la274w-eg-w55r14.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Sealed to IP67
Pb
Lead-Free Parts
LA274W/EG-W55R14
DATA SHEET
DOC. NO : QW0905-L A274W/EG-W55R14
REV.
:
B
DATE
:
15 - Mar. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LA274W/EG-W55R14
Package Dimensions
8.4
+Vcc
20.6
Vcc=24Volts
IF
RL RL=1000ohms ±5%
G
E
1
VF
155±5.0
IF=
Vcc-VF
RL
2 3
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE ORANGE
GREEN
RED
ORANGE
1 23
LEG3393/F243-PF
5.0
7.6
5.9
8.6
10.5±0.5
G
5.0±0.5
E
1.5
MAX
1
1.0±0.3
1.0±0.3
2.54TYP
2.54TYP
1
2
2 3
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE ORANGE
3
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA274W/EG-W55R14
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Rating
Symbol
Parameter
UNIT
G
E
Forward Voltage
DC
24
24
V
Reverse Voltaget @5V
Vr
24
24
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Peak Spectral
wave halfwidth
length Δλ nm
λPnm
Luminous
intensity
(mcd)
@24V
Reverse Viewing
angle
Current
2θ 1/2
(μA)
VR= 24 V (deg)
Min. Max. Min. Typ.
Lens
GaAsP/GaP Orange
Forward
current
(mA)
@24V
635
45
20.4 23.5
45
75
100
40
565
30
20.4 23.5
60
100
100
40
Water Clear
LA274W/EG-W55R14
GaP
Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA274W/EG-W55R14
Page 3/5
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative [email protected]
Fig.4 Relative Intensity vs. Temperature
Relative [email protected]
Normalize @25 ℃
Forward [email protected]
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA274W/EG-W55R14
Page 4/5
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
1.0
5.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
Relative [email protected]
Normalize @25 ℃
Forward [email protected]
Normalize @25 ℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative [email protected]
100
650
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO. LA274W/EG-W55R14
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11