DC16V(X):(DC16V,100pF-0.10µF)

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Standard Doc.
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Product
Specifications
Revision
Code
1−17
L
2 / 20
P.
Performance
Test Method
3. Capacitance
Within a range of specified value.
(Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and
with voltage of 5 Vrms or less.)
JIC C 5102-1994
7.8
IEC 384-1-1982
4. Dissipation Factor
0.6% or less
(Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and
with voltage of 5 Vrms or less.)
JIC C 5102-1994
7.9
IEC 384-1-1982
4.8
5. Connection
The connection of the element shall not open even instantaneously
when applied a voltage of 100 mVpeak or less and applied light
force.
JIS C 5102-1994
7.10
IEC 384-1-1982
No.
Item
No.
6. Vibration Resistance
The capacitor shall be mounted on the PCB (Printed Circuit Board),
and the following vibration shall be applied to the capacitor.
Range of vibration frequency 10 Hz to 55 Hz total amplitude 1.5
mm, rate of frequency vibration to be such as varying from 10 Hz to
55 Hz and return to 10 Hz in about 1 min and thus repeated.
Thus shall be conducted for a period of 2 hours in each 3 mutually
perpendicular directions (total of 6 hours).
JIC C 5102-1994
8.2.3.(A)
IEC 384-1-1982
4.17
The connection shall not get short-circuit or open when examined
the connection of the element in compliance with the previous item
(connection of element) during the last 30 min of the test.
The terminal shall be immersed in methanol solution of resin (about
25%) and the terminal shall be immersed in the solder bath at a
temperature of 255°C ±5°C for 2.5 s ±0.5 s.
After test immersion, the solder shall be stuck to 90% or more in the
surface of the electrode that shown in blew development.
X mm
X mm
Surface of External electrode
Termination surface
7. Soldering Property
Surface of External electrode
Development of electrode
Evaluation shall be conducted in this area.
X = 0.2 (2012, 3126, 3225 size)
0.1(1608 size)
Solder in the solder tank is Sn-Ag-Cu.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIS C 5102-1994
8.4
IEC 384-1-1982
4.15
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Specifications
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PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Item
No.
Revision
Code
Performance
1−17
L
3 / 20
P.
Test Method
The capacitor under test shall be kept at condition of the temperature 40°C ±2°C
and the humidity at 90%RH to 95%RH for 1000 hours +48/ -0 hours in the
testing oven and then kept at ordinary condition (ordinary temperature and
humidity) for 1.5 hours ±0.5 hours.
After the test, the capacitor shall be satisfied with the following performance.
8.
Moisture
Resistance
(I)
Appearance :
No remarkable change.
Dielectric Withstand Voltage :
Between terminals
Nothing abnormal shall be found, when applied a voltage of 130% of
the rated voltage for 1 min (the capacitor shall be applied the voltage
through 2 kΩ or more when charge and discharge).
Insulation Resistance :
Between terminals
1000 MΩ or more
Change rate of capacitance :
Within ±2% of the value before the test.
Dissipation Factor:
0.9% or less (at 1 kHz)
JIC C 5102-1994
9.5
IEC 384-1-1982
4.22
The capacitor under test shall be kept at condition of the temperature 60°C ±2°C
and the humidity at 90%RH to 95%RH for 500 +24/ -0 hours in the testing oven
and then kept at ordinary condition for 1.5 hours ±0.5 hours.
After the test, the capacitor shall be satisfied with the following performance.
Moisture
9. Resistance
(II)
Appearance :
No remarkable change.
Dielectric Withstand Voltage :
Between terminals
Nothing abnormal shall be found, when applied a voltage of 130% of
the rated voltage for 1 min (the capacitor shall be applied the voltage
through more than 2 kΩwhen charge and discharge).
Insulation Resistance :
Between terminals
500 MΩ or more
Change rate of capacitance :
Within ±2% of the value before the test.
Dissipation Factor :
0.9% or less (at 1 kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIC C 5102-1994
9.5
IEC 384-1-1982
4.22
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PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Product
Specifications
No.
Item
No.
Revision
Code
Performance
1−17
L
4 / 20
P.
Test Method
The capacitor under test shall be kept at condition of the
temperature 40°C ±2°C and the humidity at 90%RH to 95%RH with
applying the rated voltage continuously for 1000 hours +48/ -0 hours
in the testing oven and then kept at ordinary condition for 1.5 hours
±0.5 hours.
After the test, the capacitor shall be satisfied with the following
performance.
10.
Moisture Resistance
Loading (I)
Appearance :
No remarkable change.
Dielectric Withstand Voltage :
Between terminals
Nothing abnormal shall be found, when applied a voltage
of 130% of the rated voltage for 1 min (the capacitor shall
be applied the voltage through more than 2 kΩ when
charge and discharge) .
Insulation Resistance :
Between terminals
1000 MΩ or more
Change rate of capacitance :
Within ±2% of the value before the test.
Dissipation Factor :
0.9% or less (at 1 kHz)
JIC C 5102-1994
9.9
The capacitor under test shall be kept at condition of the
temperature 60°C ±2°C and the humidity at 90%RH to 95%RH with
applying the rated voltage continuously for 500 hours +24/ -0 hours
in the testing oven and then kept at ordinary condition for 1.5 hours
±0.5 hours.
After the test, the capacitor shall be satisfied with the following
performance.
11.
Moisture Resistance
Loading (II)
Appearance :
No remarkable change.
Dielectric Withstand Voltage :
JIC C 5102-1994
Between terminals
9.9
Nothing abnormal shall be found, when applied a voltage
of 130% of the rated voltage for 1 min (the capacitor shall
be applied the voltage through more than 2 kΩ when
charge and discharge).
Insulation Resistance :
Between terminals
500 MΩ or more
Change rate of capacitance :
Within ±2% of the value before the test.
Dissipation Factor :
0.9% or less (at 1 kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
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PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Product
Specifications
No.
Item
No.
Revision
Code
Performance
1−17
L
5 / 20
P.
Test Method
The capacitor under test shall be kept at condition of the
temperature 85°C ±2°C and the humidity at 85%RH +2/ -5%RH
with applying the rated voltage continuously for 500 hours +24/ -0
hours in the testing oven and then kept at ordinary condition for 1.5
hours ±0.5 hours.
After the test, the capacitor shall be satisfied with the following
performance.
12.
Moisture Resistance
Loading (III)
Appearance :
No remarkable change.
Dielectric Withstand Voltage :
JIC C 5102-1994
Between terminals
9.9
Nothing abnormal shall be found, when applied the rate
voltage for 1 min (the capacitor shall be applied the voltage
through more then 2 kΩ when charge and discharge).
Insulation Resistance :
Between terminals
10 MΩ or more
Change rate of capacitance :
Within ±10% of the value before the test.
Dissipation Factor :
1.2% or less (at 1 kHz)
The capacitor under test shall be kept at condition of the
temperature 125°C ±2°C with applying a voltage of 125% of the
rated voltage through a series-connected resister of from 20 Ω to
1000 Ω per 1 V continuously for 1000 hours +48/ -0 hours in the
testing oven and then let alone until the capacitor reaches the heat
equilibrium with ordinary condition.
After the test, the capacitor shall be satisfied with the following
performance.
13.
14.
High Temperature
Loading
Heat Resistance
Appearance :
No remarkable change.
Insulation Resistance :
Between terminals
1000 MΩ or more
Change rate of capacitance :
Within ±2% of the value before the test.
Dissipation Factor :
0.66% or less (at 1 kHz)
The capacitor under test shall be kept at condition of the
temperature at 125°C ±2°C for 2 hours +1/ -0 hour in the testing
oven.
After the test, the capacitor shall be satisfied with the following
performance.
Insulation Resistance :
Between terminals
100 MΩ or more
Change rate of capacitance :
Within +3%/ -2% of the value before the test.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIC C 5102-1994
9.10
JIC C 5102-1994
9.2
IEC 384-1-1982
4.21.2
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15.
Item
Cold Resistance
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
No.
Revision
Code
Performance
The capacitor under test shall be kept at condition of the
temperature at –55°C ±3°C for 2 hours +1/ -0 hour in the testing
oven.
After the test, the capacitor shall be satisfied with the following
performance.
Change rate of capacitance :
Within ±2% of the value before the test.
1. Reflow method
Test condition of the reflow oven shall be adjusted that
maximum temperature of the capacitor surface shall be 260°C
±3°C (see Fig.1).
After this, the capacitor shall be satisfied with the following
performance.
2. Soldering iron method
The soldering iron of a 30-watt shall be used and the
temperature of the soldering iron shall be adjusted at 260°C
±10°C.
The soldering iron together with a solder wire of 1mm diameter
shall be put to each outer electrode of the capacitor for 3.5 s
±0.5 s.
After this, the capacitor shall be satisfied with the following
performance.
16.
Soldering Heat
Resistance
Appearance :
No remarkable change.
Dielectric Withstand Voltage :
Between terminals
Nothing abnormal shall be found, when applied a voltage of
150% of the rated voltage for 1 min or 175% of the rated
voltage for 1 s to 5 s.
(The capacitor shall be applied the voltage through
2 kΩ or more when charge and discharge.)
Insulation Resistance :
Between terminals
1000 MΩ or more
Change rate of capacitance :
Within ±3% of the value before the test.
Dissipation Factor :
0.66% or less (at 1 kHz)
Connection :
Stable
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Capacitor Business Division Panasonic Corporation
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P.
Test Method
JIC C 5102-1994
9.1
IEC 384-1-1982
4.21.4
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PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Product
Specifications
No.
Item
No.
Revision
Code
Performance
17. Temperature Cycle
The capacitor under the test shall be put in the testing oven and kept
at condition of the temperature of –55°C ±3°C for 30 min ±3 min and
then kept at the ordinary temperature for 3 min or less.
After this, the capacitor under the test shall be kept at condition of
the temperature of 125°C ±2°C for 30 min ±3 min and then kept at
the ordinary temperature for 3 min or less.
These two operations shall be counted as 1 cycle, and it shall be
repeated for 5 cycles successively.
After the test, the capacitor shall be kept at the ordinary condition for
1.5 hours ±0.5 hours, and shall be satisfied with the following
performance.
1−17
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P.
Test method
JIC C 5102-1994
9.3
Appearance :
No remarkable change.
Insulation Resistance :
Between terminals
1000 MΩ or more
Change rate of capacitance :
Within ±2% of the value before the test.
Dissipation Factor :
0.66% or less (at 1 kHz)
The equipment shall permit pressurizing.
Apply a force to the center of specimen, using a pressurizing jig as
shown in the drawing, for 10 s.
The force shall be 5 N.
F
18.
Robustness of
Capacitor body
JIS C 5102-1994
8.12
Appearance :
No remarkable change.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
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19. Adhesive Strength
Revision
Code
Performance
P.
JIC C 5102-1994
8.11.2
F
The bending stroke shall be 1 mm. Pressurizing shall be carried out
at the rate of 1 mm/s. After reaching the specified bending, keep it
for 5 s.
After the test, no breaking of the terminal shall be found.
Film Capacitor Division
1−17
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Test method
Mount the specimen to the testing PCB.
Examine the appearance of specimen with a magnifying glass of 10
magnifications.
As shown in below, apply the pressurizing jig to the center in the
longitudinal direction of specimen.
Apply a force to the pressurizing jig gradually in the horizontal
direction with the testing PCB.
The pressure shall be 5N (for 1608 size : 1N) and the holding
duration for 10 s ±1 s.
After the test, use a magnifying glass of 10 magnifications, and
check for cracks of soldering position.
Appearance :
No remarkable change.
Resistance of
20.
Board to bending
No.
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Capacitor Business Division Panasonic Corporation
JIC C 5102-1994
8.11.1
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TYPE ECHU(X)
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No.
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Fig.1 Standard surface temperature curve of the capacitor for reflow method.
Please confirm the test of the reflow method within the range of the under mentioned profile.
(The guarantee temperature and time are numerical values of the bold-faced type in the profile.)
TEST CONDITION
50×115, 0.8 mm thickness
glass epoxy board
Thermocouple K
Thermo electromotive force
wire diameter 0.1 mmΦ
dummy
(Attach thermocouple on the parts top surface.)
Temperature (°C) of the capacitor surface
300
max 260℃
――― Temperature (℃) ―――
250
250°C or more, 30s max
220°C or more, 95s max
200
150
100
50
40 s ~ 90 s
60 s ~ 150 s
20 s ~ 80 s
max 70s
0
Time →
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
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PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
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Specifications
Revision
Code
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10 / 20
P.
10.△ Caution about safety in use
!
I. Operating range (voltage, current, operating temperature)
Use the capacitor within the specified limits listed below (a to d). Over rated conditions might cause deterioration,
damage, smoke and fire. Do not use capacitor beyond range of the condition.
a) Permissible Voltage
• DC rated voltage of this product is 50V (1H) and 16 V (1C). Use the capacitor within DC rated voltage.
• When used in AC applied circuit, less than 30Vr.m.s. (1H) and 11Vr.m.s. (1C) should be applied.
When used in a high frequency, less than 30Vr.m.s.(1H) and 11Vr.m.s. (1C) should be applied and current applied
should be the value of permissible current in Fig.2 to 5 in page 17 to 20.
• Do not apply to be in connected directly to AC line such as a primary power circuit.
• Use the peak of pulse voltage applied the capacitor within the DC rated voltage.
• Caution about safety in inverter circuit for LCD back light use:
Do not use DC rated voltage 16V article for resonance uses, such as an inverter power supply for back
lights of a liquid crystal display. Moreover, +B voltage of the following basic circuit should use DC rated
voltage 50V article less than [ 9.5V ]. And please use the peak of pulse voltage (especially, in case of the
using PWM brightness circuit) applied the capacitor within the DC rated voltage.
[Typical electronic inverter circuit for LCD back light]
L
+B
Lamp
b) Permissible Current
• The permissible current must be considered by dividing into pulse current (peak current) and continuous current
(rms current). When using, therefore, make sure the both current are within the permissible values.
In the case that a continuous current value is able not to be measured, use the capacitor within 10°C as the
inherent temperature rise confirmed by the measuring method shown in page 16.
• Continuous current should be within specified figure in Fig.2 to 5. Contact us when the waveforms are totally
different from the sine wave.
• Pulse current should be within the figures calculated by Tab.1. Use within 10000 cycles of pulse current. When
pulse current applied more than 10000 cycles, please consult us before use.
c) Operating Temperature Range
• The specified “Operating Temperature Range” in specification is absolute maximum and minimum temperature
rating. So in any case, each the capacitors shall be operated within the specified “Operating Temperature Range”.
• It must be noted, however the “Operating Temperature Range” is the surface temperature of the capacitor is the
sum of the ambient temperature + own temperature rise, not just the ambient temperature of the capacitor.
• If there is cooling plate of the other part of any resistance heated to high temperature near the capacitor, the
capacitor may be locally heated by the radiation heat, exceeding the “Operating Temperature Range”, and
smoking or firing may be caused. Check the capacitor surface temperature at the heat source side.
d) For safety handling, check worst conditions within the specification range.
Protective means for safety should be provided in case the pulse and rms current may exceed the permissible
values due to abnormal action of elsewhere in the circuit.
Please consult in advance when capacitors are connected in parallel to supplement capacitance.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
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TYPE ECHU(X)
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Specifications
No.
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11 / 20
P.
II. Recommendable land dimensions
For designing land dimensions, refer to the following recommendable land dimensions.
unit: mm
Dimensions
Size code
A
B
C
C
K1
0.6
2.0
0.7
J1, J2
0.8
2.4
1.1
H1, H2, H3
1.8
3.6
1.4
G1, G2, G3
1.8
3.6
2.3
<Note>
• A recommended solder paste thickness is between 0.10 mm and 0.15 mm.
A
B
III. Selection of Printed Circuit Board
Do not use ceramic and metal board, because they have a large thermal expansion coefficient that is different from
that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance.
IV. Soldering
a) Soldering method
This capacitor only used in reflow method. Don’t use in flow, dipping, and VPS soldering method.
b) Recommendable reflow soldering conditions
Recommendable reflow condition (parts surface)
Soldering (max 240°C, max 5s)
Temperature of parts surface(°C)
250
220°C, 20-30s
200
150
Pre-heating
(150°C to 180°C)
100
50
Less than 5 seconds
Less than 2.5 minites
More than 2 minites
Time
<Note>
• The above figure is recommendable conditions.
• Soldering frequency shall be maximum two times. In soldering of second time, solder after capacitor body
temperature returned to room temperature.
• When require further conditions except for the above, use within the range of test “Soldering Heat Resistance”
shown in page 6.
• The reflow method recommends the hot wind circulation method. The heat influence on the capacitor is different
in the methods other than the hot wind circulation method. Please confirm there is no problem in the
characteristic of the capacitor beforehand when it is mounted excluding the hot wind circulation method.
Please inquire when it is uncertain.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
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TYPE ECHU(X)
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c) Soldering conditions used in soldering iron
Temperature
Soldering time
Other conditions
Wattage of soldering iron: 30 W
max 270°C
max 4.0 s
Pre-heating is not needed
• In the case of sketch (a)
Put a soldering iron to an electrode (for less than 4 s) with solder like sketch (a) shows.
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
• In the case of sketch (b)
After a solder is melted on a soldering iron like sketch (b), put them to an electrode (for less than 4 s).
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
Sketch (b)
Sketch (a)
land
land
melting solder
solder
soldering iron
soldering iron
<Note>
• Soldering frequency shall be maximum two times. In soldering of a second time, solder after capacitor body
temperature returned for room temperature.
• The above condition shall be applied also on modifying by solder iron after reflow soldering.
Modifying by solder iron after reflow soldering within once. Because there is heat career once by reflow soldering.
• When measuring temperature, it shall be operated with solder on soldering iron.
• Pay attention to the soldering iron tip not to touch directly to film dielectric, especially cut edge side.
• Consult with our engineering section in advance when require further conditions except for the above.
d) Others
• It is too much heat record that solders or solders removal this product or the other part which approaches this
product using hot air–blow. Consult us before use.
• Do not to use soldering this product by light beam or laser beam. If used these method, consult us before using.
• Consult us before using, when soldering in other method.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
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PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
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No.
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13 / 20
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V. Soldering flux and solder
• The content of halogen in the flux of solder paste and solder wire shall be 0.1 wt% or less Rosin-based and
non-activated soldering flux is recommended.
• Consult with our engineering section in advance when using flux with more than 0.1 wt% of the halogen content.
VI. Cleaning
a) Applicable solvent
Type
Alcohol
Halogenated hydrocarbon
Cleaner
IPA (isopropyl alcohol)
AK-225AES
Manufacturer
General industrial use
Asahi Glass Co.,Ltd.
b) Cleaning method
Item
Conditions
Immersion
Vaporized cleaning
Ultrasonic cleaning
Temperature
Period
Room temperature
Less than 50°C
Less than 50°C
Within 5 min
Within 5 min
Within 5 min
<Note>
• Do not wash it with water.
• When cleaning after soldering, check temperature of capacitor surface is blew 60°C.
• It is necessary to remove cleaner from PCB by drying thoroughly after cleaning.
• Cleaner shall contain halogen within less than 0.1wt%, because in case of cleaning after mounting, halogen in flux
will dissolve into cleaner.
• Consult with our engineering section in advance when further information for cleaning solvent, conditions are
required.
VII. Storage and preservation
• It must be noted that the solderability of the external electrode may deteriorated when stored in an atmosphere
filled with moisture, dust, or reactive gas such as hydrogen chloride, hydrogen sulfide, sulfurous acid, or ammonia
etc.
• Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding 35°C
and 85%RH. Storage period limit is 6 months (use within 6 months).
• Consult with our engineering section in advance when require further conditions except for the above.
VIII. Operating environment
• Consult us about usage for a long period in humid environments, because characteristic deterioration by low
insulation resistance or oxidization of metallized film may occur due to moisture absorption with the passing of the
time.
• The Capacitor shall not be operated under following environmental conditions. These conditions may be
generated to deteriorated the characteristic in the capacitor.
a) Under conditions of corrosive atmosphere such as hydrogen chloride, hydrogen sulfide, sulfurous acid,
or ammonia etc.
b) Under conditions of water or frost formation.
c) To be exposed directly to water, oil, or sunlight.
d) To be exposed to ozone, radioactive rays, or ultraviolet rays.
• No dust should be permitted to remain on the surface of the product as this may cause electrical leakage.
Film Capacitor Division
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TYPE ECHU(X)
No.
Revision
Code
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L
14 / 20
P.
Rate of Capacitance
Change (%)
IX. Capacitance change due to humidity absorption
In environment with humidity change, capacitance of this capacitor change (increases and decreases).
Because capacitor absorbing and dis-absorbing due to humidity of environment.
Consult with our engineering section detail of this capacitance change.
[For example : The data shown below is capacitance change from dry condition to 40°C, 95%RH condition.]
40°C 95%RH
About 2%
Dry condition
Time →
X. In case of using resin for fixing the chip parts
In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is recommended.
XI. Resin coating
When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended.
XII. Handling of a element
When handle an element of the capacitor with tweezers, care must be taken to avoid mechanical damage.
We recommend:
• Use tweezers made of resign and should apply stress to the element less than 1N (1608 size), 5N (2012, 3216,
3225 size).
• Avoid any contact with the cut surface (except outer electrode surface).
XIII. Mechanical stress, damage
Please pay attention to the following points, when mechanical stress or damage is applied to the capacitor,
it may become the cause of malfunction.
• Do not apply 1N (1608 size), 5N (2012, 3216, 3225 size) or more as pull, stress and pressure etc.
• Do not apply strong stress to cut edge side of the capacitor and not give the damage of scratch etc.
XIII-(1). Terminal strength (pull direction)
Pay attention to the pull force of terminal (F direction) so as not to damage to the capacitor.
F
XIII-(2). Chip mounting consideration
In mounting the capacitors any bending and expanding force against them shall be kept minimum to prevent
them from bending damaged or cracked, following precautions and recommendations shall be observed
carefully in the process.
• Motion of vacuum nozzle or clump shall be adjusted so that the capacitors shall not be damaged by
pushing force.
• Maximum stroke of the nozzle shall be adjusted to avoid damage so that the maximum bending of PCB
becomes not too much.
• The PCB shall be supported by means of adequate supporting pins.
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TYPE ECHU(X)
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XIV. Singular using
This capacitor is generally surface mount device. Do not use singular using.
XV. Appearance
• The gap among a film about 0.1 mm on the cut edge side may occur by structure and process. But there is not a
problem in reliability.
• We make assurance double sure about quality of the appearance. If it obstructs the reliability and performance of
the electronic equipment requested, we exchange the appearance boundary sample.
The gap between layers
(about 0.1 mm)
XVI. Life designed
This product is designed as its life time is more than 10 year (actual working hours of capacitor are 50,000h) under
the following conditions:
• Operating temperature is less than 125°C and applied voltage is than rated voltage.
Measuring method of inherent temperature rise
As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure the
surface temperature and capacitor surface temperature while avoiding radiation heat from peripheral parts.
At this time, use a thermocouple with small thermal capacity (Φ0.1 T wire), and to avoid heat release to the
board, lift the parts to be measure from the board by using lead wire or the like, and install as shown in the
drawing. To avoid effects of convention and wind, put the capacitor into the box or the like, and measure in
wind-free condition.
Thermocouple
Land
Lead wire
Temperature measurement
instrument
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28−75
Clsf.
Standard Doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
No.
Revision
Code
1−17
L
16 / 20
P.
Tab.1 Permissible pulse current (Max 10000 cycles)
Pulse current applied to this capacitor should be used within permissible pulse current (Max 10000 cycles) shown in Tab.1
The pulse current = C(µF) × dV/dt value (V/ µs)
In case of pulse current is over the specified table, inquire of our engineering section.
Part No. (Capacitance: µF)
101 (0.00010)
121 (0.00012)
151 (0.00015)
181 (0.00018)
221 (0.00022)
271 (0.00027)
331 (0.00033)
391 (0.00039)
471 (0.00047)
561 (0.00056)
681 (0.00068)
821 (0.00082)
102 (0.0010)
122 (0.0012)
152 (0.0015)
182 (0.0018)
222 (0.0022)
272 (0.0027)
332 (0.0033)
392 (0.0039)
472 (0.0047)
562 (0.0056)
682 (0.0068)
822 (0.0082)
103 (0.010)
123 (0.012)
153 (0.015)
183 (0.018)
223 (0.022)
273 (0.027)
333 (0.033)
393 (0.039)
473 (0.047)
563 (0.056)
683 (0.068)
823 (0.082)
104 (0.10)
Film Capacitor Division
dV/dt (V/ µs)
ECHU1C(X)
ECHU1H(X)
420
1100
390
1050
350
940
325
890
295
800
270
730
245
690
225
610
205
580
193
520
175
480
160
440
150
400
135
370
123
340
115
310
105
270
95
260
86
240
80
220
74
200
68
190
62
170
58
160
52
145
48
135
43
120
40
110
37
100
33
94
31
86
28
78
26
――――――
24
――――――
22
――――――
20
――――――
19
――――――
Capacitor Business Division Panasonic Corporation
REFERENCE
28−75
Clsf.
Standard Doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
No.
Revision
Code
Fig.2 Permissible Current ECHU1C(X):(0.00010 µF to 0.0027 µF)
Measuring condition : Sine wave
0.06
0.05
0.04
Permissible Effective Current [A]
0.0027µF
0.0022µF
0.03
0.0018µF
0.0015µF
0.02
0.0012µF
0.001µF
0.00082µF
0.01
0.00068µF
0.00056µF
0.00047µF
0.00039µF
0.00033µF
0.00027µF
0.00022µF
0.00018µF
0.00015µF
0.00012µF
0.0001µF
0
10
100
1000
Frequency [kHz]
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1−17
L
17 / 20
P.
REFERENCE
28−75
Clsf.
Standard Doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
No.
Revision
Code
Fig.3 Permissible Current ECHU1C(X): ( 0.0033 µF to 0.10 µF)
Measuring condition : Sine wave
1.5
0.1µF
1.25
0.082µF
1
Permissible Effective Current [A]
0.068µF
0.056µF
0.75
0.047µF
0.039µF
0.5
0.033µF
0.027µF
0.022µF
0.018µF
0.25
0.015µF
0.012µF
0.01µF
0.0082µF
0.0068µF
0.0056µF
0.0047µF
0.0039µF
0.0033µF
0
10
100
Frequency [kHz]
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1000
1−17
L
18 / 20
P.
REFERENCE
28−75
Clsf.
Standard Doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
No.
Revision
Code
Fig.4 Permissible Current ECHU1H(X): ( 0.0001 µF to 0.0027 µF)
Measuring condition : Sine wave
0.12
0.0027µF
0.1
0.0022µF
Permissible Effective Current [A]
0.08
0.0018µF
0.06
0.0015µF
0.0012µF
0.04
0.001µF
0.00082µF
0.00068µF
0.00056µF
0.02
0.00047µF
0.00039µF
0.00033µF
0.00027µF
0.00022µF
0.00018µF
0.00015µF
0.00012µF
0.0001µF
0
10
100
1000
Frequency [kHz]
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1−17
L
19 / 20
P.
REFERENCE
28−75
Clsf.
Standard Doc.
Product
Specifications
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
No.
Revision
Code
ECHU1H(X): ( 0.0033 µF to 0.039 µF)
Fig.5 Permissible Current
Measuring condition : Sine wave
1.2
1
0.039µF
0.033µF
0.8
Permissible Effective Current [A]
0.027µF
0.022µF
0.018µF
0.6
0.015µF
0.012µF
0.4
0.01µF
0.0082µF
0.0068µF
0.0056µF
0.2
0.0047µF
0.0039µF
0.0033µF
0
10
100
1000
Frequency [kHz]
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1−17
L
20 / 20
P.
REFERENCE
28-75
PLASTIC FILM CHIP CAPACITOR
TYPE ECHU(X)
Issue
Date
Oct.16.’00
Description
1-17
Constitution
Approval
Check
M.Moriwaki Y.Miyamoto
Design
S.Ishikawa
M.Moriwaki Y.Miyamoto H.Hasegawa
A
Jul.18.’02
Revise accompanying of addition of 1608 size.
B
Feb.23.’04
Revise Collection of 9-11 Moisture Resistance Loading
M.Moriwaki Y.Miyamoto H.Hasegawa
(II) Dissipation Factor :0.9% or more → or less
C
May.12.’04 Revise Collection of fig.2 to fig.5 Permissible Current
Issue
D
Oct.1.2004
E
Dec.24.2004
F
Apr. 1. 2005
G
Apr. 1. 2006
H
I
Date
Description
Company name changed
Addition
10-XV. Appearance
Company name changed
Company name changed
[1] Fig.1 Changed
230°C or more 30smax, 180°C~260°C 20s~50s,
260°C~160°C 40smax
→250°C or more 30s max, 220°C or more 95s
max, 180°C~260°C 20s~80s, 260°C~160°C
70s max
[2] Fig.1 Addition
(The guarantee temperature and time are numerical
values of the bold-faced type in the profile.)
[3] 10-IV b) <Note> Changed
• Heat effect of VSP method is different from that of
Jul 12. 2006 reflow method, Consult us before using, when
soldering in VSP method.
→• The reflow method recommends the hot wind
circulation method. The heat influence on the
capacitor is different in the methods other than the
hot wind circulation method. Please confirm there is
no problem in the characteristic of the capacitor
beforehand when it is mounted excluding the hot
wind circulation method.
Please inquire when it is uncertain.
[4] 9. CHARACTER No.7 Addition
Solder in the solder tank is Sn-Ag-Cu.
[1]Changed
10.Caution about safety in use
I.Operating range (voltage, current, operating
temperature)
b) Permissible Current
Fig.2 , Fig.3 , Fig.4 and Fig.5
Sep.6.2006 [2]Addition
10.Caution about safety in use
I.Operating range (voltage, current, operating
temperature)
a) Permissible Voltage
• Caution about safety in inverter circuit for LCD
back light use
M.Moriwaki Y.Miyamoto H.Hasegawa
QA Approval
Approval
Design
K. Kuwata
K. Ogawa
Y. Miyamoto
K. Kuwata
K. Ogawa
H. Hasegawa
K. Ago
M. Nagaoka
Y. Miyamoto
M. Okamura
M. Nagaoka
Y. Miyamoto
M. Okamura
M. Nagaoka
Y. Miyamoto
M. Okamura
M. Nagaoka
Y. Miyamoto
J
Apr. 1.2008
Company name changed.
M. Okamura
M. Nagaoka
Y. Takata
K
Apr. 1.2012
Company name changed.
H.Arita
T.Kume
Y. Takata
REFERENCE
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