INCH-POUND MIL-M-38510/103H 18 February 2005 SUPERSEDING MIL-M-38510/103G 03 November 2004 MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, VOLTAGE COMPARATORS, MONOLITHIC SILICON Reactivated after 18 February 2005 and may be used for either new or existing design acquisition. This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, voltage comparators. Two product assurance classes and a choice of case outlines and lead finish are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3). 1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types are as shown in the following: Device type 01 02 03 04 05 06 07 Circuit Single differential voltage comparator Dual channel differential voltage comparator Single differential voltage comparator / buffer Precision voltage comparator / buffer Dual precision voltage comparator / buffer 1/ Dual precision high speed voltage comparator Dual high precision, high speed voltage comparator 1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535. ______ 1/ Device type 05 may be monolithic, or it may consist of two separate, independent dice. Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43218-3990, or emailed to [email protected]. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http://assist.daps.dla.mil. AMSC N/A FSC 5962 MIL-M-38510/103H 1.2.3 Case outlines. The case outlines are designated in MIL-STD-1835 and as follows: Descriptive designator Terminals GDFP5-F14 or CDFP6-F14 GDIP1-T14 or CDIP2-T14 GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 MACY1-X8 GDFP1-F10 or CDFP2-F10 MACY1-X10 GDIP1-T8 or CDIP2-T8 CDFP4-F16 GDFP1-G10 CQCC1-N20 14 14 16 16 8 10 10 8 16 10 20 Outline letter A 2/ C E F G H I P X Z 2 Package style Flat pack Dual-in-line Dual-in-line Flat pack Can Flat pack Can Dual-in-line Flat pack Flat pack with gull wing leads Square leadless chip carrier 1.3 Absolute maximum ratings. Positive supply voltage Negative supply voltage Total supply voltage Output voltage Output to negative supply voltage Input voltage range Differential input voltage Peak output current Sink current Output short-circuit duration Strobe voltage Maximum strobe current Storage temperature range Junction temperature (TJ) 5/ Lead temperature (soldering, 60 seconds) 01 +14.0 V -7.0 V ------- 02 +14.0 V -7.0 V ------- Device types 03 04 and 05 +15.0 V +30.0 V -15.0 V -30.0 V --+36.0 V +24.0 V --+30.0 V +50.0 V 06 and 07 +18 V -25 V +36 V --+36.0 V ±7.0 V ±7.0 V ±7.0 V ±5.0 V ±5.0 V ±5.0 V 10 mA 50 mA ------100 mA 10 s 10 s 10 s --6.0 V 6.0 V -------65°C to +150°C for all device types +175°C +175°C +175°C 3/ ±30.0 V --50 mA 10 s --10 mA ±15.0 V 4/ ±5.0 V 25 mA --10 s ----- +175°C +175°C +300°C +300°C +300°C +300°C +300°C 1.4 Recommended operating conditions. Supply voltage range : 4/ Device types 01 and 02 ................................................................ +VCC = +12 V dc, -VCC = -6.0 V dc Device type 03 .............................................................................. +VCC = +12 V dc, -VCC = -3.0 to -12.0 V dc Device types 04, 05, 06, and 07 ................................................... ±VCC = ±15.0 V dc Ambient temperature range (TA) ...................................................... -55°C to +125°C ______ 2/ Inactive case outline. 3/ The positive input voltage limit is 30 V above the negative supply. The negative input voltage limit is equal to the negative supply voltage or 30 V below the positive supply, whichever is less negative. 4/ For supply voltages less than ±15.0 V dc, the input voltage rating is equal to the supply voltage. 5/ For short term test (in the specific burn-in and life test configuration when required and up to 168 hours maximum) TJ = +275°C. 2 MIL-M-38510/103H 1.5 Power and thermal characteristics. Case outlines Maximum allowable power dissipation Maximum Maximum θJC θJA A 350 mW at TA = +125°C 60°C/W 140°C/W C, E, and P 400 mW at TA = +125°C 35°C/W 120°C/W G 330 mW at TA = +125°C 40°C/W 150°C/W I 350 mW at TA = +125°C 40°C/W 140°C/W H 330 mW at TA = +125°C 60°C/W 150°C/W F 350 mW at TA = +125°C 60°C/W 140°C/W X 200 mW at TA = +125°C 35°C/W 140°C/W Z 330 mW at TA = +125°C 21°C/W 225°C/W still air 142°C/W 500 LFPM 2 55°C/W 199 mW at TA = +125°C 121°C/W 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard for Microelectronics. - Interface Standard Electronic Component Case Outlines. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3 MIL-M-38510/103H 3. REQUIREMENTS 3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4). 3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. 3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity (DSCC-VA) upon request. 3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3. 3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6). 3.5 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as specified in table I and apply over the full operating ambient temperature range of -55°C to +125°C. 3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535. 3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III. 3.8 Marking. Marking shall be in accordance with MIL-PRF-38535. 3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 50 (see MIL-PRF-38535, appendix A). 4 MIL-M-38510/103H TABLE I. Electrical performance characteristics. Test Input offset voltage Symbol VIO Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified VOUT = 1.4 V, Temperature TA = +25°C RS = 200 Ω and 50 Ω VOUT = 1.0 V, TA = +125°C RS = 200 Ω and 50 Ω VOUT = 1.8 V, TA = -55°C RS = 200 Ω and 50 Ω VOUT = 1.5 V, TA = +25°C RS = 200 Ω and 50 Ω -55°C ≤ TA ≤ +125°C VIC = 0 V, 13 V and 3/ TA = +25°C Device type Limits Unit Min Max 01 -2 +2 02 -3.5 +3.5 01 -3 +3 02 -4.5 +4.5 01 -3 +3 02 -4.5 +4.5 03 -2 +2 -3 +3 -3 +3 04,05 -14.5 V, RS = 50 Ω, -55°C ≤ TA ≤ +125°C -4 +4 ±VCC = ±2.5 V, TA = +25°C -3 +3 RS = 50 Ω, VIC = 0 V -55°C ≤ TA ≤ +125°C -4 +4 -4 +4 -7 +7 -1 +1 -2 +2 VIC = 0 V, +12 V, and 3/ TA = +25°C 06 -12 V, RS = 50 Ω TA = -55°C, +125°C TA = +25°C TA = -55°C, +125°C See footnotes at end of table. 5 07 mV MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Symbol Input offset voltage VIO Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified Temperature +VCC = 5 V, -VCC = 0 V TA = +25°C RS = 50 Ω, VIC = 2.5 V TA = -55°C, Device type Limits Unit Min Max -4 +4 -7 +7 -1 +1 -2 +2 -3 +3 -4.5 +4.5 01,02, 03 -10 +10 04,05 -25 +25 01 -3 +3 02 -10 +10 01 -3 +3 02 -10 +10 01 -7 +7 02 -20 +20 03 -3 +3 -7 +7 06 mV +125°C TA = +25°C 07 TA = -55°C, +125°C Raised input offset voltage 4/ Input offset voltage temperature coefficient Input offset current VIO(R) VIC = 0 V, 13 V, and 3/ TA = +25°C 04,05 mV -14.5 V, RS = 50 Ω, ∆VIO / VBAL = VBAL / STB = +VCC -55°C ≤ TA ≤ +125°C RS = 50 Ω -55°C ≤ TA ≤ +125°C ∆T IIO VOUT = 1.4 V TA = +25°C VOUT = 1.0 V TA = +125°C VOUT = 1.8 V TA = -55°C VOUT = 1.5 V TA = +25°C, +125°C TA = -55°C See footnotes at end of table. 6 µV/°C µA MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Symbol Input offset current IIO Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified VIC = 0 V, 13 V, and 3/ –14.5 V, Temperature +25°C ≤ TA ≤ +125°C RS = 50 kΩ TA = -55°C VIC = 0 V, +12 V, and 3/ TA = +25°C, –12 V, 4/ IIO(R) VIC = 0 V, RS = 50 kΩ, VBAL = VBAL / STB = +VCC Input offset current temperature coefficient ∆IIO / +25°C ≤ TA ≤ +125°C Unit Min Max -10 +10 -20 +20 06 -75 +75 07 -40 +40 06 -100 +100 07 -75 +75 04,05 -25 +25 -50 +50 01,02, 03 -25 +25 nA/°C 04,05 -100 +100 pA/°C 01,02, 03 -75 +75 nA/°C 04,05 -200 +200 pA/°C 01,03 -0.1 +20 µA 02 -0.1 +75 01,03 -0.1 +45 02 -0.1 +150 04,05 TA = -55°C TA = +125°C ∆T RS = 50 kΩ TA = -55°C RS = 50 k Input bias current Limits nA +125°C TA = -55°C Raised input offset current Device type TA = +25°C, +IIB +125°C TA = -55°C See footnotes at end of table. 7 nA MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Input bias current Symbol +IIB Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified Temperature Device type Limits Min Max -100 +0.1 TA = -55°C -150 +0.1 +25°C ≤ TA ≤ +125°C -150 +0.1 RS = 50 kΩ TA = -55°C -200 +0.1 VIC = 0 V TA = +25°C, -0.1 +500 TA = -55°C -0.1 1000 TA = +25°C, -0.1 +750 -0.1 +1000 -100 +0.1 TA = -55°C -150 +0.1 +25°C ≤ TA ≤ +125°C -150 +0.1 RS = 50 kΩ TA = -55°C -200 +0.1 VIC = 0 V TA = +25°C, -0.1 +500 TA = -55°C -0.1 +1000 TA = +25°C, -0.1 +750 -0.1 +1000 VIC = 0 V, RS = 50 kΩ VIC = 13 V and –14.5 V, +25°C ≤ TA ≤ +125°C 04,05 06,07 +125°C VIC = +12 V and –12 V +125°C TA = -55°C -IIB VIC = 0 V, RS = 50 kΩ VIC = 13 V and –14.5 V, +25°C ≤ TA ≤ +125°C 04,05 06,07 +125°C VIC = +12 V and –12 V +125°C TA = -55°C See footnotes at end of table. 8 Unit nA MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Strobe current Symbol ISTROBE Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified VSTROBE = 100 mV, VID = +10 mV Temperature -55°C ≤ TA ≤ +125°C VSTROBE = 400 mV, Device type Limits Unit Min Max 02 -2.5 -0.1 03 -3.3 -0.1 02 -1.0 0 03 +2.5 +5.5 mA VID = -5 mV Strobed output level VO VSTROBE = 0.3 V, 5/ (strobed) VID = +10 mV -55°C ≤ TA ≤ +125°C VSTROBE = 0.9 V, V VID = -5 mV +0.4 VSTROBE = 2.5 V, VID = -5 mV, IOL = 16 mA Collector output voltage (strobed) VO(STB) Input voltage common mode rejection CMR Common mode rejection ratio CMRR -55°C ≤ TA ≤ +125°C 04,05 +14 V -55°C ≤ TA ≤ +125°C 01,02, 03 +80 dB -55°C ≤ TA ≤ +125°C 04,05 +80 dB 06,07 90 01 +2.5 +5.0 VID = +10 mV, IOH = 0 mA 02 +2.5 +5.0 VID = +5 mV, IOH = -5 mA 01 +2.5 +5.0 VID = +10 mV, IOH = -5 mA 02 +2.5 +5.0 VID = +5 mV, 03 +2.5 +5.5 ISTB = -3.0 mA RS = 50 Ω -VCC = -7.0 V, RS = 200 Ω, -5 V ≤ VIN ≤ +5 V VIC = 13 V and –14.5 V, RS = 50 Ω VIC = +12 V and -12 V, RS = 50 Ω High level output voltage VOH VID = +5 mV, IOH = 0 mA IOH = -400 µA See footnotes at end of table. 9 -55°C ≤ TA ≤ +125°C V MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Low level output voltage Symbol VOL Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified VID = -5 mV, IOL = 0 mA Temperature -55°C ≤ TA ≤ +125°C VID = -10 mV, IOL = 0 mA Device type Limits Unit Min Max 01 -1.0 0 02 -1.0 0 03 +1.5 VID = -5 mV, IOL = 100 mA TA = +25°C VID = -5 mV, IOL = 16 mA TA = +125°C +0.4 VID = -5 mV, IOL = 50 mA TA = -55°C +1.0 VOL1 +VCC = +4.5 V, -VCC = 0 V, VOL2 VIC = -1.75 V, +0.75 V, -55°C ≤ TA ≤ +125°C V 04,05 +0.4 VID = -6.0 mV, IO = 8 mA VOL3 ±VCC = ±15 V, VOL4 VIC = 13 V, -14 V, +1.5 VID = -5.0 mV, IO = 50 mA VOL1 +VCC = +4.5 V, -VCC = 0 V, VOL2 VIC = +2.25 V, +1.0 V, VID = 7.0 mV, IO = 3.2 mA Output sink current VOL3 VIC = ±12 V, VOL4 VID = -7.0 mV, IO = 25 mA IOL VID = -5.0 mV, VOL = 0 V TA = +25°C, +125°C VID = -10 mV, VOL = 0 V See footnotes at end of table. 10 +0.4 TA = -55°C +0.6 -55°C ≤ TA ≤ +125°C +1.5 TA = +25°C VID = -10 mV, VOL = 0 V VID = -5.0 mV, VOL = 0 V 06,07 TA = +125°C 01 +2.0 02 +0.5 01 +0.5 02 +0.12 mA MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified Temperature Device type Limits Min Output sink current IOL ICEX +1.0 02 +0.25 03 -0.1 +1.0 -0.5 +100 -1 +10 -1 +500 -1 +2.0 -1 +10.0 -5 +500 -5 +500 01 +0.5 +9.0 VID = -10 mV, VOUT = VOL 02 +0.5 +13.5 VID = -5 mV 03 +0.5 +10 TA = -55°C VOUT = 24 V, VID = +5 mV TA = +25°C TA = +125°C, -55°C Input leakage current Positive supply current Max 01 VID = -5.0 mV, VOL = 0 V VID = -10 mV, VOL = 0 V Output leakage current Unit ±VCC = ±18 V, TA = +25°C VOUT = 32 V TA = +125°C ±VCC = ±18 V, TA = +25°C VO = 18 V TA = +125°C II1 ±VCC = ±18 V, VID = +29 V -55°C ≤ TA ≤ +125°C II2 ±VCC = ±18 V, VID = -29 V +ICC VID = -5 mV, VOUT = VOL Limit is for one comparator of device type 05 -55°C ≤ TA ≤ +125°C TA = +25°C, +125°C 04,05 06,07 04,05 04,05 TA = -55°C See footnotes at end of table. 11 +6.0 +7.0 TA = -55°C TA = +25°C, +125°C mA 06,07 +10.0 +11.5 µA nA µA nA mA MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Negative supply current Symbol -ICC Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified VID = -5 mV, VOUT = VOL, no load Temperature -55°C ≤ TA ≤ +125°C VID = -10 mV, VOUT = VOL, Device type Limits Unit Min Max 01 -7.0 -0.5 02 -6.2 -0.5 03 -3.6 -0.5 04,05 -5.0 mA no load VID = -5 mV Limit is for one comparator of device type 05 TA = +25°C, +125°C -6.0 TA = -55°C TA = +25°C Output short-circuit current Adjustment for input offset voltage IOS VIO(ADJ)+ 10 ms maximum test duration RS = 50 Ω 06,07 -5.0 TA = +125°C -4.5 TA = -55°C -6.0 TA = +25°C 04,05 +200 TA = +125°C +150 TA = -55°C +250 TA = +25°C 04,05 +5.0 AV(±) mV -5.0 VIO(ADJ)Voltage gain mA ∆VOUT = ±0.5 V, TA = +25°C VOUT = 1.4 V ∆VOUT = ±0.5 V, VOUT = 1.0 V See footnotes at end of table. 12 TA = +125°C 01 +1,250 02 +750 01 +1,000 02 +500 V/V MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified Temperature Device type Limits Min Voltage gain AV(±) ∆VOUT = ±0.5 V, TA = -55°C VOUT = 1.8 V Voltage gain Voltage gain Voltage gain (emitter follower output) AV+ AV- ±AVE 01 +1,000 02 +500 03 +30 ∆VOUT = 3.0 V, TA = +25°C VOUT = 1.5 V TA = +125°C +10 TA = -55°C +50 03 TA = +25°C VOUT = 1.5 V TA = +125°C +10 TA = -55°C +50 TA = +25°C 04,05 TA = +25°C AV TA = +125°C, -55°C Response time, output saturated high level to threshold level tHTHR See figure 3, CL = 5 pF, TA = +25°C V/V V/mV V/mV +10 V/mV +8 -55°C ≤ TA ≤ +125°C Voltage gain (collector) Max +30 ∆VOUT = -1.0 V, RL = 600 Ω Unit 06 +10 07 +20 06 +5 07 +10 V/mV 01,03 60 02 90 100 mV step, 5 mV overdrive See footnotes at end of table. 13 ns MIL-M-38510/103H TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C unless otherwise specified Temperature Device type Limits Min Response time, output saturated low level to threshold level tLTHR Strobe release time tSTRL See figure 3, CL = 5 pF, Max TA = +25°C 01,02, 03 60 ns TA = +25°C 02,03 15 ns -55°C ≤ TA ≤ +25°C 04,05 300 ns 100 mV step, 5 mV overdrive See figure 4, TA = +25°C, Unit CL = 5 pF, VID = +10 mV Response time, low-to-high level collector output tRLHC VOD (overdrive) = -5 V, CL = 50 pF, VIN = 100 mV TA = +125°C VOD (overdrive) = -5 V, TA = +25°C, -55°C CL = 50 pF minimum, Response time, high-to-low level collector output tRHLC VIN = 100 mV TA = +125°C VOD (overdrive) = +5 V, -55°C ≤ TA ≤ +25°C CL = 50 pF, VIN = 100 mV TA = +125°C VOD (overdrive) = +5 V, TA = +25°C, +125°C, CL = 50 pF minimum, VIN = 100 mV 1/ 2/ 640 06,07 125 160 04,05 300 500 06,07 160 -55°C For device types 01, 02, and 03, unless otherwise specified, +VCC = +12 V dc and -VCC = -6 V. Unless otherwise specified, for device type 02, strobe on device not being tested is connected to ground; strobe on device being tested is left open. Unless otherwise specified, for device type 03, strobes are at a high level for all tests. For device types 04, 05, 06, and 07, unless otherwise specified, VIC = 0 V, ±VCC = ±15 V and –55°C ≤ TA ≤ +125°C. Limits apply to each half of device types 05, 06, and 07 except as noted for +ICC and -ICC. 3/ VIC is achieved by algebraically subtracting the common mode voltage from each VCC (power supplies) and algebraically adding it to VIN. VIC can be calculated by using the following formula: 4/ 5/ ns VIC = -[((+VCC) + (-VCC)) / 2] +VIN Subscript (R) indicates tests which are performed with input stage current raised by connecting BAL and BAL / STB terminals to +VCC. The output voltage follows the strobe voltage, staying one diode drop (0.7 V) below. 14 MIL-M-38510/103H Device type Case outlines 01 C G H 2 Terminal number 1 Terminal symbol NC GND GND NC 2 GND INPUT+ INPUT+ GND 3 INPUT+ INPUT- INPUT- NC 4 INPUT- VCC- NC NC 5 NC NC VCC- INPUT+ 6 VCC- NC OUTPUT NC 7 NC OUTPUT NC INPUT- 8 NC VCC+ VCC+ NC 9 OUTPUT --- NC NC 10 NC --- NC VCC- 11 VCC+ --- --- NC 12 NC --- --- NC 13 NC --- --- NC 14 NC --- --- NC 15 --- --- --- NC 16 --- --- --- NC 17 --- --- --- OUTPUT 18 --- --- --- NC 19 --- --- --- NC 20 --- --- --- VCC+ NC = No connection FIGURE 1. Terminal connections. 15 MIL-M-38510/103H Device type 02 Case outlines C H I 2 Terminal number 1 Terminal symbol NC INPUT- 1 GND NC 2 INPUT- 1 INPUT+ 1 STROBE 1 NC 3 INPUT+ 1 VCC- INPUT – 1 INPUT- 1 4 VCC- INPUT+ 2 INPUT+ 1 INPUT+ 1 5 INPUT+ 2 INPUT- 2 VCC- NC 6 INPUT- 2 STROBE 2 INPUT+ 2 VCC- 7 NC OUTPUT INPUT- 2 NC 8 NC VCC+ STROBE 2 INPUT+ 2 9 STROBE 2 GND OUTPUT INPUT- 2 10 OUTPUT STROBE 1 VCC+ NC 11 VCC+ --- --- NC 12 GND --- --- NC 13 STROBE 1 --- --- STROBE 2 14 NC --- --- OUTPUT 15 --- --- --- NC 16 --- --- --- VCC+ 17 --- --- --- NC 18 --- --- --- GND 19 --- --- --- STROBE 1 20 --- --- --- NC NC = No connection FIGURE 1. Terminal connections – Continued. 16 MIL-M-38510/103H Device types Case outlines 03 A 04 G C G H and Z Terminal number 1 Terminal symbol NC GND NC GND GND 2 GND INPUT+ GND INPUT+ INPUT+ 1 3 INPUT+ INPUT- INPUT+ INPUT- INPUT- 1 4 INPUT- VCC- INPUT- VCC- NC 5 NC STROBE 1 NC BAL VCC- 6 VCC- STROBE 2 VCC- BAL/STB BAL 7 STROBE 1 OUTPUT BAL OUTPUT BAL/STB 8 STROBE 2 VCC+ BAL/STB VCC+ NC 9 OUTPUT --- OUTPUT --- OUTPUT 10 NC --- NC --- VCC+ 11 VCC+ --- VCC+ --- --- 12 NC --- NC --- --- 13 NC --- NC --- --- 14 NC --- NC --- --- 15 --- --- --- --- --- 16 --- --- --- --- --- 17 --- --- --- --- --- 18 --- --- --- --- --- 19 --- --- --- --- --- 20 --- --- --- --- --- NC = No connection BAL = Balance BAL / STB = Balance / Strobe FIGURE 1. Terminal connections – Continued. 17 MIL-M-38510/103H Device types Case outlines 04 05 P 2 E, F, and X Terminal number 1 Terminal symbol GND NC VCC+ A 2 INPUT+ 1 GND GND A 3 INPUT- 1 NC INPUT+ A 4 VCC- NC INPUT- A 5 BAL INPUT+ VCC- 6 BAL/STB NC BAL B 7 OUTPUT INPUT- BAL/STB B 8 VCC+ NC COLLECTOR OUTPUT B 9 --- NC VCC+ B 10 --- VCC- GND B 11 --- NC INPUT+ B 12 --- BAL INPUT- B 13 --- NC BAL A 14 --- NC BAL/STB A 15 --- BAL/STB COLLECTOR OUTPUT A 16 --- NC NC 17 --- OUTPUT --- 18 --- NC --- 19 --- NC --- 20 --- VCC+ --- NC = No connection BAL = Balance BAL / STB = Balance / Strobe FIGURE 1. Terminal connections – Continued. 18 MIL-M-38510/103H Device types 06 and 07 Case outlines C H I Terminal number 1 Terminal symbol NC OUTPUT 1 OUTPUT 1 2 NC GND 1 GND 1 3 GND 1 INPUT+ 1 INPUT+ 1 4 INPUT+ 1 INPUT- 1 INPUT- 1 5 INPUT- 1 VCC- VCC- 6 VCC- OUTPUT 2 OUTPUT 2 7 OUTPUT 2 GND 2 GND 2 8 GND 2 INPUT+ 2 INPUT+ 2 9 INPUT+ 2 INPUT- 2 INPUT- 2 10 INPUT- 2 VCC+ VCC+ 11 VCC+ --- --- 12 OUTPUT 1 --- --- 13 NC --- --- 14 NC --- --- NC = No connection FIGURE 1. Terminal connections – Continued. 19 MIL-M-38510/103H FIGURE 2. Test circuit for static and dynamic tests. 20 MIL-M-38510/103H FIGURE 2. Test circuit for static and dynamic tests – continued. 21 MIL-M-38510/103H FIGURE 2. Test circuit for static and dynamic tests – continued. 22 MIL-M-38510/103H FIGURE 2. Test circuit for static and dynamic tests – continued. 23 MIL-M-38510/103H NOTES: 1. Test circuit pin conditions and test temperatures shall be as specified in table III. 2. Precautions shall be taken to prevent damage to the device under test (DUT) during insertion into socket and change of relay switch positions (for example, disable voltage-current supplies, current limit ±VCC, etc.). 3. As required to prevent oscillations. Also, proper wiring procedures shall be followed to prevent oscillations. Loop response and settling time shall be consistent with test rate such that any value has settled to within 5 percent of its final value before value is measured. Suggested values shown may not ensure loop stability for all layouts. Actual compensation used shall be approved by the preparing activity prior to use. 4. Any oscillation greater than 300 mV(p-p) shall be cause for device failure. 5. For dual devices, both halves shall be tested. The output of the idle half shall be driven to the off state by using either a differential input voltage or a strobe input, or the idle half may be biased the same as the tested half if oscillations can be avoided. 6. These resistors are ±0.1 percent tolerance matched to ±0.01 percent. All other resistors are ±1 percent tolerance and capacitors are 10 percent tolerance. 7. All relays are shown in the normal deenergized state. FIGURE 2. Test circuit for static and dynamic tests – continued. 24 MIL-M-38510/103H FIGURE 3. Response time test circuit and waveforms for device types 01, 02, and 03. 25 MIL-M-38510/103H NOTES: 1. VIN = 100 ns pulse width, 100 kHz repetition rate, tr and tf ≤ 5 ns (see waveforms). 2. Setup procedure: With S1 open and VIN = 0 adjust R1 for VOUT = 1.5 V. Apply VOD (see note 5) and 3. 4. 5. close S1, then apply VIN. (R1 voltage divider may be replaced with a variable power supply.) All resistor tolerances are ±1 percent and all capacitor tolerances are ±10 percent . For device type 02, ground strobe on idle side. For device type 03, strobe is left open. See waveforms for VOD values. 6. When VOD = 12 V, overdrive applied to device under test (DUT) = 5 mV. FIGURE 3. Response time test circuit and waveforms for device types 01, 02, and 03 – continued. 26 MIL-M-38510/103H NOTES: 1. VIN = 100 ns pulse width, 100 kHz repetition rate, tr and tf ≤ 5 ns (see waveforms). 2. Setup procedure: With S1 open and VIN = 3 V (device type 02), and VIN = 0 V (device type 03) adjust R1 for 3. 4. 5. VOUT = 1.5 V. Apply VOD (see note 5) and close S1, then apply VIN. (R1 voltage divider may be replaced with a variable power supply.) All resistor tolerances are ±1 percent and all capacitor tolerance are ±10 percent . For device type 02, ground strobe on idle side. For device type 03, unused strobe is left open. See waveform for VOD values. 6. When VOD = 12 V, overdrive applied to device under test (DUT) = 10 mV. FIGURE 4. Strobe release time test circuit and waveforms for device types 02 and 03. 27 MIL-M-38510/103H NOTES: 1. VIN = 10 µs pulse width at 50 kHz, tTLH and tTHL ≤ 10 ns, and ZO = 50 Ω. 2. Setup procedure: a. With VIN = 0 V, step VREF from –3.0 mV to +3.0 mV in 0.1 mV steps for subgroup 7, -4.0 mV to +4.0 mV for subgroup 8, and stop when output switches from high to low. b. Change VREF from the reference value obtained above by the required VOD (overdrive). 3. 4. c. Apply VIN and measure response time. All resistor tolerances are ±1 percent and all capacitor tolerances are ±10 percent. CL includes scope, probe, and jig capacitance. 5. 6. TA = +25°C for subgroup 7. For subgroup 8, the tests shall be performed twice, at TA = +125°C and TA = -55°C. In an environment with excessive noise, a 0.01 µF capacitor may be placed between balance and balance/strobe pins. FIGURE 5. Response time test circuit and waveforms for collector output for device types 04 and 05. 28 MIL-M-38510/103H FIGURE 6. Response time test circuit for device types 06 and 07. 29 MIL-M-38510/103H NOTES: 1. This circuit is designed especially to be used with a computer-controlled automatic tester, although it can also be implemented as a bench test setup. The test table for subgroups 9, 10, and 11 lists in detail the steps in a typical test sequence, which goes as follows: a. Measure VIO: Device under test (DUT) is in a conventional servo loop (K3 and K4 energized) with output served to TTL logic threshold. (1.4 V on adapter pin 3). Measure VIO x 1000 adapter pin 8. b. c. d. e. f. Null VIO: Release K3 and K4, apply voltage measured in step 1 to adapter pin 4. This is particularly easy to do on computer-controlled automatic test equipment. Apply 5 mV overdrive (OD): The overdrive is developed at the inverting input of the device under test (DUT) via a 1000:1 divider from adapter pin 5. Apply initial 100 mV: Close K1, apply 2 mA at adapter pin 6. Since Q1 is off, this current flows through Schottky diode D1 and the 50 Ω source resistor, giving 100 mV. If a current source is not available, 15 V at pin 6 will give about 2 mA current. Measure tRLHC: Pull adapter pin 7 low. U1A output goes high, starting the timer via U1B and turning on Q1, which turns off D1. The 100 mV drive disappears abruptly, leaving just the 5 mV overdrive. After the response time, the device under test (DUT) output crosses TTL logic threshold and stops the timer via U1B. On a bench setup, the pulse at 1UB output can be measured with a scope. Measure tRHLC: Reset pin 7, change pin 5 from –5 V to +5 V, open K1, close K2, pull pin 7 low, measure pulse width at U1B output. 2. The following delay times are of possible concern in the LM119 (device types 06 and 07) response time test circuit: a. U1A: This device merely inverts and squares up the start signal from the tester. Its gate delay does not affect the tests. b. Q1: This is the major uncompensated delay, since the timer starts when Q1 base goes high, not when Q1 collector goes low. This delay is minimized by using a fast switching transistor with an R-C speedup network driving the base. Measured Q1 delays are well under 10 ns. c. D1 and D2: These Schottky devices have negligible switching times ( < 1 ns). d. U1B: The gate delays here are not important as long as the delays from the two inputs are well matched. (Matched delays merely offset the output pulse in time.) To minimize gate delay effects even further, we use one of the “fast” series 74F86 gates; with delays around 5 ns from each input, the mismatch should be no more than 1 or 2 ns. e. Q2: This driver is required only if the time measurement systems has a 50 Ω input. Since it operates as an emitter follower rather than a saturating switch, there are no delays associated with it. 3. As required to prevent oscillations. Also, proper wiring procedures shall be followed to prevent oscillations. Loop response and settling time shall be consistent with test rate such that any value has settled to within 5 percent of its final value before value is measured. Suggested values shown may not ensure loop stability for all layouts. Actual compensation used shall be approved by preparing activity prior to use. 4. All resistor tolerances are ±1 percent and all capacitor tolerances are ±10 percent. 5. CL includes scope, probe, and jig capacitance. FIGURE 6. Response time test circuit for device types 06 and 07 – continued. 30 MIL-M-38510/103H TABLE II. Electrical test requirements. MIL-PRF-38535 test requirements Subgroups (see table III) 2/ 3/ Class S devices Class B devices Interim electrical parameters 1 1 Final electrical test parameters 1/ 1,2,3,4 1,2,3,4 Group A test requirements 1,2,3,4,5,6, 7,8,9,10,11 1,2,3,4,5,6,7,8,9 Group B electrical test parameters when using the methods 5005 QCI option 1,2,3, and table IV delta limits N/A Group C electrical parameters 1,2,3, and table IV delta limits 1 and table IV delta limits Group D end point electrical parameters 1,2,3 1 1/ PDA applies to subgroup 1. 2/ Subgroup 8 applies to device types 04 and 05 only. 3/ Subgroups 9, 10, and 11 apply to device types 06 and 07. 4. VERIFICATION. 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply: a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. Additional screening for space level product shall be as specified in MIL-PRF-38535. 31 32 no. -883 3 4 “ “ ∆IIO/∆T 4/ IIO ∆VIO/∆T 4/ VIO2 VIO1 IO(STB) 3/ VO(STB) 3/ VOH2 VOH1 IOL VOL -ICC 12 13 14 15 3006 3006 3007 3009 4001 20 19 18 17 11 3009 4001 10 3007 16 9 3005 4001 8 7 6 3005 4003 CMR +ICC 4003 5 2 “ “ 1 4001 method Test MIL-STD CMR -IIB +IIB IIO VIO2 VIO1 Symbol See footnotes at end of device types 01 and 02. (figure 2) TA = +125°C 2 (figure 2) TA = +25°C 1 Subgroup “ “ “ 2/ 2 “ “ “ 2/ 3 “ “ “ “ “ “ “ “ “ +12.0 V +7.0 V +17.0 V “ “ “ “ +12.0 V 4 “ “ “ “ “ “ “ “ “ -6.0 V -12.0 V -2.0 V “ “ “ “ -6.0 V 5 100 mV 300 mV 6 +12.0 V -6.0 V 3 Calculation: ∆IIO / ∆T = [IIO (test 19) – IIO (test 3)] x 10 / 100°C GND 3 Calculation: ∆VIO / ∆T = [VIO (test 16) – VIO (test 1)] x 10 / 100°C “ “ “ “ “ “ “ “ “ GND -5.0 V +5.0 V “ “ “ “ GND 1 Adapter PIN numbers TABLE III. Group A inspection for device types 01 and 02. 1/ -5 mA 7 -1.0 V -1.0 V -1.0 V +3.6 V -6.4 V “ “ “ “ -1.4 V 8 9 1,3,5,6,8,9,10 2,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 3,4,6 3,4,6 3,4,6 3,4,6 1,2,5 1,2,5 1,2,5 1,2,5 2,4,5,6,8,9,10 2,4,5,6,8,9,10 1,3,4,5,6,7,9,10 1,2,3,5,6,7,9,10 1,3,5,6,8,9,10 2,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 closed Relays MIL-M-38510/103H 33 no. -883 3 4 “ “ ∆IIO/∆T 4/ IIO ∆VIO/∆T 4/ VIO2 VIO1 IO(STB) 3/ VO(STB) 3/ VOH2 VOH1 IOL VOL -ICC 12 13 14 15 3006 3006 3007 3009 4001 20 19 18 17 11 3009 4001 10 3007 16 9 3005 4001 8 7 6 3005 4003 CMR +ICC 4003 5 2 “ “ 1 4001 method Test MIL-STD CMR -IIB +IIB IIO VIO2 VIO1 Symbol See footnotes at end of device types 01 and 02. (figure 2) TA = +125°C 2 (figure 2) TA = +25°C 1 Subgroup 9 9 9 6 “ “ “ “ 7 5 4 9 9 “ “ “ “ 9 No. E10 E9 E8 IO(STB) VO(STB) VOH2 VOH1 IOL VOL -ICC +ICC E7 E6 E5 E4 E3 E2 E1 Value Pin measured V V V mA V V V mA V mA mA “ “ “ “ “ “ V Unit IIO = E8 – E10 VIO = 10E9 VIO = 10E8 3 CMR = 20 log [10 / (E6 – E7)] -IIB = 10E5 – E1 +IIB = E1 – 10E4 IIO = E1 – E3 VIO = 10E2 VIO = 10E1 Equation -25 -3 -10 -3 -3 +2.5 +2.5 +2.0 -1.0 -7.0 +0.5 +80 -0.1 -3 -2 -2 Min +25 +3 +10 +3 +3 +5.0 +5.0 -0.5 +9.0 +20 +20 +3 +2 +2 Max Device type 01 TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ -0.1 -0.1 µA µA -10 µA -25 -10 µV/°C nA/°C -4.5 -4.5 -2.5 -1.0 +2.5 +2.5 +0.5 -1.0 -6.2 +0.5 mV mV V V mA V mA mA +80 -10 µA dB -3.5 -3.5 Min mV mV Unit Limits +25 +10 +10 +4.5 +4.5 -0.1 +5.0 +5.0 -0.5 +13.5 +75 +75 +10 +3.5 +3.5 Max Device type 02 nA/°C µA µV/°C mV mV mA V V V mA V mA mA dB µA µA µA mV mV Unit MIL-M-38510/103H 34 no. -883 ∆IIO/∆T 4/ IIO ∆VIO/∆T 4/ VIO2 VIO1 IO(STB) 3/ VO(STB) 3/ VOH2 VOH1 IOL VOL -ICC +ICC 37 36 “ “ 35 32 3009 “ 31 3007 34 30 3006 “ 29 3006 33 28 3009 4001 27 26 3005 3007 25 24 3005 4003 CMR 23 22 4001 4003 21 4001 method Test MIL-STD CMR -IIB +IIB Symbol See footnotes at end of device types 01 and 02. (figure 2) TA = -55°C 3 (figure 2) TA = +125°C 2 Subgroup “ “ “ 2/ 2 “ “ “ 2/ 3 “ “ “ “ “ “ “ “ “ +12.0 V +7.0 V +17.0 V +12.0 V +12.0 V 4 “ “ “ “ “ “ “ “ “ -6.0 V -12.0 V -2.0 V -6.0 V -6.0 V 5 100 mV 300 mV 6 +12.0 V -6.0 V 3 Calculation: ∆IIO / ∆T = [IIO (test 36) – IIO (test 3)] x 10 / 80°C GND 3 Calculation: ∆VIO / ∆T = [VIO (test 33) – VIO (test 1)] x 10 / 80°C “ “ “ “ “ “ “ “ “ GND -5.0 V +5.0 V GND GND 1 Adapter PIN numbers -5 mA 7 TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ -1.8 V -1.8 V -1.8 V +4.0 V -6.0 V -1.0 V -1.0 V 8 9 1,3,5,6,8,9,10 2,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 3,4,6 3,4,6 3,4,6 3,4,6 1,2,5 1,2,5 1,2,5 1,2,5 2,4,5,6,8,9,10 2,4,5,6,8,9,10 1,3,4,5,6,7,9,10 1,2,3,5,6,7,9,10 closed Relays MIL-M-38510/103H 35 no. -883 ∆IIO/∆T 4/ IIO ∆VIO/∆T 4/ VIO2 VIO1 IO(STB) 3/ VO(STB) 3/ VOH2 VOH1 IOL VOL -ICC +ICC 37 36 “ “ 35 32 3009 “ 31 3007 34 30 3006 “ 29 3006 33 28 3009 4001 27 26 3005 3007 25 24 3005 4003 CMR 23 22 4001 4003 21 4001 method Test MIL-STD CMR -IIB +IIB Symbol See footnotes at end of device types 01 and 02. (figure 2) TA = -55°C 3 (figure 2) TA = +125°C 2 Subgroup 9 9 9 6 “ “ “ “ 7 5 4 “ “ “ 9 No. E17 E16 E15 IO(STB) VO(STB) VOH2 VOH1 IOL VOL -ICC +ICC E14 E13 E12 E11 Value Pin measured V V V mA V V V mA V mA mA “ “ “ V Unit IIO = E15 – E17 VIO = 10E16 VIO = 10E15 3 CMR = 20 log [10 / (E13 – E14)] -IIB = 10E12 – E8 +IIB = E8 – 10E11 Equation -75 -7 -10 -3 -3 +2.5 +2.5 +0.5 -1.0 -7.0 +0.5 +80 -0.1 -0.1 Min +75 +7 +10 +3 +3 +5.0 +5.0 -0.5 +9.0 +20 +20 Max Device type 01 TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ -0.1 µA -20 µA -75 -10 µV/°C nA/°C -4.5 -4.5 -2.5 -1.0 +2.5 +2.5 +0.12 -1.0 -6.2 +0.5 mV mV V V mA V mA mA +80 -0.1 µA dB Min Unit Limits +75 +20 +10 +4.5 +4.5 -0.1 +5.0 +5.0 -0.5 +13.5 +75 +75 Max Device type 02 nA/°C µA µV/°C mV mV mA V V V mA V mA mA dB µA µA Unit MIL-M-38510/103H 36 no. -883 AV- AV+ AV- AV+ IO(STB) 3/ VO(STB) 3/ VOH2 VOH1 IOL VOL -ICC +ICC 48 49 3007 3009 52 53 “ “ 51 47 3006 “ 46 3006 50 45 3009 4004 44 43 3005 3007 42 41 3005 4003 CMR 40 39 4001 4003 38 4001 method Test MIL-STD CMR -IIB +IIB Symbol See footnotes at end of device types 01 and 02. TA = +125°C (see figure 2) 5 TA = +25°C (see figure 2) 4 (figure 2) TA = -55°C 3 Subgroup “ “ “ “ “ “ “ “ “ “ “ GND -5.0 V +5.0 V GND GND 1 “ “ “ 2/ 2 “ “ “ 2/ 3 “ “ “ “ “ “ “ “ “ “ “ +12.0 V +7.0 V +17.0 V +12.0 V +12.0 V 4 “ “ “ “ “ “ “ “ “ “ “ -6.0 V -12.0 V -2.0 V -6.0 V -6.0 V 5 Adapter PIN numbers 100 mV 300 mV 6 -5 mA 7 TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ -0.5 V -1.5 V -0.9 V -1.9 V +3.2 V -6.8 V -1.8 V -1.8 V 8 9 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 3,4,6 3,4,6 3,4,6 3,4,6 1,2,5 1,2,5 1,2,5 1,2,5 2,4,5,6,8,9,10 2,4,5,6,8,9,10 1,3,4,6,7,9,10 1,2,3,5,6,7,9,10 closed Relays MIL-M-38510/103H 37 no. -883 AV- AV+ AV- AV+ IO(STB) 3/ VO(STB) 3/ VOH2 VOH1 IOL VOL -ICC +ICC 48 49 3007 3009 52 53 “ “ 51 47 3006 “ 46 3006 50 45 3009 4004 44 43 3005 3007 42 41 3005 4003 CMR 40 39 4001 4003 38 4001 method Test MIL-STD CMR -IIB +IIB Symbol See footnotes at end of device types 01 and 02. TA = +125°C (figure 2) 5 TA = +25°C (figure 2) 4 (figure 2) TA = -55°C 3 Subgroup 9 9 9 9 6 “ “ “ “ 7 5 4 “ “ “ 9 No. E25 E24 E23 E22 IO(STB) VO(STB) VOH2 VOH1 IOL VOL -ICC +ICC E21 E20 E19 E18 Value Pin measured “ “ “ V mA V V V mA V mA mA “ “ “ V Unit AV- = 50 / (E8 – E25) AV+ = 50 / (E8 – E24) AV- = 50 / (E1 – E23) AV+ = 50 / (E1 – E22) 3 CMR = 20 log [10 / (E20 – E21)] -IIB = 10E19 – E15 +IIB = E15 – 10E18 Equation +1,000 +1,000 +1,250 +1,250 +2.5 +2.5 +1.0 -1.0 -7.0 +0.5 +80 -0.1 -0.1 Min +5.0 +5.0 -0.5 +9.0 +45 +45 Max Device type 01 TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ -0.1 µA “ “ “ V/V V V mA V mA mA +500 +500 +750 +750 -2.5 -1.0 +2.5 +2.5 +0.25 -1.0 -6.2 +0.5 +80 -0.1 µA dB Min Unit Limits -0.1 +5.0 +5.0 -0.5 +13.5 +150 +150 Max Device type 02 “ “ “ V/V mA V V V mA V mA mA dB µA µA Unit MIL-M-38510/103H 38 tSTRL 3/ tHTHR tLTHR AV- AV+ Symbol no. -883 55 “ 58 57 56 54 4004 method Test MIL-STD See footnotes at end of device types 01 and 02. TA = +25°C 7 TA = -55°C (figure 2) 6 Subgroup 2 3 +12.0 V +12.0 V 4 -6.0 V -6.0 V 5 6 7 8 -1.3 V -2.3 V These tests shall be performed using test conditions and procedures listed on figure 4. These tests shall be performed using test conditions and procedures listed on figure 3. GND GND 1 Adapter PIN numbers TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ 9 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 closed Relays MIL-M-38510/103H 39 tSTRL 3/ tHTHR tLTHR AV- AV+ Symbol no. -883 56 57 58 “ “ 55 “ “ 54 4004 method Test MIL-STD “ 9 No. E27 E26 Value Pin measured “ V Unit AV- = 50 / (E15 – E27) AV+ = 50 / (E15 – E26) Equation +1,000 +1,000 Min 60 60 Max Device type 01 ns ns “ V/V Unit +500 +500 Min Limits 15 90 60 Max Device type 02 ∆ Represents delta. ns ns ns “ V/V Unit 4/ Test numbers 18, 20, 35, and 37, which require read and record measurements plus a calculation, may be omitted except when subgroups 2 and 3 are being performed for group A sampling inspections and group C end points. 3/ Device type 02 only. 2/ For device type 01, use –5 mV; for device type 02, use –10 mV. 1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan. TA = +25°C 7 TA = -55°C (figure 2) 6 Subgroup TABLE III. Group A inspection for device types 01 and 02 – continued. 1/ MIL-M-38510/103H 40 no. -883 3 4 “ “ ∆IIO/∆T 2/ IIO ∆VIO/∆T 2/ VIO2 VIO1 ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL “ 23 22 4001 “ 18 21 “ 17 “ “ 16 20 “ 15 “ “ 14 -5 mV -5 mV 2 “ “ “ “ “ -5 mV “ “ -5 mV 3 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ -6.0 V -12.0 V +7.0 V +12.0 V -2.0 V “ “ “ “ -6.0 V 5 +17.0 V “ “ “ “ +12.0 V 4 +0.4 V +2.5 V +0.9 V 6 Adapter PIN numbers +12.0 V -6.0 V 3 Calculation: ∆IIO / ∆T = [IIO (test 22) – IIO (test 3)] x 10 / 100°C GND 3 Calculation: ∆VIO / ∆T = [VIO (test 19) – VIO (test 1)] x 10 / 100°C “ “ “ 13 19 “ 12 4001 “ 11 3006 “ “ 10 9 3005 -ICC GND -5.0 V +5.0 V “ “ “ “ GND 1 3007 8 3005 +ICC 7 4003 CMRR 6 4003 5 2 “ “ 1 4001 method Test MIL-STD CMRR -IIB +IIB IIO VIO2 VIO1 Symbol See footnotes at end of device type 03. (figure 4) TA = +125°C 2 (figure 4) TA = +25°C 1 Subgroup TABLE III. Group A inspection for device type 03. 1/ +16 mA +16 mA +24 V -0.4 mA +100 mA 7 -1.5 V -1.5 V -1.5 V +3.5 V -6.5 V “ “ “ “ -1.5 V 8 9 +0.4 V +2.5 V +0.9 V 10 MIL-M-38510/103H 41 no. -883 3 4 “ “ ∆IIO/∆T 2/ IIO ∆VIO/∆T 2/ VIO2 VIO1 ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL “ 23 22 “ 1,2,5 18 21 1,2,5 17 “ 1,2,5 16 20 1,2,5 15 “ 1,2,5 14 1,3,5,6,8,9,10 2,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 1,2,5 13 19 3,4,6 12 4001 3,4,6 11 3006 1,2,5 1,2,5 10 9 3005 -ICC 1,2,5 2,4,5,6,8,9,10 2,4,5,6,8,9,10 1,3,4,5,6,7,9,10 1,2,3,5,6,7,9,10 1,3,5,6,8,9,10 2,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 energized Relays 3007 8 3005 +ICC 7 4003 CMRR 6 4003 5 2 “ “ 1 4001 method Test MIL-STD CMRR -IIB +IIB IIO VIO2 VIO1 Symbol See footnotes at end of device type 03. (figure 4) TA = +125°C 2 (figure 4) TA = +25°C 1 Subgroup 9 9 9 10 6 “ “ “ “ “ “ 7 5 4 “ “ “ “ “ “ 9 No. E10 E9 E8 ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC E7 E6 E5 E4 E3 E2 E1 Value Pin measured V V V mA mA “ “ “ V IIO = E8 – E10 VIO = 10E9 -25 -3.0 -10 -3.0 -3.0 -3.3 -3.3 +2.5 +2.5 -.01 µA -3.6 +0.5 +80 -0.1 -0.1 -3.0 -2.0 -2.0 +2.5 VIO = 10E8 3 CMR = 20 log [10 / (E6 – E7)] -IIB = 10E5 – E1 +IIB = E1 – 10E4 IIO = E1 – E3 VIO = 10E2 VIO = 10E1 Min V V mA mA “ “ “ “ “ “ V Unit Equation TABLE III. Group A inspection for device type 03 – continued. 1/ +25 +3.0 +10 +3.0 +3.0 -0.1 -0.1 +0.4 +0.4 +5.5 +5.5 +1 +5.5 +1.5 -0.5 +10 +20 +20 +3.0 +2.0 +2.0 Max Limits nA/°C µA µV/°C mV mV mA mA “ “ “ V µA V V mA mA dB µA µA µA mV mV Unit MIL-M-38510/103H 42 no. -883 ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC “ “ “ “ “ “ 31 32 33 34 35 36 3006 “ “ 37 38 “ 30 3007 “ GND -5.0 V 29 28 27 +5.0 V GND GND 1 3005 3005 4003 CMRR 26 25 “ 4003 24 4001 method Test MIL-STD CMRR -IIB +IIB Symbol See footnotes at end of device type 03. TA = +125°C (figure 2) 2 (figure 4) TA = +25°C 1 Subgroup -5 mV -5 mV 2 “ “ “ “ “ -5 mV “ “ -5 mV 3 “ “ “ “ “ “ “ “ “ “ +12.0 V +7.0 V +17.0 V +12.0 V +12.0 V 4 “ “ “ “ “ “ “ “ “ “ -6.0 V -12.0 V -2.0 V -6.0 V -6.0 V 5 +0.4 V +2.5 V +0.9 V 6 Adapter PIN numbers TABLE III. Group A inspection for device type 03 – continued. 1/ +16 mA +16 mA +24 V -0.4 mA +16 mA 7 +3.5 V -6.5 V -1.5 V -1.5 V 8 9 +0.4 V +2.5 V +0.9 V 10 MIL-M-38510/103H 43 no. -883 ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC 3,4,6 3,4,6 1,2,5 1,2,5 1,2,5 1,2,5 31 32 33 34 35 36 3006 1,2,5 1,2,5 37 38 1,2,5 30 3007 1,2,5 1,2,5 2,4,5,6,8,9,10 29 28 27 2,4,5,6,8,9,10 1,3,4,5,6,7,9,10 1,2,3,5,6,7,9,10 energized Relays 3005 3005 4003 CMRR 26 25 “ 4003 24 4001 method Test MIL-STD CMRR -IIB +IIB Symbol See footnotes at end of device type 03. TA = +125°C (figure 2) 2 (figure 4) TA = +125°C 2 Subgroup 10 6 “ “ “ “ “ “ 7 5 4 “ “ “ 9 No. ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC E14 E13 E12 E11 Value Pin measured mA mA “ “ “ V -3.3 -3.3 +2.5 +2.5 -0.5 µA -3.6 +0.5 +80 +2.5 3 CMR = 20 log [10 / (E13 - E14)] -IIB = 10E12 - E8 +IIB = E8 – 10E11 Min V V mA mA “ “ “ V Unit Equation TABLE III. Group A inspection for device type 03 – continued. 1/ -0.1 -0.1 +0.4 +0.4 +5.5 +5.5 +100 +5.5 +0.4 -0.5 +10 +20 +20 Max Limits mA mA “ “ “ V µA V V mA mA dB µA µA Unit MIL-M-38510/103H 44 no. -883 “ “ “ “ “ “ “ “ 49 50 51 52 53 54 55 56 57 58 3005 3007 3006 ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC “ “ GND -5.0 V +5.0 V GND 48 45 “ GND 3005 44 “ 3 +12.0 V +12.0 V 4 -6.0 V -6.0 V 5 +12.0 V -6.0 V -5 mV -5 mV “ “ “ “ “ -5 mV “ “ -5 mV “ “ “ “ “ “ “ “ “ “ +12.0 V +7.0 V +17.0 V +12.0 V +12.0 V “ “ “ “ “ “ “ “ “ “ -6.0 V -12.0 V -2.0 V -6.0 V -6.0 V 6 +0.4 V +2.5 V +0.9 V 3 Calculation: ∆IIO / ∆T = [IIO (test 42) – IIO (test 3)] x 10 / 80°C 47 43 “ GND 4003 42 “ 2 Adapter PIN numbers 3 Calculation: ∆VIO / ∆T = [VIO (test 39) – VIO (test 1)] x 10 / 80°C GND CMRR 41 “ 46 40 “ GND 1 4003 39 4001 method Test MIL-STD CMRR -IIB +IIB ∆IIO/∆T 2/ IIO ∆VIO/∆T 2/ VIO2 VIO1 Symbol See footnotes at end of device type 03. TA = -55°C (fi 5) (figure 2) 3 Subgroup TABLE III. Group A inspection for device type 03 – continued. 1/ +16 mA +16 mA +24 V -0.4 mA +50 mA 7 8 9 +0.4 V +2.5 V +0.9 V 10 MIL-M-38510/103H ∆VIO/∆T 2/ (figure 2) no. -883 45 3,4,6 3,4,6 1,2,5 1,2,5 1,2,5 1,2,5 1,2,5 1,2,5 48 49 50 51 52 53 54 55 56 57 58 3005 3005 3007 3006 See footnotes at end of device type 03. ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC 1,2,5 1,2,5 1,2,5 2,4,5,6,8,9,10 2,4,5,6,8,9,10 1,3,4,5,6,7,9,10 47 45 “ 1,2,3,5,6,7,9,10 4003 44 “ 1,3,5,6,8,9,10 CMRR 43 “ 46 42 “ 2,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 energized Relays 4003 41 40 “ “ 39 4001 method Test MIL-STD CMRR -IIB +IIB ∆IIO/∆T 2/ IIO VIO2 VIO1 Symbol TA = -55°C 3 Subgroup 10 6 “ “ “ “ “ “ 7 5 4 “ “ “ 9 9 9 9 No. ISTB2 ISTB1 VO(STH)2 VO(STH)1 VO(STL)2 VO(STL)1 ICEX VOH VOL -ICC +ICC E21 E20 E19 E18 E17 E16 E15 Value Pin measured mA mA “ “ “ V -3.3 -3.3 +2.5 +2.5 -0.5 µA -3.6 +0.5 +80 -75 -7 -10 -3 -3 +2.5 3 CMRR = 20 log [10 / (E20 - E21)] -IIB = 10E19 - E15 +IIB = E15 – 10E18 IIO = E15 – E17 VIO = 10E16 VIO = 10E15 Min V V mA mA “ “ “ V V V V Unit Equation TABLE III. Group A inspection for device type 03 – continued. 1/ -0.1 -0.1 +0.4 +0.4 +5.5 +5.5 +100 +5.5 +1.0 -0.5 +10 +45 +45 +75 +7 +10 +3 +3 Max Limits mA mA “ “ “ V µA V V mA mA dB µA µA nA/°C µA µV/°C mV mV Unit MIL-M-38510/103H 46 tSTRL2 tSTRL1 tHTHR tLTHR AV- AV+ AV- AV+ AV- AV+ Symbol no. -883 64 4004 68 67 66 65 63 62 4004 4004 61 60 4004 4004 59 4004 method Test MIL-STD See footnotes at end of device type 03. TA = +25°C 7 TA = -55°C (figure 2) 6 TA = +125°C (figure 2) 5 TA = +25°C (figure 2) 4 Subgroup 2 3 “ “ “ “ “ +12.0 V 4 “ “ “ “ “ -6.0 V 5 6 7 These tests shall be performed using test conditions and procedures listed on figure 4. These tests shall be performed using test conditions and procedures listed on figure 3. “ “ “ “ “ GND 1 Adapter PIN numbers TABLE III. Group A inspection for device type 03 – continued. 1/ -0.5 V -4.5 V -0.5 V -4.5 V -0.5 V -4.5 V 8 9 10 MIL-M-38510/103H 47 tSTRL2 tSTRL1 tHTHR tLTHR AV- AV+ AV- AV+ AV- AV+ Symbol no. -883 15 +50 68 AV- = 100 / (E27 – E15) +50 +10 +10 +30 +30 Max 15 “ AV+ = 300 / (E15 – E26) AV- = 100 / (E25 – E8) AV+ = 300 / (E8 – E24) AV- = 100 / (E23 – E1) AV+ = 300 / (E1 – E22) Min 67 E27 “ “ “ “ V Unit Limits 60 “ E26 E25 E24 E23 E22 Value Equation 66 1,2,3,4,5,6,8,9,10 “ “ “ “ 9 No. Pin measured 60 64 “ 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 1,2,3,4,5,6,8,9,10 energized Relays 65 63 62 “ “ 61 60 “ “ 59 4004 method Test MIL-STD “ “ “ ns “ “ “ “ “ V/V Unit ∆ Represents delta. 2/ Test numbers 21, 23, 41, and 43, which require read and record measurements plus a calculation, may be omitted except when subgroups 2 and 3 are being performed for group A sampling inspections and group C end points. 1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan. TA = +25°C 7 TA = -55°C (figure 2) 6 TA = +125°C (figure 2) 5 TA = +25°C (figure 2) 4 Subgroup TABLE III. Group A inspection for device type 03 – continued. 1/ MIL-M-38510/103H 48 VIO(ADJ)- VIO(ADJ)+ VO(STB) -IIB +IIB IIO(R) IIO VIO(R) VIO Symbol no. -883 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 4001 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ method Test MIL-STD See footnotes at end of device types 04 and 05. TA = +25°C (fi 5) (figure 2) 1 Subgroup “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ GND 1 GND GND +15.0 V “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ GND 2 3 “ “ +15.0 V +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +15.0 V +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +2.5 V +2.0 V +29.5 V +15.0 V 4 “ “ -15.0 V -28.0 V -0.5 V -15.0 V -28.0 V -0.5 V -15.0 V -15.0 V -28.0 V -0.5 V -15.0 V -28.0 V -0.5 V -15.0 V -2.5 V -28.0 V -0.5 V -15.0 V 5 -3 mA +15.0 V +2.0 V +29.5 V +15.0 V 6 7 Adapter PIN numbers TABLE III. Group A inspection for device types 04 and 05 . 1/ “ “ +15.0 V +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +15.0 V +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +2.5 V +2.0 V +29.5 V +15.0 V 8 9 10 GND GND -13.0 V +14.5 V GND -13.0 V +14.5 V GND GND -13.0 V +14.5 V GND -13.0 V +14.5 V GND GND -13.0 V +14.5 V GND 11 +20.0 V +20.0 V “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ +20.0 V 12 MIL-M-38510/103H 49 VIO(ADJ)- VIO(ADJ)+ VO(STB) -IIB +IIB IIO(R) IIO VIO(R) VIO Symbol no. -883 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ 2 “ “ 1 4001 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = +25°C 1 Subgroup -20.0 V -20.0 V “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ -20.0 V 13 14 numbers Adapter pin 1,2,3,4,5,9,11 1,2,3,4,5,8,11 1,2,4,5,10 2,3,4,5 2,3,4,5 2,3,4,5 1,3,4,5 1,3,4,5 1,3,4,5 3,4,5,8,9,10 3,4,5 3,4,5 3,4,5 1,2,3,4,5,8,9,10 1,2,3,4,5,8,9,10 1,2,3,4,5,8,9,10 1,2,3,4,5 1,2,3,4,5 1,2,3,4,5 1,2,3,4,5 energized Relays 14 14 7 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ 14 No. E20 E19 E18 E17 E16 E15 E14 E13 E12 E11 E10 E9 E8 E7 E6 E5 E4 E3 E2 E1 Value Pin measured “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ V Unit VIO(ADJ)- = E1 – E20 VIO(ADJ)+ = E1 – E19 VO(STB) = E18 -IIB = 20 (E17 – E3) -IIB = 20 (E16 – E2) -IIB = 20 (E15 – E1) +IIB = 20 (E3 – E14) +IIB = 20 (E2 – E13) +IIB = 20 (E1 – E12) IIO = 20 (E5 – E11) IIO = 20 (E3 – E10) IIO = 20 (E2 – E9) IIO = 20 (E1 – E8) VIO(R) = E7 VIO(R) = E6 VIO(R) = E5 VIO = E4 VIO = E3 VIO = E2 VIO = E1 Equation TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ +5.0 +14.0 -150 -150 -100 -150 -150 -100 -25.0 “ “ -10.0 “ “ “ “ “ “ -3 Min -5.0 “ “ “ “ “ +0.1 +25.0 “ “ +10.0 “ “ “ “ “ “ +3 Max Limits mV mV V “ “ “ “ “ “ “ “ “ nA “ “ “ “ “ “ mV Unit MIL-M-38510/103H CMRR VOL1 2/ 1 TA = +25°C (fi 5) (figure 2) 50 no. -883 27 28 29 30 4001 4001 3005 3005 31 26 3009 3011 25 “ 23 “ 24 22 3007 “ 21 4003 method Test MIL-STD See footnotes at end of device types 04 and 05. IOS 3/ -ICC +ICC II2 II1 ICEX VOL4 2/ VOL3 2/ VOL2 2/ Symbol Subgroup 2 3 4 “ “ GND -17.0 V +12.0 V GND -14.0 V +13.0 V +3.0 V +0.5 V +0.1 V GND GND +12.0 V -17.0 V GND -14.0 V +13.0 V +3.0 V +0.5 V +10.0 V +10.0 V -5 V -9.0 V +18.0 v +9.0 V +6.5 V “ “ +15.0 V “ “ +18.0 V +15.0 +15.0 +4.5 V +4.5 V 3 Calculation = 20 log [27.5 x 10 / (E3 – E2)] 1 “ “ -15.0 V “ “ -18.0 V -15.0 V -15.0 V GND GND 5 6 5.0 V +32.0 V 50 mA 50 mA 8 mA 8 mA 7 Adapter PIN numbers TABLE III. Group A inspection for device types 04 and 05 - continued. 1/ “ “ “ “ “ “ “ “ “ GND 8 9 “ “ “ “ “ “ “ “ “ GND 10 11 12 MIL-M-38510/103H VOL1 2/ TA = +25°C 51 no. -883 24 25 26 27 28 29 30 31 “ “ 3009 4001 4001 3005 3005 3011 23 22 3007 “ 21 4003 method Test MIL-STD See footnotes at end of device types 04 and 05. IOS 3/ -ICC +ICC II2 II1 ICEX VOL4 2/ VOL3 2/ VOL2 2/ CMRR 1 (figure 2) Symbol Subgroup 13 14 numbers Adapter pin 1,2 1,2 1,2 1,2,12 1,2,12 1,2,12 1,2,12 1,2,12 1,2,12 1,2,12 energized Relays 7 5 4 2 1 7 “ “ “ 7 No. I31 I30 I29 I28 I27 I26 E25 E24 E23 E22 Value Pin measured “ “ mA “ “ nA “ “ “ V Unit IOS = I31 -ICC = I30 +ICC = I29 II2 = I28 II1 = I27 ICEX = I26 VOL4 = E25 VOL3 = E24 VOL2 = E23 VOL1 = E22 Equation TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ -5.0 -5 -5 -1 +80 Min +200 +6.0 +500 +500 +10 +1.5 +1.5 +0.4 +0.4 Max Limits “ “ mA “ “ nA “ “ “ V dB Unit MIL-M-38510/103H 52 -IIB +IIB ∆IIO/∆T IIO(R) IIO ∆VIO/∆T VIO(R) VIO Symbol no. -883 41 42 43 44 45 46 47 48 49 50 “ “ “ “ “ “ “ “ “ “ 38 “ 40 37 “ “ 36 “ 39 35 “ “ 34 33 “ “ 32 4001 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = +125°C 2 Subgroup “ “ “ “ “ “ GND 2 3 +2.0 V +29.5 V +15.0 V +2.5 V +2.0 V +29.5 V +15.0 V 4 “ “ “ GND +15.0 V +2.0 V +29.5 V +15.0 V “ “ “ “ “ “ “ “ “ “ GND GND +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V Calculation = [IIO(test 40) – IIO(test 8)] / 100°C 4/ “ “ “ GND Calculation = [VIO (E32) – VIO(E1)] / 100°C 4/ “ “ “ “ “ “ GND 1 -28.0 V -0.5 V -15.0 V -28.0 V -0.5 V -15.0 V -15.0 V -28.0 V -0.5 V -15.0 V -28.0 V -0.5 V -15.0 V -2.5 V -28.0 V -0.5 V -15.0 V 5 +15.0 V +2.0 V +29.5 V +15.0 V 6 7 Adapter PIN numbers TABLE III. Group A inspection for device types 04 and 05 - continued. 1/ +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +15.0 V +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +2.5 V +2.0 V +29.5 V +15.0 V 8 9 10 -13.0 V +14.5 V GND -13.0 V +14.5 V GND GND -13.0 V +14.5 V GND -13.0 V +14.5 V GND GND -13.0 V +14.5 V GND 11 “ “ “ “ “ +20.0 V “ “ “ +20.0 V “ “ “ “ “ “ +20.0 V 12 MIL-M-38510/103H 53 -IIB +IIB ∆IIO/∆T 4/ IIO(R) IIO ∆VIO/∆T 4/ VIO(R) VIO Symbol no. -883 41 42 43 44 45 46 47 48 49 50 “ “ “ “ “ “ “ “ “ “ 38 “ 40 37 “ “ 36 “ 39 35 “ “ 34 33 “ “ 32 4001 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = +125°C 2 Subgroup “ “ “ “ “ -20.0V “ “ “ -20.0 V “ “ “ “ “ “ -20.0 V 13 14 numbers Adapter pin 2,3,4,5 2,3,4,5 2,3,4,5 1,3,4,5 1,3,4,5 1,3,4,5 3,4,5,8,9,10 3,4,5 3,4,5 3,4,5 1,2,3,4,5,8,9,10 1,2,3,4,5,8,9,10 1,2,3,4,5,8,9,10 1,2,3,4,5 1,2,3,4,5 1,2,3,4,5 1,2,3,4,5 energized Relays “ “ “ 14 “ “ “ 14 “ “ “ “ “ “ 14 No. E50 E49 E48 E47 E46 E45 E43 E42 E41 E40 E38 E37 E36 E35 E34 E33 E32 Value Pin measured “ “ “ “ “ V “ “ “ V “ “ “ “ “ “ V Unit -IIB = 20 (E50 – E34) -IIB = 20 (E49 – E33) -IIB = 20 (E48 – E32) +IIB = 20 (E34 – E47) +IIB = 20 (E33 – E46) +IIB = 20 (E32 – E45) IIO(R) = 20(E43 – E35) IIO = 20 (E42 – E34) IIO = 20 (E41 – E33) IIO = 20 (E40 – E32) VIO(R) = E38 VIO(R) = E37 VIO(R) = E36 VIO = E35 VIO = E34 VIO = E33 VIO = E32 Equation TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ -150 -150 -100 -150 -150 -100 -100 -25.0 “ “ -10.0 -25.0 “ “ -4.5 “ “ “ -4 Min “ “ “ “ “ +0.1 +100 +25.0 “ “ +10.0 +25.0 “ “ +4.5 “ “ “ +4 Max Limits “ “ “ “ “ nA pA/°C “ “ “ nA µV/°C “ “ “ “ “ “ mV Unit MIL-M-38510/103H 54 IOS 3/ -ICC +ICC II2 II1 ICEX VOL4 2/ VOL3 2/ VOL2 2/ VOL1 2/ CMRR VO(STB) Symbol 54 55 56 57 58 59 60 61 62 “ “ 3009 4001 4001 3005 3005 3011 53 52 “ 3007 4003 4001 51 no. -883 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = +125°C 2 Subgroup +15.0 V 2 3 +15.0 V 4 “ “ GND -17.0 V +12.O V GND -14.0 V +13.0 V +3.0 V +0.5 V +0.1 V GND GND +12.0 V -17.0 V GND -14.0 V +13.0 V +3.0 V +0.5 V +10.0 V +10.0 V -5 V -9.0 V +18.0 V +9.0 V +6.5 V “ “ +15.0 V “ “ +18.0 V +15.0 V +15.0 V +4.5 V +4.5 V 3 Calculation = 20 log [27.5 x 10 / (E34 – E33)] GND 1 “ “ -15.0 V “ “ -18.0 V -15.0 V -15.0 V GND GND -15.0 V 5 -3 mA 6 +5.0 V +32.0 V 50 mA 50 mA 8 mA 8 mA 7 Adapter PIN numbers TABLE III. Group A inspection for device types 04 and 05 - continued. 1/ “ “ “ “ “ “ “ “ “ GND +15.0 V 8 9 “ “ “ “ “ “ “ “ “ GND 10 11 12 MIL-M-38510/103H 55 IOS 3/ -ICC +ICC II2 II1 ICEX VOL4 2/ VOL3 2/ VOL2 2/ VOL1 2/ CMRR VO(STB) Symbol 53 54 55 56 57 58 59 60 61 62 “ “ “ 3009 4001 4001 3005 3005 3011 52 3007 4003 4001 51 no. -883 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = +125°C 2 Subgroup 13 14 numbers Adapter pin 1,2 1,2 1,2 1,2,12 1,2,12 1,2 1,2,12 1,2,12 1,2,12 1,2,12 1,2,4,5,10 energized Relays 7 5 4 2 1 7 “ “ “ 7 7 No. I62 I61 I60 I59 I58 I57 E56 E55 E54 E53 E51 Value Pin measured “ “ mA “ “ nA “ “ “ V V Unit TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ IOS = I62 -ICC = I61 +ICC = I60 II2 = I59 II1 = I58 ICEX = I57 VOL4 = E56 VOL3 = E55 VOL2 = E54 VOL1 = E53 VO(STB) = E51 Equation -5.0 -5 -5 -1 +80 +14 Min +150 +6.0 “ “ +500 +1.5 +1.5 +0.4 +0.4 Max Limits “ “ mA “ “ nA “ “ “ V dB V Unit MIL-M-38510/103H 56 -IIB +IIB ∆IIO/∆T IIO(R) IIO ∆VIO/∆T VIO(R) VIO Symbol no. -883 72 73 74 75 76 77 78 79 80 81 “ “ “ “ “ “ “ “ “ “ 69 “ 71 68 “ “ 67 “ 70 66 “ “ 65 64 “ “ 63 4001 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = -55°C 3 Subgroup “ “ “ “ “ “ GND 2 3 +2.0 V +29.5 V +15.0 V +2.5 V +2.0 V +29.5 V +15.0 V 4 “ “ “ GND +15.0 V +2.0 V +29.5 V +15.0 V “ “ “ “ “ “ “ “ “ “ GND GND +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V Calculation = [IIO(test 71) – IIO(test 8)] / 80°C 4/ “ “ “ GND Calculation = [VIO (E63) – VIO(E1)] / 80°C 4/ “ “ “ “ “ “ GND 1 -28.0 V -0.5 V -15.0 V -28.0 V -0.5 V -15.0 V -15.0 V -28.0 V -0.5 V -15.0 V -28.0 V -0.5 V -15.0 V -2.5 V -28.0 V -0.5 V -15.0 V 5 +15.0 V +2.0 V +29.5 V +15.0 V 6 7 Adapter PIN numbers TABLE III. Group A inspection for device types 04 and 05 - continued. 1/ +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +15.0 V +2.0 V +29.5 V +15.0 V +2.0 V +29.5 V +15.0 V +2.5 V +2.0 V +29.5 V +15.0 V 8 9 10 -13.0 V +14.5 V GND -13.0 V +14.5 V GND GND -13.0 V +14.5 V GND -13.0 V +14.5 V GND GND -13.0 V +14.5 V GND 11 “ “ “ “ “ +20.0 V “ “ “ +20.0 V “ “ “ “ “ “ +20.0 V 12 MIL-M-38510/103H 57 -IIB +IIB ∆IIO/∆T 4/ IIO ∆VIO/∆T 4/ VIO(R) VIO Symbol no. -883 72 73 74 75 76 77 78 79 80 81 “ “ “ “ “ “ “ “ “ “ 69 “ 71 68 “ “ 67 “ 70 66 “ “ 65 64 “ “ 63 4001 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = -55°C 3 Subgroup “ “ “ “ “ -20.0V “ “ “ -20.0 V “ “ “ “ “ “ -20.0 V 13 14 numbers Adapter pin 2,3,4,5 2,3,4,5 2,3,4,5 1,3,4,5 1,3,4,5 1,3,4,5 3,4,5,8,9,10 3,4,5 3,4,5 3,4,5 1,2,3,4,5,8,9,10 1,2,3,4,5,8,9,10 1,2,3,4,5,8,9,10 1,2,3,4,5 1,2,3,4,5 1,2,3,4,5 1,2,3,4,5 energized Relays “ “ “ 14 “ “ “ 14 “ “ “ “ “ “ 14 No. E81 E80 E79 E78 E77 E76 E74 E73 E72 E71 E69 E68 E67 E66 E65 E64 E63 Value Pin measured “ “ “ “ “ V “ “ “ V “ “ “ “ “ “ V Unit -IIB = 20 (E81 – E65) -IIB = 20 (E80 – E64) -IIB = 20 (E79 – E63) +IIB = 20 (E65 – E78) +IIB = 20 (E64 – E77) +IIB = 20 (E63 – E76) IIO(R) = 20(E74 – E67) IIO = 20 (E73 – E65) IIO = 20 (E72 – E64) IIO = 20 (E71 – E63) VIO(R) = E69 VIO(R) = E68 VIO(R) = E67 VIO = E66 VIO = E65 VIO = E64 VIO = E63 Equation TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ -200 -200 -150 -200 -200 -150 -200 -50.0 “ “ -20.0 -25.0 “ “ -4.5 “ “ “ -4 Min “ “ “ “ “ +0.1 +200 +50.0 “ “ +20.0 +25.0 “ “ +4.5 “ “ “ +4 Max Limits “ “ “ “ “ nA pA/°C “ “ “ nA µV/°C “ “ “ “ “ “ mV Unit MIL-M-38510/103H 58 IOS 3/ -ICC +ICC II2 II1 VOL4 2/ VOL3 2/ VOL2 2/ VOL1 2/ CMRR VO(STB) Symbol 85 86 87 88 89 90 91 92 “ “ 4001 4001 3005 3005 3011 84 83 “ 3007 4003 4001 82 no. -883 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = -55°C 3 Subgroup +15.0 V 2 3 +15.0 V 4 “ “ GND -17.0 V +12.O V -14.0 V +13.0 V +3.0 V +0.5 V +0.1 V GND GND +12.0 V -17.0 V -14.0 V +13.0 V +3.0 V +0.5 V +10.0 V +10.0 V -9.0 V +18.0 V +9.0 V +6.5 V “ “ +15.0 V +18.0 V +18.0 V +15.0 V +15.0 V +4.5 V +4.5 V 3 Calculation = 20 log [27.5 x 10 / (E65 – E64)] GND 1 “ “ -15.0 V -18.0 V -18.0 V -15.0 V -15.0 V GND GND -15.0 V 5 -2 mA 6 +5.0 V 50 mA 50 mA 8 mA 8 mA 7 Adapter PIN numbers TABLE III. Group A inspection for device types 04 and 05 - continued. 1/ “ “ “ “ “ “ “ “ GND +15.0 V 8 9 “ “ “ “ “ “ “ “ GND 10 11 12 MIL-M-38510/103H 59 IOS 3/ -ICC +ICC II2 II1 VOL4 2/ VOL3 2/ VOL2 2/ VOL1 2/ CMRR VO(STB) Symbol 85 86 87 88 89 90 91 92 “ “ 4001 4001 3005 3005 3011 84 83 “ 3007 4003 4001 82 no. -883 method Test MIL-STD See footnotes at end of device types 04 and 05. (figure 2) TA = -55°C 3 Subgroup 13 14 numbers Adapter pin 1,2 1,2 1,2 1,2,12 1,2,12 1,2,12 1,2,12 1,2,12 1,2,12 1,2,4,5,10 energized Relays 7 5 4 2 1 “ “ “ 7 7 No. I92 I91 I90 I89 I88 E87 E86 E85 E84 E82 Value Pin measured “ “ mA nA nA “ “ “ V V Unit IOS = I92 -ICC = I91 +ICC = I90 II2 = I89 II1 = I88 VOL4 = E87 VOL3 = E86 VOL2 = E85 VOL1 = E84 VO(STB) = E82 Equation TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ -6.0 -5 -5 +80 +14 Min +250 +7.0 +500 +500 +1.5 +1.5 +0.4 +0.4 Max Limits “ “ mA nA nA “ “ “ V dB V Unit MIL-M-38510/103H 60 no. -883 “ “ “ 98 97 96 95 94 “ “ 93 4004 method Test MIL-STD “ “ “ “ “ GND 1 “ “ “ “ “ GND 2 3 “ “ “ “ “ +15.0 V 4 “ “ “ “ “ -15.0 V 5 6 “ “ “ “ “ +15.0 V 7 Adapter PIN numbers tRLHC tRHLC tRLHC tRHLC tRLHC 107 106 105 104 103 These tests shall be performed using test conditions and procedures listed on figure 5. These tests shall be performed using test conditions and procedures listed on figure 5. (Tests 99 – 101) Same tests, terminal conditions, equations, and limits as subgroup 5 except TA = -55°C. 4001 102 These tests shall be performed using test conditions and procedures listed on figure 5. tRHLC AVE- AVE+ AVE(REF) AVE- AVE+ AVE(REF) Symbol See footnotes at end of device types 04 and 05. TA = -55°C 8 TA = +125°C 8 TA = +25°C 7 6 (figure 2) TA = +125°C 5 (figure 2) TA = +25°C 4 Subgroup TABLE III. Group A inspection for device types 04 and 05 - continued. 1/ 8 -10.0 V +10.0 V GND -10.0 V +10.0 V GND 9 10 11 “ “ “ “ “ +20.0 V 12 MIL-M-38510/103H 61 98 97 “ “ 96 “ 95 94 “ “ 93 4004 “ “ “ “ “ -20.0 V 13 14 numbers Adapter pin 1,2,3,5,7 1,2,3,5,7 1,2,3,5,7 1,2,3,5,7 1,2,3,5,7 1,2,3,5,7 energized Relays “ “ “ “ “ 14 No. E98 E97 E96 E95 E94 E93 Value Pin measured tRLHC tRHLC tRLHC tRHLC tRLHC 300 300 300 300 106 107 640 +8.0 +8.0 +10.0 +10.0 Max 105 AVE- = 10/(E96 – E98) AVE+ = 10/(E97 – E96) AVE- = 10/(E93 – E95) AVE+ = 10/(E94 – E93) Min 2/ VOL1 and VOL2 use VID = -6 mV; VOL3, VOL4 use VID = -5 mV. ∆ Represents delta. 4/ Test numbers 39, 44, 70, and 75, which require read and record measurements plus a calculation, may be omitted except when subgroups 2 and 3 are being performed for group A sampling inspections and group C and D end points. 3/ Maximum test duration shall be 10 ms. Limits 500 “ “ “ “ “ V Unit Equation 104 103 (Tests 99 – 101) Same tests, terminal conditions, equations, and limits as subgroup 5 except TA = -55°C 4001 102 tRHLC AVE- AVE+ AVE(REF) AVE- AVE+ AVE(REF) no. -883 method Test MIL-STD 1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan. TA = -55°C 8 TA = +125°C 8 TA = +25°C 7 6 (figure 2) TA = +125°C 5 (figure 2) TA = +25°C 4 Subgroup TABLE III. Group A inspection for device types 04 and 05 – continued. 1/ “ “ “ “ “ ns “ “ “ V/mV Unit MIL-M-38510/103H (figure 2) TA = +25°C 1 Subgroup 62 -ICC +ICC ICEX VOL4 VOL3 VOL2 VOL1 CMRR -IIB +IIB IIO VIO Symbol 3V 13 3V 27 V 15 V 3V 27 V 15 V 3V 27 V 15 V 2.5 V 3V 27 V 15 V -27 V -3 V -15 V -27 V -3 V -15 V -27 V -3 V -15 V -2.5 V -27 V -3 V -15 V -12 V 12 V 0V -12 V 12 V 0V -12 V 12 V 0V -2.5 V -12 V 12 V 0V 3.5 V 2.25 V 27 V 3V 18 V 15 V 15 V 15 16 17 18 19 20 21 -15 V -15 V -18 V -27 V -3 V -2.25 V -1 V -12 V 12 V -2.25 V -1 V 3 Calculation = 20 log [24 x 10 / |E3 - E2|] 27 V 12 14 15 V 15 V 8 11 3V 7 3V 27 V 6 10 15 V 5 27 V 2.5 V 4 9 3V 27 V 2 3 15 V 1 3 5 10.6 V -13.4 V -1.4 V 10.6 V -13.4 V -1.4 V 10.6 V -13.4 V -1.4 V 1.1 V 10.6 V -13.4 V -1.4 V 4 2 No. 1 Adapter PIN numbers Test 18 V 25 mA 25 mA 3.2 mA 3.2 mA 6 “ 7V -7 V “ “ “ 7V 7 “ “ “ 5 “ “ 1,3,4,5 “ “ 2,3,4,5 “ “ 1,2,3,4,5 “ “ “ 3,4,5 energized Relays 3 1 6 “ “ “ 8 to 9 “ “ “ “ “ “ “ “ “ “ “ “ 10 Pin I3 I2 I1 E17 E16 E15 E14 E13 E12 E11 E10 E9 E8 E7 E6 E5 E4 E3 E2 E1 Value mA mA µA “ “ “ V “ “ “ “ “ “ “ “ “ “ “ “ V Unit Measurement TABLE III. Group A inspection for device types 06 and 07 . 1/ -ICC = I3 +ICC = I2 ICEX = I1 VOL4 = E17 VOL3 = E16 VOL2 = E15 VOL1 = E14 -IIB = 20 (E13 – E3) -IIB = 20 (E12 – E2) -IIB = 20 (E11 – E1) +IIB = 20 (E3 – E10) +IIB = 20 (E2 – E9) +IIB = 20 (E1 – E8) IIO = 20 (E7 – E3) IIO = 20 (E6 – E2) IIO = 20 (E5 – E1) VIO = E4 VIO = E3 VIO = E2 VIO = E1 Equation -5.0 -1.0 90 “ “ “ “ “ -0.1 “ “ -75 “ “ “ -4.0 Min +10.0 +2.0 +1.5 +1.5 +0.4 +0.4 +750 +750 +500 +750 +750 +500 “ “ +75 “ “ “ +4.0 Max Limit 06 mA mA µA “ “ “ V dB “ “ “ “ “ “ “ “ nA “ “ “ mV Unit -5.0 -1.0 90 “ “ “ “ “ -0.1 “ “ -40 “ “ “ -1 Min +10.0 +2.0 +1.5 +1.5 +0.4 +0.4 +750 +750 +500 +750 +750 +500 “ “ +40 “ “ “ +1 Max Limit 07 mA mA µA “ “ “ V dB “ “ “ “ “ “ “ “ nA “ “ “ mV Unit MIL-M-38510/103H (figure 2) TA = +125°C 2 Subgroup 63 -ICC +ICC ICEX VOL4 VOL3 VOL2 VOL1 CMRR -IIB +IIB IIO VIO Symbol 3V 34 3V 27 V 15 V 3V 27 V 15 V 3V 27 V 15 V 2.5 V 3V 27 V 15 V -27 V -3 V -15 V -27 V -3 V -15 V -27 V -3 V -15 V -2.5 V -27 V -3 V -15 V -12 V 12 V 0V -12 V 12 V 0V -12 V 12 V 0V -2.5 V -12 V 12 V 0V 3.5 V 2.25 V 27 V 3V 18 V 15 V 15 V 36 37 38 39 40 41 42 -15 V -15 V -18 V -27 V -3 V -2.25 V -1 V -12 V 12 V -2.25 V -1 V 3 Calculation = 20 log [24 x 10 / |E24 – E23|] 27 V 33 35 15 V 15 V 29 32 3V 28 3V 27 V 27 31 15 V 26 27 V 2.5 V 25 30 3V 27 V 23 24 15 V 22 3 5 10.6 V -13.4 V -1.4 V 10.6 V -13.4 V -1.4 V 10.6 V -13.4 V -1.4 V 1.1 V 10.6 V -13.4 V -1.4 V 4 2 No. 1 Adapter PIN numbers Test 18 V 25 mA 25 mA 3.2 mA 3.2 mA 6 “ 7V -7 V “ “ “ 7V 7 “ “ “ 5 “ “ 1,3,4,5 “ “ 2,3,4,5 “ “ 1,2,3,4,5 “ “ “ 3,4,5 energized Relays 3 1 6 “ “ “ 8 to 9 “ “ “ “ “ “ “ “ “ “ “ “ 10 Pin I6 I5 I4 E34 E33 E32 E31 E30 E29 E28 E27 E26 E25 E24 E23 E22 E21 E20 E19 E18 Value mA mA µA “ “ “ V “ “ “ “ “ “ “ “ “ “ “ “ V Unit Measurement TABLE III. Group A inspection for device types 06 and 07 – continued. 1/ -ICC = I6 +ICC = I5 ICEX = I4 VOL4 = E34 VOL3 = E33 VOL2 = E32 VOL1 = E31 -IIB = 20 (E30 – E20) -IIB = 20 (E29 – E19) -IIB = 20 (E28 – E18) +IIB = 20 (E20 – E27) +IIB = 20 (E19 – E26) +IIB = 20 (E18 – E25) IIO = 20 (E24 – E20) IIO = 20 (E23 – E19) IIO = 20 (E22 – E18) VIO = E21 VIO = E20 VIO = E19 VIO = E18 Equation -4.5 -1.0 90 “ “ “ “ “ -0.1 “ “ -75 “ “ “ -7.0 Min +10.0 +10.0 +1.5 +1.5 +0.4 +0.4 +750 +750 +500 +750 +750 +500 “ “ +75 “ “ “ +7.0 Max Limit 06 mA mA µA “ “ “ V dB “ “ “ “ “ “ “ “ nA “ “ “ mV Unit -4.5 -1.0 90 “ “ “ “ “ -0.1 “ “ -40 “ “ “ -2.0 Min +10.0 +10.0 +1.5 +1.5 +0.4 +0.4 +750 +750 +500 +750 +750 +500 “ “ +40 “ “ “ +2.0 Max Limit 07 mA mA µA “ “ “ V dB “ “ “ “ “ “ “ “ nA “ “ “ mV Unit MIL-M-38510/103H (figure 3) TA = -55°C 3 Subgroup 64 -ICC +ICC VOL4 VOL3 VOL2 VOL1 CMRR -IIB +IIB IIO VIO Symbol 27 V 3V 54 55 3V 27 V 15 V 3V 27 V 15 V 3V 27 V 15 V 2.5 V 3V 27 V 15 V -27 V -3 V -15 V -27 V -3 V -15 V -27 V -3 V -15 V -2.5 V -27 V -3 V -15 V -12 V 12 V 0V -12 V 12 V 0V -12 V 12 V 0V -2.5 V -12 V 12 V 0V 3.5 V 2.25 V 27 V 3V 15 V 15 V 57 58 59 60 61 62 -15 V -15 V -27 V -3 V -2.25 V -1 V -12 V 12 V -2.25 V -1 V 3 Calculation = 20 log [24 x 10 / |E37 – E36|] 15 V 53 56 3V 52 3V 49 27 V 27 V 48 51 15 V 47 15 V 2.5 V 46 50 3V 27 V 44 45 15 V 43 3 5 10.6 V -13.4 V -1.4 V 10.6 V -13.4 V -1.4 V 10.6 V -13.4 V -1.4 V 1.1 V 10.6 V -13.4 V -1.4 V 4 2 No. 1 Adapter PIN numbers Test 25 mA 25 mA 3.2 mA 3.2 mA 6 “ “ “ “ “ 7V 7V 7 “ “ “ 5 “ “ 1,3,4,5 “ “ 2,3,4,5 “ “ 1,2,3,4,5 “ “ “ 3,4,5 energized Relays 3 1 “ “ “ 8 to 9 “ “ “ “ “ “ “ “ “ “ “ “ 10 Pin I8 I7 E51 E50 E49 E48 E47 E46 E45 E44 E43 E42 E41 E40 E39 E38 E37 E36 E35 Value mA mA “ “ “ V “ “ “ “ “ “ “ “ “ “ “ “ V Unit Measurement TABLE III. Group A inspection for device types 06 and 07 – continued. 1/ -ICC = I8 +ICC = I7 VOL4 = E51 VOL3 = E50 VOL2 = E49 VOL1 = E48 -IIB = 20 (E47 – E37) -IIB = 20 (E46 – E36) -IIB = 20 (E45 – E35) +IIB = 20 (E37 – E44) +IIB = 20 (E36 – E43) +IIB = 20 (E35 – E42) IIO = 20 (E41 – E37) IIO = 20 (E40 – E36) IIO = 20 (E39 – E35) VIO = E38 VIO = E37 VIO = E36 VIO = E35 Equation -6.0 90 “ “ “ “ “ -0.1 “ “ -100 “ “ “ -7.0 Min +11.5 +1.5 +1.5 +0.6 +0.6 “ “ “ “ “ +1000 “ “ +100 “ “ “ +7.0 Max Limit 06 mA mA “ “ “ V dB “ “ “ “ “ “ “ “ nA “ “ “ mV Unit -6.0 90 “ “ “ “ “ -0.1 “ “ -75 “ “ “ -2.0 Min +11.5 +1.5 +1.5 +0.6 +0.6 “ “ “ “ “ +1000 “ “ +75 “ “ “ +2.0 Max Limit 07 mA mA “ “ “ V dB “ “ “ “ “ “ “ “ nA “ “ “ mV Unit MIL-M-38510/103H 65 TA = -55°C (figure 2) 6 TA = +125°C (figure 2) 5 TA = +25°C (figure 2) 4 Subgroup AV Symbol 65 64 63 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V -15 V -15 V -15 V -15 V -15 V -15 V 3 5 -11.5 V -1.5 V -11.5 V -1.5 V -11.5 V -1.5 V 4 2 No. 1 Adapter PIN numbers Test 6 7 “ 3,4 “ 3,4 “ 3,4 energized Relays “ “ “ “ “ 10 Pin E54 EC E53 EB E52 EA Value “ “ “ “ “ V Unit Measurement TABLE III. Group A inspection for device types 06 and 07 – continued. 1/ AV = 10 / (EC – E54) AV = 10 / (EB – E53) AV = 10 / (EA – E52) Equation +5 +5 +10 Min Max Limit 06 V/mV V/mV V/mV Unit +10 +10 +20 Min Max Limit 07 V/mV V/mV V/mV Unit MIL-M-38510/103H Null (figure 6) 66 “ Apply 100 mV “ “ Open k1 Close k2 67 “ Change 5 mV OD tRHLC “ “ Reset tRLHC “ Apply 100 mV “ “ “ 15 V 1 “ 66 No. Test Close k1 Apply 5 mV OD VIO Release k31, k4 VIO Symbol TA = +25°C 9 Subgroup “ “ “ “ “ “ “ “ “ “ “ -15 V 2 “ “ “ “ “ “ “ “ “ “ “ 1.4 V 3 “ “ “ “ “ “ “ “ “ E0 4 “ “ “ 5V “ “ “ “ -5 V “ “ 0V 5 Adapter PIN numbers 2 mA 2 mA “ “ 0V 2 mA 2 mA “ “ “ “ 0V 6 0V “ “ “ 5V 0V 5V “ “ “ “ 5V 7 2 2 2 1 1 1 1 1 3,4 energized Relays Counter pulse width Counter pulse width 8 Pin t2 t1 E0 Value Measurement TABLE III. Group A inspection for device types 06 and 07 – continued. 1/ ns ns V Unit t2 = tRHLC t1 = tRLHC Equation Min 160 125 Max Limits ns ns Unit MIL-M-38510/103H Null (figure 6) 67 “ Apply 100 mV “ “ Open k1 Close k2 69 “ Change 5 mV OD tRHLC “ “ Reset tRLHC “ Apply 100 mV “ “ “ 15 V 1 “ 68 No. Test Close k1 Apply 5 mV OD VIO Release k3, k4 VIO Symbol TA = +125°C 10 Subgroup “ “ “ “ “ -15 V “ “ 15 V “ “ -15 V 2 “ “ “ “ “ “ “ “ “ “ “ 1.4 V 3 “ “ “ “ “ “ “ “ “ E0 E0 4 “ “ “ 5V “ “ “ “ -5 V “ “ 0V 5 Adapter PIN numbers 2 mA 2 mA “ “ 0V 2 mA 2 mA “ “ “ “ 0V 6 0V “ “ “ 5V 0V “ “ “ “ “ 5V 7 2 2 2 1 1 1 1 1 3,4 energized Relays Counter pulse width Counter pulse width 8 Pin t4 t3 E0 Value Measurement TABLE III. Group A inspection for device types 06 and 07 – continued. 1/ ns ns V Unit t4 = tRHLC t3 = tRLHC Equation Min 160 160 Max Limits ns ns Unit MIL-M-38510/103H Null (figure 6) 68 “ “ Open k1 Close k2 Apply 100 mV “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ 1.4 V 3 “ “ “ “ “ “ “ “ “ E0 4 “ “ “ 5V “ “ “ “ -5 V “ “ 0V 5 Adapter PIN numbers 2 mA 2 mA “ “ 0V 2 mA 2 mA “ “ “ “ 0V 6 0V “ “ “ 5V 0V “ “ “ “ “ 5V 7 2 2 2 1 1 1 1 1 3,4 energized Relays Counter pulse width Counter pulse width 8 Pin t6 t5 E0 Value Measurement ns ns V Unit t6 = tRHLC t5 = tRLHC Equation Min 160 125 Max Limits 1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan. “ “ Change 5 mV OD tRHLC “ Reset 71 “ “ tRLHC “ “ Apply 100 mV “ “ “ “ “ -15 V 2 Close k1 “ “ 15 V 1 “ 70 No. Test Apply 5 mV OD VIO Release k3, k4 VIO Symbol TA = -55°C 11 Subgroup TABLE III. Group A inspection for device types 06 and 07 – continued. 1/ ns ns Unit MIL-M-38510/103H 69 Max +2 mV 20 µA 20 µA --- Min -2 mV 0 µA 0 µA --- Limits --- ±2 µA ±2 µA ±0.5 mV Delta --- 0 µA 0 µA -3.5 mV Min Max --- 75 µA 75 µA +3.5 mV Limits --- ±7.5 µA ±7.5 µA ±0.5 mV Delta Device type 02 +VCC = +12 V, -VCC = -6 V Device types 01 and 03 +VCC = +12 V, -VCC = -6 V Device types 04 and 05 -1 -100 nA -100 nA -3 mV Min Limits 10 nA ±0.1 nA ±0.1 nA +3 mV Max -0.1 nA --- ±5 nA -0.1 nA -4 mA Min ±12.5 nA ±12.5 nA ±0.5 mV Delta +VCC = +15 V, -VCC = -15 V Delta --- 500 nA 500 nA +4 mA Max --- ±50 nA ±50 nA ±1 mV 4/ ICEX deltas and limits apply to test 26 in table III. For device types 06 and 07, -IIB deltas and limits apply to tests 11, 12, and 13 in table III. 3/ For device types 01, 02, and 03, -IIB deltas and limits apply to test 5 in table III. For device types 04 and 05, -IIB deltas and limits apply to tests 15, 16, and 17 in table III. For device types 06 and 07, +IIB deltas and limits apply to tests 8, 9, and 10 in table III. 2/ For device types 01, 02, and 03, +IIB deltas and limits apply to test 4 in table III. For device types 04 and 05, +IIB deltas and limits apply to tests 12, 13, and 14 in table III. For device types 06 and 07, VIO deltas and limits apply to tests 1, 2, and 3 in table III. Min --- -0.1 nA -0.1 nA -1 mV +1 mV Max --- +500 nA +500 nA Limits ±VCC = ±15 V ±VCC = ±15 V Limits Device type 07 Device type 06 1/ For device types 01, 02, and 03, VIO deltas and limits apply to tests 1 and 2 in table III. For device types 04 and 05, VIO deltas and limits apply to tests 1, 2, and 3 in table III. ICEX 4/ -IIB +IIB VIO Test TABLE IV. Group C end-point electrical parameters. (TA = +25°C) 1/ 2/ 3/ --- ±50 nA ±50 nA ±0.5 mV Delta MIL-M-38510/103H MIL-M-38510/103H 4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. 4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. Tests shall be as specified in table II herein. 4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535. 4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows: a. End point electrical parameters shall be as specified in table II herein. b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical parameters shall be as specified in table II herein. 4.5 Methods of inspection. Methods of inspection shall be specified and as follows. 4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. 4.5.2 Burn-in and life test cooldown procedure. When devices are measured at +25°C following application of the steady state life or burn-in condition, they shall be cooled to within 10°C of their power stable condition at room temperature prior to removal of the bias. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point’s packaging activity within the Military Department or Defense Agency, or within the Military Department’s System Command. Packaging data retrieval is available from the managing Military Department’s or Defense Agency’s automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 70 MIL-M-38510/103H 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. PIN and compliance identifier, if applicable (see 1.2). c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. Requirements for certificate of compliance, if applicable. e. Requirements for notification of change of product or process to acquiring activity in addition to notification of the qualifying activity, if applicable. f. Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003), corrective action and reporting of results, if applicable. g. Requirements for product assurance options. h. Requirements for special carriers, lead lengths, or lead forming, if applicable. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government. i. Requirements for "JAN" marking. j. Packaging requirements (see 5.1). 6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists. 71 MIL-M-38510/103H 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43128-3990. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-STD-1331 and as follows: 6.5.1 Logic threshold voltage. The approximate voltage at the output of the comparator at which the loading logic circuitry changes its digital state. 6.5.2 Voltage gain. The ratio of the change in output voltage to the change in voltage between the input terminals producing it with the dc output level in the vicinity of the logic threshold voltage (AV). 6.5.3 Response time. The interval between the application of an input step function and the time when the output crosses the logic threshold voltage. The input step drives the comparator from some initial, saturated input voltage to an input level just barely in excess of that required to bring the output from saturation to the logic threshold voltage. This excess is referred to as the voltage overdrive. 6.5.4 Positive output level. The dc output voltage in the positive direction with the input voltage equal to or greater than a minimum specified amount. 6.5.5 Negative output level. The dc output voltage in the negative direction with the input voltage equal to or greater than a minimum specified amount. 6.5.6 Output sink current. The maximum negative current that can be delivered by the comparator (IOL). 6.5.7 Peak output current. The maximum current that may flow into the output load without causing damage to the comparator. 6.5.8 Differential input voltage. The difference between the two voltages applied to the input terminals of an amplifier. The difference is considered positive when the noninverting input is positive with respect to the inverting input and negative when the inverting input is positive with respect to the noninverting input (VID). 6.5.9 Strobe current. The current into the strobe terminal of an amplifier (ISTB). 6.5.10 Output leakage current. The current into the output of an amplifier with the output at high level (IO). 6.5.11 Ground leakage current. The current into the ground terminal of an amplifier with the output at high level (IG). 6.5.12 Input leakage current. The current into the input terminal of an amplifier with the output at a specified voltage (II). 72 MIL-M-38510/103H 6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired to Government logistic support should be acquired to device class B (see 1.2.2), and lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number. 6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535. Military device type 01 02 03 04 05 06 07 Generic-industry type 710 711 LM106 LM111 LH2111 LM119 LT119A 6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes. Custodians: Army – CR Navy – EC Air Force – 11 NASA – NA DLA – CC Preparing activity: DLA - CC Project 5962-2102 Review activities: Army – MI, SM Navy - AS, CG, MC, SH, TD Air Force – 03, 19, 99 NOTE: The activities listed above were interested in this document as of this date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at http://assist.daps.dla.mil. 73