Download Product Data Sheet

High Performance BGA Cooling
Solutions w/ superGRIP™ Attachment
ATS PART # ATS-X50230G-C1-R0
FT
Features & Benefits
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Designed for 23 x 23 mm BGA components
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Allows the heat sink to be detached and reattached
without damaging the component or the PCB, an important
feature in the event a PCB may need to be reworked
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Strong, uniform attachment force helps achieve maximum
performance from phase-changing TIMs
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Eliminates the need to drill mounting holes in the PCB
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Comes standard with clean break, reworkable, Chomerics
T-766 phase change material
Requires minimal space around the component’s
perimeter; ideal for densely populated PCBs
W
Assembly comes standard with a high performance
maxiFLOW™ heat sink which maximizes convection (air)
cooling
L
H
Thermal Performance
*Image above is for illustration purposes only.
Air Velocity
Thermal Resistance
FT/MIN
M/S
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
200
1.0
6.7
5.4
300
1.5
5.5
400
2.0
4.8
500
2.5
4.3
600
3.0
3.9
700
3.5
3.6
800
4.0
3.4
Product Details
LENGTH
WIDTH
HEIGHT
FIN TIP to FIN TIP
INTERFACE MATERIAL
FINISH
23 mm
23 mm
12.5 mm
41.5 mm
Chomerics T766
BLUE-ANODIZED
Notes:
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Length and width dimensions refer to the size of the component. Dimensions of the heat
sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
Thermal performance data are provided for reference only. Actual performance may vary
by application
ATS reserves the right to update or change its products without notice to improve the
design or performance
Additional tooling fees may be required
Typical lead time is a minimum of 4-6 weeks
Contact ATS to learn about custom options available
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV0_042109
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