HS-26C31RH ® Data Sheet May 27, 2010 Radiation Hardened Quad Differential Line Driver The Intersil HS-26C31RH is a quad differential line driver designed for digital data transmission over balanced lines and meets the requirements of EIA standard RS-422. Radiation hardened CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26C31RH accepts CMOS signal levels and converts them to RS-422 compatible outputs. This circuit uses special outputs that enable the drivers to power-down without loading down the bus. Enable and disable pins allow several devices to be connected to the same data source and addressed independently. Specifications FN3401.5 Features • Electrically Screened to SMD # 5962-96663 • QML Qualified per MIL-PRF-38535 Requirements • 1.2 Micron Radiation Hardened CMOS - Total Dose Up to . . . . . . . . . . . . . . . . . . . . 300kRAD(Si) • Latchup Free • EIA RS-422 Compatible Outputs (Except for IOS) • CMOS Inputs • High Impedance Outputs when Disabled or Powered Down • Low Power Dissipation . . . . . . . . . 2.75mW Standby (Max) • Single 5V Supply • Low Output Impedance . . . . . . . . . . . . . . . . . 10Ω or Less Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-96663. A “hot-link” is provided on our homepage for downloading. www.intersil.com/military/ • Full -55°C to +125°C Military Temperature Range Applications • Line Transmitter for MIL-STD-1553 Serial Data Bus Ordering Information ORDERING NUMBER INTERNAL MKT. NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # 5962F9666301QEC HS1-26C31RH-8 Q 5962F96 6630QEC -55 to +125 16 LD SBDIP D16.3 5962F9666301QXC HS9-26C31RH-8 Q 5962F96 66301QXC -55 to +125 16 LD FLATPACK K16.A 5962F9666301VEC HS1-26C31RH-Q Q 5962F96 66301VEC -55 to +125 16 LD SBDIP D16.3 5962F9666301VXC HS9-26C31RH-Q Q 5962F96 66301VXC -55 to +125 16 LD FLATPACK K16.A HS1-26C31RH/PROTO HS1-26C31RH/PROTO HS1- 26C31RH/PROTO -55 to +125 16 LD SBDIP D16.3 HS9-26C31RH/PROTO HS9-26C31RH/PROTO HS9- 26C31RH/PROTO -55 to +125 16 LD FLATPACK K16.A 5962F9666301V9A HSO-26C31RH-Q 1 -55 to +125 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2000, 2008, 2010. All Rights Reserved Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation. All other trademarks mentioned are the property of their respective owners. HS-26C31RH Pinouts HS1-26C31RH (16 LD SBDIP) CDIP2-T16 TOP VIEW HS9-26C31RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW 16 VDD AIN 1 16 VDD AO 2 15 DIN AO 2 15 DIN AO 3 14 DO AIN 1 13 DO ENABLE 4 BO 5 12 ENABLE BO 6 11 CO BIN 7 10 CO GND 8 9 CIN AO 3 14 DO ENABLE 4 13 DO BO 5 12 ENABLE BO 6 11 CO BIN 7 10 CO GND 8 9 CIN Logic Diagram ENABLE ENABLE DIN CIN BIN AIN DO DO CO CO BO BO AO AO All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 2 FN3401.5 May 27, 2010 HS-26C31RH Die Characteristics DIE DIMENSIONS: Substrate: 96.5 mils x 195 mils x 21 mils (2450 x 4950) AVLSI1RA Backside Finish: INTERFACE MATERIALS: Silicon Glassivation: ASSEMBLY RELATED INFORMATION: Type: PSG (Phosphorus Silicon Glass) Thickness: 10kÅ ±1kÅ Substrate Potential (Powered Up): VDD Metallization: ADDITIONAL INFORMATION: M1: Mo/TiW Thickness: 5800Å M2: Al/Si/Cu (Top) Thickness: 10kÅ ±1kÅ Worst Case Current Density: <2.0x105A/cm2 Bond Pad Size: 110µmx100µm Metallization Mask Layout (15) DIN (16) VDD (1) AIN (16) VDD HS-26C31RH AO (2) (14) DO AO (3) (13) DO (12) ENABLE ENABLE (4) 3 CIN (9) (10) CO GND (8) BO (6) GND (8) (11) CO BIN (7) BO (5) FN3401.5 May 27, 2010