12 Pin UDFN, 3x3, 0.4P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN12, 3x3, 0.4P
CASE 506BE−01
ISSUE O
1
DATE 05 OCT 2006
SCALE 2:1
A B
D
PIN 1
REFERENCE
2X
0.15 C
2X
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.15 C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.10 C
A
12X
0.08 C
(A3)
A1
SIDE VIEW
C
SEATING
PLANE
L
1
6
e
e/2
E2
12X
K
12
7
12X
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
D2
12X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.15 REF
0.15
0.25
3.00 BSC
2.40
2.60
3.00 BSC
1.70
1.80
0.40 BSC
0.15
−−−
0.30
0.50
b
0.10 C A B
0.05 C
BOTTOM VIEW
(NOTE 3)
xxxxx = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to device
data sheet for actual part marking. Pb−Free indicator,
“G” or microdot “ G”, may or may not be present.
SOLDERING FOOTPRINT*
2.50
1.25
0.85
3.30
1.70
0.40
PITCH
12X
0.55
12X
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON23436D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
12 PIN DFN, 3X3, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON23436D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY M. COMBES.
DATE
05 OCT 2006
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 01O
Case Outline Number:
506BE
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