12PIN FLPCHP BUMPED DIE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
12 PIN FLIP−CHIP CSP
CASE 499AB−01
ISSUE A
DATE 18 OCT 2004
1
SCALE 4:1
4X
0.10 C
TERMINAL A1
LOCATOR
D
Ç
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
MILLIMETERS
MIN
MAX
0.550
0.650
0.215
0.265
0.36 REF
1.90
2.00
1.4
1.5
0.250
0.350
0.500 BSC
1.500 BSC
1.000 BSC
DIM
A
A1
A2
D
E
b
e
D1
E1
E
A1
A2
0.10 C
A
0.075 C
C
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
1
e
D
12 X
b
0.15 C A B
0.05 C
C
E1
B
A
1
ÇÇ
ÇÇ
XXXX
AYWW
D1
2
3
4
e
XXXX
A
Y
WW
G or = Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”,
may or may not be present.
DOCUMENT NUMBER:
98AON13128D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
 Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
12 PIN FLIP−CHIP CSP
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON13128D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ BY C. GOYAN
05 AUG 2003
A
CORRECTED MARKING DIAGRAM. REQ. BY T. MANES
18 OCT 2004
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
 Semiconductor Components Industries, LLC, 2004
October, 2004 − Rev. 01A
Case Outline Number:
499AB