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INCH-POUND
MIL-M-38510/103H
18 February 2005
SUPERSEDING
MIL-M-38510/103G
03 November 2004
MILITARY SPECIFICATION
MICROCIRCUITS, LINEAR, VOLTAGE COMPARATORS, MONOLITHIC SILICON
Reactivated after 18 February 2005 and may be used for either new or existing design acquisition.
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, voltage comparators. Two product
assurance classes and a choice of case outlines and lead finish are provided for each type and are reflected in the complete
part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as shown in the following:
Device type
01
02
03
04
05
06
07
Circuit
Single differential voltage comparator
Dual channel differential voltage comparator
Single differential voltage comparator / buffer
Precision voltage comparator / buffer
Dual precision voltage comparator / buffer 1/
Dual precision high speed voltage comparator
Dual high precision, high speed voltage comparator
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
______
1/ Device type 05 may be monolithic, or it may consist of two separate, independent dice.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43218-3990, or emailed
to [email protected] Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A
FSC 5962
MIL-M-38510/103H
1.2.3 Case outlines. The case outlines are designated in MIL-STD-1835 and as follows:
Descriptive designator
Terminals
GDFP5-F14 or CDFP6-F14
GDIP1-T14 or CDIP2-T14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
MACY1-X8
GDFP1-F10 or CDFP2-F10
MACY1-X10
GDIP1-T8 or CDIP2-T8
CDFP4-F16
GDFP1-G10
CQCC1-N20
14
14
16
16
8
10
10
8
16
10
20
Outline letter
A 2/
C
E
F
G
H
I
P
X
Z
2
Package style
Flat pack
Dual-in-line
Dual-in-line
Flat pack
Can
Flat pack
Can
Dual-in-line
Flat pack
Flat pack with gull wing leads
Square leadless chip carrier
1.3 Absolute maximum ratings.
Positive supply voltage
Negative supply voltage
Total supply voltage
Output voltage
Output to negative supply
voltage
Input voltage range
Differential input voltage
Peak output current
Sink current
Output short-circuit duration
Strobe voltage
Maximum strobe current
Storage temperature range
Junction temperature (TJ) 5/
Lead temperature
(soldering, 60 seconds)
01
+14.0 V
-7.0 V
-------
02
+14.0 V
-7.0 V
-------
Device types
03
04 and 05
+15.0 V
+30.0 V
-15.0 V
-30.0 V
--+36.0 V
+24.0 V
--+30.0 V
+50.0 V
06 and 07
+18 V
-25 V
+36 V
--+36.0 V
±7.0 V
±7.0 V
±7.0 V
±5.0 V
±5.0 V
±5.0 V
10 mA
50 mA
------100 mA
10 s
10 s
10 s
--6.0 V
6.0 V
-------65°C to +150°C for all device types
+175°C
+175°C
+175°C
3/
±30.0 V
--50 mA
10 s
--10 mA
±15.0 V 4/
±5.0 V
25 mA
--10 s
-----
+175°C
+175°C
+300°C
+300°C
+300°C
+300°C
+300°C
1.4 Recommended operating conditions.
Supply voltage range : 4/
Device types 01 and 02 ................................................................ +VCC = +12 V dc, -VCC = -6.0 V dc
Device type 03 .............................................................................. +VCC = +12 V dc, -VCC = -3.0 to -12.0 V dc
Device types 04, 05, 06, and 07 ................................................... ±VCC = ±15.0 V dc
Ambient temperature range (TA) ...................................................... -55°C to +125°C
______
2/ Inactive case outline.
3/ The positive input voltage limit is 30 V above the negative supply. The negative input voltage limit is equal to the
negative supply voltage or 30 V below the positive supply, whichever is less negative.
4/ For supply voltages less than ±15.0 V dc, the input voltage rating is equal to the supply voltage.
5/ For short term test (in the specific burn-in and life test configuration when required and up to 168 hours
maximum) TJ = +275°C.
2
MIL-M-38510/103H
1.5 Power and thermal characteristics.
Case outlines
Maximum allowable power
dissipation
Maximum
Maximum
θJC
θJA
A
350 mW at TA = +125°C
60°C/W
140°C/W
C, E, and P
400 mW at TA = +125°C
35°C/W
120°C/W
G
330 mW at TA = +125°C
40°C/W
150°C/W
I
350 mW at TA = +125°C
40°C/W
140°C/W
H
330 mW at TA = +125°C
60°C/W
150°C/W
F
350 mW at TA = +125°C
60°C/W
140°C/W
X
200 mW at TA = +125°C
35°C/W
140°C/W
Z
330 mW at TA = +125°C
21°C/W
225°C/W still air
142°C/W 500 LFPM
2
55°C/W
199 mW at TA = +125°C
121°C/W
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does
not include documents cited in other sections of this specification or recommended for additional information or as examples.
While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all
specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification
to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or
contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535
- Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
- Test Method Standard for Microelectronics.
- Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia,
PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein the
text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3
MIL-M-38510/103H
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer
authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and
6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein.
3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VA) upon request.
3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as
specified in table I and apply over the full operating ambient temperature range of -55°C to +125°C.
3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535.
3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table
II. The electrical tests for each subgroup are described in table III.
3.8 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 50 (see
MIL-PRF-38535, appendix A).
4
MIL-M-38510/103H
TABLE I. Electrical performance characteristics.
Test
Input offset voltage
Symbol
VIO
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
VOUT = 1.4 V,
Temperature
TA = +25°C
RS = 200 Ω and 50 Ω
VOUT = 1.0 V,
TA = +125°C
RS = 200 Ω and 50 Ω
VOUT = 1.8 V,
TA = -55°C
RS = 200 Ω and 50 Ω
VOUT = 1.5 V,
TA = +25°C
RS = 200 Ω and 50 Ω
-55°C ≤ TA ≤
+125°C
VIC = 0 V, 13 V and
3/
TA = +25°C
Device
type
Limits
Unit
Min
Max
01
-2
+2
02
-3.5
+3.5
01
-3
+3
02
-4.5
+4.5
01
-3
+3
02
-4.5
+4.5
03
-2
+2
-3
+3
-3
+3
04,05
-14.5 V,
RS = 50 Ω,
-55°C ≤ TA ≤
+125°C
-4
+4
±VCC = ±2.5 V,
TA = +25°C
-3
+3
RS = 50 Ω, VIC = 0 V
-55°C ≤ TA ≤
+125°C
-4
+4
-4
+4
-7
+7
-1
+1
-2
+2
VIC = 0 V, +12 V, and
3/
TA = +25°C
06
-12 V,
RS = 50 Ω
TA = -55°C,
+125°C
TA = +25°C
TA = -55°C,
+125°C
See footnotes at end of table.
5
07
mV
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Input offset voltage
VIO
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Temperature
+VCC = 5 V, -VCC = 0 V
TA = +25°C
RS = 50 Ω, VIC = 2.5 V
TA = -55°C,
Device
type
Limits
Unit
Min
Max
-4
+4
-7
+7
-1
+1
-2
+2
-3
+3
-4.5
+4.5
01,02,
03
-10
+10
04,05
-25
+25
01
-3
+3
02
-10
+10
01
-3
+3
02
-10
+10
01
-7
+7
02
-20
+20
03
-3
+3
-7
+7
06
mV
+125°C
TA = +25°C
07
TA = -55°C,
+125°C
Raised input offset
voltage
4/
Input offset voltage
temperature coefficient
Input offset current
VIO(R)
VIC = 0 V, 13 V, and
3/
TA = +25°C
04,05
mV
-14.5 V, RS = 50 Ω,
∆VIO /
VBAL = VBAL / STB = +VCC
-55°C ≤ TA ≤
+125°C
RS = 50 Ω
-55°C ≤ TA ≤
+125°C
∆T
IIO
VOUT = 1.4 V
TA = +25°C
VOUT = 1.0 V
TA = +125°C
VOUT = 1.8 V
TA = -55°C
VOUT = 1.5 V
TA = +25°C,
+125°C
TA = -55°C
See footnotes at end of table.
6
µV/°C
µA
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Input offset current
IIO
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
VIC = 0 V, 13 V, and
3/
–14.5 V,
Temperature
+25°C ≤ TA ≤
+125°C
RS = 50 kΩ
TA = -55°C
VIC = 0 V, +12 V, and 3/
TA = +25°C,
–12 V,
4/
IIO(R)
VIC = 0 V, RS = 50 kΩ,
VBAL = VBAL / STB = +VCC
Input offset current
temperature coefficient
∆IIO /
+25°C ≤ TA ≤
+125°C
Unit
Min
Max
-10
+10
-20
+20
06
-75
+75
07
-40
+40
06
-100
+100
07
-75
+75
04,05
-25
+25
-50
+50
01,02,
03
-25
+25
nA/°C
04,05
-100
+100
pA/°C
01,02,
03
-75
+75
nA/°C
04,05
-200
+200
pA/°C
01,03
-0.1
+20
µA
02
-0.1
+75
01,03
-0.1
+45
02
-0.1
+150
04,05
TA = -55°C
TA = +125°C
∆T
RS = 50 kΩ
TA = -55°C
RS = 50 k
Input bias current
Limits
nA
+125°C
TA = -55°C
Raised input offset
current
Device
type
TA = +25°C,
+IIB
+125°C
TA = -55°C
See footnotes at end of table.
7
nA
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Input bias current
Symbol
+IIB
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Temperature
Device
type
Limits
Min
Max
-100
+0.1
TA = -55°C
-150
+0.1
+25°C ≤ TA ≤
+125°C
-150
+0.1
RS = 50 kΩ
TA = -55°C
-200
+0.1
VIC = 0 V
TA = +25°C,
-0.1
+500
TA = -55°C
-0.1
1000
TA = +25°C,
-0.1
+750
-0.1
+1000
-100
+0.1
TA = -55°C
-150
+0.1
+25°C ≤ TA ≤
+125°C
-150
+0.1
RS = 50 kΩ
TA = -55°C
-200
+0.1
VIC = 0 V
TA = +25°C,
-0.1
+500
TA = -55°C
-0.1
+1000
TA = +25°C,
-0.1
+750
-0.1
+1000
VIC = 0 V, RS = 50 kΩ
VIC = 13 V and –14.5 V,
+25°C ≤ TA ≤
+125°C
04,05
06,07
+125°C
VIC = +12 V and –12 V
+125°C
TA = -55°C
-IIB
VIC = 0 V, RS = 50 kΩ
VIC = 13 V and –14.5 V,
+25°C ≤ TA ≤
+125°C
04,05
06,07
+125°C
VIC = +12 V and –12 V
+125°C
TA = -55°C
See footnotes at end of table.
8
Unit
nA
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Strobe current
Symbol
ISTROBE
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
VSTROBE = 100 mV,
VID = +10 mV
Temperature
-55°C ≤ TA ≤
+125°C
VSTROBE = 400 mV,
Device
type
Limits
Unit
Min
Max
02
-2.5
-0.1
03
-3.3
-0.1
02
-1.0
0
03
+2.5
+5.5
mA
VID = -5 mV
Strobed output level
VO
VSTROBE = 0.3 V, 5/
(strobed)
VID = +10 mV
-55°C ≤ TA ≤
+125°C
VSTROBE = 0.9 V,
V
VID = -5 mV
+0.4
VSTROBE = 2.5 V,
VID = -5 mV, IOL = 16 mA
Collector output voltage
(strobed)
VO(STB)
Input voltage
common mode
rejection
CMR
Common mode rejection
ratio
CMRR
-55°C ≤ TA ≤
+125°C
04,05
+14
V
-55°C ≤ TA ≤
+125°C
01,02,
03
+80
dB
-55°C ≤ TA ≤
+125°C
04,05
+80
dB
06,07
90
01
+2.5
+5.0
VID = +10 mV, IOH = 0 mA
02
+2.5
+5.0
VID = +5 mV, IOH = -5 mA
01
+2.5
+5.0
VID = +10 mV, IOH = -5 mA
02
+2.5
+5.0
VID = +5 mV,
03
+2.5
+5.5
ISTB = -3.0 mA
RS = 50 Ω
-VCC = -7.0 V, RS = 200 Ω,
-5 V ≤ VIN ≤ +5 V
VIC = 13 V and –14.5 V,
RS = 50 Ω
VIC = +12 V and -12 V,
RS = 50 Ω
High level output
voltage
VOH
VID = +5 mV, IOH = 0 mA
IOH = -400 µA
See footnotes at end of table.
9
-55°C ≤ TA ≤
+125°C
V
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Low level output
voltage
Symbol
VOL
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
VID = -5 mV, IOL = 0 mA
Temperature
-55°C ≤ TA ≤
+125°C
VID = -10 mV, IOL = 0 mA
Device
type
Limits
Unit
Min
Max
01
-1.0
0
02
-1.0
0
03
+1.5
VID = -5 mV, IOL = 100 mA
TA = +25°C
VID = -5 mV, IOL = 16 mA
TA = +125°C
+0.4
VID = -5 mV, IOL = 50 mA
TA = -55°C
+1.0
VOL1
+VCC = +4.5 V, -VCC = 0 V,
VOL2
VIC = -1.75 V, +0.75 V,
-55°C ≤ TA ≤
+125°C
V
04,05
+0.4
VID = -6.0 mV, IO = 8 mA
VOL3
±VCC = ±15 V,
VOL4
VIC = 13 V, -14 V,
+1.5
VID = -5.0 mV, IO = 50 mA
VOL1
+VCC = +4.5 V, -VCC = 0 V,
VOL2
VIC = +2.25 V, +1.0 V,
VID = 7.0 mV, IO = 3.2 mA
Output sink current
VOL3
VIC = ±12 V,
VOL4
VID = -7.0 mV, IO = 25 mA
IOL
VID = -5.0 mV, VOL = 0 V
TA = +25°C,
+125°C
VID = -10 mV, VOL = 0 V
See footnotes at end of table.
10
+0.4
TA = -55°C
+0.6
-55°C ≤ TA ≤
+125°C
+1.5
TA = +25°C
VID = -10 mV, VOL = 0 V
VID = -5.0 mV, VOL = 0 V
06,07
TA = +125°C
01
+2.0
02
+0.5
01
+0.5
02
+0.12
mA
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Temperature
Device
type
Limits
Min
Output sink current
IOL
ICEX
+1.0
02
+0.25
03
-0.1
+1.0
-0.5
+100
-1
+10
-1
+500
-1
+2.0
-1
+10.0
-5
+500
-5
+500
01
+0.5
+9.0
VID = -10 mV, VOUT = VOL
02
+0.5
+13.5
VID = -5 mV
03
+0.5
+10
TA = -55°C
VOUT = 24 V, VID = +5 mV
TA = +25°C
TA = +125°C,
-55°C
Input leakage current
Positive supply current
Max
01
VID = -5.0 mV, VOL = 0 V
VID = -10 mV, VOL = 0 V
Output leakage current
Unit
±VCC = ±18 V,
TA = +25°C
VOUT = 32 V
TA = +125°C
±VCC = ±18 V,
TA = +25°C
VO = 18 V
TA = +125°C
II1
±VCC = ±18 V, VID = +29 V
-55°C ≤ TA ≤
+125°C
II2
±VCC = ±18 V, VID = -29 V
+ICC
VID = -5 mV, VOUT = VOL
Limit is for one comparator
of device type 05
-55°C ≤ TA ≤
+125°C
TA = +25°C,
+125°C
04,05
06,07
04,05
04,05
TA = -55°C
See footnotes at end of table.
11
+6.0
+7.0
TA = -55°C
TA = +25°C,
+125°C
mA
06,07
+10.0
+11.5
µA
nA
µA
nA
mA
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Negative supply current
Symbol
-ICC
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
VID = -5 mV, VOUT = VOL,
no load
Temperature
-55°C ≤ TA ≤
+125°C
VID = -10 mV, VOUT = VOL,
Device
type
Limits
Unit
Min
Max
01
-7.0
-0.5
02
-6.2
-0.5
03
-3.6
-0.5
04,05
-5.0
mA
no load
VID = -5 mV
Limit is for one comparator
of device type 05
TA = +25°C,
+125°C
-6.0
TA = -55°C
TA = +25°C
Output short-circuit
current
Adjustment for input
offset voltage
IOS
VIO(ADJ)+
10 ms maximum test
duration
RS = 50 Ω
06,07
-5.0
TA = +125°C
-4.5
TA = -55°C
-6.0
TA = +25°C
04,05
+200
TA = +125°C
+150
TA = -55°C
+250
TA = +25°C
04,05
+5.0
AV(±)
mV
-5.0
VIO(ADJ)Voltage gain
mA
∆VOUT = ±0.5 V,
TA = +25°C
VOUT = 1.4 V
∆VOUT = ±0.5 V,
VOUT = 1.0 V
See footnotes at end of table.
12
TA = +125°C
01
+1,250
02
+750
01
+1,000
02
+500
V/V
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Temperature
Device
type
Limits
Min
Voltage gain
AV(±)
∆VOUT = ±0.5 V,
TA = -55°C
VOUT = 1.8 V
Voltage gain
Voltage gain
Voltage gain
(emitter follower output)
AV+
AV-
±AVE
01
+1,000
02
+500
03
+30
∆VOUT = 3.0 V,
TA = +25°C
VOUT = 1.5 V
TA = +125°C
+10
TA = -55°C
+50
03
TA = +25°C
VOUT = 1.5 V
TA = +125°C
+10
TA = -55°C
+50
TA = +25°C
04,05
TA = +25°C
AV
TA = +125°C,
-55°C
Response time,
output saturated high
level to threshold level
tHTHR
See figure 3, CL = 5 pF,
TA = +25°C
V/V
V/mV
V/mV
+10
V/mV
+8
-55°C ≤ TA ≤
+125°C
Voltage gain
(collector)
Max
+30
∆VOUT = -1.0 V,
RL = 600 Ω
Unit
06
+10
07
+20
06
+5
07
+10
V/mV
01,03
60
02
90
100 mV step,
5 mV overdrive
See footnotes at end of table.
13
ns
MIL-M-38510/103H
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Temperature
Device
type
Limits
Min
Response time,
output saturated low
level to threshold level
tLTHR
Strobe release time
tSTRL
See figure 3, CL = 5 pF,
Max
TA = +25°C
01,02,
03
60
ns
TA = +25°C
02,03
15
ns
-55°C ≤ TA ≤
+25°C
04,05
300
ns
100 mV step,
5 mV overdrive
See figure 4, TA = +25°C,
Unit
CL = 5 pF, VID = +10 mV
Response time,
low-to-high level
collector output
tRLHC
VOD (overdrive) = -5 V,
CL = 50 pF,
VIN = 100 mV
TA = +125°C
VOD (overdrive) = -5 V,
TA = +25°C,
-55°C
CL = 50 pF minimum,
Response time,
high-to-low level
collector output
tRHLC
VIN = 100 mV
TA = +125°C
VOD (overdrive) = +5 V,
-55°C ≤ TA ≤
+25°C
CL = 50 pF,
VIN = 100 mV
TA = +125°C
VOD (overdrive) = +5 V,
TA = +25°C,
+125°C,
CL = 50 pF minimum,
VIN = 100 mV
1/
2/
640
06,07
125
160
04,05
300
500
06,07
160
-55°C
For device types 01, 02, and 03, unless otherwise specified, +VCC = +12 V dc and -VCC = -6 V.
Unless otherwise specified, for device type 02, strobe on device not being tested is connected to ground; strobe on
device being tested is left open. Unless otherwise specified, for device type 03, strobes are at a high level for all tests.
For device types 04, 05, 06, and 07, unless otherwise specified, VIC = 0 V, ±VCC = ±15 V and –55°C ≤ TA ≤ +125°C.
Limits apply to each half of device types 05, 06, and 07 except as noted for +ICC and -ICC.
3/
VIC is achieved by algebraically subtracting the common mode voltage from each VCC (power supplies) and
algebraically adding it to VIN. VIC can be calculated by using the following formula:
4/
5/
ns
VIC = -[((+VCC) + (-VCC)) / 2] +VIN
Subscript (R) indicates tests which are performed with input stage current raised by connecting BAL and
BAL / STB terminals to +VCC.
The output voltage follows the strobe voltage, staying one diode drop (0.7 V) below.
14
MIL-M-38510/103H
Device type
Case outlines
01
C
G
H
2
Terminal
number
1
Terminal symbol
NC
GND
GND
NC
2
GND
INPUT+
INPUT+
GND
3
INPUT+
INPUT-
INPUT-
NC
4
INPUT-
VCC-
NC
NC
5
NC
NC
VCC-
INPUT+
6
VCC-
NC
OUTPUT
NC
7
NC
OUTPUT
NC
INPUT-
8
NC
VCC+
VCC+
NC
9
OUTPUT
---
NC
NC
10
NC
---
NC
VCC-
11
VCC+
---
---
NC
12
NC
---
---
NC
13
NC
---
---
NC
14
NC
---
---
NC
15
---
---
---
NC
16
---
---
---
NC
17
---
---
---
OUTPUT
18
---
---
---
NC
19
---
---
---
NC
20
---
---
---
VCC+
NC = No connection
FIGURE 1. Terminal connections.
15
MIL-M-38510/103H
Device type
02
Case outlines
C
H
I
2
Terminal
number
1
Terminal symbol
NC
INPUT- 1
GND
NC
2
INPUT- 1
INPUT+ 1
STROBE 1
NC
3
INPUT+ 1
VCC-
INPUT – 1
INPUT- 1
4
VCC-
INPUT+ 2
INPUT+ 1
INPUT+ 1
5
INPUT+ 2
INPUT- 2
VCC-
NC
6
INPUT- 2
STROBE 2
INPUT+ 2
VCC-
7
NC
OUTPUT
INPUT- 2
NC
8
NC
VCC+
STROBE 2
INPUT+ 2
9
STROBE 2
GND
OUTPUT
INPUT- 2
10
OUTPUT
STROBE 1
VCC+
NC
11
VCC+
---
---
NC
12
GND
---
---
NC
13
STROBE 1
---
---
STROBE 2
14
NC
---
---
OUTPUT
15
---
---
---
NC
16
---
---
---
VCC+
17
---
---
---
NC
18
---
---
---
GND
19
---
---
---
STROBE 1
20
---
---
---
NC
NC = No connection
FIGURE 1. Terminal connections – Continued.
16
MIL-M-38510/103H
Device types
Case outlines
03
A
04
G
C
G
H and Z
Terminal
number
1
Terminal symbol
NC
GND
NC
GND
GND
2
GND
INPUT+
GND
INPUT+
INPUT+ 1
3
INPUT+
INPUT-
INPUT+
INPUT-
INPUT- 1
4
INPUT-
VCC-
INPUT-
VCC-
NC
5
NC
STROBE 1
NC
BAL
VCC-
6
VCC-
STROBE 2
VCC-
BAL/STB
BAL
7
STROBE 1
OUTPUT
BAL
OUTPUT
BAL/STB
8
STROBE 2
VCC+
BAL/STB
VCC+
NC
9
OUTPUT
---
OUTPUT
---
OUTPUT
10
NC
---
NC
---
VCC+
11
VCC+
---
VCC+
---
---
12
NC
---
NC
---
---
13
NC
---
NC
---
---
14
NC
---
NC
---
---
15
---
---
---
---
---
16
---
---
---
---
---
17
---
---
---
---
---
18
---
---
---
---
---
19
---
---
---
---
---
20
---
---
---
---
---
NC = No connection
BAL = Balance
BAL / STB = Balance / Strobe
FIGURE 1. Terminal connections – Continued.
17
MIL-M-38510/103H
Device types
Case outlines
04
05
P
2
E, F, and X
Terminal
number
1
Terminal symbol
GND
NC
VCC+ A
2
INPUT+ 1
GND
GND A
3
INPUT- 1
NC
INPUT+ A
4
VCC-
NC
INPUT- A
5
BAL
INPUT+
VCC-
6
BAL/STB
NC
BAL B
7
OUTPUT
INPUT-
BAL/STB B
8
VCC+
NC
COLLECTOR OUTPUT B
9
---
NC
VCC+ B
10
---
VCC-
GND B
11
---
NC
INPUT+ B
12
---
BAL
INPUT- B
13
---
NC
BAL A
14
---
NC
BAL/STB A
15
---
BAL/STB
COLLECTOR OUTPUT A
16
---
NC
NC
17
---
OUTPUT
---
18
---
NC
---
19
---
NC
---
20
---
VCC+
---
NC = No connection
BAL = Balance
BAL / STB = Balance / Strobe
FIGURE 1. Terminal connections – Continued.
18
MIL-M-38510/103H
Device types
06 and 07
Case outlines
C
H
I
Terminal
number
1
Terminal symbol
NC
OUTPUT 1
OUTPUT 1
2
NC
GND 1
GND 1
3
GND 1
INPUT+ 1
INPUT+ 1
4
INPUT+ 1
INPUT- 1
INPUT- 1
5
INPUT- 1
VCC-
VCC-
6
VCC-
OUTPUT 2
OUTPUT 2
7
OUTPUT 2
GND 2
GND 2
8
GND 2
INPUT+ 2
INPUT+ 2
9
INPUT+ 2
INPUT- 2
INPUT- 2
10
INPUT- 2
VCC+
VCC+
11
VCC+
---
---
12
OUTPUT 1
---
---
13
NC
---
---
14
NC
---
---
NC = No connection
FIGURE 1. Terminal connections – Continued.
19
MIL-M-38510/103H
FIGURE 2. Test circuit for static and dynamic tests.
20
MIL-M-38510/103H
FIGURE 2. Test circuit for static and dynamic tests – continued.
21
MIL-M-38510/103H
FIGURE 2. Test circuit for static and dynamic tests – continued.
22
MIL-M-38510/103H
FIGURE 2. Test circuit for static and dynamic tests – continued.
23
MIL-M-38510/103H
NOTES:
1. Test circuit pin conditions and test temperatures shall be as specified in table III.
2. Precautions shall be taken to prevent damage to the device under test (DUT) during insertion into socket
and change of relay switch positions (for example, disable voltage-current supplies, current limit ±VCC, etc.).
3. As required to prevent oscillations. Also, proper wiring procedures shall be followed to prevent oscillations.
Loop response and settling time shall be consistent with test rate such that any value has settled to within
5 percent of its final value before value is measured. Suggested values shown may not ensure loop stability
for all layouts. Actual compensation used shall be approved by the preparing activity prior to use.
4. Any oscillation greater than 300 mV(p-p) shall be cause for device failure.
5. For dual devices, both halves shall be tested. The output of the idle half shall be driven to the off state by
using either a differential input voltage or a strobe input, or the idle half may be biased the same as the
tested half if oscillations can be avoided.
6. These resistors are ±0.1 percent tolerance matched to ±0.01 percent. All other resistors are ±1 percent
tolerance and capacitors are 10 percent tolerance.
7. All relays are shown in the normal deenergized state.
FIGURE 2. Test circuit for static and dynamic tests – continued.
24
MIL-M-38510/103H
FIGURE 3. Response time test circuit and waveforms for device types 01, 02, and 03.
25
MIL-M-38510/103H
NOTES:
1. VIN = 100 ns pulse width, 100 kHz repetition rate, tr and tf ≤ 5 ns (see waveforms).
2.
Setup procedure: With S1 open and VIN = 0 adjust R1 for VOUT = 1.5 V. Apply VOD (see note 5) and
3.
4.
5.
close S1, then apply VIN. (R1 voltage divider may be replaced with a variable power supply.)
All resistor tolerances are ±1 percent and all capacitor tolerances are ±10 percent .
For device type 02, ground strobe on idle side. For device type 03, strobe is left open.
See waveforms for VOD values.
6.
When VOD = 12 V, overdrive applied to device under test (DUT) = 5 mV.
FIGURE 3. Response time test circuit and waveforms for device types 01, 02, and 03 – continued.
26
MIL-M-38510/103H
NOTES:
1. VIN = 100 ns pulse width, 100 kHz repetition rate, tr and tf ≤ 5 ns (see waveforms).
2.
Setup procedure: With S1 open and VIN = 3 V (device type 02), and VIN = 0 V (device type 03) adjust R1 for
3.
4.
5.
VOUT = 1.5 V. Apply VOD (see note 5) and close S1, then apply VIN. (R1 voltage divider may be replaced with
a variable power supply.)
All resistor tolerances are ±1 percent and all capacitor tolerance are ±10 percent .
For device type 02, ground strobe on idle side. For device type 03, unused strobe is left open.
See waveform for VOD values.
6.
When VOD = 12 V, overdrive applied to device under test (DUT) = 10 mV.
FIGURE 4. Strobe release time test circuit and waveforms for device types 02 and 03.
27
MIL-M-38510/103H
NOTES:
1. VIN = 10 µs pulse width at 50 kHz, tTLH and tTHL ≤ 10 ns, and ZO = 50 Ω.
2. Setup procedure:
a. With VIN = 0 V, step VREF from –3.0 mV to +3.0 mV in 0.1 mV steps for subgroup 7, -4.0 mV to +4.0 mV for
subgroup 8, and stop when output switches from high to low.
b. Change VREF from the reference value obtained above by the required VOD (overdrive).
3.
4.
c. Apply VIN and measure response time.
All resistor tolerances are ±1 percent and all capacitor tolerances are ±10 percent.
CL includes scope, probe, and jig capacitance.
5.
6.
TA = +25°C for subgroup 7. For subgroup 8, the tests shall be performed twice, at TA = +125°C and TA = -55°C.
In an environment with excessive noise, a 0.01 µF capacitor may be placed between balance and balance/strobe pins.
FIGURE 5. Response time test circuit and waveforms for collector output for device types 04 and 05.
28
MIL-M-38510/103H
FIGURE 6. Response time test circuit for device types 06 and 07.
29
MIL-M-38510/103H
NOTES:
1. This circuit is designed especially to be used with a computer-controlled automatic tester, although it can
also be implemented as a bench test setup. The test table for subgroups 9, 10, and 11 lists in detail the
steps in a typical test sequence, which goes as follows:
a. Measure VIO: Device under test (DUT) is in a conventional servo loop (K3 and K4 energized) with
output served to TTL logic threshold. (1.4 V on adapter pin 3). Measure VIO x 1000 adapter pin 8.
b.
c.
d.
e.
f.
Null VIO: Release K3 and K4, apply voltage measured in step 1 to adapter pin 4. This is particularly
easy to do on computer-controlled automatic test equipment.
Apply 5 mV overdrive (OD): The overdrive is developed at the inverting input of the device under
test (DUT) via a 1000:1 divider from adapter pin 5.
Apply initial 100 mV: Close K1, apply 2 mA at adapter pin 6. Since Q1 is off, this current flows through
Schottky diode D1 and the 50 Ω source resistor, giving 100 mV. If a current source is not available,
15 V at pin 6 will give about 2 mA current.
Measure tRLHC: Pull adapter pin 7 low. U1A output goes high, starting the timer via U1B and turning on
Q1, which turns off D1. The 100 mV drive disappears abruptly, leaving just the 5 mV overdrive.
After the response time, the device under test (DUT) output crosses TTL logic threshold and stops the
timer via U1B. On a bench setup, the pulse at 1UB output can be measured with a scope.
Measure tRHLC: Reset pin 7, change pin 5 from –5 V to +5 V, open K1, close K2, pull pin 7 low,
measure pulse width at U1B output.
2.
The following delay times are of possible concern in the LM119 (device types 06 and 07) response time
test circuit:
a. U1A: This device merely inverts and squares up the start signal from the tester. Its gate delay does not
affect the tests.
b. Q1: This is the major uncompensated delay, since the timer starts when Q1 base goes high, not when Q1
collector goes low. This delay is minimized by using a fast switching transistor with an R-C speedup
network driving the base. Measured Q1 delays are well under 10 ns.
c. D1 and D2: These Schottky devices have negligible switching times ( < 1 ns).
d. U1B: The gate delays here are not important as long as the delays from the two inputs are well matched.
(Matched delays merely offset the output pulse in time.) To minimize gate delay effects even further,
we use one of the “fast” series 74F86 gates; with delays around 5 ns from each input, the mismatch
should be no more than 1 or 2 ns.
e. Q2: This driver is required only if the time measurement systems has a 50 Ω input. Since it operates
as an emitter follower rather than a saturating switch, there are no delays associated with it.
3.
As required to prevent oscillations. Also, proper wiring procedures shall be followed to prevent oscillations.
Loop response and settling time shall be consistent with test rate such that any value has settled to within
5 percent of its final value before value is measured. Suggested values shown may not ensure loop
stability for all layouts. Actual compensation used shall be approved by preparing activity prior to use.
4.
All resistor tolerances are ±1 percent and all capacitor tolerances are ±10 percent.
5.
CL includes scope, probe, and jig capacitance.
FIGURE 6. Response time test circuit for device types 06 and 07 – continued.
30
MIL-M-38510/103H
TABLE II. Electrical test requirements.
MIL-PRF-38535
test requirements
Subgroups (see table III) 2/ 3/
Class S
devices
Class B
devices
Interim electrical parameters
1
1
Final electrical test parameters 1/
1,2,3,4
1,2,3,4
Group A test requirements
1,2,3,4,5,6,
7,8,9,10,11
1,2,3,4,5,6,7,8,9
Group B electrical test parameters
when using the methods 5005 QCI
option
1,2,3, and
table IV delta
limits
N/A
Group C electrical parameters
1,2,3, and
table IV delta
limits
1 and table IV
delta limits
Group D end point electrical
parameters
1,2,3
1
1/ PDA applies to subgroup 1.
2/ Subgroup 8 applies to device types 04 and 05 only.
3/ Subgroups 9, 10, and 11 apply to device types 06 and 07.
4. VERIFICATION.
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not effect the
form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a.
The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test
prior to burn-in is optional at the discretion of the manufacturer.
c.
Additional screening for space level product shall be as specified in MIL-PRF-38535.
31
32
no.
-883
3
4
“
“
∆IIO/∆T 4/
IIO
∆VIO/∆T 4/
VIO2
VIO1
IO(STB) 3/
VO(STB) 3/
VOH2
VOH1
IOL
VOL
-ICC
12
13
14
15
3006
3006
3007
3009
4001
20
19
18
17
11
3009
4001
10
3007
16
9
3005
4001
8
7
6
3005
4003
CMR
+ICC
4003
5
2
“
“
1
4001
method
Test
MIL-STD
CMR
-IIB
+IIB
IIO
VIO2
VIO1
Symbol
See footnotes at end of device types 01 and 02.
(figure 2)
TA = +125°C
2
(figure 2)
TA = +25°C
1
Subgroup
“
“
“
2/
2
“
“
“
2/
3
“
“
“
“
“
“
“
“
“
+12.0 V
+7.0 V
+17.0 V
“
“
“
“
+12.0 V
4
“
“
“
“
“
“
“
“
“
-6.0 V
-12.0 V
-2.0 V
“
“
“
“
-6.0 V
5
100 mV
300 mV
6
+12.0 V
-6.0 V
3
Calculation: ∆IIO / ∆T = [IIO (test 19) – IIO (test 3)] x 10 / 100°C
GND
3
Calculation: ∆VIO / ∆T = [VIO (test 16) – VIO (test 1)] x 10 / 100°C
“
“
“
“
“
“
“
“
“
GND
-5.0 V
+5.0 V
“
“
“
“
GND
1
Adapter PIN numbers
TABLE III. Group A inspection for device types 01 and 02. 1/
-5 mA
7
-1.0 V
-1.0 V
-1.0 V
+3.6 V
-6.4 V
“
“
“
“
-1.4 V
8
9
1,3,5,6,8,9,10
2,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
3,4,6
3,4,6
3,4,6
3,4,6
1,2,5
1,2,5
1,2,5
1,2,5
2,4,5,6,8,9,10
2,4,5,6,8,9,10
1,3,4,5,6,7,9,10
1,2,3,5,6,7,9,10
1,3,5,6,8,9,10
2,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
closed
Relays
MIL-M-38510/103H
33
no.
-883
3
4
“
“
∆IIO/∆T 4/
IIO
∆VIO/∆T 4/
VIO2
VIO1
IO(STB) 3/
VO(STB) 3/
VOH2
VOH1
IOL
VOL
-ICC
12
13
14
15
3006
3006
3007
3009
4001
20
19
18
17
11
3009
4001
10
3007
16
9
3005
4001
8
7
6
3005
4003
CMR
+ICC
4003
5
2
“
“
1
4001
method
Test
MIL-STD
CMR
-IIB
+IIB
IIO
VIO2
VIO1
Symbol
See footnotes at end of device types 01 and 02.
(figure 2)
TA = +125°C
2
(figure 2)
TA = +25°C
1
Subgroup
9
9
9
6
“
“
“
“
7
5
4
9
9
“
“
“
“
9
No.
E10
E9
E8
IO(STB)
VO(STB)
VOH2
VOH1
IOL
VOL
-ICC
+ICC
E7
E6
E5
E4
E3
E2
E1
Value
Pin measured
V
V
V
mA
V
V
V
mA
V
mA
mA
“
“
“
“
“
“
V
Unit
IIO = E8 – E10
VIO = 10E9
VIO = 10E8
3
CMR = 20 log [10 / (E6 – E7)]
-IIB = 10E5 – E1
+IIB = E1 – 10E4
IIO = E1 – E3
VIO = 10E2
VIO = 10E1
Equation
-25
-3
-10
-3
-3
+2.5
+2.5
+2.0
-1.0
-7.0
+0.5
+80
-0.1
-3
-2
-2
Min
+25
+3
+10
+3
+3
+5.0
+5.0
-0.5
+9.0
+20
+20
+3
+2
+2
Max
Device type 01
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
-0.1
-0.1
µA
µA
-10
µA
-25
-10
µV/°C
nA/°C
-4.5
-4.5
-2.5
-1.0
+2.5
+2.5
+0.5
-1.0
-6.2
+0.5
mV
mV
V
V
mA
V
mA
mA
+80
-10
µA
dB
-3.5
-3.5
Min
mV
mV
Unit
Limits
+25
+10
+10
+4.5
+4.5
-0.1
+5.0
+5.0
-0.5
+13.5
+75
+75
+10
+3.5
+3.5
Max
Device type 02
nA/°C
µA
µV/°C
mV
mV
mA
V
V
V
mA
V
mA
mA
dB
µA
µA
µA
mV
mV
Unit
MIL-M-38510/103H
34
no.
-883
∆IIO/∆T 4/
IIO
∆VIO/∆T 4/
VIO2
VIO1
IO(STB) 3/
VO(STB) 3/
VOH2
VOH1
IOL
VOL
-ICC
+ICC
37
36
“
“
35
32
3009
“
31
3007
34
30
3006
“
29
3006
33
28
3009
4001
27
26
3005
3007
25
24
3005
4003
CMR
23
22
4001
4003
21
4001
method
Test
MIL-STD
CMR
-IIB
+IIB
Symbol
See footnotes at end of device types 01 and 02.
(figure 2)
TA = -55°C
3
(figure 2)
TA = +125°C
2
Subgroup
“
“
“
2/
2
“
“
“
2/
3
“
“
“
“
“
“
“
“
“
+12.0 V
+7.0 V
+17.0 V
+12.0 V
+12.0 V
4
“
“
“
“
“
“
“
“
“
-6.0 V
-12.0 V
-2.0 V
-6.0 V
-6.0 V
5
100 mV
300 mV
6
+12.0 V
-6.0 V
3
Calculation: ∆IIO / ∆T = [IIO (test 36) – IIO (test 3)] x 10 / 80°C
GND
3
Calculation: ∆VIO / ∆T = [VIO (test 33) – VIO (test 1)] x 10 / 80°C
“
“
“
“
“
“
“
“
“
GND
-5.0 V
+5.0 V
GND
GND
1
Adapter PIN numbers
-5 mA
7
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
-1.8 V
-1.8 V
-1.8 V
+4.0 V
-6.0 V
-1.0 V
-1.0 V
8
9
1,3,5,6,8,9,10
2,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
3,4,6
3,4,6
3,4,6
3,4,6
1,2,5
1,2,5
1,2,5
1,2,5
2,4,5,6,8,9,10
2,4,5,6,8,9,10
1,3,4,5,6,7,9,10
1,2,3,5,6,7,9,10
closed
Relays
MIL-M-38510/103H
35
no.
-883
∆IIO/∆T 4/
IIO
∆VIO/∆T 4/
VIO2
VIO1
IO(STB) 3/
VO(STB) 3/
VOH2
VOH1
IOL
VOL
-ICC
+ICC
37
36
“
“
35
32
3009
“
31
3007
34
30
3006
“
29
3006
33
28
3009
4001
27
26
3005
3007
25
24
3005
4003
CMR
23
22
4001
4003
21
4001
method
Test
MIL-STD
CMR
-IIB
+IIB
Symbol
See footnotes at end of device types 01 and 02.
(figure 2)
TA = -55°C
3
(figure 2)
TA = +125°C
2
Subgroup
9
9
9
6
“
“
“
“
7
5
4
“
“
“
9
No.
E17
E16
E15
IO(STB)
VO(STB)
VOH2
VOH1
IOL
VOL
-ICC
+ICC
E14
E13
E12
E11
Value
Pin measured
V
V
V
mA
V
V
V
mA
V
mA
mA
“
“
“
V
Unit
IIO = E15 – E17
VIO = 10E16
VIO = 10E15
3
CMR = 20 log [10 / (E13 – E14)]
-IIB = 10E12 – E8
+IIB = E8 – 10E11
Equation
-75
-7
-10
-3
-3
+2.5
+2.5
+0.5
-1.0
-7.0
+0.5
+80
-0.1
-0.1
Min
+75
+7
+10
+3
+3
+5.0
+5.0
-0.5
+9.0
+20
+20
Max
Device type 01
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
-0.1
µA
-20
µA
-75
-10
µV/°C
nA/°C
-4.5
-4.5
-2.5
-1.0
+2.5
+2.5
+0.12
-1.0
-6.2
+0.5
mV
mV
V
V
mA
V
mA
mA
+80
-0.1
µA
dB
Min
Unit
Limits
+75
+20
+10
+4.5
+4.5
-0.1
+5.0
+5.0
-0.5
+13.5
+75
+75
Max
Device type 02
nA/°C
µA
µV/°C
mV
mV
mA
V
V
V
mA
V
mA
mA
dB
µA
µA
Unit
MIL-M-38510/103H
36
no.
-883
AV-
AV+
AV-
AV+
IO(STB) 3/
VO(STB) 3/
VOH2
VOH1
IOL
VOL
-ICC
+ICC
48
49
3007
3009
52
53
“
“
51
47
3006
“
46
3006
50
45
3009
4004
44
43
3005
3007
42
41
3005
4003
CMR
40
39
4001
4003
38
4001
method
Test
MIL-STD
CMR
-IIB
+IIB
Symbol
See footnotes at end of device types 01 and 02.
TA = +125°C
(see figure 2)
5
TA = +25°C
(see figure 2)
4
(figure 2)
TA = -55°C
3
Subgroup
“
“
“
“
“
“
“
“
“
“
“
GND
-5.0 V
+5.0 V
GND
GND
1
“
“
“
2/
2
“
“
“
2/
3
“
“
“
“
“
“
“
“
“
“
“
+12.0 V
+7.0 V
+17.0 V
+12.0 V
+12.0 V
4
“
“
“
“
“
“
“
“
“
“
“
-6.0 V
-12.0 V
-2.0 V
-6.0 V
-6.0 V
5
Adapter PIN numbers
100 mV
300 mV
6
-5 mA
7
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
-0.5 V
-1.5 V
-0.9 V
-1.9 V
+3.2 V
-6.8 V
-1.8 V
-1.8 V
8
9
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
3,4,6
3,4,6
3,4,6
3,4,6
1,2,5
1,2,5
1,2,5
1,2,5
2,4,5,6,8,9,10
2,4,5,6,8,9,10
1,3,4,6,7,9,10
1,2,3,5,6,7,9,10
closed
Relays
MIL-M-38510/103H
37
no.
-883
AV-
AV+
AV-
AV+
IO(STB) 3/
VO(STB) 3/
VOH2
VOH1
IOL
VOL
-ICC
+ICC
48
49
3007
3009
52
53
“
“
51
47
3006
“
46
3006
50
45
3009
4004
44
43
3005
3007
42
41
3005
4003
CMR
40
39
4001
4003
38
4001
method
Test
MIL-STD
CMR
-IIB
+IIB
Symbol
See footnotes at end of device types 01 and 02.
TA = +125°C
(figure 2)
5
TA = +25°C
(figure 2)
4
(figure 2)
TA = -55°C
3
Subgroup
9
9
9
9
6
“
“
“
“
7
5
4
“
“
“
9
No.
E25
E24
E23
E22
IO(STB)
VO(STB)
VOH2
VOH1
IOL
VOL
-ICC
+ICC
E21
E20
E19
E18
Value
Pin measured
“
“
“
V
mA
V
V
V
mA
V
mA
mA
“
“
“
V
Unit
AV- = 50 / (E8 – E25)
AV+ = 50 / (E8 – E24)
AV- = 50 / (E1 – E23)
AV+ = 50 / (E1 – E22)
3
CMR = 20 log [10 / (E20 – E21)]
-IIB = 10E19 – E15
+IIB = E15 – 10E18
Equation
+1,000
+1,000
+1,250
+1,250
+2.5
+2.5
+1.0
-1.0
-7.0
+0.5
+80
-0.1
-0.1
Min
+5.0
+5.0
-0.5
+9.0
+45
+45
Max
Device type 01
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
-0.1
µA
“
“
“
V/V
V
V
mA
V
mA
mA
+500
+500
+750
+750
-2.5
-1.0
+2.5
+2.5
+0.25
-1.0
-6.2
+0.5
+80
-0.1
µA
dB
Min
Unit
Limits
-0.1
+5.0
+5.0
-0.5
+13.5
+150
+150
Max
Device type 02
“
“
“
V/V
mA
V
V
V
mA
V
mA
mA
dB
µA
µA
Unit
MIL-M-38510/103H
38
tSTRL 3/
tHTHR
tLTHR
AV-
AV+
Symbol
no.
-883
55
“
58
57
56
54
4004
method
Test
MIL-STD
See footnotes at end of device types 01 and 02.
TA = +25°C
7
TA = -55°C
(figure 2)
6
Subgroup
2
3
+12.0 V
+12.0 V
4
-6.0 V
-6.0 V
5
6
7
8
-1.3 V
-2.3 V
These tests shall be performed using test conditions and procedures listed on figure 4.
These tests shall be performed using test conditions and procedures listed on figure 3.
GND
GND
1
Adapter PIN numbers
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
9
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
closed
Relays
MIL-M-38510/103H
39
tSTRL 3/
tHTHR
tLTHR
AV-
AV+
Symbol
no.
-883
56
57
58
“
“
55
“
“
54
4004
method
Test
MIL-STD
“
9
No.
E27
E26
Value
Pin measured
“
V
Unit
AV- = 50 / (E15 – E27)
AV+ = 50 / (E15 – E26)
Equation
+1,000
+1,000
Min
60
60
Max
Device type 01
ns
ns
“
V/V
Unit
+500
+500
Min
Limits
15
90
60
Max
Device type 02
∆ Represents delta.
ns
ns
ns
“
V/V
Unit
4/ Test numbers 18, 20, 35, and 37, which require read and record measurements plus a calculation, may be omitted except when subgroups 2 and 3 are being performed for group A sampling
inspections and group C end points.
3/ Device type 02 only.
2/ For device type 01, use –5 mV; for device type 02, use –10 mV.
1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan.
TA = +25°C
7
TA = -55°C
(figure 2)
6
Subgroup
TABLE III. Group A inspection for device types 01 and 02 – continued. 1/
MIL-M-38510/103H
40
no.
-883
3
4
“
“
∆IIO/∆T 2/
IIO
∆VIO/∆T 2/
VIO2
VIO1
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
“
23
22
4001
“
18
21
“
17
“
“
16
20
“
15
“
“
14
-5 mV
-5 mV
2
“
“
“
“
“
-5 mV
“
“
-5 mV
3
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
-6.0 V
-12.0 V
+7.0 V
+12.0 V
-2.0 V
“
“
“
“
-6.0 V
5
+17.0 V
“
“
“
“
+12.0 V
4
+0.4 V
+2.5 V
+0.9 V
6
Adapter PIN numbers
+12.0 V
-6.0 V
3
Calculation: ∆IIO / ∆T = [IIO (test 22) – IIO (test 3)] x 10 / 100°C
GND
3
Calculation: ∆VIO / ∆T = [VIO (test 19) – VIO (test 1)] x 10 / 100°C
“
“
“
13
19
“
12
4001
“
11
3006
“
“
10
9
3005
-ICC
GND
-5.0 V
+5.0 V
“
“
“
“
GND
1
3007
8
3005
+ICC
7
4003
CMRR
6
4003
5
2
“
“
1
4001
method
Test
MIL-STD
CMRR
-IIB
+IIB
IIO
VIO2
VIO1
Symbol
See footnotes at end of device type 03.
(figure 4)
TA = +125°C
2
(figure 4)
TA = +25°C
1
Subgroup
TABLE III. Group A inspection for device type 03. 1/
+16 mA
+16 mA
+24 V
-0.4 mA
+100 mA
7
-1.5 V
-1.5 V
-1.5 V
+3.5 V
-6.5 V
“
“
“
“
-1.5 V
8
9
+0.4 V
+2.5 V
+0.9 V
10
MIL-M-38510/103H
41
no.
-883
3
4
“
“
∆IIO/∆T 2/
IIO
∆VIO/∆T 2/
VIO2
VIO1
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
“
23
22
“
1,2,5
18
21
1,2,5
17
“
1,2,5
16
20
1,2,5
15
“
1,2,5
14
1,3,5,6,8,9,10
2,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
1,2,5
13
19
3,4,6
12
4001
3,4,6
11
3006
1,2,5
1,2,5
10
9
3005
-ICC
1,2,5
2,4,5,6,8,9,10
2,4,5,6,8,9,10
1,3,4,5,6,7,9,10
1,2,3,5,6,7,9,10
1,3,5,6,8,9,10
2,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
energized
Relays
3007
8
3005
+ICC
7
4003
CMRR
6
4003
5
2
“
“
1
4001
method
Test
MIL-STD
CMRR
-IIB
+IIB
IIO
VIO2
VIO1
Symbol
See footnotes at end of device type 03.
(figure 4)
TA = +125°C
2
(figure 4)
TA = +25°C
1
Subgroup
9
9
9
10
6
“
“
“
“
“
“
7
5
4
“
“
“
“
“
“
9
No.
E10
E9
E8
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
E7
E6
E5
E4
E3
E2
E1
Value
Pin measured
V
V
V
mA
mA
“
“
“
V
IIO = E8 – E10
VIO = 10E9
-25
-3.0
-10
-3.0
-3.0
-3.3
-3.3
+2.5
+2.5
-.01
µA
-3.6
+0.5
+80
-0.1
-0.1
-3.0
-2.0
-2.0
+2.5
VIO = 10E8
3
CMR = 20 log [10 / (E6 – E7)]
-IIB = 10E5 – E1
+IIB = E1 – 10E4
IIO = E1 – E3
VIO = 10E2
VIO = 10E1
Min
V
V
mA
mA
“
“
“
“
“
“
V
Unit
Equation
TABLE III. Group A inspection for device type 03 – continued. 1/
+25
+3.0
+10
+3.0
+3.0
-0.1
-0.1
+0.4
+0.4
+5.5
+5.5
+1
+5.5
+1.5
-0.5
+10
+20
+20
+3.0
+2.0
+2.0
Max
Limits
nA/°C
µA
µV/°C
mV
mV
mA
mA
“
“
“
V
µA
V
V
mA
mA
dB
µA
µA
µA
mV
mV
Unit
MIL-M-38510/103H
42
no.
-883
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
“
“
“
“
“
“
31
32
33
34
35
36
3006
“
“
37
38
“
30
3007
“
GND
-5.0 V
29
28
27
+5.0 V
GND
GND
1
3005
3005
4003
CMRR
26
25
“
4003
24
4001
method
Test
MIL-STD
CMRR
-IIB
+IIB
Symbol
See footnotes at end of device type 03.
TA = +125°C
(figure 2)
2
(figure 4)
TA = +25°C
1
Subgroup
-5 mV
-5 mV
2
“
“
“
“
“
-5 mV
“
“
-5 mV
3
“
“
“
“
“
“
“
“
“
“
+12.0 V
+7.0 V
+17.0 V
+12.0 V
+12.0 V
4
“
“
“
“
“
“
“
“
“
“
-6.0 V
-12.0 V
-2.0 V
-6.0 V
-6.0 V
5
+0.4 V
+2.5 V
+0.9 V
6
Adapter PIN numbers
TABLE III. Group A inspection for device type 03 – continued. 1/
+16 mA
+16 mA
+24 V
-0.4 mA
+16 mA
7
+3.5 V
-6.5 V
-1.5 V
-1.5 V
8
9
+0.4 V
+2.5 V
+0.9 V
10
MIL-M-38510/103H
43
no.
-883
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
3,4,6
3,4,6
1,2,5
1,2,5
1,2,5
1,2,5
31
32
33
34
35
36
3006
1,2,5
1,2,5
37
38
1,2,5
30
3007
1,2,5
1,2,5
2,4,5,6,8,9,10
29
28
27
2,4,5,6,8,9,10
1,3,4,5,6,7,9,10
1,2,3,5,6,7,9,10
energized
Relays
3005
3005
4003
CMRR
26
25
“
4003
24
4001
method
Test
MIL-STD
CMRR
-IIB
+IIB
Symbol
See footnotes at end of device type 03.
TA = +125°C
(figure 2)
2
(figure 4)
TA = +125°C
2
Subgroup
10
6
“
“
“
“
“
“
7
5
4
“
“
“
9
No.
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
E14
E13
E12
E11
Value
Pin measured
mA
mA
“
“
“
V
-3.3
-3.3
+2.5
+2.5
-0.5
µA
-3.6
+0.5
+80
+2.5
3
CMR = 20 log [10 / (E13 - E14)]
-IIB = 10E12 - E8
+IIB = E8 – 10E11
Min
V
V
mA
mA
“
“
“
V
Unit
Equation
TABLE III. Group A inspection for device type 03 – continued. 1/
-0.1
-0.1
+0.4
+0.4
+5.5
+5.5
+100
+5.5
+0.4
-0.5
+10
+20
+20
Max
Limits
mA
mA
“
“
“
V
µA
V
V
mA
mA
dB
µA
µA
Unit
MIL-M-38510/103H
44
no.
-883
“
“
“
“
“
“
“
“
49
50
51
52
53
54
55
56
57
58
3005
3007
3006
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
“
“
GND
-5.0 V
+5.0 V
GND
48
45
“
GND
3005
44
“
3
+12.0 V
+12.0 V
4
-6.0 V
-6.0 V
5
+12.0 V
-6.0 V
-5 mV
-5 mV
“
“
“
“
“
-5 mV
“
“
-5 mV
“
“
“
“
“
“
“
“
“
“
+12.0 V
+7.0 V
+17.0 V
+12.0 V
+12.0 V
“
“
“
“
“
“
“
“
“
“
-6.0 V
-12.0 V
-2.0 V
-6.0 V
-6.0 V
6
+0.4 V
+2.5 V
+0.9 V
3
Calculation: ∆IIO / ∆T = [IIO (test 42) – IIO (test 3)] x 10 / 80°C
47
43
“
GND
4003
42
“
2
Adapter PIN numbers
3
Calculation: ∆VIO / ∆T = [VIO (test 39) – VIO (test 1)] x 10 / 80°C
GND
CMRR
41
“
46
40
“
GND
1
4003
39
4001
method
Test
MIL-STD
CMRR
-IIB
+IIB
∆IIO/∆T 2/
IIO
∆VIO/∆T 2/
VIO2
VIO1
Symbol
See footnotes at end of device type 03.
TA = -55°C
(fi
5)
(figure 2)
3
Subgroup
TABLE III. Group A inspection for device type 03 – continued. 1/
+16 mA
+16 mA
+24 V
-0.4 mA
+50 mA
7
8
9
+0.4 V
+2.5 V
+0.9 V
10
MIL-M-38510/103H
∆VIO/∆T 2/
(figure 2)
no.
-883
45
3,4,6
3,4,6
1,2,5
1,2,5
1,2,5
1,2,5
1,2,5
1,2,5
48
49
50
51
52
53
54
55
56
57
58
3005
3005
3007
3006
See footnotes at end of device type 03.
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
1,2,5
1,2,5
1,2,5
2,4,5,6,8,9,10
2,4,5,6,8,9,10
1,3,4,5,6,7,9,10
47
45
“
1,2,3,5,6,7,9,10
4003
44
“
1,3,5,6,8,9,10
CMRR
43
“
46
42
“
2,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
energized
Relays
4003
41
40
“
“
39
4001
method
Test
MIL-STD
CMRR
-IIB
+IIB
∆IIO/∆T 2/
IIO
VIO2
VIO1
Symbol
TA = -55°C
3
Subgroup
10
6
“
“
“
“
“
“
7
5
4
“
“
“
9
9
9
9
No.
ISTB2
ISTB1
VO(STH)2
VO(STH)1
VO(STL)2
VO(STL)1
ICEX
VOH
VOL
-ICC
+ICC
E21
E20
E19
E18
E17
E16
E15
Value
Pin measured
mA
mA
“
“
“
V
-3.3
-3.3
+2.5
+2.5
-0.5
µA
-3.6
+0.5
+80
-75
-7
-10
-3
-3
+2.5
3
CMRR = 20 log [10 / (E20 - E21)]
-IIB = 10E19 - E15
+IIB = E15 – 10E18
IIO = E15 – E17
VIO = 10E16
VIO = 10E15
Min
V
V
mA
mA
“
“
“
V
V
V
V
Unit
Equation
TABLE III. Group A inspection for device type 03 – continued. 1/
-0.1
-0.1
+0.4
+0.4
+5.5
+5.5
+100
+5.5
+1.0
-0.5
+10
+45
+45
+75
+7
+10
+3
+3
Max
Limits
mA
mA
“
“
“
V
µA
V
V
mA
mA
dB
µA
µA
nA/°C
µA
µV/°C
mV
mV
Unit
MIL-M-38510/103H
46
tSTRL2
tSTRL1
tHTHR
tLTHR
AV-
AV+
AV-
AV+
AV-
AV+
Symbol
no.
-883
64
4004
68
67
66
65
63
62
4004
4004
61
60
4004
4004
59
4004
method
Test
MIL-STD
See footnotes at end of device type 03.
TA = +25°C
7
TA = -55°C
(figure 2)
6
TA = +125°C
(figure 2)
5
TA = +25°C
(figure 2)
4
Subgroup
2
3
“
“
“
“
“
+12.0 V
4
“
“
“
“
“
-6.0 V
5
6
7
These tests shall be performed using test conditions and procedures listed on figure 4.
These tests shall be performed using test conditions and procedures listed on figure 3.
“
“
“
“
“
GND
1
Adapter PIN numbers
TABLE III. Group A inspection for device type 03 – continued. 1/
-0.5 V
-4.5 V
-0.5 V
-4.5 V
-0.5 V
-4.5 V
8
9
10
MIL-M-38510/103H
47
tSTRL2
tSTRL1
tHTHR
tLTHR
AV-
AV+
AV-
AV+
AV-
AV+
Symbol
no.
-883
15
+50
68
AV- = 100 / (E27 – E15)
+50
+10
+10
+30
+30
Max
15
“
AV+ = 300 / (E15 – E26)
AV- = 100 / (E25 – E8)
AV+ = 300 / (E8 – E24)
AV- = 100 / (E23 – E1)
AV+ = 300 / (E1 – E22)
Min
67
E27
“
“
“
“
V
Unit
Limits
60
“
E26
E25
E24
E23
E22
Value
Equation
66
1,2,3,4,5,6,8,9,10
“
“
“
“
9
No.
Pin measured
60
64
“
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
1,2,3,4,5,6,8,9,10
energized
Relays
65
63
62
“
“
61
60
“
“
59
4004
method
Test
MIL-STD
“
“
“
ns
“
“
“
“
“
V/V
Unit
∆ Represents delta.
2/ Test numbers 21, 23, 41, and 43, which require read and record measurements plus a calculation, may be omitted except when subgroups 2 and 3 are being performed for group A
sampling inspections and group C end points.
1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan.
TA = +25°C
7
TA = -55°C
(figure 2)
6
TA = +125°C
(figure 2)
5
TA = +25°C
(figure 2)
4
Subgroup
TABLE III. Group A inspection for device type 03 – continued. 1/
MIL-M-38510/103H
48
VIO(ADJ)-
VIO(ADJ)+
VO(STB)
-IIB
+IIB
IIO(R)
IIO
VIO(R)
VIO
Symbol
no.
-883
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
4001
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
TA = +25°C
(fi
5)
(figure 2)
1
Subgroup
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
GND
1
GND
GND
+15.0 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
GND
2
3
“
“
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.5 V
+2.0 V
+29.5 V
+15.0 V
4
“
“
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-2.5 V
-28.0 V
-0.5 V
-15.0 V
5
-3 mA
+15.0 V
+2.0 V
+29.5 V
+15.0 V
6
7
Adapter PIN numbers
TABLE III. Group A inspection for device types 04 and 05 . 1/
“
“
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.5 V
+2.0 V
+29.5 V
+15.0 V
8
9
10
GND
GND
-13.0 V
+14.5 V
GND
-13.0 V
+14.5 V
GND
GND
-13.0 V
+14.5 V
GND
-13.0 V
+14.5 V
GND
GND
-13.0 V
+14.5 V
GND
11
+20.0 V
+20.0 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
+20.0 V
12
MIL-M-38510/103H
49
VIO(ADJ)-
VIO(ADJ)+
VO(STB)
-IIB
+IIB
IIO(R)
IIO
VIO(R)
VIO
Symbol
no.
-883
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
2
“
“
1
4001
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = +25°C
1
Subgroup
-20.0 V
-20.0 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
-20.0 V
13
14
numbers
Adapter pin
1,2,3,4,5,9,11
1,2,3,4,5,8,11
1,2,4,5,10
2,3,4,5
2,3,4,5
2,3,4,5
1,3,4,5
1,3,4,5
1,3,4,5
3,4,5,8,9,10
3,4,5
3,4,5
3,4,5
1,2,3,4,5,8,9,10
1,2,3,4,5,8,9,10
1,2,3,4,5,8,9,10
1,2,3,4,5
1,2,3,4,5
1,2,3,4,5
1,2,3,4,5
energized
Relays
14
14
7
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
14
No.
E20
E19
E18
E17
E16
E15
E14
E13
E12
E11
E10
E9
E8
E7
E6
E5
E4
E3
E2
E1
Value
Pin measured
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
V
Unit
VIO(ADJ)- = E1 – E20
VIO(ADJ)+ = E1 – E19
VO(STB) = E18
-IIB = 20 (E17 – E3)
-IIB = 20 (E16 – E2)
-IIB = 20 (E15 – E1)
+IIB = 20 (E3 – E14)
+IIB = 20 (E2 – E13)
+IIB = 20 (E1 – E12)
IIO = 20 (E5 – E11)
IIO = 20 (E3 – E10)
IIO = 20 (E2 – E9)
IIO = 20 (E1 – E8)
VIO(R) = E7
VIO(R) = E6
VIO(R) = E5
VIO = E4
VIO = E3
VIO = E2
VIO = E1
Equation
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
+5.0
+14.0
-150
-150
-100
-150
-150
-100
-25.0
“
“
-10.0
“
“
“
“
“
“
-3
Min
-5.0
“
“
“
“
“
+0.1
+25.0
“
“
+10.0
“
“
“
“
“
“
+3
Max
Limits
mV
mV
V
“
“
“
“
“
“
“
“
“
nA
“
“
“
“
“
“
mV
Unit
MIL-M-38510/103H
CMRR
VOL1 2/
1
TA = +25°C
(fi
5)
(figure 2)
50
no.
-883
27
28
29
30
4001
4001
3005
3005
31
26
3009
3011
25
“
23
“
24
22
3007
“
21
4003
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
IOS 3/
-ICC
+ICC
II2
II1
ICEX
VOL4 2/
VOL3 2/
VOL2 2/
Symbol
Subgroup
2
3
4
“
“
GND
-17.0 V
+12.0 V
GND
-14.0 V
+13.0 V
+3.0 V
+0.5 V
+0.1 V
GND
GND
+12.0 V
-17.0 V
GND
-14.0 V
+13.0 V
+3.0 V
+0.5 V
+10.0 V
+10.0 V
-5 V
-9.0 V
+18.0 v
+9.0 V
+6.5 V
“
“
+15.0 V
“
“
+18.0 V
+15.0
+15.0
+4.5 V
+4.5 V
3
Calculation = 20 log [27.5 x 10 / (E3 – E2)]
1
“
“
-15.0 V
“
“
-18.0 V
-15.0 V
-15.0 V
GND
GND
5
6
5.0 V
+32.0 V
50 mA
50 mA
8 mA
8 mA
7
Adapter PIN numbers
TABLE III. Group A inspection for device types 04 and 05 - continued. 1/
“
“
“
“
“
“
“
“
“
GND
8
9
“
“
“
“
“
“
“
“
“
GND
10
11
12
MIL-M-38510/103H
VOL1 2/
TA = +25°C
51
no.
-883
24
25
26
27
28
29
30
31
“
“
3009
4001
4001
3005
3005
3011
23
22
3007
“
21
4003
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
IOS 3/
-ICC
+ICC
II2
II1
ICEX
VOL4 2/
VOL3 2/
VOL2 2/
CMRR
1
(figure 2)
Symbol
Subgroup
13
14
numbers
Adapter pin
1,2
1,2
1,2
1,2,12
1,2,12
1,2,12
1,2,12
1,2,12
1,2,12
1,2,12
energized
Relays
7
5
4
2
1
7
“
“
“
7
No.
I31
I30
I29
I28
I27
I26
E25
E24
E23
E22
Value
Pin measured
“
“
mA
“
“
nA
“
“
“
V
Unit
IOS = I31
-ICC = I30
+ICC = I29
II2 = I28
II1 = I27
ICEX = I26
VOL4 = E25
VOL3 = E24
VOL2 = E23
VOL1 = E22
Equation
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
-5.0
-5
-5
-1
+80
Min
+200
+6.0
+500
+500
+10
+1.5
+1.5
+0.4
+0.4
Max
Limits
“
“
mA
“
“
nA
“
“
“
V
dB
Unit
MIL-M-38510/103H
52
-IIB
+IIB
∆IIO/∆T
IIO(R)
IIO
∆VIO/∆T
VIO(R)
VIO
Symbol
no.
-883
41
42
43
44
45
46
47
48
49
50
“
“
“
“
“
“
“
“
“
“
38
“
40
37
“
“
36
“
39
35
“
“
34
33
“
“
32
4001
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = +125°C
2
Subgroup
“
“
“
“
“
“
GND
2
3
+2.0 V
+29.5 V
+15.0 V
+2.5 V
+2.0 V
+29.5 V
+15.0 V
4
“
“
“
GND
+15.0 V
+2.0 V
+29.5 V
+15.0 V
“
“
“
“
“
“
“
“
“
“
GND
GND
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
Calculation = [IIO(test 40) – IIO(test 8)] / 100°C 4/
“
“
“
GND
Calculation = [VIO (E32) – VIO(E1)] / 100°C 4/
“
“
“
“
“
“
GND
1
-28.0 V
-0.5 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-2.5 V
-28.0 V
-0.5 V
-15.0 V
5
+15.0 V
+2.0 V
+29.5 V
+15.0 V
6
7
Adapter PIN numbers
TABLE III. Group A inspection for device types 04 and 05 - continued. 1/
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.5 V
+2.0 V
+29.5 V
+15.0 V
8
9
10
-13.0 V
+14.5 V
GND
-13.0 V
+14.5 V
GND
GND
-13.0 V
+14.5 V
GND
-13.0 V
+14.5 V
GND
GND
-13.0 V
+14.5 V
GND
11
“
“
“
“
“
+20.0 V
“
“
“
+20.0 V
“
“
“
“
“
“
+20.0 V
12
MIL-M-38510/103H
53
-IIB
+IIB
∆IIO/∆T 4/
IIO(R)
IIO
∆VIO/∆T 4/
VIO(R)
VIO
Symbol
no.
-883
41
42
43
44
45
46
47
48
49
50
“
“
“
“
“
“
“
“
“
“
38
“
40
37
“
“
36
“
39
35
“
“
34
33
“
“
32
4001
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = +125°C
2
Subgroup
“
“
“
“
“
-20.0V
“
“
“
-20.0 V
“
“
“
“
“
“
-20.0 V
13
14
numbers
Adapter pin
2,3,4,5
2,3,4,5
2,3,4,5
1,3,4,5
1,3,4,5
1,3,4,5
3,4,5,8,9,10
3,4,5
3,4,5
3,4,5
1,2,3,4,5,8,9,10
1,2,3,4,5,8,9,10
1,2,3,4,5,8,9,10
1,2,3,4,5
1,2,3,4,5
1,2,3,4,5
1,2,3,4,5
energized
Relays
“
“
“
14
“
“
“
14
“
“
“
“
“
“
14
No.
E50
E49
E48
E47
E46
E45
E43
E42
E41
E40
E38
E37
E36
E35
E34
E33
E32
Value
Pin measured
“
“
“
“
“
V
“
“
“
V
“
“
“
“
“
“
V
Unit
-IIB = 20 (E50 – E34)
-IIB = 20 (E49 – E33)
-IIB = 20 (E48 – E32)
+IIB = 20 (E34 – E47)
+IIB = 20 (E33 – E46)
+IIB = 20 (E32 – E45)
IIO(R) = 20(E43 – E35)
IIO = 20 (E42 – E34)
IIO = 20 (E41 – E33)
IIO = 20 (E40 – E32)
VIO(R) = E38
VIO(R) = E37
VIO(R) = E36
VIO = E35
VIO = E34
VIO = E33
VIO = E32
Equation
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
-150
-150
-100
-150
-150
-100
-100
-25.0
“
“
-10.0
-25.0
“
“
-4.5
“
“
“
-4
Min
“
“
“
“
“
+0.1
+100
+25.0
“
“
+10.0
+25.0
“
“
+4.5
“
“
“
+4
Max
Limits
“
“
“
“
“
nA
pA/°C
“
“
“
nA
µV/°C
“
“
“
“
“
“
mV
Unit
MIL-M-38510/103H
54
IOS 3/
-ICC
+ICC
II2
II1
ICEX
VOL4 2/
VOL3 2/
VOL2 2/
VOL1 2/
CMRR
VO(STB)
Symbol
54
55
56
57
58
59
60
61
62
“
“
3009
4001
4001
3005
3005
3011
53
52
“
3007
4003
4001
51
no.
-883
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = +125°C
2
Subgroup
+15.0 V
2
3
+15.0 V
4
“
“
GND
-17.0 V
+12.O V
GND
-14.0 V
+13.0 V
+3.0 V
+0.5 V
+0.1 V
GND
GND
+12.0 V
-17.0 V
GND
-14.0 V
+13.0 V
+3.0 V
+0.5 V
+10.0 V
+10.0 V
-5 V
-9.0 V
+18.0 V
+9.0 V
+6.5 V
“
“
+15.0 V
“
“
+18.0 V
+15.0 V
+15.0 V
+4.5 V
+4.5 V
3
Calculation = 20 log [27.5 x 10 / (E34 – E33)]
GND
1
“
“
-15.0 V
“
“
-18.0 V
-15.0 V
-15.0 V
GND
GND
-15.0 V
5
-3 mA
6
+5.0 V
+32.0 V
50 mA
50 mA
8 mA
8 mA
7
Adapter PIN numbers
TABLE III. Group A inspection for device types 04 and 05 - continued. 1/
“
“
“
“
“
“
“
“
“
GND
+15.0 V
8
9
“
“
“
“
“
“
“
“
“
GND
10
11
12
MIL-M-38510/103H
55
IOS 3/
-ICC
+ICC
II2
II1
ICEX
VOL4 2/
VOL3 2/
VOL2 2/
VOL1 2/
CMRR
VO(STB)
Symbol
53
54
55
56
57
58
59
60
61
62
“
“
“
3009
4001
4001
3005
3005
3011
52
3007
4003
4001
51
no.
-883
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = +125°C
2
Subgroup
13
14
numbers
Adapter pin
1,2
1,2
1,2
1,2,12
1,2,12
1,2
1,2,12
1,2,12
1,2,12
1,2,12
1,2,4,5,10
energized
Relays
7
5
4
2
1
7
“
“
“
7
7
No.
I62
I61
I60
I59
I58
I57
E56
E55
E54
E53
E51
Value
Pin measured
“
“
mA
“
“
nA
“
“
“
V
V
Unit
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
IOS = I62
-ICC = I61
+ICC = I60
II2 = I59
II1 = I58
ICEX = I57
VOL4 = E56
VOL3 = E55
VOL2 = E54
VOL1 = E53
VO(STB) = E51
Equation
-5.0
-5
-5
-1
+80
+14
Min
+150
+6.0
“
“
+500
+1.5
+1.5
+0.4
+0.4
Max
Limits
“
“
mA
“
“
nA
“
“
“
V
dB
V
Unit
MIL-M-38510/103H
56
-IIB
+IIB
∆IIO/∆T
IIO(R)
IIO
∆VIO/∆T
VIO(R)
VIO
Symbol
no.
-883
72
73
74
75
76
77
78
79
80
81
“
“
“
“
“
“
“
“
“
“
69
“
71
68
“
“
67
“
70
66
“
“
65
64
“
“
63
4001
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = -55°C
3
Subgroup
“
“
“
“
“
“
GND
2
3
+2.0 V
+29.5 V
+15.0 V
+2.5 V
+2.0 V
+29.5 V
+15.0 V
4
“
“
“
GND
+15.0 V
+2.0 V
+29.5 V
+15.0 V
“
“
“
“
“
“
“
“
“
“
GND
GND
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
Calculation = [IIO(test 71) – IIO(test 8)] / 80°C 4/
“
“
“
GND
Calculation = [VIO (E63) – VIO(E1)] / 80°C 4/
“
“
“
“
“
“
GND
1
-28.0 V
-0.5 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-28.0 V
-0.5 V
-15.0 V
-2.5 V
-28.0 V
-0.5 V
-15.0 V
5
+15.0 V
+2.0 V
+29.5 V
+15.0 V
6
7
Adapter PIN numbers
TABLE III. Group A inspection for device types 04 and 05 - continued. 1/
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.0 V
+29.5 V
+15.0 V
+2.5 V
+2.0 V
+29.5 V
+15.0 V
8
9
10
-13.0 V
+14.5 V
GND
-13.0 V
+14.5 V
GND
GND
-13.0 V
+14.5 V
GND
-13.0 V
+14.5 V
GND
GND
-13.0 V
+14.5 V
GND
11
“
“
“
“
“
+20.0 V
“
“
“
+20.0 V
“
“
“
“
“
“
+20.0 V
12
MIL-M-38510/103H
57
-IIB
+IIB
∆IIO/∆T 4/
IIO
∆VIO/∆T 4/
VIO(R)
VIO
Symbol
no.
-883
72
73
74
75
76
77
78
79
80
81
“
“
“
“
“
“
“
“
“
“
69
“
71
68
“
“
67
“
70
66
“
“
65
64
“
“
63
4001
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = -55°C
3
Subgroup
“
“
“
“
“
-20.0V
“
“
“
-20.0 V
“
“
“
“
“
“
-20.0 V
13
14
numbers
Adapter pin
2,3,4,5
2,3,4,5
2,3,4,5
1,3,4,5
1,3,4,5
1,3,4,5
3,4,5,8,9,10
3,4,5
3,4,5
3,4,5
1,2,3,4,5,8,9,10
1,2,3,4,5,8,9,10
1,2,3,4,5,8,9,10
1,2,3,4,5
1,2,3,4,5
1,2,3,4,5
1,2,3,4,5
energized
Relays
“
“
“
14
“
“
“
14
“
“
“
“
“
“
14
No.
E81
E80
E79
E78
E77
E76
E74
E73
E72
E71
E69
E68
E67
E66
E65
E64
E63
Value
Pin measured
“
“
“
“
“
V
“
“
“
V
“
“
“
“
“
“
V
Unit
-IIB = 20 (E81 – E65)
-IIB = 20 (E80 – E64)
-IIB = 20 (E79 – E63)
+IIB = 20 (E65 – E78)
+IIB = 20 (E64 – E77)
+IIB = 20 (E63 – E76)
IIO(R) = 20(E74 – E67)
IIO = 20 (E73 – E65)
IIO = 20 (E72 – E64)
IIO = 20 (E71 – E63)
VIO(R) = E69
VIO(R) = E68
VIO(R) = E67
VIO = E66
VIO = E65
VIO = E64
VIO = E63
Equation
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
-200
-200
-150
-200
-200
-150
-200
-50.0
“
“
-20.0
-25.0
“
“
-4.5
“
“
“
-4
Min
“
“
“
“
“
+0.1
+200
+50.0
“
“
+20.0
+25.0
“
“
+4.5
“
“
“
+4
Max
Limits
“
“
“
“
“
nA
pA/°C
“
“
“
nA
µV/°C
“
“
“
“
“
“
mV
Unit
MIL-M-38510/103H
58
IOS 3/
-ICC
+ICC
II2
II1
VOL4 2/
VOL3 2/
VOL2 2/
VOL1 2/
CMRR
VO(STB)
Symbol
85
86
87
88
89
90
91
92
“
“
4001
4001
3005
3005
3011
84
83
“
3007
4003
4001
82
no.
-883
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = -55°C
3
Subgroup
+15.0 V
2
3
+15.0 V
4
“
“
GND
-17.0 V
+12.O V
-14.0 V
+13.0 V
+3.0 V
+0.5 V
+0.1 V
GND
GND
+12.0 V
-17.0 V
-14.0 V
+13.0 V
+3.0 V
+0.5 V
+10.0 V
+10.0 V
-9.0 V
+18.0 V
+9.0 V
+6.5 V
“
“
+15.0 V
+18.0 V
+18.0 V
+15.0 V
+15.0 V
+4.5 V
+4.5 V
3
Calculation = 20 log [27.5 x 10 / (E65 – E64)]
GND
1
“
“
-15.0 V
-18.0 V
-18.0 V
-15.0 V
-15.0 V
GND
GND
-15.0 V
5
-2 mA
6
+5.0 V
50 mA
50 mA
8 mA
8 mA
7
Adapter PIN numbers
TABLE III. Group A inspection for device types 04 and 05 - continued. 1/
“
“
“
“
“
“
“
“
GND
+15.0 V
8
9
“
“
“
“
“
“
“
“
GND
10
11
12
MIL-M-38510/103H
59
IOS 3/
-ICC
+ICC
II2
II1
VOL4 2/
VOL3 2/
VOL2 2/
VOL1 2/
CMRR
VO(STB)
Symbol
85
86
87
88
89
90
91
92
“
“
4001
4001
3005
3005
3011
84
83
“
3007
4003
4001
82
no.
-883
method
Test
MIL-STD
See footnotes at end of device types 04 and 05.
(figure 2)
TA = -55°C
3
Subgroup
13
14
numbers
Adapter pin
1,2
1,2
1,2
1,2,12
1,2,12
1,2,12
1,2,12
1,2,12
1,2,12
1,2,4,5,10
energized
Relays
7
5
4
2
1
“
“
“
7
7
No.
I92
I91
I90
I89
I88
E87
E86
E85
E84
E82
Value
Pin measured
“
“
mA
nA
nA
“
“
“
V
V
Unit
IOS = I92
-ICC = I91
+ICC = I90
II2 = I89
II1 = I88
VOL4 = E87
VOL3 = E86
VOL2 = E85
VOL1 = E84
VO(STB) = E82
Equation
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
-6.0
-5
-5
+80
+14
Min
+250
+7.0
+500
+500
+1.5
+1.5
+0.4
+0.4
Max
Limits
“
“
mA
nA
nA
“
“
“
V
dB
V
Unit
MIL-M-38510/103H
60
no.
-883
“
“
“
98
97
96
95
94
“
“
93
4004
method
Test
MIL-STD
“
“
“
“
“
GND
1
“
“
“
“
“
GND
2
3
“
“
“
“
“
+15.0 V
4
“
“
“
“
“
-15.0 V
5
6
“
“
“
“
“
+15.0 V
7
Adapter PIN numbers
tRLHC
tRHLC
tRLHC
tRHLC
tRLHC
107
106
105
104
103
These tests shall be performed using test conditions and procedures listed on figure 5.
These tests shall be performed using test conditions and procedures listed on figure 5.
(Tests 99 – 101) Same tests, terminal conditions, equations, and limits as subgroup 5 except TA = -55°C.
4001
102
These tests shall be performed using test conditions and procedures listed on figure 5.
tRHLC
AVE-
AVE+
AVE(REF)
AVE-
AVE+
AVE(REF)
Symbol
See footnotes at end of device types 04 and 05.
TA = -55°C
8
TA = +125°C
8
TA = +25°C
7
6
(figure 2)
TA = +125°C
5
(figure 2)
TA = +25°C
4
Subgroup
TABLE III. Group A inspection for device types 04 and 05 - continued. 1/
8
-10.0 V
+10.0 V
GND
-10.0 V
+10.0 V
GND
9
10
11
“
“
“
“
“
+20.0 V
12
MIL-M-38510/103H
61
98
97
“
“
96
“
95
94
“
“
93
4004
“
“
“
“
“
-20.0 V
13
14
numbers
Adapter pin
1,2,3,5,7
1,2,3,5,7
1,2,3,5,7
1,2,3,5,7
1,2,3,5,7
1,2,3,5,7
energized
Relays
“
“
“
“
“
14
No.
E98
E97
E96
E95
E94
E93
Value
Pin measured
tRLHC
tRHLC
tRLHC
tRHLC
tRLHC
300
300
300
300
106
107
640
+8.0
+8.0
+10.0
+10.0
Max
105
AVE- = 10/(E96 – E98)
AVE+ = 10/(E97 – E96)
AVE- = 10/(E93 – E95)
AVE+ = 10/(E94 – E93)
Min
2/ VOL1 and VOL2 use VID = -6 mV; VOL3, VOL4 use VID = -5 mV.
∆ Represents delta.
4/ Test numbers 39, 44, 70, and 75, which require read and record measurements plus a calculation, may be omitted except when subgroups 2 and 3 are being performed for
group A sampling inspections and group C and D end points.
3/ Maximum test duration shall be 10 ms.
Limits
500
“
“
“
“
“
V
Unit
Equation
104
103
(Tests 99 – 101) Same tests, terminal conditions, equations, and limits as subgroup 5 except TA = -55°C
4001
102
tRHLC
AVE-
AVE+
AVE(REF)
AVE-
AVE+
AVE(REF)
no.
-883
method
Test
MIL-STD
1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan.
TA = -55°C
8
TA = +125°C
8
TA = +25°C
7
6
(figure 2)
TA = +125°C
5
(figure 2)
TA = +25°C
4
Subgroup
TABLE III. Group A inspection for device types 04 and 05 – continued. 1/
“
“
“
“
“
ns
“
“
“
V/mV
Unit
MIL-M-38510/103H
(figure 2)
TA = +25°C
1
Subgroup
62
-ICC
+ICC
ICEX
VOL4
VOL3
VOL2
VOL1
CMRR
-IIB
+IIB
IIO
VIO
Symbol
3V
13
3V
27 V
15 V
3V
27 V
15 V
3V
27 V
15 V
2.5 V
3V
27 V
15 V
-27 V
-3 V
-15 V
-27 V
-3 V
-15 V
-27 V
-3 V
-15 V
-2.5 V
-27 V
-3 V
-15 V
-12 V
12 V
0V
-12 V
12 V
0V
-12 V
12 V
0V
-2.5 V
-12 V
12 V
0V
3.5 V
2.25 V
27 V
3V
18 V
15 V
15 V
15
16
17
18
19
20
21
-15 V
-15 V
-18 V
-27 V
-3 V
-2.25 V
-1 V
-12 V
12 V
-2.25 V
-1 V
3
Calculation = 20 log [24 x 10 / |E3 - E2|]
27 V
12
14
15 V
15 V
8
11
3V
7
3V
27 V
6
10
15 V
5
27 V
2.5 V
4
9
3V
27 V
2
3
15 V
1
3
5
10.6 V
-13.4 V
-1.4 V
10.6 V
-13.4 V
-1.4 V
10.6 V
-13.4 V
-1.4 V
1.1 V
10.6 V
-13.4 V
-1.4 V
4
2
No.
1
Adapter PIN numbers
Test
18 V
25 mA
25 mA
3.2 mA
3.2 mA
6
“
7V
-7 V
“
“
“
7V
7
“
“
“
5
“
“
1,3,4,5
“
“
2,3,4,5
“
“
1,2,3,4,5
“
“
“
3,4,5
energized
Relays
3
1
6
“
“
“
8 to 9
“
“
“
“
“
“
“
“
“
“
“
“
10
Pin
I3
I2
I1
E17
E16
E15
E14
E13
E12
E11
E10
E9
E8
E7
E6
E5
E4
E3
E2
E1
Value
mA
mA
µA
“
“
“
V
“
“
“
“
“
“
“
“
“
“
“
“
V
Unit
Measurement
TABLE III. Group A inspection for device types 06 and 07 . 1/
-ICC = I3
+ICC = I2
ICEX = I1
VOL4 = E17
VOL3 = E16
VOL2 = E15
VOL1 = E14
-IIB = 20 (E13 – E3)
-IIB = 20 (E12 – E2)
-IIB = 20 (E11 – E1)
+IIB = 20 (E3 – E10)
+IIB = 20 (E2 – E9)
+IIB = 20 (E1 – E8)
IIO = 20 (E7 – E3)
IIO = 20 (E6 – E2)
IIO = 20 (E5 – E1)
VIO = E4
VIO = E3
VIO = E2
VIO = E1
Equation
-5.0
-1.0
90
“
“
“
“
“
-0.1
“
“
-75
“
“
“
-4.0
Min
+10.0
+2.0
+1.5
+1.5
+0.4
+0.4
+750
+750
+500
+750
+750
+500
“
“
+75
“
“
“
+4.0
Max
Limit 06
mA
mA
µA
“
“
“
V
dB
“
“
“
“
“
“
“
“
nA
“
“
“
mV
Unit
-5.0
-1.0
90
“
“
“
“
“
-0.1
“
“
-40
“
“
“
-1
Min
+10.0
+2.0
+1.5
+1.5
+0.4
+0.4
+750
+750
+500
+750
+750
+500
“
“
+40
“
“
“
+1
Max
Limit 07
mA
mA
µA
“
“
“
V
dB
“
“
“
“
“
“
“
“
nA
“
“
“
mV
Unit
MIL-M-38510/103H
(figure 2)
TA = +125°C
2
Subgroup
63
-ICC
+ICC
ICEX
VOL4
VOL3
VOL2
VOL1
CMRR
-IIB
+IIB
IIO
VIO
Symbol
3V
34
3V
27 V
15 V
3V
27 V
15 V
3V
27 V
15 V
2.5 V
3V
27 V
15 V
-27 V
-3 V
-15 V
-27 V
-3 V
-15 V
-27 V
-3 V
-15 V
-2.5 V
-27 V
-3 V
-15 V
-12 V
12 V
0V
-12 V
12 V
0V
-12 V
12 V
0V
-2.5 V
-12 V
12 V
0V
3.5 V
2.25 V
27 V
3V
18 V
15 V
15 V
36
37
38
39
40
41
42
-15 V
-15 V
-18 V
-27 V
-3 V
-2.25 V
-1 V
-12 V
12 V
-2.25 V
-1 V
3
Calculation = 20 log [24 x 10 / |E24 – E23|]
27 V
33
35
15 V
15 V
29
32
3V
28
3V
27 V
27
31
15 V
26
27 V
2.5 V
25
30
3V
27 V
23
24
15 V
22
3
5
10.6 V
-13.4 V
-1.4 V
10.6 V
-13.4 V
-1.4 V
10.6 V
-13.4 V
-1.4 V
1.1 V
10.6 V
-13.4 V
-1.4 V
4
2
No.
1
Adapter PIN numbers
Test
18 V
25 mA
25 mA
3.2 mA
3.2 mA
6
“
7V
-7 V
“
“
“
7V
7
“
“
“
5
“
“
1,3,4,5
“
“
2,3,4,5
“
“
1,2,3,4,5
“
“
“
3,4,5
energized
Relays
3
1
6
“
“
“
8 to 9
“
“
“
“
“
“
“
“
“
“
“
“
10
Pin
I6
I5
I4
E34
E33
E32
E31
E30
E29
E28
E27
E26
E25
E24
E23
E22
E21
E20
E19
E18
Value
mA
mA
µA
“
“
“
V
“
“
“
“
“
“
“
“
“
“
“
“
V
Unit
Measurement
TABLE III. Group A inspection for device types 06 and 07 – continued. 1/
-ICC = I6
+ICC = I5
ICEX = I4
VOL4 = E34
VOL3 = E33
VOL2 = E32
VOL1 = E31
-IIB = 20 (E30 – E20)
-IIB = 20 (E29 – E19)
-IIB = 20 (E28 – E18)
+IIB = 20 (E20 – E27)
+IIB = 20 (E19 – E26)
+IIB = 20 (E18 – E25)
IIO = 20 (E24 – E20)
IIO = 20 (E23 – E19)
IIO = 20 (E22 – E18)
VIO = E21
VIO = E20
VIO = E19
VIO = E18
Equation
-4.5
-1.0
90
“
“
“
“
“
-0.1
“
“
-75
“
“
“
-7.0
Min
+10.0
+10.0
+1.5
+1.5
+0.4
+0.4
+750
+750
+500
+750
+750
+500
“
“
+75
“
“
“
+7.0
Max
Limit 06
mA
mA
µA
“
“
“
V
dB
“
“
“
“
“
“
“
“
nA
“
“
“
mV
Unit
-4.5
-1.0
90
“
“
“
“
“
-0.1
“
“
-40
“
“
“
-2.0
Min
+10.0
+10.0
+1.5
+1.5
+0.4
+0.4
+750
+750
+500
+750
+750
+500
“
“
+40
“
“
“
+2.0
Max
Limit 07
mA
mA
µA
“
“
“
V
dB
“
“
“
“
“
“
“
“
nA
“
“
“
mV
Unit
MIL-M-38510/103H
(figure 3)
TA = -55°C
3
Subgroup
64
-ICC
+ICC
VOL4
VOL3
VOL2
VOL1
CMRR
-IIB
+IIB
IIO
VIO
Symbol
27 V
3V
54
55
3V
27 V
15 V
3V
27 V
15 V
3V
27 V
15 V
2.5 V
3V
27 V
15 V
-27 V
-3 V
-15 V
-27 V
-3 V
-15 V
-27 V
-3 V
-15 V
-2.5 V
-27 V
-3 V
-15 V
-12 V
12 V
0V
-12 V
12 V
0V
-12 V
12 V
0V
-2.5 V
-12 V
12 V
0V
3.5 V
2.25 V
27 V
3V
15 V
15 V
57
58
59
60
61
62
-15 V
-15 V
-27 V
-3 V
-2.25 V
-1 V
-12 V
12 V
-2.25 V
-1 V
3
Calculation = 20 log [24 x 10 / |E37 – E36|]
15 V
53
56
3V
52
3V
49
27 V
27 V
48
51
15 V
47
15 V
2.5 V
46
50
3V
27 V
44
45
15 V
43
3
5
10.6 V
-13.4 V
-1.4 V
10.6 V
-13.4 V
-1.4 V
10.6 V
-13.4 V
-1.4 V
1.1 V
10.6 V
-13.4 V
-1.4 V
4
2
No.
1
Adapter PIN numbers
Test
25 mA
25 mA
3.2 mA
3.2 mA
6
“
“
“
“
“
7V
7V
7
“
“
“
5
“
“
1,3,4,5
“
“
2,3,4,5
“
“
1,2,3,4,5
“
“
“
3,4,5
energized
Relays
3
1
“
“
“
8 to 9
“
“
“
“
“
“
“
“
“
“
“
“
10
Pin
I8
I7
E51
E50
E49
E48
E47
E46
E45
E44
E43
E42
E41
E40
E39
E38
E37
E36
E35
Value
mA
mA
“
“
“
V
“
“
“
“
“
“
“
“
“
“
“
“
V
Unit
Measurement
TABLE III. Group A inspection for device types 06 and 07 – continued. 1/
-ICC = I8
+ICC = I7
VOL4 = E51
VOL3 = E50
VOL2 = E49
VOL1 = E48
-IIB = 20 (E47 – E37)
-IIB = 20 (E46 – E36)
-IIB = 20 (E45 – E35)
+IIB = 20 (E37 – E44)
+IIB = 20 (E36 – E43)
+IIB = 20 (E35 – E42)
IIO = 20 (E41 – E37)
IIO = 20 (E40 – E36)
IIO = 20 (E39 – E35)
VIO = E38
VIO = E37
VIO = E36
VIO = E35
Equation
-6.0
90
“
“
“
“
“
-0.1
“
“
-100
“
“
“
-7.0
Min
+11.5
+1.5
+1.5
+0.6
+0.6
“
“
“
“
“
+1000
“
“
+100
“
“
“
+7.0
Max
Limit 06
mA
mA
“
“
“
V
dB
“
“
“
“
“
“
“
“
nA
“
“
“
mV
Unit
-6.0
90
“
“
“
“
“
-0.1
“
“
-75
“
“
“
-2.0
Min
+11.5
+1.5
+1.5
+0.6
+0.6
“
“
“
“
“
+1000
“
“
+75
“
“
“
+2.0
Max
Limit 07
mA
mA
“
“
“
V
dB
“
“
“
“
“
“
“
“
nA
“
“
“
mV
Unit
MIL-M-38510/103H
65
TA = -55°C
(figure 2)
6
TA = +125°C
(figure 2)
5
TA = +25°C
(figure 2)
4
Subgroup
AV
Symbol
65
64
63
15 V
15 V
15 V
15 V
15 V
15 V
15 V
15 V
15 V
15 V
15 V
15 V
-15 V
-15 V
-15 V
-15 V
-15 V
-15 V
3
5
-11.5 V
-1.5 V
-11.5 V
-1.5 V
-11.5 V
-1.5 V
4
2
No.
1
Adapter PIN numbers
Test
6
7
“
3,4
“
3,4
“
3,4
energized
Relays
“
“
“
“
“
10
Pin
E54
EC
E53
EB
E52
EA
Value
“
“
“
“
“
V
Unit
Measurement
TABLE III. Group A inspection for device types 06 and 07 – continued. 1/
AV = 10 / (EC – E54)
AV = 10 / (EB – E53)
AV = 10 / (EA – E52)
Equation
+5
+5
+10
Min
Max
Limit 06
V/mV
V/mV
V/mV
Unit
+10
+10
+20
Min
Max
Limit 07
V/mV
V/mV
V/mV
Unit
MIL-M-38510/103H
Null
(figure 6)
66
“
Apply
100 mV
“
“
Open k1
Close k2
67
“
Change
5 mV OD
tRHLC
“
“
Reset
tRLHC
“
Apply
100 mV
“
“
“
15 V
1
“
66
No.
Test
Close k1
Apply
5 mV OD
VIO
Release
k31, k4
VIO
Symbol
TA = +25°C
9
Subgroup
“
“
“
“
“
“
“
“
“
“
“
-15 V
2
“
“
“
“
“
“
“
“
“
“
“
1.4 V
3
“
“
“
“
“
“
“
“
“
E0
4
“
“
“
5V
“
“
“
“
-5 V
“
“
0V
5
Adapter PIN numbers
2 mA
2 mA
“
“
0V
2 mA
2 mA
“
“
“
“
0V
6
0V
“
“
“
5V
0V
5V
“
“
“
“
5V
7
2
2
2
1
1
1
1
1
3,4
energized
Relays
Counter pulse
width
Counter pulse
width
8
Pin
t2
t1
E0
Value
Measurement
TABLE III. Group A inspection for device types 06 and 07 – continued. 1/
ns
ns
V
Unit
t2 = tRHLC
t1 = tRLHC
Equation
Min
160
125
Max
Limits
ns
ns
Unit
MIL-M-38510/103H
Null
(figure 6)
67
“
Apply
100 mV
“
“
Open k1
Close k2
69
“
Change
5 mV OD
tRHLC
“
“
Reset
tRLHC
“
Apply
100 mV
“
“
“
15 V
1
“
68
No.
Test
Close k1
Apply
5 mV OD
VIO
Release
k3, k4
VIO
Symbol
TA = +125°C
10
Subgroup
“
“
“
“
“
-15 V
“
“
15 V
“
“
-15 V
2
“
“
“
“
“
“
“
“
“
“
“
1.4 V
3
“
“
“
“
“
“
“
“
“
E0
E0
4
“
“
“
5V
“
“
“
“
-5 V
“
“
0V
5
Adapter PIN numbers
2 mA
2 mA
“
“
0V
2 mA
2 mA
“
“
“
“
0V
6
0V
“
“
“
5V
0V
“
“
“
“
“
5V
7
2
2
2
1
1
1
1
1
3,4
energized
Relays
Counter pulse
width
Counter pulse
width
8
Pin
t4
t3
E0
Value
Measurement
TABLE III. Group A inspection for device types 06 and 07 – continued. 1/
ns
ns
V
Unit
t4 = tRHLC
t3 = tRLHC
Equation
Min
160
160
Max
Limits
ns
ns
Unit
MIL-M-38510/103H
Null
(figure 6)
68
“
“
Open k1
Close k2
Apply
100 mV
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
1.4 V
3
“
“
“
“
“
“
“
“
“
E0
4
“
“
“
5V
“
“
“
“
-5 V
“
“
0V
5
Adapter PIN numbers
2 mA
2 mA
“
“
0V
2 mA
2 mA
“
“
“
“
0V
6
0V
“
“
“
5V
0V
“
“
“
“
“
5V
7
2
2
2
1
1
1
1
1
3,4
energized
Relays
Counter pulse
width
Counter pulse
width
8
Pin
t6
t5
E0
Value
Measurement
ns
ns
V
Unit
t6 = tRHLC
t5 = tRLHC
Equation
Min
160
125
Max
Limits
1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s
QM plan.
“
“
Change
5 mV OD
tRHLC
“
Reset
71
“
“
tRLHC
“
“
Apply
100 mV
“
“
“
“
“
-15 V
2
Close k1
“
“
15 V
1
“
70
No.
Test
Apply
5 mV OD
VIO
Release
k3, k4
VIO
Symbol
TA = -55°C
11
Subgroup
TABLE III. Group A inspection for device types 06 and 07 – continued. 1/
ns
ns
Unit
MIL-M-38510/103H
69
Max
+2 mV
20 µA
20 µA
---
Min
-2 mV
0 µA
0 µA
---
Limits
---
±2 µA
±2 µA
±0.5 mV
Delta
---
0 µA
0 µA
-3.5 mV
Min
Max
---
75 µA
75 µA
+3.5 mV
Limits
---
±7.5 µA
±7.5 µA
±0.5 mV
Delta
Device type 02
+VCC = +12 V, -VCC = -6 V
Device types 01 and 03
+VCC = +12 V, -VCC = -6 V
Device types 04 and 05
-1
-100 nA
-100 nA
-3 mV
Min
Limits
10 nA
±0.1 nA
±0.1 nA
+3 mV
Max
-0.1 nA
---
±5 nA
-0.1 nA
-4 mA
Min
±12.5 nA
±12.5 nA
±0.5 mV
Delta
+VCC = +15 V, -VCC = -15 V
Delta
---
500 nA
500 nA
+4 mA
Max
---
±50 nA
±50 nA
±1 mV
4/ ICEX deltas and limits apply to test 26 in table III.
For device types 06 and 07, -IIB deltas and limits apply to tests 11, 12, and 13 in table III.
3/ For device types 01, 02, and 03, -IIB deltas and limits apply to test 5 in table III. For device types 04 and 05, -IIB deltas and limits apply to tests 15, 16, and 17 in table III.
For device types 06 and 07, +IIB deltas and limits apply to tests 8, 9, and 10 in table III.
2/ For device types 01, 02, and 03, +IIB deltas and limits apply to test 4 in table III. For device types 04 and 05, +IIB deltas and limits apply to tests 12, 13, and 14 in table III.
For device types 06 and 07, VIO deltas and limits apply to tests 1, 2, and 3 in table III.
Min
---
-0.1 nA
-0.1 nA
-1 mV
+1 mV
Max
---
+500 nA
+500 nA
Limits
±VCC = ±15 V
±VCC = ±15 V
Limits
Device type 07
Device type 06
1/ For device types 01, 02, and 03, VIO deltas and limits apply to tests 1 and 2 in table III. For device types 04 and 05, VIO deltas and limits apply to tests 1, 2, and 3 in table III.
ICEX 4/
-IIB
+IIB
VIO
Test
TABLE IV. Group C end-point electrical parameters. (TA = +25°C) 1/ 2/ 3/
---
±50 nA
±50 nA
±0.5 mV
Delta
MIL-M-38510/103H
MIL-M-38510/103H
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a.
Tests shall be as specified in table II herein.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:
a.
End point electrical parameters shall be as specified in table II herein.
b.
The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall
be maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request.
The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with
the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical
parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows.
4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced to
the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into
the referenced terminal.
4.5.2 Burn-in and life test cooldown procedure. When devices are measured at +25°C following application of the steady
state life or burn-in condition, they shall be cooled to within 10°C of their power stable condition at room temperature prior to
removal of the bias.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2).
When packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging
activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point’s
packaging activity within the Military Department or Defense Agency, or within the Military Department’s System Command.
Packaging data retrieval is available from the managing Military Department’s or Defense Agency’s automated packaging files,
CD-ROM products, or by contacting the responsible packaging activity.
70
MIL-M-38510/103H
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and
logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
PIN and compliance identifier, if applicable (see 1.2).
c.
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to acquiring activity in addition to
notification of the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003),
corrective action and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. Unless otherwise specified,
these requirements will not apply to direct purchase by or direct shipment to the Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in
this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this
specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid
adversely impacting existing government logistics systems and contractor's parts lists.
71
MIL-M-38510/103H
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the
time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have
actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are
urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that
they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43128-3990.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535, MIL-STD-1331 and as follows:
6.5.1 Logic threshold voltage. The approximate voltage at the output of the comparator at which the loading logic circuitry
changes its digital state.
6.5.2 Voltage gain. The ratio of the change in output voltage to the change in voltage between the input terminals
producing it with the dc output level in the vicinity of the logic threshold voltage (AV).
6.5.3 Response time. The interval between the application of an input step function and the time when the output
crosses the logic threshold voltage. The input step drives the comparator from some initial, saturated input voltage to
an input level just barely in excess of that required to bring the output from saturation to the logic threshold voltage.
This excess is referred to as the voltage overdrive.
6.5.4 Positive output level. The dc output voltage in the positive direction with the input voltage equal to or greater
than a minimum specified amount.
6.5.5 Negative output level. The dc output voltage in the negative direction with the input voltage equal to or greater
than a minimum specified amount.
6.5.6 Output sink current. The maximum negative current that can be delivered by the comparator (IOL).
6.5.7 Peak output current. The maximum current that may flow into the output load without causing damage to the
comparator.
6.5.8 Differential input voltage. The difference between the two voltages applied to the input terminals of an
amplifier. The difference is considered positive when the noninverting input is positive with respect to the inverting input and
negative when the inverting input is positive with respect to the noninverting input (VID).
6.5.9 Strobe current. The current into the strobe terminal of an amplifier (ISTB).
6.5.10
Output leakage current. The current into the output of an amplifier with the output at high level (IO).
6.5.11
Ground leakage current. The current into the ground terminal of an amplifier with the output at high level (IG).
6.5.12
Input leakage current. The current into the input terminal of an amplifier with the output at a specified voltage (II).
72
MIL-M-38510/103H
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits
acquired to Government logistic support should be acquired to device class B (see 1.2.2), and lead material and finish A (see
3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered
by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have
equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M38510 device types and may have slight physical variations in relation to case size. The presence of this information should not
be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of
MIL-PRF-38535.
Military device type
01
02
03
04
05
06
07
Generic-industry type
710
711
LM106
LM111
LH2111
LM119
LT119A
6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the
previous issue, due to the extensiveness of the changes.
Custodians:
Army – CR
Navy – EC
Air Force – 11
NASA – NA
DLA – CC
Preparing activity:
DLA - CC
Project 5962-2102
Review activities:
Army – MI, SM
Navy - AS, CG, MC, SH, TD
Air Force – 03, 19, 99
NOTE: The activities listed above were interested in this document as of this date of this document. Since organizations and
responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at
http://assist.daps.dla.mil.
73
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