BM23 Evaluation Board User Guide

BM23 Bluetooth®
Evaluation Board User’s Guide
2015 Microchip Technology Inc.
Preliminary Edition
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BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Index
Preface.................................................................................... Error! Bookmark not defined.
1 OVERVIEW ...................................................................................................................... 5
1.1 INTRODUCTION...................................................................................................................................... 5
1.2 BM23 EVALUATION BOARD FEATURES .............................................................................................. 5
1.3 BM23 EVALUATION BOARD CONTENTS .............................................................................................. 7
2. Getting Started ............................................................................................................. 10
2.1 INTRODUCTION.................................................................................................................................... 10
2.2 HARDWARE REQUIREMENTS ............................................................................................................ 10
2.3 APPLICATION DEMONSTRATION ....................................................................................................... 10
2.4 SOFTWARE/UTILITY REQUIREMENTS .............................................................................................. 13
2.5 MODULE CONFIGURATION................................................................................................................. 25
APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS ............................... 26
APPENDIX B. CLASS D AMPLIFIER DAUGHTER BOARD............................................ 37
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EVALUTATION BOARD USER’S GUIDE
PREFACE
INTRODUCTION
This chapter contains general information that will be useful to know before using the
Product Name. Items discussed in this chapter include:

Document Layout

Recommended Reading

The Microchip Web Site

Customer Support

Document Revision History
DOCUMENT LAYOUT
This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. The document is organized as
follows:

Chapter 1. “Overview” – This chapter introduces the BM23 Bluetooth Evaluation Board and provides an
overview of various features.


Chapter 2. “Getting Started” – This chapter describes

The hardware components and setup of the BM23 Bluetooth Evaluation Board.

The application demonstrations of the BM23 Bluetooth Evaluation Board.

Software/Utility Requirements of the BM23 Bluetooth Evaluation Board.
Appendix A. “BM23 Audio Evaluation Board Schematics” – This appendix includes a schematic of the
BM23 Bluetooth Evaluation Board.
RECOMMENDED READING
This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. Other useful documents are
listed below. The following Microchip documents are available and recommended as supplemental reference
resources:
STEREO Module Data Sheet (DSxxxxxxxx)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at http://www.microchip.com. This
web site is used as a means to make files and information easily available to
customers. Accessible by using your favorite Internet browser, the web site contains
the following information:

Product Support – Data sheets and errata, application notes and sample programs, design resources,
user’s guides and hardware support documents, latest software releases and archived software

General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online
discussion groups, Microchip consultant program member listing

Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of
seminars and events, listings of Microchip sales offices, distributors and factory representatives
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EVALUTATION BOARD USER’S GUIDE
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:

Distributor or Representative

Local Sales Office

Field Application Engineer (FAE)

Technical Support
Customers should contact their distributor, representative or Field Application Engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (Aug 2015)
This is the initial released version of this document.
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BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
1 OVERVIEW
1.1 INTRODUCTION
This user’s guide describes the hardware and software setup for the BM23 Bluetooth® Evaluation Board.
This board contains the hardware needed to evaluate the BM23 Bluetooth module. The BM23 module is
mounted to an evaluation board that demonstrates the module’s key features. The evaluation board
contains:

PIC18 MCU and YAMAHA YDA174 DSP on board

12 push buttons to control audio playback

Status LEDs

The BM23 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP

A2DP stereo audio (Sink mode support for Sub-Band Coding (SBC)),

AVRCP media player remote control

HFP/HSP for accepting a phone call support.
For data sheet and other details related to BM23 module, refer to the Microchip web
site at http://www.microchip.com.
This chapter discusses the following topics:

BM23 Evaluation Board Features

BM23 Evaluation Board Contents and Part Details
1.2 BM23 EVALUATION BOARD FEATURES
The BM23 Evaluation Board has the following features:

Fully qualified Bluetooth version 4.1 module, fully compatible with Bluetooth version 3.0, 2.0, 1.2
system.

Embedded BM23 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shielding
case)

Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP

Stereo audio output for highest quality audio

Castellated SMT pads for easy and reliable PCB mounting

Environmentally friendly, RoHS compliant

Bluetooth SIG certified

Integrate MCU and DSP on board for easy function and feature demonstration.
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1.3 BM23 EVALUATION BOARD CONTENTS
BM23 Evaluation Board contains the following components as shown in Figure 1-1 which describes the
evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation
board.
FIGURE 1-1: BM23 EVALUATION BOARD
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MIC (JP23)
1
2
ICSP (J5)
3
1
2
3
4
5
6
Pin
Description
Pin
Description
1
MIC_P1
1
Reset
2
AGND
2
ICD3 power
3
MIC_N1
3
GND
4
PGD
5
PGC
6
NC
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TABLE 1-1:BM23 EVALUATION BOARD HARDWARE
Hardware Component
Description
BM23
Bluetooth® 4.1 Module
USB Connector
USB to UART for EEPROM R/W for BM23.
15V Adapter Jack
Connect to 15V adapter (P2) for main power source of whole system.
Amplifier Audio Out
External AMP Connector JP6 / 7
Audio In
Audio 3.5 mm jack for Mono microphone input(P6) and AUX input(P8)
Status LEDs
Red and Blue LEDs show the pairing/connection status
MFB Button
Switch to turn on/off BM23 module (SW24)
Play/Pause Button
Button to play or pause the audio playback (SW31)
Previous Track Button
Button to skip track backwards (SW23)
Next Track Button
Button to skip track forwards(SW45)
Volume Up Button
Button to increase volume (SW27)
Volume Down Button
Button to decrease volume (SW28)
Reset Button
Reset BM23 (SW10); Reset MCU (SW1)
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EVALUTATION BOARD USER’S GUIDE
2. Getting Started
2.1 INTRODUCTION
This chapter describes how the BM23 Evaluation Board works. Certain hardware and utilities are essential to
support the evaluation/development of demo applications. This chapter discusses the following topics:

Hardware Requirements

Software/Utility Requirements

Module Configuration
2.2 HARDWARE REQUIREMENTS
2.2.1 HARDWARE SETUP
To setup the evaluation hardware, perform the following steps:
1. Make sure pin 1 / 2 / 3 of “SW9” in “Off / Off / On” state make .system in application mode.
2. Connect the speaker line to the amplifier output connector (J6 / 7).
2.2.2 USING THE EVALUATION BOARD
1. Connect 15V adapter P2.
2. Click MFB button to turn-on and enter pairing mode. The status LEDs will blink. Now the BM23 Evaluation
board should be discoverable.
3. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device will display a list
of discoverable Bluetooth devices. Select the device and connect with it.
4. If the pairing with the device is successful, BM23 evaluation board can connect to the host device. Once
connected, BM23 evaluation board enables Advanced Audio Distribution Profile (A2DP) for audio
playback and Audio Video Remote Control Profile (AVRCP) for player control.
2.3 APPLICATION DEMONSTRATION
2.3.1 AUDIO DEMONSTRATION
In this demonstration, user can play an audio stream on both BM23 evaluation boards using a computer or
smartphone. The following are the steps to perform the demonstration.
1. Connect BM23 evaluation board to a host device (PC or smartphone) that has an audio source.
2. Connect speakers to BM23 evaluation board J6 / 7.
3. Open the audio source on the host device. Microchip recommends using media player.(e.g. Microsoft
Media Player, iTunes, and Android).
4. Start the audio stream on the media player.
When BM23 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the audio
control buttons are use to:

Control the volume of audio output.

Go to the previous track.
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
Go to the next track.

Start / stop playing the current track.
FIGURE 1-2: BM23 EVALUATION BOARD AUDIO CONTROL BUTTONS
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2.3.2 HSP/HFP DEMONSTRATION
In this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a
paired smartphone. This demonstration requires a microphone. It would be good to use a PC
headset/microphone (with two-plugs). The following are the steps to perform the demonstration.
1. Connect the speakers / microphone to BM23 evaluation board’s audio out connector (J6/7) and MIC
input (P6) respectively.
2. Connect BM23 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetooth
profiles.
3. From another one phone, initiate a call to the smartphone that is paired with BM23 evaluation board. The
A2DP stream pauses and the ringtone plays on the speakers.
4. Click button “MFB” on BM23 evaluation board to accept the incoming call.
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2.4 SOFTWARE/UTILITY REQUIREMENTS
2.4.1 UI SETTING
Step1. Open UI tool
Step2. Firstly, you can load default UI setting or previous setting file.
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Step3. Click “Edit” to modify the settings meet your needs.
Step4. In the main settings, it can enable or disable supported profile or function which system need.
Click “Next” for other setting.
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Step5. You can do system and functional setting in these pages.
Click “Help” you can get more detail information.
Step6. After finish parameter set up, click “Finish” button and a message will remind you check EEPROM
size on your system.
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Step7. Click “Save” button to save these UI parameter as a “.txt” file
Step8. We will use MPET tool to merge it with EEPROM table and use EEPROM tool load these parameter
to system.
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2.4.2 DSP TOOL SETTING
Step1. Open DSP tool
Step2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2020S-203)
Step3. You can setup all voice and audio function in these pages.
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Step4. Click “Save” button to save these DSP parameter as a “.txt” file after finish all DSP
setting. Then use MPET tool to merge it with EEPROM table and use EEPROM tool load
these parameter to system.
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2.4.3 MERGE TOOL SETTING
Step1. Open MPET tool, click “Next” to set up.
Step2. Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.
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Step3. Select the bin file (full EEPROM table) and click “Next”
Step4. If the bin file had included UI, DSP or patch code parameter, you can see them in block 1 as the
figure below. If you want keep the in your new system, you can select the item which you want to keep and
use “pull down” button to add them to merge list. If you want to add new parameter (e.g. UI and DSP
parameter), click “+” button to add these files into tool for merge with EEPROM table.
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Step5. Select an output path and create a name for the merged EEPROM table.
Step6. Click “Generate” button to generate the new EEPROM table.
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Step7. Select if you want use new setting of these parts.
Step8. Now you have a merged patch file (*.ipf file).
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2.4.4 Procedure to Update EEPROM Parameters
Step 1. Make sure SW9 in “ROM TEST” mode.
Step 2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting.
Step 3. Run the E2PROM_tool.exe program and a window will be come up as below
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Step 4. Specify the COM Port.
Step5. Press ”Browse” to choose the file where you want to write EEPROM table or patch file.
Step6. Press” Write” to write these setting to EEPROM
Step7. After finish data update, remove USB cable and make SW9 to “ROM APP” mode and reboot.
Now EVB can use the new setting after updated EEPROM parameter.
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2.5 MODULE CONFIGURATION
2.5.1 Mode Settings
Setting in Mode Switch:
For ROM chip application
Mode
SW9 Setting
Switch 9 PIN Definition
Test Mode
1: ON (P2_0: LOW)
2: OFF (P2_4: HIGH)
3: ON (EAN: HIGH)
Application Mode
1: OFF (P2_0: HIGH)
2: OFF (P2_4: HIGH)
3: ON (EAN: HIGH)
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APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS
EVB block diagram
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G
S
Q1
TS2301
D
GND
P2_0
P3_0
P2_0
P2_7
P0_5
HCI_RXD
HCI_TXD
P0_3
P0_2
P2_4
LED2
LED1
MFB
BK_OUT
BAT_IN
o BAT_IN trace
t.
3
1
2
R29
1K
C52
1u/16V
16
17
18
19
20
21
22
23
24
25
Preliminary Edition
V
2015 Microchip Technology Inc.
RST
NC
NC
VDD_IO
P1_5
P0_1
ADAP_IN
BAT_IN
AMB_DET
SYS_PWR
P0_0
RFS0
TFS0
SLK0
DR0
DT0
P0_4
EAN
MIC1_P
MIC1_N
MIC_BIAS
VDDA
AIR
AIL
GND
PCB1
FP-BM23
BAT_IN
5V
P2_4
HCI_RXD
HCI_TXD
P3_0
P2_0
MFB
SY S_PWR
LED2
LED1
P3_0
C2
0.1u/10V
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
SY S_PWR
RST_N 1
3
2
G691L293
RST
VCC
GND
U7
SW10
TS08M-PF
RESET
1
2
RST_N
P6
PJ-2001-5K
P8
TSH-3865D
3
5
4
2
1
MIC1
10
2
4
1
3
LINE_R
1
1
1
R13
1K
R14
2K
2
2
R32
0
R38
0
1
2
3
C20
2.2u/6.3V
JP23
JP 1x3
1
C26
0.1u/10V
LINE_L
P3_0
LINE INPUT
R11
1K
LED3
LED2
LED1
1
R37
NP-0402
2
2
R36
NP-0402
C29
0.1u/10V
P2_4
LED3
2
LED2 2
LED-G
1
1
LED2 LED-HR
1
LED1 LED-B
1
MIC_N1
C28
0.1u/10V
LED1 2
AIL
AIR
MIC_P1
MIC_BIAS
C22
2.2u/6.3V
C27
220p/50V
2
C51
NP-0402
C50
1u/16V
C38
1u/16V
C47
NP-0402
1K
R64
2
Wednesday , July 22, 2015
Sheet
4
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
8
Rev
4.0
P/N
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
MAIN CIRCUIT
Title
Date:
BM23 EVB
Size
B
Board Name
VDD_IO
C7
0.1u/10V
SY S_PWR
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7
11
8
9
10
VBUS
DD+
ID
GND
1
2
3
4
5
C23
0.1u/16V
RST_N
R21
470
2
X1
X4P-12MHZ
3
2
R69
1K
RX
1
5V
C19
12p/50V
D1
LED-HR
C18
10u/16V
D18
CDSU400B
1
4
1
C12
1u/16V
C21
12p/50V
DD+
R20
10K
EXT_3V3
1
2
6
5V
2
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1
R92
3K
1
2
3
4
5
6
7
8
9
10
2
R7
10
R9
4K7
1 6
5
4
HCI_TXD
1
U10
VSS
D+
DVUSB
GP0/SSPND
GP1/USBCFG
GP2
CTS
RX
RTS
R8
4K7
2
HCI_RXD
MCP2200
VDD
OSC1
OSC2
RST
GP7/TxLED
GP6/RxLED
GP5
GP4
GP3
TX
C62
0.1u/16V
VDD_IO
1
2
1
2
1
2
1
2
SW9
2
TX
D+
D-
3
2
1
Date:
Size
A
Sheet
5
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
8
Rev
4.0
P/N
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
HCI INTERFACE
BM23 EVB
C24
0.1u/16V
EXT_3V3
EAN
P2_4
P2_0
Wednesday , July 22, 2015
Title
Board Name
R91
3K
20
19
18
17
16
15
14
13
12
11
SW-3BIT
ON
P3
UCB02SB3021-99R
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12
4
5
+
_IC_N
_SLEEP
_MUTE
_IRQ_N
_PROT_N
_P1_3
_P1_2
1
R124
3K/1%
(0.41V)
DSP_IC_N
DSP_SLEEP
DSP_MUTE
DSP_IRQ_N
DSP_PROT_N
DSP_P1_3
DSP_P1_2
1V8
D17
CDSL4148
R125
10K
12
C14
10u/16V
DC_AMP
C133
1000u/50V
INTERFACE
9
mpatible)
24T
ADJ
VOUT
D15
CDSL4148
8
1
2
1
2
D16
CDSL4148
C32
1000u/50V
1
2
1
1
R4
47K
RFS0
TFS0
SCLK0
DR0
DT0
C102
10p/50V
1
1
1
1
1
1V8
X2
XTL571300-L118-045
C11
0.1u/16V
1V8
C100
10u/16V
U2
R17
R19
R118
R18
R22
33
33
33
33
33
C103
0.1u/16V
3V3
2
YDA174A30
R94
1M
3V3
R97
4K7
C96
0.1u/16V
1V8
DSP_P1_2
DSP_P1_3
3V3
R15
4K7
220
Y DA174A30
DVDD18
GPIO6
GPIO5
GPIO4
GPIO3
DVSS
GPIO2
GPIO1
GPIO0
PLLVDD
IC_N
PLLVSS
2
2
2
2
2
RFS0_DSP
TFS0_DSP
SLK0_DSP
DR0_DSP
DT0_DSP
1
1
1
1
1
TP1
TP2
TP3
TP4
TP5
I2S INTERFACE
R95
1
C101
10p/50V
1
2
3
4
5
6
7
DT0_DSP
SLK0_DSP 8
RFS0_DSP 9
10
11
DSP_IC_N
12
C98
0.1u/16V
C1
0.1u/16V
3
2
G
4 G
1
2
3V3
1
EP
48
47
46
45
44
43
42
41
40
39
38
37
OPEN
PVDDPL
OUTPL
PVSSL
OUTML
PVDDML
PVDDMR
OUTMR
PVSSR
OUTPR
PVDDPR
OPEN
GPIO7
IOVDD
GPIO8
GPIO9
GPIO10
GPIO11
TESTb
DVSS
OPEN
DVSS
REFA
AVSS
36
35
34
33
32
31
30
29
28
27
26
25
DSP_IRQ_N
3V3
R99
47K
3V3
R12
100K
C97
1u/50V
DC_AMP
OUTPR
OUTMR
OUTML
C10
1u/50V
DC_AMP
DC_AMP
C134
1u/50V
R93
100K
DC_AMP
C8
1u/50V
OUTPL
R100
47K
C6
1u/16V
DSP_MUTE
DSP_SLEEP
DSP_PROT_N
XIN
XOUT
IOVDD
SCL
SDA
DVDD18
IRQ_N
OPEN
PROT_N
SLEEP_N
MUTE_N
TESTr
13
14
15
16
17
18
19
20
21
22
23
24
+
Preliminary Edition
2
1
49
2
1
2
1
2
1
2
1
2
1
2
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DC_AMP
L4
L3
OUTMR 1
OUTPR 1
L22uH
L6
2
2
2
2
C104
0.1u/50V
C105
0.1u/50V
C25
0.1u/50V
C106
0.1u/50V
Wednesday , July 22, 2015
1
2
J7
1
2
J6
HDR 1x2
HDR 1x2
Sheet
6
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
8
Rev
4.0
P/N
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
DSP_YDA174
Title
Date:
BM23 EVB
C30
0.22u/16V
C107
0.22u/16V
Size
B
Board Name
L22uH
L22uH
L22uH
L5
SPKOUT
OUTML 1
OUTPL 1
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
page 33
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
2015 Microchip Technology Inc.
Preliminary Edition
page 34
P3_0
Preliminary Edition
1
2
3
4
5
6
7
8
RESET 9
10
11
12
13
14
15
16
17
18
19
20
P77
PIC18F85J10
RJ2/WRL
RJ3/WRH
RB0/INT0/FLT0
RB1/INT1
RB2/INT2
RB3/INT3/ECCP2/P2A
RB4/KBI0
RB5/KBI1
RB6/KBI2/PGC
VSS
OSC2/CLKO
OSC1/CLKI
VDD
RB7/KBI3/PGD
RC5/SDO1
RC4/SDI1/SDA1
RC3/SCK1/SCL1
RC2/ECCP1/P1A
RJ7/UB
RJ6/LB
MCU_P72
3V3
C125
0.1u/25V
3V3
C126
0.1u/25V
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
2
DP1
DP-4
1
T1OSO
2
DP2
DP-4
1
3
C129
0.1u/25V
3V3
X4
XTAL-32.768KHZ
T1OSI
PGD
PGC
MCU_P44
MCU_P45
MCU_P46
P0_0 (TX_IND)
DSP_PROT_N
DSP_IRQ_N
15p/50V
C120
15p/50V
C114
1
4
C4
10p/50V
X3
X4P-16MHZ
2
3
C3
10p/50V
R128
1K
R127
1K
R126
2K
2
1
ICD3_PWR
Q3
STS2306
3
RST_N
ICSP
J5
JP 1x6
1
2
3
4
5
6
1
2
Q2
STS2306
3
RST_PIC18
Wednesday , July 22, 2015
Date:
MCU_PIC18
Size
B
BM23 EVB
Title
Sheet
7
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
8
Rev
4.0
P/N
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
(Reset PIC18 when connect to USB)
Board Name
5V
(Reset BT when connect to ICD3)
1
2
PGD
PGC
RESET
ICD3_PWR
S
C127
0.1u/25V
PIC18F85J10
RH2/A18
RH3/A19
RE1/AD9/WR/P2C
RE0/AD8/RD/P2D
RG0/ECCP3/P3A
RG1/TX2/CK2
RG2/RX2/DT2
RG3/CCP4/P3D
MCLR
RG4/CCP5/P1D
VSS
VDDCORE/VCAP
RF7/SS1
RF6/AN11
RF5/AN10/CVREF
RF4/AN9
RF3/AN8
RF2/AN7/C1OUT
RH7/AN15/P1B
RH6/AN14/P1C
3V3
JP33
JP 1x2
G
C130
0.1u/25V
(Audio AMP Enable)
P1_5
(LINE_IN_DET)
C131
0u/16V
2
1
2
R122 3K
1
2
R123 3K
1
R112
100/1%
ST_N
I_TXD
I_RXD
MCU_P71
MCU_P70
FB/RX_IND) MFB
U13
T1OSI
T1OSO
C128
0.1u/25V
DSP_IC_N
DSP_SLEEP
DSP_MUTE
DSP_P1_3
DSP_P1_2
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P17
P20
2
RH1/A17
RH0/A16
RE2/AD10/CS/P2B
RE3/AD11/P3C
RE4/AD12/P3B
RE5/AD13/P1C
RE6/AD14/P1B
RE7/AD15/ECCP2/P2A
RD0/AD0/PSP0
VDD
VSS
RD1/AD1/PSP1
RD2/AD2/PSP2
RD3/AD3/PSP3
RD4/AD4/PSP4/SDO2
RD5/AD5/PSP5/SDI2/SDA2
RD6/AD6/PSP6/SCK2/SCL2
RD7/AD7/PSP7/SS2
RJ0/ALE
RJ1/OE
RH5/AN13/P3B
RH4/AN12/P3C
RF1/AN6/C2OUT
ENVREG
AVDD
AVSS
RA3/AN3/VREF+
RA2/AN2/VREFRA1/AN1
RA0/AN0
VSS
VDD
RA5/AN4
RA4/T0CKI
RC1/T1OSI/ECCP2/P2A
RC0/T1OSO/T13CKI
RC6/TX1/CK1
RC7/RX1/DT1
RJ4/BA0
RJ5/CE
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
1
2
1
S
D
2
D
1
1
2015 Microchip Technology Inc.
G
2
3V3
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
page 35
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
2015 Microchip Technology Inc.
Preliminary Edition
page 36
R116
10K/1%
2
2015 Microchip Technology Inc.
C61
1u/16V
1
3V3
Preliminary Edition
1
1
1
1
1
1
MCU_P72
MCU_P72
1
2
MCU_P70
SW34
TS08M-PF
2
P77
P77
1
SW35
TS08M-PF
2
P77
Board Name
Date:
Size
A
P77
MCU_P72
MCU_P71
MCU_P70
Sheet
8
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
MCU_BUTTON
Monday , July 27, 2015
Title
2
2
2
2
R3
R2
R1
R0
8
Rev
4.0
P/N
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
SW38
TS08M-PF
BM23 EVB
1
SW PT
SOUND
EFFECT
SW45
TS08M-PF
FWD >>
SW39
TS08M-PF
PAIRING
1
1
1
SW40
TS08M-PF
MCU_P72
MCU_P71
C63
1u/16V
R11510K/1%
1
2
SW28
TS08M-PF
2
2
3V3
MCU_P46
C2
SW24
TS08M-PF
VOL-
MFB
2
SW31
TS08M-PF
SW23
TS08M-PF
C132
1u/16V
R11410K/1%
1
2
3V3
PLAY/PAUSE
MCU_P71
MCU_P70
<< PRV
MCU_P71
MCU_P70
SW27
TS08M-PF
2
2
MCU_P45
VOL+
C1
SW22
TS08M-PF
MCU_P44
C0
BUTTON
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
page 37
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