24 LD MFL2 4X4MM BODY

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
24 PIN MLF
CASE 485F–01
ISSUE O
SCALE 4:1
DATE 01/30/2001
2 PL
0.25 T X
–X–
xxxxx
ABC
A
H
F
2 PL
P
24
0.25 T Y
19
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIE THICKNESS ALLOWABLE IS 0.305 MM
MAXIMUM (0.012 INCHES MAXIMUM).
4. DIMENSION D APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.20 AND 0.25 MM
FROM TERMINAL.
5. THE PIN #1 IDENTIFIER MUST BE ON THE TOP
SURFACE OF THE PACKAGE BY USING
IDENTIFICATION MARK OR OTHER FEATURE OF
PACKAGE BODY.
6. EXACT SHAPE AND SIZE OF THIS FEATURE IS
OPTIONAL.
7. THE SHAPE SHOWN ON FOUR CORNERS ARE
NOT ACTUAL I/O.
8. PACKAGE WARPAGE MAX 0.05 MM.
18
N
R
Q
NOTE 5 & 6
B
E
6
13
2 PL
0.20 T Y
7
–Y–
12
2 PL
0.20 T X
AB
M
AA
C
–T–
0.05 T
AE
K
V
4 PL
AF
NOTE 7
AD
4 PL
Z
AG
4 PL
W
xxxxx = Specific Device
ABC = Date Code
DIM
A
B
C
D
E
F
G
H
K
L
M
N
P
Q
R
V
W
Z
AA
AB
AD
AE
AF
AG
MILLIMETERS
MIN
MAX
4.00 BSC
4.00 BSC
--1.00
0.18
0.30
3.75 BSC
3.75 BSC
0.50 BSC
2.00 BSC
0.01
0.05
0.30
0.55
--12 °
2.00 BSC
1.88 BSC
0.50 DIA
1.88 BSC
2.50 BSC
1.30 BSC
2.50 BSC
0.65
0.80
0.20 REF
1.30 BSC
0.13
0.23
0.24
0.60
0.30
0.45
INCHES
MIN
MAX
0.157 BSC
0.157 BSC
--0.039
0.007
0.012
0.148 BSC
0.148 BSC
0.020 BSC
0.79 BSC
0.000
0.002
0.012
0.022
--12 °
0.079 BSC
0.074 BSC
0.020 DIA
0.079 BSC
0.098 BSC
0.051 BSC
0.098 BSC
0.026
0.031
0.008 REF
0.051 BSC
0.005
0.009
0.009
0.024
0.012
0.018
L
AF 4 PL
D NOTE 4
0.10
G
M
T X Y
ON Semiconductor and
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 Semiconductor Components Industries, LLC, 2001
January, 2001 – Rev. 01O
1
Case Outline Number:
485F
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