Data Sheet

PZUxBL series
Single Zener diodes
Rev. 01 — 6 May 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
n Non-repetitive peak reverse power
dissipation: PZSM ≤ 40 W
n Total power dissipation: Ptot ≤ 250 mW
n Tolerance series:
B: approximately ±5 %;
B2: approximately ±2 %
n Wide working voltage range:
nominal 2.4 V to 36 V (E24 range)
n Low reverse current IR range
n Small plastic package suitable for
surface-mounted design
n AEC-Q101 qualified
1.3 Applications
n General regulation functions
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
forward voltage
VF
PZSM
non-repetitive peak reverse
power dissipation
Ptot
total power dissipation
Conditions
IF = 100 mA
Tamb ≤ 25 °C
Min
Typ
Max
Unit
[1]
-
-
1.1
V
[2]
-
-
40
W
[3][4]
-
-
250
mW
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
[3]
Reflow soldering is the only recommended soldering method.
[4]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PZUxBL series
NXP Semiconductors
Single Zener diodes
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
006aaa152
Transparent
top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PZU2.4BL to
PZU36BL[1]
Package
Name
Description
Version
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
PZU2.7B2L to
PZU24B2L[2]
[1]
The series consists of 29 types with nominal working voltages from 2.4 V to 36 V.
[2]
The series consists of 25 types with nominal working voltages from 2.7 V to 24 V.
4. Marking
Table 4.
Marking codes
Type number
Marking code
Type number
Marking code
PZU2.4BL
H2
PZU2.7B2L
HZ
PZU2.7BL
H3
PZU3.0B2L
K1
PZU3.0BL
H4
PZU3.3B2L
K2
PZU3.3BL
H5
PZU3.6B2L
K3
PZU3.6BL
H6
PZU3.9B2L
K4
PZU3.9BL
H7
PZU4.3B2L
K5
PZU4.3BL
H8
PZU4.7B2L
K6
PZU4.7BL
H9
PZU5.1B2L
K7
PZU5.1BL
HA
PZU5.6B2L
K8
PZU5.6BL
HB
PZU6.2B2L
H1
PZU6.2BL
HC
PZU6.8B2L
K9
PZU6.8BL
HD
PZU7.5B2L
KA
PZU7.5BL
HE
PZU8.2B2L
KB
PZU8.2BL
HF
PZU9.1B2L
KC
PZU9.1BL
HG
PZU10B2L
KD
PZU10BL
HH
PZU11B2L
KE
PZU11BL
HK
PZU12B2L
KF
PZUXBL_SER_1
Product data sheet
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Rev. 01 — 6 May 2008
2 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
Table 4.
Marking codes …continued
Type number
Marking code
Type number
Marking code
PZU12BL
HL
PZU13B2L
KG
PZU13BL
HM
PZU14B2L
KH
PZU15BL
HN
PZU15B2L
KK
PZU16BL
HP
PZU16B2L
KL
PZU18BL
HR
PZU18B2L
KM
PZU20BL
HS
PZU20B2L
KN
PZU22BL
HT
PZU22B2L
KP
PZU24BL
HU
PZU24B2L
KR
PZU27BL
HV
-
-
PZU30BL
HW
-
-
PZU33BL
HX
-
-
PZU36BL
HY
-
-
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
IF
forward current
Max
Unit
mA
-
200
-
see
Table 8
and 9
IZSM
non-repetitive peak reverse
current
[1]
PZSM
non-repetitive peak reverse
power dissipation
[1]
-
40
W
Ptot
total power dissipation
[2][3]
-
250
mW
[2][4]
-
500
mW
Tamb ≤ 25 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
[2]
Reflow soldering is the only recommended soldering method.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PZUXBL_SER_1
Product data sheet
Min
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 6 May 2008
3 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance from
junction to ambient
Rth(j-a)
in free air
Min
Typ
Max
Unit
[1][2]
-
-
500
K/W
[1][3]
-
-
250
K/W
[4]
-
-
55
K/W
thermal resistance from
junction to solder point
Rth(j-sp)
[1]
Reflow soldering is the only recommended soldering method.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
IF = 10 mA
-
-
0.9
V
IF = 100 mA
-
-
1.1
V
[1]
forward voltage
VF
[1]
Conditions
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Table 8.
Characteristics per type; PZU2.4BL to PZU5.6B2L
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
current
r (Ω)
Temperature
coefficient
dif
VZ (V)
IR (µA)
SZ (mV/K)
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)[1]
d
IZSM (A)[2]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
2.4
B
2.3
2.6
1000
100
50
1
−1.6
450
8
2.7
B
2.5
2.9
1000
100
20
1
−2.0
440
8
B2
2.65
2.9
B
2.80
3.20
1000
95
10
1
−2.1
425
8
B2
2.95
3.20
B
3.10
3.50
1000
95
5
1
−2.4
410
8
B2
3.25
3.50
B
3.40
3.80
1000
90
5
1
−2.4
390
8
B2
3.55
3.80
B
3.70
4.10
1000
90
3
1
−2.5
370
8
B2
3.87
4.10
B
4.01
4.48
1000
90
3
1
−2.5
350
8
B2
4.15
4.34
3.0
3.3
3.6
3.9
4.3
PZUXBL_SER_1
Product data sheet
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Rev. 01 — 6 May 2008
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PZUxBL series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; PZU2.4BL to PZU5.6B2L …continued
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
current
r (Ω)
Temperature
coefficient
dif
VZ (V)
IR (µA)
SZ (mV/K)
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)[1]
d
IZSM (A)[2]
4.7
5.1
5.6
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
B
4.42
4.90
800
80
2
1
−1.4
325
8
B2
4.55
4.75
B
4.84
5.37
250
60
2
1.5
0.3
300
5.5
B2
4.98
5.20
B
5.31
5.92
100
40
1
2.5
1.9
275
5.5
B2
5.49
5.73
Temperature
coefficient
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)[1]
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
IZ = 5 mA
Table 9.
Characteristics per type; PZU6.2BL to PZU36BL
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
current
r (Ω)
dif
VZ (V)
IR (nA)
SZ (mV/K)
d
IZSM (A)[2]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
5.86
6.53
80
30
500
3
2.7
250
5.5
60
20
500
3.5
3.4
215
5.5
60
10
500
4
4.0
170
3.5
60
10
500
5
4.6
150
3.5
60
10
500
6
5.5
120
3.5
10
100
7
6.4
110
3.5
10
100
8
7.4
108
3
10
100
9
8.4
105
3
10
100
10
9.4
103
2.5
10
100
11
10.4
101
2
6.2
B
B2
6.06
6.33
6.8
B
6.47
7.14
B2
6.65
6.93
7.5
B
7.06
7.84
B2
7.28
7.60
8.2
B
7.76
8.64
B2
8.02
8.36
9.1
B
8.56
9.55
B2
8.85
9.23
10
B
9.45
10.55 60
B2
9.77
10.21
11
B
10.44 11.56 60
B2
10.76 11.22
12
B
11.42 12.60 80
B2
11.74 12.24
13
B
12.47 13.96 80
B2
12.91 13.49
14
B2
13.70 14.30 80
IZ = 5 mA
PZUXBL_SER_1
Product data sheet
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Rev. 01 — 6 May 2008
5 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
Table 9.
Characteristics per type; PZU6.2BL to PZU36BL …continued
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
current
r (Ω)
Temperature
coefficient
dif
VZ (V)
IR (nA)
SZ (mV/K)
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)[1]
d
IZSM (A)[2]
15
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
Min
Max
Max
IZ = 5 mA
Max
Max
VR (V)
Typ
Max
Max
15
50
11
11.4
99
2
20
50
12
12.4
97
1.5
20
50
13
14.4
93
1.5
20
50
15
16.4
88
1.5
25
50
17
18.4
84
1.3
30
50
19
20.4
80
1.3
B
13.84 15.52 80
B2
14.34 14.98
B
15.37 17.09 80
B2
15.85 16.51
B
16.94 19.03 80
B2
17.56 18.35
B
18.86 21.08 100
B2
19.52 20.39
B
20.88 23.17 100
B2
21.54 22.47
B
22.93 25.57 120
B2
23.72 24.78
27
B
25.1
28.9
150
40
50
21
23.4
73
1
30
B
28
32
200
40
50
23
26.6
66
1
33
B
31
35
250
40
50
25
29.7
60
0.9
36
B
34
38
300
60
50
27
33.0
59
0.8
16
18
20
22
24
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
PZUXBL_SER_1
Product data sheet
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Rev. 01 — 6 May 2008
6 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
006aab129
103
mbg781
300
PZSM
(W)
IF
(mA)
102
200
10
100
1
10−1
1
0
0.6
10
0.8
1
tp (ms)
VF (V)
Tj = 25 °C (prior to surge)
Fig 1.
Tj = 25 °C
Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 2.
mgl273
0
Forward current as a function of forward
voltage; typical values
mgl274
10
12
SZ
(mV/K)
4.3
−1
SZ
(mV/K)
11
5
10
9.1
8.2
7.5
6.8
3.9
3.6
−2
6.2
5.6
5.1
0
3.3
4.7
3.0
2.4
2.7
−3
Fig 3.
−5
0
20
40
IZ (mA)
60
0
4
8
Tj = 25 °C to 150 °C
Tj = 25 °C to 150 °C
PZU2.4BL to PZU4.3B2L
PZU4.7BL to PZU12B2L
Temperature coefficient as a function of
working current; typical values
Fig 4.
PZUXBL_SER_1
Product data sheet
12
16
IZ (mA)
20
Temperature coefficient as a function of
working current; typical values
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 6 May 2008
7 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
006aab246
102
IZ
(mA)
VZ(nom) (V) = 4.7
IZ
(mA)
VZ(nom) (V) = 2.4
3.6
3.0
2.7 3.3
10
006aab247
102
4.3
10
5.6 6.8
3.9
6.2
1
1
10−1
10−1
10−2
10−2
10−3
5.1
11
10
12
10−3
0
1
2
3
4
5
0
2
4
6
VZ (V)
Fig 5.
9.1
8.2
7.5
Tj = 25 °C
Tj = 25 °C
PZU2.4BL to PZU4.3B2L
PZU4.7BL to PZU12B2L
Working current as a function of working
voltage; typical values
Fig 6.
10
12
14
VZ (V)
Working current as a function of working
voltage; typical values
006aab248
102
IZ
(mA)
8
VZ(nom) (V) = 13
10
1
14
15
16
18
22
20
27
24
33
30
36
10−1
10−2
10−3
10
20
30
40
VZ (V)
Tj = 25 °C
PZU13BL to PZU36BL
Fig 7.
Working current as a function of working voltage; typical values
PZUXBL_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 6 May 2008
8 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
0.50
0.46
0.62
0.55
2
0.30
0.22
0.65
0.30
0.22
1
0.55
0.47
cathode marking on top side
Dimensions in mm
Fig 8.
1.02
0.95
03-04-17
Package outline SOD882
10. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
10000
PZU2.4BL to
PZU36BL
SOD882
2 mm pitch, 8 mm tape and reel
-315
PZU2.7B2L to
PZU24B2L
[1]
For further information and the availability of packing methods, see Section 13.
PZUXBL_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 6 May 2008
9 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
11. Soldering
1.30
R = 0.05 (8×)
0.30
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
solder lands
solder paste
solder resist
R = 0.05 (8×)
0.30
(2×)
0.40
(2×)
0.50
(2×)
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 9.
Reflow soldering footprint SOD882
PZUXBL_SER_1
Product data sheet
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Rev. 01 — 6 May 2008
10 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
12. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PZUXBL_SER_1
20080506
Product data sheet
-
-
PZUXBL_SER_1
Product data sheet
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Rev. 01 — 6 May 2008
11 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Rev. 01 — 6 May 2008
12 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information. . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 May 2008
Document identifier: PZUXBL_SER_1
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