CIC61508 Data Sheet

CIC61508
Functional Safety Companion Chip
Data Sheet
V1.2 2011-06
Edition 2011-06
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
CIC61508
Functional Safety Companion Chip
Data Sheet
V1.2 2011-06
CIC61508
CIC61508 Data Sheet
Revision History: V1.2 2011-06
Previous Versions: V1.0, V1.1
Page
Subjects (major changes since last revision)
20
Typical SPI timing parameters are replaced by limit values.
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
[email protected]
Data Sheet
V1.2, 2011-06
CIC61508
Table of Contents
Table of Contents
1
1.1
1.2
1.3
1.4
1.5
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
2.1
2.1.1
2.1.2
2.1.3
2.2
2.2.1
2.2.2
2.2.3
2.2.4
2.3
2.3.1
2.3.2
2.3.3
2.3.4
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Supply Threshold Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Voltage Monitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3
3.1
3.2
3.3
Package and Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Sheet
I-1
1
1
1
1
2
5
21
21
22
23
V1.2, 2011-06
Functional Safety Companion Chip
1
Overview
1.1
Features
CIC61508
The CIC61508 has the following features:
•
•
•
•
•
•
•
•
•
Power supply monitor for over- and under-voltage
Sequencer
Task monitor
Data comparison and verification functions
SPI communication monitor
Safety path control (enable/disable)
Configurable Wake-Up Timer
Wide range of voltage supply supported (3.3V or 5.0V +/-10%)
TSSOP-38 package available
1.2
Ordering Information
For the available ordering codes for the CIC61508, please refer to your responsible sales
representative or your local distributor.
This document decribes the device types shown in Table 1-1.
Table 1-1
CIC61508 Device Types
Device Type
Power Supply
Ambient Temperature Range
SAA-CIC61508-OSRF 5V
5.0 V
-40 to 140 °C
SAA-CIC61508-OSRF 3V
3.3 V
-40 to 140 °C
1.3
Functional Summary
The CIC61508 is a Companion Safety Monitor Chip to build up functional safety
applications; examples include airbag, Electrical Powered Steering (EPS) and damping
systems. The chip is responsible for monitoring the host microcontroller’s behaviour. It
can monitor the host microcontroller’s power supply and verify the host microcontroller’s
requests. It therefore serves as an independent diagnostic monitoring device to allow the
host microcontroller system to be SIL3 approved.
Data Sheet
1
V1.2, 2011-06
CIC61508
Overview
1.4
Pin Configuration
VDDP
1
38
RESET
SCLK
2
37
NC
MTSR
3
36
NC
MRST
4
35
NC
NC
5
34
NC
NC
6
33
SYSDISA
VSSC
7
32
SYSDISB
VDDC
8
31
NC
30
CS
29
NC
NC
9
NC
10
VSSP
11
28
NC
NC
12
27
NC
SYSDISC
13
26
SEND
NC
14
25
SENREF
SENA
15
24
SENGND
SENB
16
23
VSSP
SENC
17
22
VSSP
VDDP
18
21
VSSP
VSSP
19
20
VSSP
CIC61508
Figure 1-1
CIC61508 Pinout (PG-TSSOP-38)
Table 1-2
Pin Definitions and Functions (PG-TSSOP-38)
Pin
Type
Number
Reset Symbol
State1)
1
-
-
VDDP
Voltage Supply
2
I
Hi-Z
SCLK
SPI Clock
3
I
Hi-Z
MTSR
SPI Input
4
O
Hi-Z
MRST
SPI Output
5
-
-
NC
Not connected
Data Sheet
Function
2
V1.2, 2011-06
CIC61508
Overview
Table 1-2
Pin Definitions and Functions (PG-TSSOP-38)
Pin
Type
Number
Reset Symbol
State1)
Function
6
-
-
NC
Not connected
7
-
-
VSSC
Supply Ground (Digital)
8
-
-
VDDC
Core Supply Monitor
9
-
-
NC
Not connected
10
-
-
NC
Not connected
11
-
-
VSSP
Supply Ground
12
-
-
NC
Not connected
13
O
PU
SYSDISC
System Disable C
14
-
-
NC
Not connected
15
I
Hi-Z
SENA
Analog Input A
16
I
Hi-Z
SENB
Analog Input B
17
I
Hi-Z
SENC
Analog Input C
18
-
-
VDDP
Voltage Supply
19
-
-
VSSP
Supply Ground
20
-
-
VSSP
Supply Ground
21
-
-
VSSP
Supply Ground
22
-
-
VSSP
Supply Ground
23
-
-
VSSP
Supply Ground
24
-
-
SENGND
Analog Ground
25
-
-
SENREF
Analog Reference
26
I
Hi-Z
SEND
Analog Input D
27
-
-
NC
Not connected
28
-
-
NC
Not connected
29
-
-
NC
Not connected
30
I/O
PD
CS
Chip Select / Wake-Up Output
31
-
-
NC
Not connected
32
O
Hi-Z
SYSDISB
System Disable B
33
O
Hi-Z
SYSDISA
System Disable A
34
-
-
NC
Not connected
35
-
-
NC
Not connected
Data Sheet
3
V1.2, 2011-06
CIC61508
Overview
Table 1-2
Pin Definitions and Functions (PG-TSSOP-38)
Pin
Type
Number
Reset Symbol
State1)
Function
36
-
-
NC
Not connected
37
-
-
NC
Not connected
38
I
PU
RESET
Reset Input
1) Abbreviations: PU - Pull up; PD - Pull down; Hi-Z - High impedance.
Data Sheet
4
V1.2, 2011-06
CIC61508
Overview
1.5
Power Supply and Reset
The power supply to the CIC61508 is regulated by the internal voltage regulator that
comes with detection circuitries to ensure that the supplied voltages are within the
specified operating range.
The CIC61508 microcontroller requires a power supply voltage level (VDDP) of 3.3 V or
5.0 V, which must be provided from the external power supply pin.
VDDP is used to power up the CIC61508. In order to power up the chip properly, the
external reset pin RESET must be asserted until the internal working voltage (VDDC)
reaches 90% of its intended voltage of 2.5 V. The delay of external reset can be realized
by an external capacitor at RESET pin. This capacitor value must be selected so that
VRESET reaches 0.4 V, but not before VDDC reaches 0.9* VDDC.
A typical application example is shown in Figure 1-2. VDDP capacitor value is 300 nF.
VDDC capacitor value is 220 nF. The capacitor connected to RESET pin is 100 nF.
Typically, the time taken for VDDC to reach 0.9*VDDC is less than 50 μs once VDDP reaches
2.3V. Hence, based on the condition that 10% to 90% VDDP (slew rate) is less than
500 μs, the RESET pin should be held low for 500 μs typically. See Figure 1-3.
Vin
VR
3.3 / 5V
e.g. 300nF
VSSP
typ.
100nF
VDDP
220nF
VDDC
VSSC
RESET
30k
CIC61508
Figure 1-2
Data Sheet
Reset Circuitry
5
V1.2, 2011-06
CIC61508
Overview
Voltage
5V
VDDP
2.5V
2.3V
0.9*VDDC
VDDC
Time
Voltage
RESET with
capacitor
5V
< 0.4V
0V
Time
typ. < 50us
Figure 1-3
VDDP, VDDC and VRESET during Power-on Reset
An external hardware reset is triggered when the reset input pin RESET is asserted and
held low for at least 100 ns.
VDDC detector in the internal voltage regulator detects brownout when the core supply
voltage VDDC dips below the threshold voltage VDDC_TH (2.1 V). The brownout will cause
the device to be reset.
Both the hardware reset and the brownout reset have the same effect as a power-on
reset, therefore the SYSDISx pins will be reset to their default states shown in Table 1-2.
Data Sheet
6
V1.2, 2011-06
CIC61508
Electrical Parameters
2
Electrical Parameters
Chapter 2 provides the characteristics of the electrical parameters which are
implementation-specific for the CIC61508.
2.1
General Parameters
The general parameters are described here to aid the users in interpreting the
parameters mainly in Section 2.2 and Section 2.3.
2.1.1
Parameter Interpretation
The parameters listed in this section represent partly the characteristics of the CIC61508
and partly its requirements on the system. To aid interpreting the parameters easily
when evaluating them for a design, they are indicated by the abbreviations in the
“Symbol” column:
•
•
CC
These parameters indicate Chip Characteristics, which are distinctive features of the
CIC61508 and must be regarded for a system design.
SR
These parameters indicate System Requirements, which must be provided by the
system in which the CIC61508 is designed in.
Data Sheet
7
V1.2, 2011-06
CIC61508
Electrical Parameters
2.1.2
Absolute Maximum Rating
Maximum ratings are the extreme limits to which the CIC61508 can be subjected to
without permanent damage.
Table 1
Absolute Maximum Rating Parameters
Parameter
Symbol
Limit Values
TA
Storage temperature
TST
Junction temperature
TJ
Voltage on power supply pin with VDDP
respect to VSS
Voltage on any pin with respect VIN
to VSS
Ambient temperature
Unit Notes
min.
max.
-40
140
°C
-65
150
°C
-40
150
°C
-0.5
6
V
-0.5
VDDP +
0.5 or
max. 6
V
under bias
under bias
whichever is
lower
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pin with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
8
V1.2, 2011-06
CIC61508
Electrical Parameters
2.1.3
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the CIC61508. All parameters mentioned in the following table refer to these
operating conditions, unless otherwise noted.
Table 2
Operating Condition Parameters
Parameter
Symbol
min.
Limit Values
typ.
max.
Unit Notes/
Conditions
V
Digital power supply voltage
VDDP
3.0
-
3.6
Digital power supply voltage
VDDP
4.5
-
5.5
Digital ground voltage
VSS
0
Operating Clock Frequency1) fCLK
-
26.7
-
MHz
-40
-
140
°C
Ambient temperature
TA
3.3V
Variant
5.0V
Variant
V
1) Some parts of the CIC61508 run at 80 MHz frequency. These frequencies are internal working frequencies of
the CIC61508.
Data Sheet
9
V1.2, 2011-06
CIC61508
Electrical Parameters
2.2
DC Parameters
The electrical characteristics of the DC Parameters are detailed in this section.
2.2.1
Input/Output Characteristics
Table 3 provides the characteristics of the input/output pins of the CIC61508.
Table 3
Input/Output Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
min.
Unit Test Conditions
max.
VDDP = 5 V Range
Output low voltage
VOL
CC –
1.0
V
–
0.4
V
Output high voltage
VOH
CC VDDP - –
1.0
V
IOL = 15 mA
IOL = 5 mA
IOH = -15 mA
VDDP - –
V
IOH = -5 mA
V
CMOS Mode
V
CMOS Mode
–
V
CMOS Mode
–
V
CMOS Mode
Input Hysteresis on port HYSP CC 0.08 × –
pins1)
VDDP
V
CMOS Mode
-10
μA
–
μA
10
μA
–
μA
CC -0.5
0.5
μA
VIH,min
VIL,max
VIL,max
VIH,min
0 < VIN < VDDP,
TA ≤ 140°C
SR -5
5
mA
0.4
Input low voltage on
port pins
VILP
Input low voltage on
RESET pin
VILR
Input high voltage on
port pins
VIHP
Input high voltage on
RESET pin
VIHR
0.3 ×
SR –
VDDP
0.3 ×
SR –
VDDP
SR 0.7 ×
VDDP
SR 0.7 ×
VDDP
Pull-up current
IPU
SR –
Pull-down current
IPD
SR –
-150
150
Input leakage current
2)3)
IOZ1
Overload current on any IOV
pin
Data Sheet
10
V1.2, 2011-06
CIC61508
Electrical Parameters
Table 3
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values
min.
Unit Test Conditions
max.
Absolute sum of
overload currents
Σ|IOV|
SR –
25
mA
3)
Voltage on any pin
during VDDP power off
VPO
SR –
0.3
V
4)
Maximum current per
IM SR SR –
pin (excluding VDDP and
VSS)
15
mA
Maximum current for all Σ|IM|
pins (excluding VDDP
and VSS)
SR –
60
mA
IMVDDP SR –
80
mA
SR –
80
mA
Maximum current into
VDDP
Maximum current out of IMVSS
VSS
VDDP = 3.3 V Range
Output low voltage
VOL
CC –
1.0
V
–
0.4
V
Output high voltage
VOH
CC VDDP - –
1.0
V
IOL = 8 mA
IOL = 2.5 mA
IOH = -8 mA
VDDP - –
V
IOH = -2.5 mA
V
CMOS Mode
V
CMOS Mode
–
V
CMOS Mode
–
V
CMOS Mode
CC 0.03 × –
V
CMOS Mode
-5
μA
–
μA
VIH,min
VIL,max
0.4
Input low voltage on
port pins
VILP
Input low voltage on
RESET pin
VILR
Input high voltage on
port pins
VIHP
Input high voltage on
RESET pin
VIHR
Input Hysteresis1)
HYS
0.3 ×
SR –
VDDP
0.3 ×
SR –
VDDP
SR 0.7 ×
VDDP
SR 0.7 ×
VDDP
VDDP
Pull-up current
IPU
SR –
-50
Data Sheet
11
V1.2, 2011-06
CIC61508
Electrical Parameters
Table 3
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values
min.
Pull-down current
IPD
SR –
50
Unit Test Conditions
max.
5
μA
–
μA
Input leakage current2)3) IOZ1
CC -0.5
0.5
μA
Overload current on any IOV
pin
SR -5
5
mA
VIL,max
VIH,min
0 < VIN < VDDP,
TA ≤ 140°C
Absolute sum of
overload currents
Σ|IOV|
SR –
25
mA
3)
Voltage on any pin
during VDDP power off
VPO
SR –
0.3
V
4)
Maximum current per
IM SR SR –
pin (excluding VDDP and
VSS)
15
mA
Maximum current for all Σ|IM|
pins (excluding VDDP
and VSS)
SR –
60
mA
IMVDDP SR –
80
mA
80
mA
Maximum current into
VDDP
Maximum current out of IMVSS
SR –
VSS
1) Not subjected to production test, verified by design/characterization. Hysteresis is implemented to avoid meta
stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses
switching due to external system noise.
2) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. RESET pin has
internal pull devices and is not included in the input leakage current characteristic.
3) Not subjected to production test, verified by design/characterization.
4) Not subjected to production test, verified by design/characterization. However, for applications with strict low
power-down current requirements, it is mandatory that no active voltage source is supplied at any pin when
VDDP is powered off.
Data Sheet
12
V1.2, 2011-06
CIC61508
Electrical Parameters
2.2.2
Supply Threshold Characteristics
Table 4 provides the characteristics of the supply threshold in the CIC61508.
Note: VDDC is an internal working voltage used by some parts of the CIC61508.
5.0V
VDDPPW
VDDP
2.5V
V DDCPW
VDDCBO
VDDC
VDDCPOR
VDDCBOPD
Figure 1
Supply Threshold Parameters
Table 4
Supply Threshold Parameters (Operating Conditions apply)
Parameters
Symbol
VDDC prewarning voltage1)
VDDC brownout voltage in
VDDCPW
VDDCBO
Limit Values
Unit
min.
typ.
max.
CC
2.2
2.3
2.4
V
CC
2.0
2.1
2.2
V
VDDC brownout voltage in
power-down mode2)
VDDCBOPD CC
1.3
1.5
1.7
V
VDDP prewarning voltage3)
VDDPPW
VDDCPOR
CC
3.4
4.0
4.65
V
CC
1.3
1.5
1.7
V
active mode1)
Power-on reset voltage2)
1) Detection is disabled in power-down mode.
2) Detection is enabled in both active and power-down mode.
3) Detection is enabled for external power supply of 5.0V.
Detection is disabled for external power supply of 3.3V.
Data Sheet
13
V1.2, 2011-06
CIC61508
Electrical Parameters
2.2.3
Voltage Monitor Characteristics
All ground pins (VSS) must be externally connected to one single star point in the system.
The voltage difference between the ground pins must not exceed 200mV.
Table 1
Voltage Monitor Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
typ .
max.
Unit Test Conditions/
Remarks
Analog reference
voltage
VAREF
SR VAGND VDDP
+1
VDDP
V
+ 0.05
Analog reference
ground
VAGND
SR VSS 0.05
-1
Analog input
voltage range
VAIN
SR VAGND –
VAREF V
Total unadjusted
error (for 10-bit
conversion
TUE
CC –
–
2
LSB 5V variant
–
–
3
LSB 3.3V variant
Switched
capacitance at the
reference voltage
input
CAREFSW CC –
10
20
pF
1)2)
Switched
capacitance at the
analog voltage
inputs
CAINSW
CC –
5
7
pF
1)3)
Input resistance of RAREF
the reference input
CC –
1
2
kΩ
1)
Input resistance of RAIN
the selected analog
channel
CC –
1
1.5
kΩ
1)
min.
VSS
VAREF V
1) Not subject to production test, verified by design/characterization.
2) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this, smaller capacitances are successively switched to the reference voltage.
3) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before connecting the input to
the C-Network. Because of the parasitic elements, the voltage measured at ANx is lower than VAREF/2.
Data Sheet
14
V1.2, 2011-06
CIC61508
Electrical Parameters
Analog Input Circuitry
R EXT
VAIN
R AIN, On
SENx
C EXT
C AINSW
SENGND
Reference Voltage Input Circuitry
RAREF, On
SENREF
VAREF
C AREFSW
SENGND
Figure 2
Data Sheet
Voltage Monitor Input Circuits
15
V1.2, 2011-06
CIC61508
Electrical Parameters
2.2.4
Power Supply Current
Table 2 provides the characteristics of the power supply current in the CIC61508.
Table 2
Power Supply Current Parameters (Operating Conditions apply)
Parameter
Symbol
Limit Values
1)
typ.
Unit Test Condition
2)
max.
Active Mode
IDDP
22.6
24.5
mA
Periodic Wake-up (low current)
Mode3)
IPWU
4.1
-
mA
4)
1) The typical current values are based on preliminary measurements and are to be used as reference only.
These values are periodically measured at TA = + 25 °C and VDDP = 5.0 V.
2) The maximum current values are measured under worst case conditions (TA = + 140 °C and VDDP = 5.5 V).
3) The periodic wake-up or low current mode is entered once the wake-up timer functionality is enabled.
4) Not subjected to production test, verified by design/characterization.
Data Sheet
16
V1.2, 2011-06
CIC61508
Electrical Parameters
2.3
AC Parameters
The electrical characteristics of the AC Parameters are detailed in this section.
2.3.1
Testing Waveforms
The testing waveforms for rise/fall time, output delay and output high impedance are
shown in Figure 3, Figure 4 and Figure 5.
VDDP
90%
10%
10%
VSS
Figure 3
90%
tF
tR
Rise/Fall Time Parameters
VDDP
VDDE / 2
Test Points
VDDE / 2
VSS
Figure 4
Testing Waveform, Output Delay
VLoad + 0.1 V
VLoad - 0.1 V
Figure 5
Data Sheet
Timing
Reference
Points
VOH - 0.1 V
VOL - 0.1 V
Testing Waveform, Output High Impedance
17
V1.2, 2011-06
CIC61508
Electrical Parameters
2.3.2
Output Rise/Fall Times
Table 1 provides the characteristics of the output rise/fall times in the CIC61508.
Table 1
Output Rise/Fall Times Parameters (Operating Conditions apply)
Parameter
Symbol
Limit
Values
Unit Test Conditions
min. max.
VDDP = 5V Range
Rise/fall times1) 2)
tR, tF
–
10
ns
20 pF.3)
tR, tF
–
10
ns
20 pF.4)
VDDP = 3.3V Range
Rise/fall times 1) 2)
1) Rise/Fall time measurements are taken with 10% - 90% of pad supply.
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
3) Additional rise/fall time valid for CL = 20pF - 100pF @ 0.125 ns/pF.
4) Additional rise/fall time valid for CL = 20pF - 100pF @ 0.225 ns/pF.
VDDP
90%
90%
VSS
10%
10%
tF
tR
Figure 6
Data Sheet
Rise/Fall Times Parameters
18
V1.2, 2011-06
CIC61508
Electrical Parameters
2.3.3
Reset Timing
Table 3 provides the characteristics of the reset timing in the CIC61508.
Table 2
Reset Timing (Operating Conditions apply)
Parameter
Symbol
Limit Values
min. typ.
Start-up time from an
immediate wake-up
timer reset1)
tSWU
CC –
Unit Test Conditions
max.
55.8 –
ms
2)
1) The start-up time is measured from the time the immediate wake-up timer reset is triggered to the time the
start-up BIST is completed. The immediate wake-up timer reset is triggered by a SFR write command to the
WAKERELOAD SFR while WAKEPRESCALAR SFR is configured with the value 8XH.
2) Not subjected to production test, verified by design/characterization.
Data Sheet
19
V1.2, 2011-06
CIC61508
Electrical Parameters
2.3.4
SPI Timing
Table 3 provides the characteristics of the SPI timing in the CIC61508.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 3
SPI Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
t0
t1
t2
t3
t4
t5
t6
SCLK clock period
Data valid
Data setup time
Data hold time
Clock active after CS becomes valid
Clock inactive before CS becomes invalid
Time between active CS
1)
SR
Limit Values
min.
max.
500
2000
Unit
ns
CC 0
–
ns
SR
22
–
ns
SR
0
–
ns
SR
2.0
3.5
μs
SR
0
2.8
μs
SR
60.7
65
μs
1) The typical value is based on 8 consecutive 16-bit data transfers per heartbeat, at a baud rate of 2 Mbaud.
CS
t4
t0
t5
t6
SCK
t1
MRST
LSB
MSB
t 2 t3
MTSR
Figure 4
Data Sheet
LSB
MSB
SPI Timing
20
V1.2, 2011-06
CIC61508
Package and Quality Declaration
3
Package and Quality Declaration
Chapter 3 provides the information of the CIC61508 package and reliability section.
3.1
Package Parameters
Table 3 provides the thermal characteristics of the package used in CIC61508.
Table 3
Thermal Characteristics of the Package
Parameter
Symbol
Limit Values
Min.
Unit
Notes
Max.
PG-TSSOP-38
Thermal resistance junction RTJC
case1)
CC -
15.7
K/W
-
Thermal resistance junction RTJL
lead1)
CC -
39.2
K/W
-
1) The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead
(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient, while PD is given by the multiplication of the
max. VDDP and max. IDDP. The total junction ambient resistance RTJA can be obtained from the upper four
partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
Data Sheet
21
V1.2, 2011-06
CIC61508
Package and Quality Declaration
3.2
Package Outline
Figure 7 show the package outline of the CIC61508.
Figure 7
Data Sheet
PG-TSSOP-38 Package Outline
22
V1.2, 2011-06
CIC61508
Package and Quality Declaration
3.3
Quality Declaration
Table 4 shows the characteristics of the quality parameters in the CIC61508.
Table 4
Quality Parameters1)
Parameter
Symbol Limit Values
Min.
Operation Lifetime
tOP
when the device is used
at the four stated TA 2)
Typ.
Unit
Notes
TA = 140°C
TA = 125°C
TA = 85°C
TA = -40°C
TA = 108°C
TA = 27°C
Max.
-
-
1500
hours
-
-
2000
hours
-
-
10000
hours
-
-
1500
hours
hours
Operation Lifetime
tOP2
when the device is used
at the two stated TA2)
-
-
18000
-
-
130000 hours
Weighted Average
Temperature3)
TWA
-
106
-
°C
For 15000 hours
ESD susceptibility
according to Human
Body Model (HBM) for
all pins (except VDDC)
VHBM
-
-
2000
V
Conforming to
EIA/JESD22A114-B
ESD susceptibility
according to Human
Body Model (HBM) for
VHBMC
600
Conforming to
EIA/JESD22A114-B
VDDC
ESD susceptibility
according to Charged
Device Model (CDM)
pins
VCDM
-
-
750
V
Conforming to
JESD22-C101-C
1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
2) This lifetime refers only to the time when the device is powered-on.
3) This parameter is derived based on the Arrhenius model.
Data Sheet
23
V1.2, 2011-06
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
Similar pages