12 Pin UDFN, 3x3, 0.4P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN12, 3x3, 0.4P
CASE 506BE−01
ISSUE O
1
DATE 05 OCT 2006
SCALE 2:1
A B
D
PIN 1
REFERENCE
2X
0.15 C
2X
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.15 C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.10 C
A
12X
0.08 C
(A3)
A1
SIDE VIEW
C
SEATING
PLANE
L
1
6
e
e/2
E2
12X
K
12
7
12X
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
D2
12X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.15 REF
0.15
0.25
3.00 BSC
2.40
2.60
3.00 BSC
1.70
1.80
0.40 BSC
0.15
−−−
0.30
0.50
b
0.10 C A B
0.05 C
BOTTOM VIEW
(NOTE 3)
xxxxx = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to device
data sheet for actual part marking. Pb−Free indicator,
“G” or microdot “ G”, may or may not be present.
SOLDERING FOOTPRINT*
2.50
1.25
0.85
3.30
1.70
0.40
PITCH
12X
0.55
12X
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON23436D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
12 PIN DFN, 3X3, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON23436D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY M. COMBES.
DATE
05 OCT 2006
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 01O
Case Outline Number:
506BE