20 Pin Flip-Chip, 2.54 x 2.03, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
20 PIN FLIP−CHIP, 2.54x2.03, 0.5P
CASE 766AK−01
ISSUE A
DATE 16 JUL 2010
A1
SCALE 4:1
Ç
Ç
PIN A1
REFERENCE
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
A B
D
E
DIM
A
A1
A2
b
D
D1
E
E1
e
0.10 C
2X
0.10 C
TOP VIEW
A1
0.10 C
A2
20X
0.05 C
A
C
SIDE VIEW
NOTE 3
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
XXXXXX
AYWW
G
D1
20X
e
b
0.05 C A B
0.03 C
XXXXXX
A
Y
WW
G
D
C
E1
B
A
1
2
3
4
e/2
5
MILLIMETERS
MIN
MAX
--0.66
0.21
0.27
0.33
0.39
0.29
0.34
2.54 BSC
2.00 BSC
2.03 BSC
1.50 BSC
0.50 BSC
BOTTOM VIEW
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
20X
0.25
0.50
PITCH
A1
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON23416D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
20 PIN FLIP−CHIP, 2.54 X 2.03, 10.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON23416D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY B. COOK.
06 MAR 2007
A
ADDED SOLDER FOOTPRINT. REQ. BY N. LOPEZ.
16 JUL 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 01A
Case Outline Number:
766AK
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