DC16V(A):(DC16V,0.1µF-1.0µF)

REFERENCE
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
Item
No.
1−4
Revision code F
2/12
Performance
3.
Capacitance
Within a range of specified value.
(Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C
±2°C and a voltage of 5V or less.)
4.
Dissipation
Factor
1.5 % or less
(Measured at a frequency of 1 kHz ±0.2 kHz, at 20 °C
±2 °C and a voltage of 5 V or less.)
5.
Connection
The connection of the element shall not open even
Instantaneously when applied a voltage of 100 mV
(peak value) or less and applied light force.
6.
The capacitor shall be mounted on the PC board, and the
Following vibration shall be applied to the capacitor.
Range of vibration frequency 10 Hz to 55 Hz total
amplitude 1.5 mm , rate of frequency vibration to be such
as to vary from 10 Hz to 55 Hz and return to 10 Hz in
about 1 minute and thus repeated.
Thus shall be conducted for 2 hours each (total 6 hours)
in 3 mutually perpendicular directions.
Vibration
Proof
P
Testing method
JIS C
5102-1994
7.8
IEC 384-1-1982
JIS C
5102-1994
7.9
IEC 4.8
JIS C
5102-1994
7.10
IEC 384-1-1982
JIS C
5102-1994
8.2.3.(A)
IEC 384-1-1982
4.17
The connection shall not get short-circuit or open when
Examined the connection of the element in compliance
with The previous item (connection of element) during the
last 30 minutes of the test.
7.
8.
Soldering
Property
The terminal shall be immersed in methanol solution of
Resin (about 25%) and the terminal shall be immersed in
the solder bath at a temperature of 245°C ±3°C for
2.5 seconds ±0.5 seconds.
After the immersion test, the surface of the electrodes
shall be covered with the solder more than 90 % .
JIS C
5102-1994
8.4
IEC 384-1-1982
4.15
Moisture
Resistance
The capacitor under test shall be put in the testing oven
and kept at condition of the temperature +40 °C ±2 °C and
+24
the relative humidity at 90 % to 95 % for 500 0 hours and
then shall be let alone at ordinary condition for 1.5 hours
±0.5 hours.
After the test, the capacitor shall be satisfied with the
following performance.
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
Voltage of 130 % of the rated voltage for 1 minute.
(The capacitor shall be applied the voltage
through
2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals
100 MΩ or more (C: 0.33 µF or less)
30 MΩ • µF or more(C: more than 0.33 µF)
Change rate of capacitance :
+20
Within - 3 % of the value before the test.
Dissipation factor :
2.25 % or less (at 1 kHz)
JIS C
5102-1994
9.5
IEC
384-1-1982
4.22
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
Item
No.
1−4
Revision code F
3/12
Performance
P
Testing method
The capacitor under test shall be applied the rated
+24
voltage continuously for 500 0 hours in the testing oven
and kept at condition of the temperature +40 °C ±2 °C and
the relative humidity at 90 % to 95 % and then shall be let
alone at ordinary condition for 1.5 hours ±0.5 hours.
After the test, the capacitor shall be satisfied with the
following performance.
9.
Moisture
Resistant
Loading
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
voltage of 130 % of the rated voltage for 1 minute.
(The capacitor shall be applied the voltage
through
2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals
100 MΩ or more (C: 0.33 µF or less)
30 MΩ • µF or more(C: more than 0.33 µF)
Change rate of capacitance :
+20
Within - 3 % of the value before the test.
Dissipation factor :
2.25 % or less (at 1 kHz)
JIS C
5102-1994
9.9
The capacitor under test shall be applied the voltage of
125 % of rated voltage through a series-connected
resister of from 20 Ω to 1000 Ω per 1 V, continuously for
+48
1000 0 hours in the testing oven and kept at condition of
the temperature +85 °C ±2 °C and then shall be let alone
at ordinary condition for 1.5 hours ±0.5 hours.
After the test, the capacitor shall be satisfied with the
following performance.
10.
11.
High
Temperature
Loading
Heat
Resistance
Appearance :
No remarkable change.
Insulation resistance :
Between terminals
300 MΩ or more (C: 0.33 µF or less)
100 MΩ • µF or more(C: more than 0.33 µF)
Change rate of capacitance :
+7
Within - 2 0 % of the value before the test.
Dissipation factor :
1.65 % or less (at 1 kHz)
Insulation resistance at +85 °C±2 °C after 2 +- 01 hours.
Between terminals
300 MΩ or more (C: 0.33 µF or less)
100 MΩ • µF or more(C: more than 0.33 µF)
+1
Change rate of capacitance at +85 °C±2 °C after 2 - 0
hours.
+ 5
Within - 2 0 % of the value before the test.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIS C
5102-1994
9.10
JIS C
5102-1994
9.2
IEC 384-1-1982
4.21.2
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No. Item
12.
Cold
Resistance
No.
1−4
Revision code F
4/12
Performance
Testing method
Change rate of capacitance at –40 °C ±3 °C after 2 +10
hours.
+ 5
Within -10
% of the value before the test.
JIS C
5102-1994
9.1
IEC 384-1-1982
4.21.4
1. Reflow method
Test condition of the reflow oven shall be adjusted that
maximum temperature of the capacitor surface shall be
237 °C ±3 °C. (see TABLE 1.)
After the test, the capacitor shall be let alone at
ordinary temperature and humidity for 1 hour±0.5
hours.
After this, the capacitor shall be satisfied with the
following performance.
13.
Soldering
Heat
Resistance
P
2. Soldering iron method
The soldering iron of a 30-watt shall be used and the
temperature of the soldering iron shall be adjusted
at 270 °C ± 10°C.
The soldering iron together with a solder wire of 1 mm
diameter shall be put to each outer electrode of the
capacitor for 3.5 seconds ±0.5 seconds.
After this, the capacitor shall be satisfied with the
following performance.
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
voltage of 150 % of the rated voltage for 1 minute
or 175 % of the rated voltage for 1 second to 5
seconds.
(The capacitor shall be applied the voltage
through
2 kΩ or more when charge or
discharge.)
Insulation resistance :
Between terminals
500 MΩ or more (C: 0.33 µF or less)
150 MΩ•µF or more(C: more than 0.33 µF)
Change rate of capacitance :
+ 3
Within -15
% of the value before the test.
Dissipation factor :
1.65 % or less (at 1 kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
Clsf 28−78
Standard doc.
Product
Specifications
No.
14.
Item
Temperature
Cycle
15
Adhesivenes
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
No.
1−4
Revision code F
5/12
Performance
The capacitor under the test shall be kept in the testing
oven and kept at condition of the temperature of –40 °C
±3 °C for 30 minutes ±3 minutes. After this, the capacitor
shall be let alone at the ordinary temperature for 3
minutes or less.
After this, the capacitor under the test shall be kept in the
testing oven and kept at condition of the temperature of
+85 °C ±2 °C for 30 minutes ±3 minutes.
Then the capacitor shall be let alone at the ordinary
temperature for 3 minutes or less.
This operation shall be counted as 1 cycle, and it shall be
repeated for 5 cycles successively.
After the test, the capacitor shall be let alone at the
ordinary condition for 1.5 hours±0.5 hours, and shall be
satisfied with the following performance.
Appearance :
No remarkable change.
Insulation resistance :
Between terminals
100 MΩ or more (C: 0.33 µF or less)
30 MΩ • µF or more(C: more than 0.33 µF)
Change rate of capacitance :
+ 5
Within - 2 0 % of the value before the test.
Dissipation factor :
1.65 % or less (at 1 kHz)
Mount the specimen to the testing wiring printed board.
Examine, with a magnifier of magnification of 10, the
appearance of specimen.
As shown in below, apply the pressurizing jig to the
center in the longitudinal direction of specimen.
Apply a force to the pressurizing jig gradually in the
horizontal direction with the testing printed wiring board.
The pressure shall be 5 N ±0.5 N, and the holding
duration, 10 s ±1 s.
After the test, use magnifier of magnification of 10, and
Check for cracks of soldering position.
Appearance
No remarkable change.
F
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
P
Testing method
JIS
5102-1994
9.3
JIS C
5102-1996
8.11.2
C
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
1−4
Revision code F
6/12
10. ! Caution about safety in use
(1) Capacitance change due to humidity absorption
In environment with humidity change, capacitance of this capacitor changes (increases and decreases).
Because capacitor absorbing and dis-absorbing due to humidity of environment.
Consult with our engineering section detail of this capacitance change.
[ For example : The data shown below is capacitance change from dry condition to condition of the
temperature 40 °C and the relative humidity 95 %.]
Capacitance change
Temperature:40 °C
Relative humidity:95 %
about 20 %
Dry condition
Time →
(2) High impedance circuit use.
In case of used in high impedance circuit, be careful of guarantee for insulation resistance.
(3) AC voltage
In case AC voltage applied to this capacitor shall be used under 12 V (effective value).
(4)Current
In case of current applied to this capacitor shall be careful of continuous current and pulse current shown
below.
(4)-1.Continuous current
Continuous current applied to this capacitor should be under inherent temperature rise within 10 °C and
within permissible current shown in figure 2.
And temperature of capacitor should be kept within the operating temperature including inherent
temperature rise.
<Measuring method for inherent temperature rise>
As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and
measure the surface temperature and capacitor surface temperature while avoiding radiation
heat from peripheral parts. At this time, use a thermocouple with small thermal capacity (φ0.1
mm T wire),and to avoid heat release to the board, lift the parts to be measure from the board by
using lead wire or the like, and install as shown in the drawing. To avoid effects of convention
and wind, put the capacitor into the box or the like, and measure in wind-free condition.
Thermocouple
Land
Lead wire
Temperature measurement
instrument
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
P
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
1−4
Revision code F
7/12
(4)-2.Pulse current
Pulse current applied to this capacitor should be used within permissible pulse current (Max.10000 cycles)
shown in table 1, and permissible continuous current(shown in figure 2).
In case of pulse current is over the specified Table 1, inquire of our engineering section.
Table 1: Permissible pulse current (Max.10000 cycles)
Item
dV/dt(V/µs)
ECPU1C104MA5
19
ECPU1C154MA5
15
ECPU1C224MA5
13
ECPU1C334MA5
10
ECPU1C474MA5
7
ECPU1C684MA5
5
ECPU1C105MA5
3
(5)Soldering
(5)-1.Solderig method
This capacitor shall be used in only reflow method. Don’t use in flow, dipping, and VPS soldering method.
(5)-2.Recommendable reflow soldering conditions
Figure1: Recommendable reflow soldering conditions
Temperature of element surface(°C)
Recommendable conditions
300
235 °C,MAX.5s
250
220°C or more,MAX.30s
200
150
100
150°C to 180°C
60 to 150s
50
<Note>
• Figure1 is recommendable conditions.
• Soldering frequency shall be less than two
(2) times. The second soldering should be
carried after the capacitor itself has returned
to normal temperature.
• When further conditions are required except
figure1.
Please keep the soldering heat resistance
shown in page 4.
0
Time(s)
(6) Soldering conditions used in soldering iron
(6)-1.Conditions
Pre-conditioning
Temperature
Soldering time
No
pre-conditioning
-----------
280 °C
maximum
4.0 seconds
maximum
Pre-conditioning
125 °C±5 °C • 3 h±1 h
Soldering shall be used in
5hours after pre-conditioning
330 °C
maximum
5.0 seconds
maximum
Other conditions
Power of soldering
iron:30 W
Pre-heating is not needed
Power of soldering
iron:30 W
Pre-heating is not needed
Pre-conditioning shall be less than two (2) times.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
P
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
1−4
Revision code F
8/12
(6)-2.Specified area
<No pre-conditioning>
<Pre-conditioning>
320
290
280
270
260
0
1
2
3
4
5
6
7
8
9
10
Temperature of
Soldering iron tip (°C)
Temperature of
Soldering iron tip (°C)
330
300
250
P
Soldering time (s)
310
300
290
280
0
1
2
3
4
5
6
7
8
9
10
Soldering time (s)
<Note>
• Refrain from using soldering iron except for the case of parts exchange.
Even on that case, observe the soldering conditions shown above.
• Don’t reuse the product removed by the soldering iron.
• Soldering frequency used with soldering iron shall be less than two (2) times. The second soldering
should be carried after the capacitor itself has returned to normal temperature.
• When measuring temperature, it shall be operated with solder on soldering iron.
• Consult with our engineering section in advance when require further conditions except for above.
(7) Warning about solder paste
• Solder paste shall be used which contains halogen with less than 0.1 wt%.
(In case of reflow soldering and using soldering iron.)
• Consult with our engineering section in advance when using flux with more than 0.1 wt% of the halogen
content.
(8) Cleaning
(8)-1.Applicable solvent
Type
Alcohol
Halogenated hydrocarbon
Cleaner
IPA(isopropyl alcohol)
AK-225AES
Manufacturer
General industrial use
Asahi Glass co.,Ltd.
Temperature
Period
Room temperature
less than 50 °C
less than 50 °C
Within 5 minutes
Within 5 minutes
Within 5 minutes
(8)-2.Cleaning method
Item
Conditions
Immersion
Vaporized cleaning
Ultrasonic cleaning
<Note>
• It is necessary to remove cleaner from P.W.B. by drying thoroughly after cleaning.
• Cleaner shall contain halogen with less than 0.1 wt%, because in case of cleaning after mounting,
halogen in flux will dissolve into cleaner.
• Consult with our engineering section in advance when further information for cleaning solvent, conditions
are required.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
1−4
Revision code F
9/12
(9) Recommendable land size
For designing land size, refer to the following recommendable land size.
C
A
B
Size code
Dimensions
A
unit: mm
B
J1
(2012)
0.8
2.4
H1 • H2 • H3(3216)
1.8
3.6
G2
(3225)
1.8
3.6
A recommended solder paste thickness is between 0.10 mm and 0.15 mm.
C
1.1
1.4
2.3
(10) Design of P.W.B.
Do not use ceramic and metal board, because they have a large thermal expansion coefficient which is
different from that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance.
(11) In case of using resin for fixing the chip parts
In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is
recommended.
(12) Resin coating
When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended.
(13) Rated voltage
Do not apply over the rated voltage, because, if used beyond the rating voltage, it may induce insulation
breakdown of the dielectric and cause short circuit.
(14) Be careful not to scratch the capacitor surface with sharp edges (such as screwdriver, soldering iron,
pincers, chassis), and not to give hard mechanical-stress.
(14)-1.Tensile strength of termination
Minimum tensile strength of termination is about 2 N. Be careful not to give hard tension to terminal,
especially take care to direction F(see figure below).
F
(14)-2.Chip mounting consideration
The locating crow, when worn out, impose uneven forces on the capacitor when positing, causing failed
capacitors. An excessively low bottom dead point of suction nozzle impose great force on the capacitor
during mounting, causing failed capacitors.
In mounting the capacitors on a printed circuit board, be careful not to give large bending and expanding
force against them
The printed circuit board shall be supported by means of adequate supporting pins.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
P
REFERENCE
Clsf 28−78
Standard doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
No.
1−4
Revision code F
10/12
P
(15) Operating environment
Avoid to use in a place of corrosive and oxidizing gas atmosphere (hydrogen chloride, hydrogen sulfide,
sulfuric acid etc.)
(16) Singular using
This capacitor is generally surface mount device. Do not use singular using.
(17) Storage and preservation
It must be noted that the solderability of the external electrode may deteriorated when stored in an
atmosphere filled with moisture, dust, or a reactive oxidizing gas (hydrogen chloride, hydrogen sulfide, sulfuric
acid) .
Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding
at temperature 35 °C and relative humidity 75 %.
Storage period limit is 1 year (use within 1 year).
The unpacked products shall be kept in dry pack together of well-dried silica-gel (3 g, 4 packs) or
be kept in storage conditioned at a temperature less than 20 °C,a relative humidity less than 50 %.
(18) Period of soldering from opening dry pack.
These capacitors are sensitive to the moisture. The capacitors should be soldered in 72 hours in conditions
a temperature less than 25 °C, a relative humidity less than 70 %, after opening dry pack.
In case of over 72 hours, should be kept in dry pack together of well-dried silica-gel (3 g, 4 packs) or
be kept in storage conditioned at a temperature less than 20°C,a relative humidity less than 50%.
(19) Life time
These capacitors’ life shall be as follows.
At condition of the temperature of 85 °C or less and the applied voltage of rated voltage or less,
then these capacitor s’ life are over 50 000hours.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
Clsf 28−78
Standard doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
Product
Specifications
No.
1−4
Revision code F
11/12
Figure1: Standard surface temperature curve of the capacitor for reflow method
Reflow profile
50 mm
Thermocouple (φ0.1 mm K-type)
Glass epoxy base board (0.8 mm)
115 mm
Temperature of element surface
Max.240°C
250
220°C or more
MAX.30s
Temperature(°C)
200
150
100
50
Max.50
Min.20s
Max.90s
Min.40s
Max.40s
0
0
60
Film Capacitor Division
120
Time (s)
180
240
Capacitor Business Division Panasonic Corporation
P
REFERENCE
Clsf 28−78
Standard doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECPU(A)
No.
1−4
Revision code F
12/12
Figure 2 Permissible current
Permissible current
2.0
1.5
Permissible current (A)
ECPU1C105MA5
ECPU1C684MA5
ECPU1C474MA5
1.0
ECPU1C334MA5
ECPU1C224MA5
ECPU1C154MA5
0.5
ECPU1C104MA5
0.0
10
100
1000
Frequency (kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
P
REFERENCE
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