Data Sheet

SO
D3
23F
TDZxJ series
Single Zener diodes
Rev. 2 — 29 July 2011
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead
Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
 Non-repetitive peak reverse power
dissipation:  180 W
 Total power dissipation:  500 mW
 Very small plastic package suitable for
surface-mounted design
 Low differential resistance
 AEC-Q101 qualified
1.3 Applications
 General regulation functions
1.4 Quick reference data
Table 1.
Symbol
VF
Ptot
Quick reference data
Parameter
Conditions
forward voltage
IF = 100 mA
[1]
total power dissipation
Tamb  25 C
[2]
Min
Typ
Max
Unit
-
-
1.1
V
-
-
500
mW
[1]
Pulse test: tp  300 s;   0.02.
[2]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 16 mm2.
2. Pinning information
Table 2.
Pin
Pinning
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
006aaa152
[1]
The marking bar indicates the cathode.
TDZxJ series
NXP Semiconductors
Single Zener diodes
3. Ordering information
Table 3.
Ordering information
Type number
TDZxJ series
Package
Name
Description
Version
SC-90
plastic surface-mounted package; 2 leads
SOD323F
4. Marking
Table 4.
TDZXJ_SER
Product data sheet
Marking codes
Type number
Marking code
Type number
Marking code
TDZ2V4J
3A
TDZ9V1J
3Q
TDZ2V7J
3B
TDZ10J
3R
TDZ3V0J
3C
TDZ11J
3S
TDZ3V3J
3D
TDZ12J
3T
TDZ3V6J
3E
TDZ13J
3U
TDZ3V9J
3F
TDZ15J
3V
TDZ4V3J
3G
TDZ16J
3W
TDZ4V7J
3H
TDZ18J
3Y
TDZ5V1J
3J
TDZ20J
3Z
TDZ5V6J
JQ
TDZ22J
4A
TDZ6V2J
3K
TDZ24J
4B
TDZ6V8J
3L
TDZ27J
4C
TDZ7V5J
3N
TDZ30J
4D
TDZ8V2J
3P
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
2 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
IF
forward current
-
250
mA
-
see
Table 8
and 10
TDZ2V4J to TDZ5V6J
-
180
W
TDZ6V2J to TDZ6V8J
-
100
W
-
40
W
IZSM
non-repetitive peak
reverse current
[1]
PZSM
non-repetitive peak
reverse power dissipation
[1]
TDZ7V5J to TDZ30J
Tamb  25 C
[2]
Ptot
total power dissipation
-
500
mW
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
[1]
tp = 100 s; square wave; Tj = 25 C before surge.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2.
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
in free air
Min
Typ
Max
Unit
[1]
-
-
250
K/W
[2]
-
-
25
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2.
[2]
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tj = 25 C unless otherwise specified.
Symbol
Parameter
VF
forward voltage
[1]
TDZXJ_SER
Product data sheet
Conditions
Min
Typ
Max
Unit
IF = 10 mA
-
-
0.9
V
IF = 100 mA
-
-
1.1
V
[1]
Pulse test: tp  300 s;   0.02.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
3 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; Zener TDZ2V4J to Zener TDZ24J
Tj = 25 C unless otherwise specified.
TDZxxxJ Working voltage
VZ (V)
Differential
resistance
Reverse current Temperature
coefficient
I (A)
R
rdif ()
SZ (mV/K)
Diode
capacitance
Cd (pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ = 5 mA
IZ = 1 mA IZ = 5 mA
IZ = 5 mA
Min
Max
Max
Max
Max
VR (V)
Min
Max
Max
Max
2V4
2.35
2.45
400
100
50
1.0
3.5
0
450
15
2V7
2.65
2.75
450
100
20
1.0
3.5
0
440
15
3V0
2.94
3.06
500
95
10
1.0
3.5
0
425
15
3V3
3.23
3.37
500
95
5
1.0
3.5
0
410
15
3V6
3.53
3.67
500
90
5
1.0
3.5
0
390
15
3V9
3.82
3.98
500
90
3
1.0
3.5
0
370
15
4V3
4.21
4.39
600
90
3
1.0
3.5
0
350
15
4V7
4.61
4.79
500
80
3
2.0
3.5
0.2
325
15
5V1
5.00
5.20
480
60
2
2.0
2.7
1.2
300
15
5V6
5.49
5.71
400
40
10
2.5
2
2.5
275
15
6V2
6.08
6.32
150
10
3
4.0
0.4
3.7
250
12
6V8
6.66
6.94
80
15
2
4.0
1.2
4.5
215
12
7V5
7.5
7.65
80
10
1
5.0
2.5
5.3
170
4.0
8V2
8.04
8.36
80
10
0.70
5.0
3.2
6.2
150
4.0
9V1
8.92
9.28
100
10
0.50
6.0
3.8
7.0
120
3.0
10
9.80
10.20
150
10
0.20
7.0
4.5
8.0
110
3.0
11
10.80
11.20
150
10
0.10
8.0
5.4
9.0
108
2.5
12
11.80
12.20
150
10
0.10
8.0
6.0
10
105
2.5
13
12.70
13.30
170
10
0.10
8.0
7.0
11
103
2.5
15
14.70
15.30
200
15
0.05
10.5
9.2
13
99
2.0
16
15.70
16.30
200
20
0.05
11.2
10.4
14
97
1.5
18
17.6
18.4
225
20
0.05
12.6
12.4
16
93
1.5
20
19.6
20.4
225
20
0.05
14.0
14.4
18
88
1.5
22
21.6
22.4
250
25
0.05
15.4
16.4
20
84
1.25
24
23.5
24.5
250
30
0.05
16.8
18.4
22
80
1.25
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 s; square wave; Tj = 25 C before surge.
Table 9.
Characteristics per type; Zener TDZ5V6J
Tj = 25 C unless otherwise specified.
TDZxxxJ
Working voltage
Differential resistance
Temperature coefficient
VZ (V)
rdif ()
SZ (mV/K)
IZ = 10 mA
5V6
TDZXJ_SER
Product data sheet
IZ = 0.5 mA
IZ = 10 mA
IZ = 5 mA
Min
Max
Max
Max
Min
Max
5.20
6.00
500
7
1.7
2.8
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
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TDZxJ series
NXP Semiconductors
Single Zener diodes
Table 10. Characteristics per type; Zener TDZ27J to Zener TDZ30J
Tj = 25 C unless otherwise specified.
TDZxxxJ Working voltage
Differential resistance Reverse
current
r ()
VZ (V)
dif
IR (A)
Temperature
coefficient
Diode
capacitance
SZ (mV/K)
Cd (pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ = 2 mA
IZ = 0.5 mA IZ = 2 mA
IZ = 2 mA
Min
Max
Max
Max
Max
VR (V)
Min
Max
Max
Max
27
26.5
27.5
250
40
0.05
18.9
21.4
25.3
73
1
30
29.4
30.6
250
40
0.05
21
24.4
29.4
66
1
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 s; square wave; Tj = 25 C before surge.
006aac671
103
mbg781
300
PZSM
(W)
IF
(mA)
102
200
(1)
(2)
(3)
10
100
(4)
1
10–4
10–3
0
0.6
10–2
tp (s)
0.8
1
VF (V)
Tj = 25 C
(1) TDZ2V4J to TDZ5V6J
(2) TDZ6V2J to TDZ6V8J
(3) TDZ7V5J to TDZ30J; Tj = 25 C before surge
(4) TDZ7V5J to TDZ30J; Tj = 150 C before surge
Fig 1.
Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
TDZXJ_SER
Product data sheet
Fig 2.
Forward current as a function of forward
voltage; typical values
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Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
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TDZxJ series
NXP Semiconductors
Single Zener diodes
mld444
0.5
SZ
(mV/K)
mld445
12
15
SZ
(mV/K)
4V7
13
12
11
10
9V1
8V2
7V5
6V8
6V2
5V6
5V1
0
8
4V3
−0.5
2V4
4
2V7
3V9
−1
3V6
−1.5
0
3V3
3V0
−2
10−1
1
−4
10−1
102
10
1
Fig 3.
IZ (mA)
TDZ2V4J to TDZ4V7J
TDZ5V1J to TDZ15J
Tj = 25 C to 150 C
Tj = 25 C to 150 C
Temperature coefficient as a function of
working current; typical values
Fig 4.
006aaa996
50
102
10
IZ (mA)
Temperature coefficient as a function of
working current; typical values
006aac672
30
VZ(nom) (V) = 2.7
IZ
(mA)
3.3
VZ(nom) (V) = 10
IZ
(mA)
3.9
40
4.7
5.6
6.8
20
8.2
12
30
15
20
10
18
22
10
0
0
0
2
4
6
8
0
10
10
20
30
VZ (V)
VZ (V)
Fig 5.
27
TDZ2V7J to TDZ6V6J
TDZ10J to TDZ27J
Tj = 25 C
Tj = 25 C
Working current as a function of working
voltage; typical values
Fig 6.
Working current as a function of working
voltage; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
TDZXJ_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
6 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
9. Package outline
1.35
1.15
0.80
0.65
0.5
0.3
1
2.7
2.3
1.8
1.6
2
0.40
0.25
Dimensions in mm
Fig 7.
0.25
0.10
04-09-13
Package outline SOD323F (SC-90)
10. Packing information
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
TDZxJ series
[1]
TDZXJ_SER
Product data sheet
Package
SOD323F
Description
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 14.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
7 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
11. Soldering
3.05
2.2
2.1
solder lands
solder resist
0.5 (2×)
1.65 0.95
0.6 (2×)
solder paste
occupied area
0.5
(2×)
0.6
(2×)
Dimensions in mm
sod323f_fr
Reflow soldering is the only recommended soldering method.
Fig 8.
TDZXJ_SER
Product data sheet
Reflow soldering footprint SOD323F (SC-90)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
8 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDZXJ_SER v.2
20110729
Product data sheet
-
TDZ5V6J v.1
Modifications:
TDZ5V6J v.1
TDZXJ_SER
Product data sheet
•
Added type numbers TDZ2V4J, TDZ2V7J, TDZ3V0J, TDZ3V3J, TDZ3V6J, TDZ3V9J,
TDZ4V3J, TDZ4V7J, TDZ5V1J, TDZ6V2J, TDZ6V8J, TDZ7V5J, TDZ8V2J, TDZ9V1J,
TDZ10J, TDZ11J, TDZ12J, TDZ13J, TDZ15J, TDZ16J, TDZ18J, TDZ20J, TDZ22J,
TDZ24J, TDZ27J and TDZ30J.
•
•
Added Table 8 to 10.
Updated Figure 1 to 4 and added Figure 5 and 6.
20100823
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 July 2011
-
© NXP B.V. 2011. All rights reserved.
9 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
TDZXJ_SER
Product data sheet
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Rev. 2 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
10 of 12
TDZxJ series
NXP Semiconductors
Single Zener diodes
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TDZXJ_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
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© NXP B.V. 2011. All rights reserved.
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15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Quality information . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 July 2011
Document identifier: TDZXJ_SER
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