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DHX91 DHAN Module
DECT-ULE Platform
Datasheet
Version 1.3
June 2015
Version 1.3
DHX91 DHAN Module Datasheet
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© 2015 DSP Group Confidential. All rights reserved.
June 2015
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Version 1.3
DHX91 DHAN Module Datasheet
Table of Contents
TABLE OF CONTENTS
1.
INTRODUCTION ........................................................................................................................................... 4
1.1. General Description ................................................................................................................................. 4
1.2. Block Diagram ......................................................................................................................................... 4
1.3. Features .................................................................................................................................................... 5
2.
PIN AND SIGNAL DESCRIPTION............................................................................................................... 6
2.1. Pin List..................................................................................................................................................... 6
3.
MODULE ELECTRICAL SPECIFICATIONS .............................................................................................. 8
3.1. Absolute Maximum Rating ...................................................................................................................... 8
3.2. Recommended Operating Conditions ...................................................................................................... 8
3.3. Power Consumption................................................................................................................................. 9
3.4. Transmitter............................................................................................................................................. 10
3.5. Receiver ................................................................................................................................................. 10
4.
MODIFYING MODULE SOFTWARE AND ADJUSTING PARAMETERS ............................................ 11
5.
APPLICATION SCHEMATIC GUIDE ........................................................................................................ 11
5.1. Power Supply and Battery Check .......................................................................................................... 11
5.2. UART Interface and Wakeup (Applications running on external MCU) .............................................. 12
5.3. Driving LEDs ........................................................................................................................................ 13
5.4. DHAN Standalone Applications ............................................................................................................ 13
6.
APPLICATION PCB DESIGN RECOMMENDATIONS............................................................................ 14
6.1. Antenna Recommendations ................................................................................................................... 14
6.1.1. Wire Antennas ................................................................................................................................ 14
6.1.2. Chip Antennas ................................................................................................................................. 15
6.1.3. Printed Antennas ............................................................................................................................. 15
7.
ASSEMBLY INFORMATION ..................................................................................................................... 16
7.1. Mechanical............................................................................................................................................. 16
7.2. Surface Mount ....................................................................................................................................... 16
8.
SUPPLEMENTARY INFORMATION ........................................................................................................ 17
8.1. Ordering Information ............................................................................................................................. 17
8.2. Abbreviations Used ............................................................................................................................... 17
8.3. Change Log............................................................................................................................................ 17
LIST OF FIGURES ............................................................................................................................................... 18
LIST OF TABLES ................................................................................................................................................ 18
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DHX91 DHAN Module Datasheet
Introduction
1. Introduction
1.1. General Description
The DSPG DHAN module is based on the state-of-the-art DHX91 - a 4th generation DECT SOC. The DHAN
module is appropriate for the AC or battery powered ULE Node operating in a star network with a ULEcertified Controller at the hub.
The DHAN is a “turn-key” solution providing the user with a jump-start in developing a ULE Node
Application. It is easily integrated into the smallest of ULE Nodes, providing excellent range with minimized
drain on the battery, allowing the designer to focus on developing the application. The complete platform
includes an SDK, API GUI, and user documentation.
The DHAN module can be used as a standalone solution (with the application running on the DHX91 ARM)
or it can provide the wireless connectivity channel for a sensor application running on an external MCU. In
the latter case, the MCU communicates with the DHAN via serial UART interface.
For the standalone DHAN case (or other cases where customization is required), the user will need to account
for replacing the standard HAN-FUN SW stack with a customized stack
1.2. Block Diagram
JTAG
I2C
QSPI
DHX91
UART
Antenna
Matching,
external
to
Module
GPIO
VCC
13M
XTAL
ULE IO
ULE ADC/DAC
DHAN
Figure ‎1-1: DXH91 DHAN Module Block Diagram
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DHX91 DHAN Module Datasheet
Introduction
1.3. Features
General

Appropriate for both battery
powered and AC-powered ULE
Nodes

Includes embedded HAN-FUN
ULE SW Stack with welldocumented API for control via
external application MCU



June 2015
Processor (ARM926 32-bit RISC
Controller) and memory
appropriate for standalone DHAN
solutions (requires SW
customization)
Best-in-class radio performance

Tx power: +23.5 dBm

Rx sensitivity: -96
[email protected] ppm

Support for EU, US and other
regional DECT bands

Compliance with EN301406, FCC
part 15.329 & ARIB STD-T101

Small form factor: 15 mm x 32.5
mm x 3.8 mm

Low external BOM

Well matched RF Port, easily
connected to an off-module 50Ohm antenna

Operating temperature: -40° C to
+85° C
Applications
Hibernation mode: low power (<2
uA)
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
Home automation

Home security

Connected appliances

Smart energy
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DHX91 DHAN Module Datasheet
Version 1.3
Pin and Signal Description
2. Pin and Signal Description
2.1. Pin List
Table ‎2-1: DHAN Module Pinout
PIN NO.
NAME
1
GND
2
DCINS
NC (Not Connected)
3
DCIN3
Used to monitor battery level via this ADC input.
RSTN
Pull to GND to force reset. Optionally connect to
external MCU output or to a SPST switch (for
manual reset) or leave NC
4
5
6
7
GND
SCL
I2C Clock I/O. Not used by HAN_FUN. Can be left
as NC
SDA
I2C Data I/O, Not used by HAN_FUN. Can be left as
NC
IIC_ACK
I2C ACK, Not used by HAN_FUN. Can be left as
NC
8
GPIO7
General Purpose I/O. Can be left NC
9
GPIO8
General Purpose I/O. Can be left NC
10
RxD (GPIO9)
11
TDI
JTAG Data In, If not needed, can be left NC
12
TMS
JTAG Mode Select, If not needed, can be left NC
13
TDO
JTAG Data Out, If not needed, can be left NC
14
TCK
JTAG Clock, If not needed, can be left NC
15
RTCK
JTAG Reset, If not needed, can be left NC
16-17
GND
GND
UART Rx
18
TxD (GPIO10)
19
VDD_APU
1.8V test point. 0V during hibernate. Leave NC
20
VDD
1.2V test point. 0V during hibernate. Leave NC
VCC
Power Supply Input. Connect to Battery or 3V
regulated supply
21
UART Tx
22
DOUBCAP2P
ULE I/O. If not used, can be left NC
23
DCIN2
ULE I/O. If not used, can be left NC
24
VCC3V
3V test point. 0V during hibernate. Leave NC
25
LEDSINK/DCIN
26-27
June 2015
DESCRIPTION/TYPE
GND
ULE I/O. If not used, can be left NC
GND
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DHX91 DHAN Module Datasheet
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PIN NO.
28
AMP2_OUT
29
AMP1_P
30
AMP1_OUT
31
MPWR/ANA2_IN
DESCRIPTION/TYPE
ULE I/O. If not used, can be left NC
ULE non-inverting sensor conditioning input
ULE I/O. If not used, can be left NC
ULE I/O (or Microphone Power). If not used, can be
left NC
32
MIN
Leave NC
33
MIP
Leave NC
34
ANA_IN1
ULE I/O. If not used, can be left NC
35
SPOUTP
Leave NC
36
SPOUTN
Leave NC
37
PWM0
38
XIN_32K
Leave NC
39
XOUT_32K
Leave NC
40
VDD_ULE
1.8V test point. Active during hibernate. Leave NC
41
VCCRF
42-50
June 2015
NAME
Pin and Signal Description
GND
51
Antenna
52
GND
Analog Output
Power Supply Input to RF
GND
RF In/Out, 50 Ohm
GND
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DHX91 DHAN Module Datasheet
Module Electrical Specifications
3. Module Electrical Specifications
All parameters are for 25ºC.
3.1. Absolute Maximum Rating
Table ‎3-1: Absolute Maximum Rating
PIN NAME
PIN
MIN
MAX
UNIT
VCC
21
-0.3
4.6
V
VccRF
41
-0.3
4.6
V
I2C
5, 6, 7
-0.3
4.6
V
JTAG
11, 12, 13, 14, 15
-0.3
4.6
V
GPIO
8, 9, 10, 18
-0.3
4.6
V
DCINs,DCIN1,2,3
2, 3, 23, 25
-0.3
4.6
V
Storage Temperature
-
-45
+90
°C
3.2. Recommended Operating Conditions
Table ‎3-2: Recommended Operating Conditions
RATING
MIN
TYP
MAX
UNIT
Operating ambient
temperature
-40
+25
+85
°C
VccRF, VCC
1.95
3.0
3.6
V
0.8
V
JTAG, UART
DCIN3
June 2015
CONDITIONS
VIL
VIH
VOL
VOH
(VCC is at
nominal 3V)
2.0
0.4
2.4
1.95
3.0
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VCC
V
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DHX91 DHAN Module Datasheet
Module Electrical Specifications
3.3. Power Consumption
Table ‎3-3: Power Consumption
June 2015
PARAMETER
TEST CONDITIONS
TYP
MAX
UNIT
Tx Current
VccRF=3 V
VCC=3 V
Band=EU @ 23dBm
400
480
mA
Tx Current
VccRF=3 V
VCC=3 V
Band=US @ 21 dBm
250
300
mA
Rx Current
VccRF=3 V
VCC=3 V
125
135
mA
Hibernation
VccRF=3 V
VCC=3 V
1.7
2.5
uA
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DHX91 DHAN Module Datasheet
Module Electrical Specifications
3.4. Transmitter
Table ‎3-4: Tx Characteristics
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
NTP
VccRF=3 V
VCC=3 V
Band=EU
22
23
24
dBm
NTP
VccRF=3 V
VCC=3 V
Band=US
19
20
21
dBm
Harmonics
VccRF=3 V
VCC=3 V
Band=EU & US
-40
-35
dBm
Transmission Mask
EN 301406
Paragraph 5.3.3
Comply
Frequency Offset
EN 301406
Paragraph 5.3.1
-50
8
+50
KHz
Frequency Drift
EN 301406
Paragraph 5.3.5
-15
0
+15
KHz/Slot
Emission Due
Modulation
EN 301406
Paragraph 5.3.6.2
M±1
M±2
M±3
M>±3
N/A
dBm
-20
-42
-47
-50
-8
-30
-40
-44
3.5. Receiver
Table ‎3-5: Rx Characteristics
June 2015
CHARACTERISTICS
TEST CONDITIONS
Sensitivity, BER <
1000ppm
VccRF=3 V
VCC=3 V
Maximum input power
VccRF=3 V
VCC=3 V
MIN
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TYP
MAX
UNIT
-96
-93
dBm
15
dBm
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DHX91 DHAN Module Datasheet
Application Information
4. Modifying Module Software and Adjusting Parameters
The DHAN module is loaded with the standard HAN-FUN image, configured for application control by an
external MCU via the UART CMND Node Interface. It is also configured for European band operation, with
a generic ID (IPEI in DECT nomenclature) and it will identify itself as a smoke detector. These latter 3 items
are configurable ULE parameters that can be modified by the user and stored back into the module nonvolatile memory. However, if the user application is using the DHX91 as a standalone controller (ie no
external MCU) or needs some means other than the UART CMND interface for communication between the
external MCU and the DHAN – customization and reloading of the software image running on the DHAN is
required.
Custom software images as well as ULE parameters can be updated either via the JTAG or the UART I/F.
DSP Group can supply a tool (Vega Memory Tool) to accomplish both image update and parameter
modification using the JTAG I/F. So it is recommended that the customer include test points in the application
board layout to access the JTAG port (see schematic tips later on) – at least during development phase. Note,
however, that this tool, while appropriate for prototype needs, is likely not suitable for a mass production
setting – in particular if a new image needs to be burned.
The UART CMND API includes commands for updating parameters. Furthermore, the UART I/F can
facilitate more efficient means of erasing and refreshing the software image on the DHAN. So the user should
consider exposing this I/F as well for connecting to his production rack. If the application board includes an
external MCU, than its UART I/F will need to be tri-stated during this production phase.
5. Application Schematic Guide
This section describes how to connect the DHAN to the power supply, to an external MCU via UART and to
LED indicators
5.1. Power Supply and Battery Check
VCC (21)
DHAN
VCCRF (41)
Bulk Cap*
Battery or Regulator Output
DCIN3 (3)
GND (1,16,17,26,27, 42-50, 52)
Notes:
1) Bulk cap is not required when using lithium batteries such CR123A or CR2. Suggest 100µF cap for AA
or AAA applications and 500mF for CR2032 Coin-Cell operation
2) DCIN3 is an input to an ADC that monitors the battery level
Figure ‎5-1: Power Supply and Battery Detect Interconnect
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DHX91 DHAN Module Datasheet
Application Information
5.2. UART Interface and Wakeup (Applications running on external
MCU)
In circumstances where the external MCU detects an event that needs to be communicated to the DHAN, it
will need to wake up the DHAN from its low current hibernation mode, wait ~10mS for the DHX91 to reboot
and then signal to the DHX91 via UART I/F. There are two options for the external MCU to wake the DHAN
from hibernation:
1) Apply a rising edge to one of the ULE I/O (configured as a Digital Wakeup), wait ~10mS and begin
communication with the DHX91 DHAN via UART. See Figure 5-2
2) Begin communication via UART, with the expectation that it will take ~10mS for the ext MCU to obtain
a response from the awaking DHAN. See Figure 5-3
In other circumstances, an incoming Page or Alert from the Controller will be detected by the DHAN. If the
external MCU is in a Sleep Mode the DHAN will need to first awake the MCU. Most MCUs will wake upon
sensing transitions on the DHAN UART TxD line. However, some may require (prefer) to be woken up by
application of a rising edge to a generic digital input at the MCU. This option is also called out in Figure 5-2.
GPIO9/RxD(10)
TxD
GPIO10/TxD (18)
RxD
DHAN
Ext MCU
ULE_IO*
Wakeup
ULE_IO or GPIO
Wakeup
Note: ULE IOs are pins 22, 25, 28, 30, 31, 34
Figure ‎5-2: UART I/F with bi-directional, dedicated signals for wakeup
DHAN
Pin10
Pin30
TxD
Ext MCU
RxD
Pin34
Pin18
TxD
Figure ‎5-3: UART I/F used for wakeup of DHAN
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DHX91 DHAN Module Datasheet
Application Information
5.3. Driving LEDs
LEDs that need to operate while the DHAN is in hibernation can utilize the ANA_IN1 pin (34) which can be
configured as a PWM and the LEDSINK pin (25) which features a PWM with LED sink capabilities. For
DHAN active or registration indications, PWM0 (pin37) can also be used.
5.4. DHAN Standalone Applications
The DHX91 ULE block includes a Sensor Conditioning Module which can facilitate many types of ULE
applications. This module is a highly configurable analog circuit that can be used to interface to a wide
variety of sensor transducers.
The module is built around the following sub-circuits:
 Two analog operational amplifiers (op-Amps) with shared bias source
 Two analog comparators with digital output
 One configurable digital potentiometer
 Three configurable ratiometric voltage references with selectable source
 Several analog distribution MUXes
 Several sample-and-hold (S&H) mechanisms
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DHX91 DHAN Module Datasheet
Application Information
6. Application PCB Design Recommendations
It is recommended that unused pads on the Application PCB not be left as isolated islands of copper but rather
be anchored with via to inner layers of the PCB. It is also recommend that GND vias be applied liberally in
the vicinity of the antenna pin output (Pin 51) and the associated GND pins (42-50 and 52).
The following layout recommendations need to be apply on Main Board:
1.
Implement a solid ground under the DHAN module.
2.
Do not route signal traces under the module. Use the bottom layer for signal routing.
3.
Make sure no components are near the antenna.
4.
Locate the antenna on the edge of the PCB.
5.
Use coplanar wave-guide trace between the DHAN module and antenna, it should be designed to be as
short as possible with 50Ω impedance.
6.
Add GND vias alongside the RF trace.
7.
Route the RF trace with gradual bends and no sharp corners.
8.
Design the antenna position according to the common usage/position of the ULE product for optimal
range.
6.1. Antenna Recommendations
A Pi-scheme should be added between the DHAN module antenna port and the antenna. This circuit will be
used for antenna matching, if needed.
To
Module
To
Antenna
DNP
DNP
0 ohm
Figure ‎6-1: Pi-Scheme for Antenna Matching
Applications can use chip, wire or printed antennas – the latter being the most cost-effective and assemblyfriendly. However it requires space on the application PCB.
6.1.1.
Wire Antennas
The wire antenna should be bent according to the cabinet structure one should try to implement minimal of
parallel structures. The total length of the wire antenna should be ¼ Lambda (~40.0 mm). It is important to
ensure an adequate ground plane near the antenna port in order to obtain maximal antenna gain and
efficiency.
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Version 1.3
6.1.2.
6.1.3.
DHX91 DHAN Module Datasheet
Application Information
Chip Antennas
P/N
Manufacture
ANT8868LL00R1880A
Yageo
CAN4311112001881K
Yageo
W3022
Pulse Elect
Printed Antennas
The most popular are INV-F-Antenna and monopole antenna, RF CAD tools are recommended to use when
designing such, below one can find typical INV-F-Antenna dimensions for DECT band.
85 mil
Feeding
Point
GND
180 mil
25 mil
1060 mil
Figure ‎6-2: INV-F-Antenna Dimension
A practical, more compact version of this inverted-F is shown below. Contact DSPG to obtain the design file.
June 2015
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DHX91 DHAN Module Datasheet
Application Information
7. Assembly Information
7.1. Mechanical
Shield
Pin-1
Pin-16
Typ 1.27
Pin-17
Pin-51 Antenna
15.77 14.50
13.02
1.59
Pin-42
Pin-27
Pin-26
2.60
0.90
3.72
31.45
32.55
Figure ‎7-1: Module Mechanical Outline
Figure ‎7-2: Recommended PCB Footprint
7.2. Surface Mount
The DHAN module uses a flat shield cover for a fully automatic assembly process. For backing and reflow
recommendations, use MSL 3 in the JEDEC/IPC standard J-STD-20b. The temperature classification (TC) for
the module is 245° C.
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DHX91 DHAN Module Datasheet
Supplementary Information
8. Supplementary Information
8.1. Ordering Information
Part #: DHX91MDMCFAE5AMI
8.2. Abbreviations Used
Table ‎8-1: Abbreviations
ACRONYM
DESCRIPTION
GPIO
General-Purpose Input Output
I2C
Inter Integrated Circuit
JTAG
Joint Test Action Group, the common name for the IEEE
1149.1 standard test access port and boundary-scan
architecture
RF
Radio Frequency
UART
Universal Asynchronous Receiver Transmitter
ULE
Ultra Low Energy
8.3. Change Log
Table ‎8-2: List of Changes
REVISION
DATE
1.0
July 2014
1.1
December 2014
Corrected App Schematic
February 2015
*Clarified that printed antenna is not
incorporated in the module.
*Added recommendations for application
board PCB
June 2015
*Add Application Schematic and Layout
*Add PCB footprint
*Corrected Part# in Ordering Info
1.2
1.3
June 2015
DESCRIPTION
First release
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DHX91 DHAN Module Datasheet
List of Tables
LIST OF FIGURES
Figure 1-1: DXH91 DHAN Module Block Diagram .................................................................................................... 4
Figure 5-1: Power Supply and Battery Detect Interconnect ........................................................................................ 11
Figure 5-2: UART I/F with bi-directional, dedicated signals for wakeup ................................................................... 12
Figure 5-3: UART I/F used for wakeup of DHAN ...................................................................................................... 12
Figure 6-1: Pi-Scheme for Antenna Matching ............................................................................................................. 14
Figure 6-2: INV-F-Antenna Dimension ...................................................................................................................... 15
Figure 7-1: Module Mechanical Outline ..................................................................................................................... 16
Figure 7-2: Recommended PCB Footprint .................................................................................................................. 16
LIST OF TABLES
Table 2-1: DHAN Module Pinout ................................................................................................................................. 6
Table 3-1: Absolute Maximum Rating .......................................................................................................................... 8
Table 3-2: Recommended Operating Conditions .......................................................................................................... 8
Table 3-3: Power Consumption ..................................................................................................................................... 9
Table 3-4: Tx Characteristics ...................................................................................................................................... 10
Table 3-5: Rx Characteristics ...................................................................................................................................... 10
Table 8-1: Abbreviations ............................................................................................................................................. 17
Table 8-2: List of Changes ......................................................................................................................................... 17
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