Data Sheet

PZUxBA series
Single Zener diodes
Rev. 01 — 19 September 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
n Non-repetitive peak reverse power
dissipation: PZSM ≤ 40 W
n Total power dissipation: Ptot ≤ 320 mW
n Tolerance series:
B: approximately ±5 %;
B1, B2, B3: approximately ±2 %
n Wide working voltage range:
nominal 2.4 V to 36 V (E24 range)
n Low reverse current IR range
n Small plastic package suitable for
surface-mounted design
n AEC-Q101 qualified
1.3 Applications
n General regulation functions
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
forward voltage
VF
PZSM
non-repetitive peak reverse
power dissipation
Ptot
total power dissipation
Conditions
IF = 100 mA
Tamb ≤ 25 °C
Min
Typ
Max
Unit
[1]
-
-
1.1
V
[2]
-
-
40
W
[3]
-
-
320
mW
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
[3]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PZUxBA series
NXP Semiconductors
Single Zener diodes
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PZU2.4BA to
PZU36BA[1]
Package
Name
Description
Version
SC-76
plastic surface-mounted package; 2 leads
SOD323
PZU2.4BA/DG to
PZU36BA/DG[1][2]
[1]
The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.
[2]
/DG: halogen-free
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
2 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
4. Marking
Table 4.
Marking codes
Type number[1]
Type number[1]
Marking code
B
B1
B2
B3
PZU2.4*A
X8
-
-
-
PZU2.7*A
X9
XA
XB
PZU3.0*A
XT
XU
XV
PZU3.3*A
XW
XX
PZU3.6*A
XZ
PZU3.9*A
PZU4.3*A
B
B1
B2
B3
PZU2.4*A/DG
Y8
-
-
-
-
PZU2.7*A/DG
Y9
YA
YB
-
-
PZU3.0*A/DG
YT
YU
YV
-
XY
-
PZU3.3*A/DG
YW
YX
YY
-
MC
MD
-
PZU3.6*A/DG
YZ
NC
ND
-
ME
MF
MG
-
PZU3.9*A/DG
NE
NF
NG
-
MM
MN
MP
MR
PZU4.3*A/DG
NM
NN
NP
NR
PZU4.7*A
MS
MT
MU
MV
PZU4.7*A/DG
NS
NT
NU
NV
PZU5.1*A
MW
MX
MY
MZ
PZU5.1*A/DG
NW
NX
NY
NZ
PZU5.6*A
LF
LG
LH
LK
PZU5.6*A/DG
RF
RG
RH
RK
PZU6.2*A
LL
LM
LN
LP
PZU6.2*A/DG
RL
RM
RN
RP
PZU6.8*A
LR
LS
LT
LU
PZU6.8*A/DG
RR
RS
RT
RU
PZU7.5*A
LV
LW
LX
LY
PZU7.5*A/DG
RV
RW
RX
RY
PZU8.2*A
LZ
CR
CS
CT
PZU8.2*A/DG
RZ
ER
ES
ET
PZU9.1*A
CU
CV
CW
CX
PZU9.1*A/DG
EU
EV
EW
EX
PZU10*A
VA
VB
VC
VD
PZU10*A/DG
WA
WB
WC
WD
PZU11*A
VE
VF
VG
VH
PZU11*A/DG
WE
WF
WG
WH
PZU12*A
VK
VL
VM
VN
PZU12*A/DG
WK
WL
WM
WN
PZU13*A
VP
VR
VS
VT
PZU13*A/DG
WP
WR
WS
WT
PZU14*A
-
-
VU
-
PZU14*A/DG
-
-
WU
-
PZU15*A
VV
VW
VX
VY
PZU15*A/DG
WV
WW
WX
WY
PZU16*A
VZ
X1
X2
X3
PZU16*A/DG
WZ
Y1
Y2
Y3
PZU18*A
X4
X5
X6
X7
PZU18*A/DG
Y4
Y5
Y6
Y7
PZU20*A
XC
XD
XE
XF
PZU20*A/DG
YC
YD
YE
YF
PZU22*A
XG
XH
XK
XL
PZU22*A/DG
YG
YH
YK
YL
PZU24*A
XM
XN
XP
XR
PZU24*A/DG
YM
YN
YP
YR
PZU27*A
XS
-
-
-
PZU27*A/DG
YS
-
-
-
PZU30*A
MH
-
-
-
PZU30*A/DG
NH
-
-
-
PZU33*A
MK
-
-
-
PZU33*A/DG
NK
-
-
-
PZU36*A
ML
-
-
-
PZU36*A/DG
NL
-
-
-
[1]
* = B: tolerance series B, approximately ±5 %
* = B1, B2, B3: tolerance series B1, B2, B3: approximately ±2 %
PZUXBA_SER_1
Product data sheet
Marking code
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
3 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
IF
forward current
Conditions
Min
Max
Unit
mA
-
200
-
see
Table 8
and 9
IZSM
non-repetitive peak reverse
current
[1]
PZSM
non-repetitive peak reverse
power dissipation
[1]
-
40
W
Ptot
total power dissipation
[2]
-
320
mW
[3]
-
490
mW
Tamb ≤ 25 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1]
-
-
390
K/W
[2]
-
-
255
K/W
[3]
-
-
55
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3]
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
VF
[1]
Parameter
Conditions
Min
Typ
Max
Unit
IF = 10 mA
-
-
0.9
V
IF = 100 mA
-
-
1.1
V
[1]
forward voltage
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
4 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; PZU2.4BA to PZU5.6B3A and PZU2.4BA/DG to PZU5.6B3A/DG
Tj = 25 °C unless otherwise specified.
PZUxBA
Sel
Working
voltage
VZ (V)
Differential resistance Reverse
rdif (Ω)
current
IR (µA)
Temperature Diode
coefficient
capacitance
SZ (mV/K)
Cd (pF)[1]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Non-repetitive
peak reverse
current
IZSM (A)[2]
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
2.4
B
2.3
2.6
1000
100
50
1
−1.6
450
8
2.7
B
2.5
2.9
1000
100
20
1
−2.0
440
8
B1
2.5
2.75
B2
2.65
2.9
B
2.8
3.2
1000
95
10
1
−2.1
425
8
B1
2.8
3.05
B2
2.95
3.2
B
3.1
3.5
1000
95
5
1
−2.4
410
8
B1
3.1
3.35
B2
3.25
3.5
B
3.4
3.8
1000
90
5
1
−2.4
390
8
B1
3.4
3.65
B2
3.55
3.8
B
3.7
4.1
1000
90
3
1
−2.5
370
8
B1
3.7
3.97
B2
3.87
4.10
B
4.01
4.48
1000
90
3
1
−2.5
350
8
B1
4.01
4.21
B2
4.15
4.34
B3
4.28
4.48
B
4.42
4.9
800
80
2
1
−1.4
325
8
B1
4.42
4.61
B2
4.55
4.75
B3
4.69
4.9
B
4.84
5.37
250
60
2
1.5
0.3
300
5.5
B1
4.84
5.04
B2
4.98
5.2
B3
5.14
5.37
B
5.31
5.92
100
40
1
2.5
1.9
275
5.5
B1
5.31
5.55
B2
5.49
5.73
B3
5.67
5.92
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
5 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
Table 9.
Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG
Tj = 25 °C unless otherwise specified.
PZUxBA
6.2
6.8
7.5
8.2
9.1
10
11
12
13
Sel
Working
voltage
VZ (V)
Differential resistance Reverse
rdif (Ω)
current
IR (nA)
Temperature Diode
coefficient
capacitance
SZ (mV/K)
Cd (pF)[1]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Non-repetitive
peak reverse
current
IZSM (A)[2]
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
B
5.86
6.53
80
30
500
3
2.7
250
5.5
B1
5.86
6.12
B2
6.06
6.33
B3
6.26
6.53
B
6.47
7.14
60
20
500
3.5
3.4
215
5.5
B1
6.47
6.73
B2
6.65
6.93
B3
6.86
7.14
B
7.06
7.84
60
10
500
4
4.0
170
3.5
B1
7.06
7.36
B2
7.28
7.60
B3
7.52
7.84
B
7.76
8.64
60
10
500
5
4.6
150
3.5
B1
7.76
8.1
B2
8.02
8.36
B3
8.28
8.64
B
8.56
9.55
60
10
500
6
5.5
120
3.5
B1
8.56
8.93
B2
8.85
9.23
B3
9.15
9.55
B
9.45
10.55 60
10
100
7
6.4
110
3.5
B1
9.45
9.87
B2
9.77
10.21
B3
10.11 10.55
B
10.44 11.56 60
10
100
8
7.4
108
3
B1
10.44 10.88
B2
10.76 11.22
B3
11.1
B
11.42 12.6
80
10
100
9
8.4
105
3
B1
11.42 11.9
B2
11.74 12.24
B3
12.08 12.6
B
12.47 13.96 80
10
100
10
9.4
103
2.5
B1
12.47 13.03
B2
12.91 13.49
B3
13.37 13.96
11.56
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
6 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
Table 9.
Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG …continued
Tj = 25 °C unless otherwise specified.
PZUxBA
Sel
Working
voltage
VZ (V)
Differential resistance Reverse
rdif (Ω)
current
IR (nA)
Temperature Diode
coefficient
capacitance
SZ (mV/K)
Cd (pF)[1]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Min
Max
Max
Non-repetitive
peak reverse
current
IZSM (A)[2]
Max
Max
VR (V)
Typ
Max
Max
14
B2
13.70 14.30 80
10
100
11
10.4
101
2
15
B
13.84 15.52 80
15
50
11
11.4
99
2
B1
13.84 14.46
B2
14.34 14.98
B3
14.85 15.52
B
15.37 17.09 80
20
50
12
12.4
97
1.5
B1
15.37 16.01
B2
15.85 16.51
B3
16.35 17.09
B
16.94 19.03 80
20
50
13
14.4
93
1.5
B1
16.94 17.7
B2
17.56 18.35
B3
18.21 19.03
B
18.86 21.08 100
20
50
15
16.4
88
1.5
B1
18.86 19.7
B2
19.52 20.39
B3
20.21 21.08
B
20.88 23.17 100
25
50
17
18.4
84
1.3
B1
20.88 21.77
B2
21.54 22.47
B3
22.23 23.17
B
22.93 25.57 120
30
50
19
20.4
80
1.3
B1
22.93 23.96
B2
23.72 24.78
B3
24.54 25.57
27
B
25.1
28.9
150
40
50
21
23.4
73
1
30
B
28
32
200
40
50
23
26.6
66
1
33
B
31
35
250
40
50
25
29.7
60
0.9
36
B
34
38
300
60
50
27
33.0
59
0.8
16
18
20
22
24
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
7 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
006aab215
103
PZSM
(W)
mbg781
300
IF
(mA)
102
200
10
100
1
10−4
10−3
0
0.6
10−2
0.8
1
tp (s)
VF (V)
Tj = 25 °C (prior to surge)
Fig 1.
Tj = 25 °C
Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 2.
mgl273
0
Forward current as a function of forward
voltage; typical values
mgl274
10
12
SZ
(mV/K)
4.3
−1
SZ
(mV/K)
11
5
10
9.1
8.2
7.5
6.8
3.9
3.6
−2
6.2
5.6
5.1
0
3.3
4.7
3.0
2.4
2.7
−3
Fig 3.
−5
0
20
40
IZ (mA)
60
0
4
8
Tj = 25 °C to 150 °C
Tj = 25 °C to 150 °C
VZ = 2.4 V to 4.3 V
VZ = 4.7 V to 12 V
Temperature coefficient as a function of
working current; typical values
Fig 4.
16
IZ (mA)
20
Temperature coefficient as a function of
working current; typical values
PZUXBA_SER_1
Product data sheet
12
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
8 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
006aab246
102
IZ
(mA)
VZ(nom) (V) = 4.7
IZ
(mA)
VZ(nom) (V) = 2.4
3.6
3.0
2.7 3.3
10
006aab247
102
4.3
10
5.6 6.8
3.9
6.2
1
1
10−1
10−1
10−2
10−2
10−3
5.1
11
10
12
10−3
0
1
2
3
4
5
0
2
4
VZ (V)
Fig 5.
9.1
8.2
7.5
Tj = 25 °C
Tj = 25 °C
VZ = 2.4 V to 4.3 V
VZ = 4.7 V to 12 V
Working current as a function of working
voltage; typical values
Fig 6.
8
10
12
14
VZ (V)
Working current as a function of working
voltage; typical values
006aab248
102
IZ
(mA)
6
VZ(nom) (V) = 13
10
1
14
15
16
18
22
20
27
24
33
30
36
10−1
10−2
10−3
10
20
30
40
VZ (V)
Tj = 25 °C
VZ = 13 V to 36 V
Fig 7.
Working current as a function of working voltage; typical values
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
9 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
1.35
1.15
1.1
0.8
0.45
0.15
1
2.7
2.3
1.8
1.6
2
0.40
0.25
0.25
0.10
Dimensions in mm
Fig 8.
03-12-17
Package outline SOD323 (SC-76)
10. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PZU2.4BA to
PZU36BA
Package
SOD323
Description
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
10000
-115
-135
PZU2.4BA/DG to
PZU36BA/DG
[1]
For further information and the availability of packing methods, see Section 13.
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
10 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
11. Soldering
3.05
2.1
solder lands
solder resist
0.5 (2×)
1.65 0.95
0.6 (2×)
solder paste
occupied area
2.2
Dimensions in mm
0.5
(2×)
0.6
(2×)
Fig 9.
sod323_fr
Reflow soldering footprint SOD323 (SC-76)
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
2.75
1.2
(2×)
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
Fig 10. Wave soldering footprint SOD323 (SC-76)
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
11 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
12. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PZUXBA_SER_1
20080919
Product data sheet
-
-
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
12 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PZUXBA_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 19 September 2008
13 of 14
PZUxBA series
NXP Semiconductors
Single Zener diodes
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information. . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 September 2008
Document identifier: PZUXBA_SER_1
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