16 Pin UQFN, 1.8x2.6, 0.4P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN16 1.8x2.6, 0.4P
CASE 488AU-01
ISSUE A
DATE 01 AUG 2007
1
SCALE 5:1
ÉÉ
ÉÉ
ÉÉ
ÉÉ
PIN 1 REFERENCE
2X
D
A
EDGE OF PACKAGE
L1
E
DETAIL A
Bottom View
(Optional)
0.10 C
EXPOSED Cu
2X
0.10 C
B
TOP VIEW
A
0.05 C
16X
A1
0.05 C
A1
SIDE VIEW
5
15X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
MOLD CMPD
ÉÉÉ
ÉÉÉ
DETAIL B
Side View
(Optional)
SEATING
PLANE
C
8
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.127 REF
0.15
0.25
1.80 BSC
2.60 BSC
0.40 BSC
0.30
0.50
0.00
0.15
0.40
0.60
DIM
A
A1
A3
b
D
E
e
L
L1
L3
A3
GENERIC
MARKING DIAGRAM*
ÇÇÇ
ÇÇÇ
ÇÇÇ
16
1
L
XXMG
G
9
4
e
1
12
16
16X
L3
0.10 C A B
b
0.05 C
NOTE 3
BOTTOM VIEW
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb-Free indicator, “G”, may
or not be present.
MOUNTING FOOTPRINT
0.562
0.0221
XX
= Specific Device Code
M
= Date Code/Assembly Location
G
= Pb-Free Package
(Note: Microdot may be in either location)
0.400
0.0157
0.225
0.0089
1
2.900
0.1142
0.463
0.0182
1.200
0.0472
2.100
0.0827
SCALE 20:1
DOCUMENT NUMBER:
STATUS:
mm Ǔ
ǒinches
98AON22494D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 - Rev. 0
http://onsemi.com
16 PIN UQFN, 1.8 X 2.6, 0.4P 1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON22494D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY E SOTO.
04 MAY 2006
A
ADDED DETAILS A AND B. REQ. BY E. SOTO.
01 AUG 2007
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2007
August, 2007 - Rev. 01A
Case Outline Number:
488AU
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