Data Sheet

NZH series
Single Zener diodes
Rev. 01 — 27 January 2010
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
1.2 Features
„ Total power dissipation: ≤ 500 mW
„ Wide working voltage range
„ Small plastic package suitable for
surface-mounted design
„ Low differential resistance
1.3 Applications
„ General regulation functions
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 10 mA
[1]
-
-
0.9
V
Ptot
total power dissipation
Tamb ≤ 25 °C
[2]
-
-
500
mW
[3]
-
-
1
W
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
NZH series
NXP Semiconductors
Single Zener diodes
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
2
1
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
NZH3V0B to
NZH30C[1]
[1]
Package
Name
Description
Version
-
plastic surface-mounted package; 2 leads
SOD123F
The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
4. Marking
Table 4.
Marking codes
Type number
Marking code
Type number
Marking code
NZH3V0B
CH
NZH10C
CW
NZH3V3A
CJ
NZH11C
CX
NZH3V6B
CK
NZH12B
CY
NZH3V9B
CL
NZH13B
D9
NZH4V3B
CM
NZH15B
D1
NZH4V7B
CN
NZH16C
D2
NZH5V1B
CP
NZH18C
D3
NZH5V6B
CQ
NZH20C
D4
NZH6V2B
CR
NZH22C
D5
NZH6V8B
CS
NZH24C
D6
NZH7V5C
CT
NZH27C
D7
NZH8V2B
CU
NZH30C
DA
NZH9V1B
CV
-
-
NZH_SER_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
2 of 9
NZH series
NXP Semiconductors
Single Zener diodes
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
IF
forward current
Tamb ≤ 25 °C
total power dissipation
Ptot
Min
Max
Unit
-
250
mA
[1]
-
500
mW
[2]
-
1
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
in free air
Rth(j-sp)
[1]
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1]
-
-
250
K/W
[2]
-
-
125
K/W
[3]
-
-
70
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[3]
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Conditions
forward voltage
VF
[1]
Parameter
[1]
IF = 10 mA
Min
Typ
Max
Unit
-
-
0.9
V
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
Table 8.
Characteristics per type; NZH3V0B to NZH10C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage
VZ (V);
IZ = 20 mA
Maximum differential
resistance
rdif (Ω)
Min
Max
IZ = 1 mA
IZ = 20 mA Max
VR (V)
Max
3V0B
2.85
3.15
1000
80
50
1
450
3V3A
3.16
3.38
1000
70
20
1
450
3V6B
3.42
3.78
1000
60
5
1
450
3V9B
3.71
4.10
1000
50
5
1
450
NZH_SER_1
Product data sheet
Reverse current
IR (μA)
Diode
capacitance
Cd (pF)[1]
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
3 of 9
NZH series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; NZH3V0B to NZH10C …continued
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage
VZ (V);
IZ = 20 mA
Min
Max
IZ = 1 mA
IZ = 20 mA Max
VR (V)
Max
4V3B
4.17
4.43
1000
40
5
1
450
4V7B
4.55
4.80
900
25
5
1
300
5V1B
4.94
5.20
800
20
5
1.5
300
5V6B
5.45
5.73
500
13
5
2.5
300
6V2B
5.96
6.27
300
10
5
3
200
6V8B
6.49
6.83
150
8
2
3.5
200
7V5C
7.29
7.67
120
8
0.5
4
150
8V2B
8.02
8.36
120
8
0.5
5
150
9V1B
8.85
9.23
120
8
0.5
6
150
10C
9.70
10.20
120
8
0.2
7
90
[1]
Maximum differential
resistance
rdif (Ω)
Reverse current
IR (μA)
Diode
capacitance
Cd (pF)[1]
f = 1 MHz; VR = 0 V
Table 9.
Characteristics per type; NZH11C to NZH20C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage
VZ (V);
IZ = 10 mA
Maximum differential
resistance
rdif (Ω)
Min
Max
IZ = 1 mA
IZ = 10 mA Max
VR (V)
Max
10.82
11.38
120
10
0.04
8
85
12B
11.44
12.03
110
12
0.04
9
85
13B
12.35
13.65
110
14
0.04
10
80
15B
14.25
15.75
110
16
0.04
11
75
16C
15.69
16.51
150
18
0.04
12
75
18C
17.42
18.33
150
23
0.04
13
70
20C
19.23
20.22
200
28
0.04
15
60
11C
[1]
Reverse current
IR (μA)
Diode
capacitance
Cd (pF)[1]
f = 1 MHz; VR = 0 V
Table 10. Characteristics per type; NZH22C to NZH30C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage
VZ (V);
IZ = 5 mA
Maximum differential
resistance
rdif (Ω)
Reverse current
IR (μA)
Diode
capacitance
Cd (pF)[1]
Min
Max
IZ = 1 mA
IZ = 5 mA
Max
VR (V)
Max
22C
21.08
22.17
200
30
0.04
17
60
24C
23.12
24.31
200
35
0.04
19
55
27C
25.63
26.95
250
45
0.04
21
50
30C
28.50
31.50
250
55
0.04
23
50
[1]
f = 1 MHz; VR = 0 V
NZH_SER_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
4 of 9
NZH series
NXP Semiconductors
Single Zener diodes
mbg781
300
IF
(mA)
200
100
0
0.6
0.8
1
VF (V)
Tj = 25 °C
Fig 1.
Forward current as a function of forward voltage; typical values
006aac010
50
VZ(nom) (V) = 3.0
IZ
(mA)
IZ
(mA)
25
3.3
3.6
3.9
40
006aac011
30
5.1
6.2
20
9.1
7.5
5.6
6.8
13
VZ(nom) (V) = 12
30
15
16
8.2
15
20
10
10
5
0
0
2
4
6
8
0
7.5
10
10.0
VZ (V)
17.5
Tj = 25 °C
Working current as a function of working
voltage; typical values
Fig 3.
Working current as a function of working
voltage; typical values
NZH_SER_1
Product data sheet
15.0
VZ (V)
Tj = 25 °C
Fig 2.
12.5
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
5 of 9
NZH series
NXP Semiconductors
Single Zener diodes
8. Package outline
1.7
1.5
1.2
1.0
1
0.55
0.35
3.6
3.4
2.7
2.5
2
0.25
0.10
0.70
0.55
Dimensions in mm
Fig 4.
04-11-29
Package outline SOD123F
9. Packing information
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
NZH3V0B to
NZH30C[2]
Package
SOD123F
Description
Packing quantity
4 mm pitch, 8 mm tape and reel
[1]
For further information and the availability of packing methods, see Section 13.
[2]
The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
3000
10000
-115
-135
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5.
Reflow soldering footprint SOD123F
NZH_SER_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
6 of 9
NZH series
NXP Semiconductors
Single Zener diodes
11. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NZH_SER_1
20100127
Product data sheet
-
-
NZH_SER_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
7 of 9
NZH series
NXP Semiconductors
Single Zener diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NZH_SER_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 27 January 2010
8 of 9
NZH series
NXP Semiconductors
Single Zener diodes
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
3
3
3
6
6
6
7
8
8
8
8
8
8
9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 27 January 2010
Document identifier: NZH_SER_1
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