MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN16 1.8x2.6, 0.4P CASE 488AU-01 ISSUE A DATE 01 AUG 2007 1 SCALE 5:1 ÉÉ ÉÉ ÉÉ ÉÉ PIN 1 REFERENCE 2X D A EDGE OF PACKAGE L1 E DETAIL A Bottom View (Optional) 0.10 C EXPOSED Cu 2X 0.10 C B TOP VIEW A 0.05 C 16X A1 0.05 C A1 SIDE VIEW 5 15X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD ÉÉÉ ÉÉÉ DETAIL B Side View (Optional) SEATING PLANE C 8 MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.127 REF 0.15 0.25 1.80 BSC 2.60 BSC 0.40 BSC 0.30 0.50 0.00 0.15 0.40 0.60 DIM A A1 A3 b D E e L L1 L3 A3 GENERIC MARKING DIAGRAM* ÇÇÇ ÇÇÇ ÇÇÇ 16 1 L XXMG G 9 4 e 1 12 16 16X L3 0.10 C A B b 0.05 C NOTE 3 BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, “G”, may or not be present. MOUNTING FOOTPRINT 0.562 0.0221 XX = Specific Device Code M = Date Code/Assembly Location G = Pb-Free Package (Note: Microdot may be in either location) 0.400 0.0157 0.225 0.0089 1 2.900 0.1142 0.463 0.0182 1.200 0.0472 2.100 0.0827 SCALE 20:1 DOCUMENT NUMBER: STATUS: mm Ǔ ǒinches 98AON22494D ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 - Rev. 0 http://onsemi.com 16 PIN UQFN, 1.8 X 2.6, 0.4P 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON22494D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY E SOTO. 04 MAY 2006 A ADDED DETAILS A AND B. REQ. BY E. SOTO. 01 AUG 2007 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2007 August, 2007 - Rev. 01A Case Outline Number: 488AU