LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA321B/HRFSDBK-S1-PF DATA SHEET DOC. NO : QW0905-LA321B/HRFSDBK-S1-PF REV. : A DATE : 08 - Feb. - 2015 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LA321B/HRFSDBK-S1-PF Package Dimensions 2.2±0.5 6.35 7.0 ∅3.0 6.6 4.0 0.5TYP HRF(S) DBK 1 ∅3.0 3.5±0.5 2 3 5.08±0.5 2.54TYP 1 2 3 1.CATHODE BLUE 2.COMMON ANODE 3.CATHODE RED Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LHRFSDBK2692/R21 HRF(S) DBK 1 2 3 1.CATHODE BLUE 2.COMMON ANODE 3.CATHODE RED 2.9 3.1 3.3 4.3 6.45±0.5 1.5 MAX □0.5 TYP 18.0MIN 1 2 3 2.0MIN 2.0MIN 2.54TYP 2.54TYP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA321B/HRFSDBK-S1-PF Page 2/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DBK HRF(S) Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 60 mA Power Dissipation PD 120 72 mW ESD 500 2000 V Reverse Current @5V Ir 50 10 Operating Temperature Topr -20 ~ +80 -40 ~ +85 ℃ Storage Temperature Tstg -30 ~ +100 -40 ~ +100 ℃ Electrostatic Discharge( * ) μA Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * Static glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP Red InGaN Blue Lens Luminous Viewing Dominant Spectral Forward intensity angle wave halfwidth voltage length △λ nm @10mA(V) @10mA(mcd) 2θ 1/2 (deg) λDnm Min. Max. Min. Typ. 630 20 1.7 2.6 550 1800 50 465 30 3.0 4.0 220 700 50 White Diffused LA321B/HRFSDBK-S1-PF Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. LA321B/HRFSDBK-S1-PF Brightness Code For Standard LED Lamps HRF(S) CHIP Group Luminous Intensity(mcd) at 10 mA Min. Max. A21 550 700 A22 700 900 A23 900 1100 A24 A25 1100 1500 1500 1800 Color Code HRF(S) CHIP Group Wave length(nm) at 20 mA Min. Max. 27 620 625 28 625 630 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/7 PART NO. LA321B/HRFSDBK-S1-PF Brightness Code For Standard LED Lamps DBK CHIP Group Luminous Intensity(mcd) at 10 mA Min. Max. A17 350 450 A18 450 550 A19 550 700 A20 700 900 A21 900 1100 Color Code DBK CHIP Group Wave length(nm) at 20 mA Min. Max. 0D 465 468 0C 468 471 0B 471 474 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO. LA321B/HRFSDBK-S1-PF Typical Electro-Optical Characteristics Curve HRFS CHIP Fig.2 Luminous Intensity vs. Forward Current 6.0 150 Luminous Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 50 0 0 0.5 1.0 1.5 2.0 2.5 5.0 4.0 3.0 2.0 1.0 0.0 0 3.0 50 1.06 1.04 1.02 1.00 0.98 0.96 0.94 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 600 650 Wavelength (nm) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 550 Fig.4 Luminous Intensity vs. Temperature Luminous Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 150 Forward Current(mA) Forward Voltage(V) -40 100 700 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA321B/HRFSDBK-S1-PF Page 6/7 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 400 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 550 Fig.6 Directivity Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA321B/HRFSDBK-S1-PF Page 7/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA321B/HRFSDBK-S1-PF Page 9/9 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11