20 PIN QFN, 2.5*4.5 MM

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
QFN20, 2.5x4.5 MM
CASE 485AA−01
ISSUE B
DATE 30 APR 2010
20
SCALE 2:1
PIN ONE REFERENCE
D
A
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
2X
0.15 C
2X
0.15 C
TOP VIEW
GENERIC MARKING
DIAGRAM*
0.10 C
A
20X
0.08 C
(A3)
A1
SIDE VIEW
11
20X
L
e
9
12
e
E2
20X
b
0.10 C A B
0.05 C
19
2
NOTE 3
1
20
1
C
D2
20X
K
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.50 BSC
0.85
1.15
4.50 BSC
2.85
3.15
0.50 BSC
0.20
--0.35
0.45
SEATING
PLANE
XXXX
XXXX
ALYWG
G
XXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
BOTTOM VIEW
DOCUMENT NUMBER:
98AON12653D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN20. 2.5X4.5 MM
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON12653D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
NEW CASE OUTLINE. REQ. BY MICHELE WORKMAN, PHILL CELAYA.
31 MAR 2002
A
CORRECTED MARKING DIAGRAM. REQ. BY J. LETTERMAN.
20 JUL 2004
B
REMOVED DIMENSION A2, UPDATED MARKING DIAGRAM. REQ. BY M RAMOS.
30 APR 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 01B
Case Outline Number:
485AA