
8
6
4
SUPPLY VOLTAGE (VDD) = 15V
2
10V
10V
104
5V
8
6
4
103
CL = 50pF
CL = 15pF
2
8
6
4
2
102
8
6
4
2
AMBIENT TEMPERATURE (TA) = +25oC
10
2
20
-15
FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
SUPPLY VOLTAGE (VDD) = 15V
10
15
INPUT VOLTAGE (VI) (V)
-10
-15V
AMBIENT TEMPERATURE (TA) = +25oC
5
0
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
0
0
AMBIENT TEMPERATURE (TA) = +25oC
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
0
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
AMBIENT TEMPERATURE (TA) = +25oC
1/6 OUTPUT LOW (SINK) CURRENT (IOL) (mA)
1/6 OUTPUT LOW (SINK) CURRENT (IOL) (mA)
Typical Performance Characteristics
100
25
FIGURE 7. TYPICAL VOLTAGE TRANSFER CHARACTERISTICS
7-479
4 68
2
4 6 8
2
4 6 8
101
102
103
INPUT FREQUENCY (fI) (kHz)
2
4 6 8
104
FIGURE 8. TYPICAL POWER DISSIPATION AS A FUNCTION
OF INPUT FREQUENCY
CD4502BMS
(Continued)
PROPAGATION DELAY TIME (tPLH, tPHL) (ns)
Typical Performance Characteristics
TRANSITION TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (TA) = +25oC
150
SUPPLY VOLTAGE (VDD) = 5V (tTLH)
100
5V (tTLH)
10V (tTLH)
50 15V (tTLH)
10V (tTHL)
15V (tTLH)
0
20
40
60
80
100
AMBIENT TEMPERATURE (TA) = +25oC
250
SUPPLY VOLTAGE (VDD) = 5V (tPLH)
200
5V (tPHL)
150
10V (tPLH)
100 15V (tPLH)
50 10V (tPHL)
15V (tPHL)
0
LOAD CAPACITANCE (CL) (pF)
20
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
FIGURE 9. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
FIGURE 10. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION:
PASSIVATION:
Thickness: 11kÅ − 14kÅ,
AL.
10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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