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Colligo System on Module
10/01/2016
-Confidential-
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Customer Challenges
Time to Market
Rapid technology changes force us to introduce new products on a constant
basis
Embedding new technologies is always challenging and time consuming
Costs
Embedding new solutions bear high expenses at the design and development
stages
Lack of resources
Limited engineering resources
Knowhow
Complexity
Valens Colligo SoM
The Colligo System on Module (SoM) is a small form-factor, surface
mount module that consists of the entire* HDBaseT system
RX SoM
TX SoM
* For maximum flexibility, the transformer and connectors are excluded
SoM Bottom
SoM w/Cover
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Customer Benefits
Faster Time to Market
Pre-validated
Fully Featured
Shortens development time
Saves cost and reduces risk
Reduces development risks and costs
Lowers the system costs
Enables you to test the market with minimal investments
Efficiency
Frees up your most valuable resource to work on other tasks
Enables you to introduce the exact feature set you need
Straightforward
Key Features
Small Form Factor: 50mm x 50mm x 7mm
Pre-validated, Pre-CTS certified
Same pinout for both TX & RX Modules
Single module with over 250 components
Single Supply Voltage (5V - 12V)
Optimized carrier board design
Carrier can be implemented using 4 layer PCB
Same carrier for both TX & RX Modules
Increased flexibility
Modular design - enables faster spins for the carrier (application) boards
Exposes all interfaces that are available at the chip level
Connectors and magnetics are excluded
Module Interfaces
USB
HDMI
HDBaseT
MISC
MISC
HDBaseT
HDMI
USB
JTAG
RMII
RMII
JTAG
I2C
SPI
I2C
SPI
GPIO/MSIO
GPIO/MSIO
SGMII
MII
MII
HDIO
HDIO
HDII
HDII
HDIO
MII
HDII
SGMII
BOTTOM
HDIO
HDII
MII
Colligo Module Assembly
Shield
frame
Module PCB
Colligo
Colligo Module Assembly
Module assembled on Carrier Board
Shield
frame
Module PCB
Carrier board
Colligo
Colligo Module Assembly
Module assembled on Carrier Board
Thermal Pad added
Thermal pad
Shield
frame
Module PCB
Carrier board
Colligo
Colligo Module Assembly
Module assembled on Carrier Board
Thermal Pad added
Metal shield assembled
Thermal pad
shield
Shield
frame
Module PCB
Carrier board
Colligo
Module Thermal Design
Designed for heat dissipation from both top and bottom
shield
Module PCB
Mother board
VS2
Shield
frame
Module Thermal Design
Designed for heat dissipation from both top and bottom
Bottom – using thermal pad
shield
Module PCB
Shield
frame
VS2
Mother board
Product metal case
Thermal pad
Module Thermal Design
Designed for heat dissipation from both top and bottom
Bottom – using thermal pad
Top – using thermal pad and module’s shield
Thermal pad
shield
Module PCB
Shield
frame
VS2
Mother board
Product metal case
Thermal pad
Colligo Module TX Placement
HDBT LINK LED(1)
HDMI HDCP LED(1)
FW LED(1)
RESETN(1)
VSMS_RX_LVTTL(1)
VSMS 3V3(1)
VSMS_TX_LVTTL(1)
GND(1)
RMII_MAC_CLK(1)
(1)
RMII_MAC_RXD0(1)
RMII_MAC_TXEN(1)
RMII_MAC_TXD0
RMII_MAC_RXDV(1)
CFG_SDA(1)
RMII_MAC_RXD1(1)
RMII_MAC_TXD1(1)
VS2-MDL1 TX – REV A
(TOP-SIDE)
HDBT
ESD
CFG_SCL(1)
GMII_MDC(1)
USB
12Mhz XTAL
25Mhz XTAL
(assembly option with 125Mhz Osc.)
GMII_MDIO(1)
VS2-23XXX TX
Flash Ext.
Buffer
125Mhz OSC.
(assembly option with 25Mhz XTAL.)
Flash
DCDC 1.0V
(1)
SMD Test Points
DCDC 1.8V
DCDC 3.3V
Colligo Module RX Placement
HDBT LINK LED(1)
HDMI HDCP LED(1)
FW LED(1)
RESETN(1)
VSMS_RX_LVTTL(1)
VSMS 3V3(1)
VSMS_TX_LVTTL(1)
GND(1)
VS2-MDL1 RX – REV A
(TOP-SIDE)
HDBT
ESD
CFG_SDA(1)
CFG_SCL(1)
USB
12Mhz XTAL
25Mhz XTAL
(assembly option with 125Mhz Osc.)
VS2-23XXX RX
Flash Ext.
Buffer
125Mhz OSC.
(assembly option with 25Mhz XTAL.)
Flash
MII_RXD_ST5(1)
DCDC 1.0V
(1)
SMD Test Points
DCDC 1.8V
DCDC 3.3V
HDMI Extender Application
Minimal additional BOM
4-layer PCB
No need for power management
LEDS
PWR
DBG/RIF
Transformer
ESD
ESD
HDMI & USB Extender Application
Minimal additional BOM
4-layer PCB
No need for power management
With USB interface
LEDS
PWR
DBG/RIF
ESD
Transformer
ESD
ESD
Carrier for HDMI + USB – Example
Connectors
HDMI, HDBaseT, USB and DC
Indicators (optional)
LEDs for Power, Link, Video/HDCP, FW activity
Dimensions – 130mm x 66mm
4 layers – lower cost
Same PCB design for TX / RX
Carrier Board Placement - Top
J1
19
20
J2
1 19
2 20
J4
EXT 1.8V
J5
-
-
1 3 5 7
2 46 8
J8
VS2XXX RX / TX
MDL1
19
HDII
4 3 2 1
15
16
1
2
15
16
1
2
J16
(micro-B) Assembly option
I2C_HOST
POR_BYPASS
2
1
20
19
J17
2
1
20
19
J18
D5 D10 D7 D9
DC JACK
1 2 3 J12
J14
J13
J11
J10
1 2 3 4
J9
5 1
USB Host
J3
1 2 3 4 J7
1
HDMI
In/OUT
(Type-A) Assembly option
-
1 2 3 4 J6
HDBT
Transformer
USB Device
1
2
+
SW1
JR1
HDBT
RJ-45
Reset
Pushbutton
+
DEBUG
EXT 1.0V
RIF_UART
+
EXT 3.3V
VS2-CRR1-MDL1 – REVA
(TOP)
LED HDMI HDCP
LED HDBT LINK
LED FW
LED POWER
Carrier Board Placement - Bottom
VS2-CRR1-MDL1 – REVA
(BOT)
J19
HDIO
Use-Cases: Projector & Matrix
Adding HDBaseT support using minimal design effort
Use-Cases: Industrial PC
Adding HDBaseT support using minimal design effort
Thank You
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