REFERENCE REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. Item No. 1−4 Revision code F 2/12 Performance 3. Capacitance Within a range of specified value. (Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and a voltage of 5V or less.) 4. Dissipation Factor 1.5 % or less (Measured at a frequency of 1 kHz ±0.2 kHz, at 20 °C ±2 °C and a voltage of 5 V or less.) 5. Connection The connection of the element shall not open even Instantaneously when applied a voltage of 100 mV (peak value) or less and applied light force. 6. The capacitor shall be mounted on the PC board, and the Following vibration shall be applied to the capacitor. Range of vibration frequency 10 Hz to 55 Hz total amplitude 1.5 mm , rate of frequency vibration to be such as to vary from 10 Hz to 55 Hz and return to 10 Hz in about 1 minute and thus repeated. Thus shall be conducted for 2 hours each (total 6 hours) in 3 mutually perpendicular directions. Vibration Proof P Testing method JIS C 5102-1994 7.8 IEC 384-1-1982 JIS C 5102-1994 7.9 IEC 4.8 JIS C 5102-1994 7.10 IEC 384-1-1982 JIS C 5102-1994 8.2.3.(A) IEC 384-1-1982 4.17 The connection shall not get short-circuit or open when Examined the connection of the element in compliance with The previous item (connection of element) during the last 30 minutes of the test. 7. 8. Soldering Property The terminal shall be immersed in methanol solution of Resin (about 25%) and the terminal shall be immersed in the solder bath at a temperature of 245°C ±3°C for 2.5 seconds ±0.5 seconds. After the immersion test, the surface of the electrodes shall be covered with the solder more than 90 % . JIS C 5102-1994 8.4 IEC 384-1-1982 4.15 Moisture Resistance The capacitor under test shall be put in the testing oven and kept at condition of the temperature +40 °C ±2 °C and +24 the relative humidity at 90 % to 95 % for 500 0 hours and then shall be let alone at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. Appearance : No remarkable change. Withstand voltage : Between terminals Nothing abnormal shall be found, when applied a Voltage of 130 % of the rated voltage for 1 minute. (The capacitor shall be applied the voltage through 2 kΩ or more when charge or discharge.) Insulation resistance : Between terminals 100 MΩ or more (C: 0.33 µF or less) 30 MΩ • µF or more(C: more than 0.33 µF) Change rate of capacitance : +20 Within - 3 % of the value before the test. Dissipation factor : 2.25 % or less (at 1 kHz) JIS C 5102-1994 9.5 IEC 384-1-1982 4.22 Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. Item No. 1−4 Revision code F 3/12 Performance P Testing method The capacitor under test shall be applied the rated +24 voltage continuously for 500 0 hours in the testing oven and kept at condition of the temperature +40 °C ±2 °C and the relative humidity at 90 % to 95 % and then shall be let alone at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. 9. Moisture Resistant Loading Appearance : No remarkable change. Withstand voltage : Between terminals Nothing abnormal shall be found, when applied a voltage of 130 % of the rated voltage for 1 minute. (The capacitor shall be applied the voltage through 2 kΩ or more when charge or discharge.) Insulation resistance : Between terminals 100 MΩ or more (C: 0.33 µF or less) 30 MΩ • µF or more(C: more than 0.33 µF) Change rate of capacitance : +20 Within - 3 % of the value before the test. Dissipation factor : 2.25 % or less (at 1 kHz) JIS C 5102-1994 9.9 The capacitor under test shall be applied the voltage of 125 % of rated voltage through a series-connected resister of from 20 Ω to 1000 Ω per 1 V, continuously for +48 1000 0 hours in the testing oven and kept at condition of the temperature +85 °C ±2 °C and then shall be let alone at ordinary condition for 1.5 hours ±0.5 hours. After the test, the capacitor shall be satisfied with the following performance. 10. 11. High Temperature Loading Heat Resistance Appearance : No remarkable change. Insulation resistance : Between terminals 300 MΩ or more (C: 0.33 µF or less) 100 MΩ • µF or more(C: more than 0.33 µF) Change rate of capacitance : +7 Within - 2 0 % of the value before the test. Dissipation factor : 1.65 % or less (at 1 kHz) Insulation resistance at +85 °C±2 °C after 2 +- 01 hours. Between terminals 300 MΩ or more (C: 0.33 µF or less) 100 MΩ • µF or more(C: more than 0.33 µF) +1 Change rate of capacitance at +85 °C±2 °C after 2 - 0 hours. + 5 Within - 2 0 % of the value before the test. Film Capacitor Division Capacitor Business Division Panasonic Corporation JIS C 5102-1994 9.10 JIS C 5102-1994 9.2 IEC 384-1-1982 4.21.2 REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. Item 12. Cold Resistance No. 1−4 Revision code F 4/12 Performance Testing method Change rate of capacitance at –40 °C ±3 °C after 2 +10 hours. + 5 Within -10 % of the value before the test. JIS C 5102-1994 9.1 IEC 384-1-1982 4.21.4 1. Reflow method Test condition of the reflow oven shall be adjusted that maximum temperature of the capacitor surface shall be 237 °C ±3 °C. (see TABLE 1.) After the test, the capacitor shall be let alone at ordinary temperature and humidity for 1 hour±0.5 hours. After this, the capacitor shall be satisfied with the following performance. 13. Soldering Heat Resistance P 2. Soldering iron method The soldering iron of a 30-watt shall be used and the temperature of the soldering iron shall be adjusted at 270 °C ± 10°C. The soldering iron together with a solder wire of 1 mm diameter shall be put to each outer electrode of the capacitor for 3.5 seconds ±0.5 seconds. After this, the capacitor shall be satisfied with the following performance. Appearance : No remarkable change. Withstand voltage : Between terminals Nothing abnormal shall be found, when applied a voltage of 150 % of the rated voltage for 1 minute or 175 % of the rated voltage for 1 second to 5 seconds. (The capacitor shall be applied the voltage through 2 kΩ or more when charge or discharge.) Insulation resistance : Between terminals 500 MΩ or more (C: 0.33 µF or less) 150 MΩ•µF or more(C: more than 0.33 µF) Change rate of capacitance : + 3 Within -15 % of the value before the test. Dissipation factor : 1.65 % or less (at 1 kHz) Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE Clsf 28−78 Standard doc. Product Specifications No. 14. Item Temperature Cycle 15 Adhesivenes PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) No. 1−4 Revision code F 5/12 Performance The capacitor under the test shall be kept in the testing oven and kept at condition of the temperature of –40 °C ±3 °C for 30 minutes ±3 minutes. After this, the capacitor shall be let alone at the ordinary temperature for 3 minutes or less. After this, the capacitor under the test shall be kept in the testing oven and kept at condition of the temperature of +85 °C ±2 °C for 30 minutes ±3 minutes. Then the capacitor shall be let alone at the ordinary temperature for 3 minutes or less. This operation shall be counted as 1 cycle, and it shall be repeated for 5 cycles successively. After the test, the capacitor shall be let alone at the ordinary condition for 1.5 hours±0.5 hours, and shall be satisfied with the following performance. Appearance : No remarkable change. Insulation resistance : Between terminals 100 MΩ or more (C: 0.33 µF or less) 30 MΩ • µF or more(C: more than 0.33 µF) Change rate of capacitance : + 5 Within - 2 0 % of the value before the test. Dissipation factor : 1.65 % or less (at 1 kHz) Mount the specimen to the testing wiring printed board. Examine, with a magnifier of magnification of 10, the appearance of specimen. As shown in below, apply the pressurizing jig to the center in the longitudinal direction of specimen. Apply a force to the pressurizing jig gradually in the horizontal direction with the testing printed wiring board. The pressure shall be 5 N ±0.5 N, and the holding duration, 10 s ±1 s. After the test, use magnifier of magnification of 10, and Check for cracks of soldering position. Appearance No remarkable change. F Film Capacitor Division Capacitor Business Division Panasonic Corporation P Testing method JIS 5102-1994 9.3 JIS C 5102-1996 8.11.2 C REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. 1−4 Revision code F 6/12 10. ! Caution about safety in use (1) Capacitance change due to humidity absorption In environment with humidity change, capacitance of this capacitor changes (increases and decreases). Because capacitor absorbing and dis-absorbing due to humidity of environment. Consult with our engineering section detail of this capacitance change. [ For example : The data shown below is capacitance change from dry condition to condition of the temperature 40 °C and the relative humidity 95 %.] Capacitance change Temperature:40 °C Relative humidity:95 % about 20 % Dry condition Time → (2) High impedance circuit use. In case of used in high impedance circuit, be careful of guarantee for insulation resistance. (3) AC voltage In case AC voltage applied to this capacitor shall be used under 12 V (effective value). (4)Current In case of current applied to this capacitor shall be careful of continuous current and pulse current shown below. (4)-1.Continuous current Continuous current applied to this capacitor should be under inherent temperature rise within 10 °C and within permissible current shown in figure 2. And temperature of capacitor should be kept within the operating temperature including inherent temperature rise. <Measuring method for inherent temperature rise> As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure the surface temperature and capacitor surface temperature while avoiding radiation heat from peripheral parts. At this time, use a thermocouple with small thermal capacity (φ0.1 mm T wire),and to avoid heat release to the board, lift the parts to be measure from the board by using lead wire or the like, and install as shown in the drawing. To avoid effects of convention and wind, put the capacitor into the box or the like, and measure in wind-free condition. Thermocouple Land Lead wire Temperature measurement instrument Film Capacitor Division Capacitor Business Division Panasonic Corporation P REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. 1−4 Revision code F 7/12 (4)-2.Pulse current Pulse current applied to this capacitor should be used within permissible pulse current (Max.10000 cycles) shown in table 1, and permissible continuous current(shown in figure 2). In case of pulse current is over the specified Table 1, inquire of our engineering section. Table 1: Permissible pulse current (Max.10000 cycles) Item dV/dt(V/µs) ECPU1C104MA5 19 ECPU1C154MA5 15 ECPU1C224MA5 13 ECPU1C334MA5 10 ECPU1C474MA5 7 ECPU1C684MA5 5 ECPU1C105MA5 3 (5)Soldering (5)-1.Solderig method This capacitor shall be used in only reflow method. Don’t use in flow, dipping, and VPS soldering method. (5)-2.Recommendable reflow soldering conditions Figure1: Recommendable reflow soldering conditions Temperature of element surface(°C) Recommendable conditions 300 235 °C,MAX.5s 250 220°C or more,MAX.30s 200 150 100 150°C to 180°C 60 to 150s 50 <Note> • Figure1 is recommendable conditions. • Soldering frequency shall be less than two (2) times. The second soldering should be carried after the capacitor itself has returned to normal temperature. • When further conditions are required except figure1. Please keep the soldering heat resistance shown in page 4. 0 Time(s) (6) Soldering conditions used in soldering iron (6)-1.Conditions Pre-conditioning Temperature Soldering time No pre-conditioning ----------- 280 °C maximum 4.0 seconds maximum Pre-conditioning 125 °C±5 °C • 3 h±1 h Soldering shall be used in 5hours after pre-conditioning 330 °C maximum 5.0 seconds maximum Other conditions Power of soldering iron:30 W Pre-heating is not needed Power of soldering iron:30 W Pre-heating is not needed Pre-conditioning shall be less than two (2) times. Film Capacitor Division Capacitor Business Division Panasonic Corporation P REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. 1−4 Revision code F 8/12 (6)-2.Specified area <No pre-conditioning> <Pre-conditioning> 320 290 280 270 260 0 1 2 3 4 5 6 7 8 9 10 Temperature of Soldering iron tip (°C) Temperature of Soldering iron tip (°C) 330 300 250 P Soldering time (s) 310 300 290 280 0 1 2 3 4 5 6 7 8 9 10 Soldering time (s) <Note> • Refrain from using soldering iron except for the case of parts exchange. Even on that case, observe the soldering conditions shown above. • Don’t reuse the product removed by the soldering iron. • Soldering frequency used with soldering iron shall be less than two (2) times. The second soldering should be carried after the capacitor itself has returned to normal temperature. • When measuring temperature, it shall be operated with solder on soldering iron. • Consult with our engineering section in advance when require further conditions except for above. (7) Warning about solder paste • Solder paste shall be used which contains halogen with less than 0.1 wt%. (In case of reflow soldering and using soldering iron.) • Consult with our engineering section in advance when using flux with more than 0.1 wt% of the halogen content. (8) Cleaning (8)-1.Applicable solvent Type Alcohol Halogenated hydrocarbon Cleaner IPA(isopropyl alcohol) AK-225AES Manufacturer General industrial use Asahi Glass co.,Ltd. Temperature Period Room temperature less than 50 °C less than 50 °C Within 5 minutes Within 5 minutes Within 5 minutes (8)-2.Cleaning method Item Conditions Immersion Vaporized cleaning Ultrasonic cleaning <Note> • It is necessary to remove cleaner from P.W.B. by drying thoroughly after cleaning. • Cleaner shall contain halogen with less than 0.1 wt%, because in case of cleaning after mounting, halogen in flux will dissolve into cleaner. • Consult with our engineering section in advance when further information for cleaning solvent, conditions are required. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. 1−4 Revision code F 9/12 (9) Recommendable land size For designing land size, refer to the following recommendable land size. C A B Size code Dimensions A unit: mm B J1 (2012) 0.8 2.4 H1 • H2 • H3(3216) 1.8 3.6 G2 (3225) 1.8 3.6 A recommended solder paste thickness is between 0.10 mm and 0.15 mm. C 1.1 1.4 2.3 (10) Design of P.W.B. Do not use ceramic and metal board, because they have a large thermal expansion coefficient which is different from that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance. (11) In case of using resin for fixing the chip parts In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is recommended. (12) Resin coating When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended. (13) Rated voltage Do not apply over the rated voltage, because, if used beyond the rating voltage, it may induce insulation breakdown of the dielectric and cause short circuit. (14) Be careful not to scratch the capacitor surface with sharp edges (such as screwdriver, soldering iron, pincers, chassis), and not to give hard mechanical-stress. (14)-1.Tensile strength of termination Minimum tensile strength of termination is about 2 N. Be careful not to give hard tension to terminal, especially take care to direction F(see figure below). F (14)-2.Chip mounting consideration The locating crow, when worn out, impose uneven forces on the capacitor when positing, causing failed capacitors. An excessively low bottom dead point of suction nozzle impose great force on the capacitor during mounting, causing failed capacitors. In mounting the capacitors on a printed circuit board, be careful not to give large bending and expanding force against them The printed circuit board shall be supported by means of adequate supporting pins. Film Capacitor Division Capacitor Business Division Panasonic Corporation P REFERENCE Clsf 28−78 Standard doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) No. 1−4 Revision code F 10/12 P (15) Operating environment Avoid to use in a place of corrosive and oxidizing gas atmosphere (hydrogen chloride, hydrogen sulfide, sulfuric acid etc.) (16) Singular using This capacitor is generally surface mount device. Do not use singular using. (17) Storage and preservation It must be noted that the solderability of the external electrode may deteriorated when stored in an atmosphere filled with moisture, dust, or a reactive oxidizing gas (hydrogen chloride, hydrogen sulfide, sulfuric acid) . Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding at temperature 35 °C and relative humidity 75 %. Storage period limit is 1 year (use within 1 year). The unpacked products shall be kept in dry pack together of well-dried silica-gel (3 g, 4 packs) or be kept in storage conditioned at a temperature less than 20 °C,a relative humidity less than 50 %. (18) Period of soldering from opening dry pack. These capacitors are sensitive to the moisture. The capacitors should be soldered in 72 hours in conditions a temperature less than 25 °C, a relative humidity less than 70 %, after opening dry pack. In case of over 72 hours, should be kept in dry pack together of well-dried silica-gel (3 g, 4 packs) or be kept in storage conditioned at a temperature less than 20°C,a relative humidity less than 50%. (19) Life time These capacitors’ life shall be as follows. At condition of the temperature of 85 °C or less and the applied voltage of rated voltage or less, then these capacitor s’ life are over 50 000hours. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE Clsf 28−78 Standard doc. PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) Product Specifications No. 1−4 Revision code F 11/12 Figure1: Standard surface temperature curve of the capacitor for reflow method Reflow profile 50 mm Thermocouple (φ0.1 mm K-type) Glass epoxy base board (0.8 mm) 115 mm Temperature of element surface Max.240°C 250 220°C or more MAX.30s Temperature(°C) 200 150 100 50 Max.50 Min.20s Max.90s Min.40s Max.40s 0 0 60 Film Capacitor Division 120 Time (s) 180 240 Capacitor Business Division Panasonic Corporation P REFERENCE Clsf 28−78 Standard doc. Product Specifications PLASTIC FILM CHIP CAPACITOR TYPE ECPU(A) No. 1−4 Revision code F 12/12 Figure 2 Permissible current Permissible current 2.0 1.5 Permissible current (A) ECPU1C105MA5 ECPU1C684MA5 ECPU1C474MA5 1.0 ECPU1C334MA5 ECPU1C224MA5 ECPU1C154MA5 0.5 ECPU1C104MA5 0.0 10 100 1000 Frequency (kHz) Film Capacitor Division Capacitor Business Division Panasonic Corporation P REFERENCE