1 A, 1% Precision Very Low Dropout Voltage Regulator with Enable

NCP708
1 A, 1% Precision Very Low
Dropout Voltage Regulator
with Enable
The NCP708 is a Very Low Dropout Regulator which provides up to
1 A of load current and maintains excellent output voltage accuracy of
1.5% including line, load and temperature variations. The operating
input voltage range from 2.4 V up to 5.5 V makes this device suitable
for Li−ion battery powered products as well as post−regulation
applications. The product is available in 3.3 V fixed output voltage
option. Other voltage options are possible on request. NCP708 is fully
protected against overheating and output short circuit.
Small 6−pin UDFN6 3x3 package makes the device especially
suitable for space constrained applications.
Features
Other Output Voltage Options Available on Request.
Low Quiescent Current of Typ. 200 mA
Very Low Dropout: 250 mV Max. at IOUT = 1 A
±1.5% Accuracy Over Load/Line/Temperature
High PSRR: 70 dB at 1 kHz
Internal Soft−Start to Limit the Inrush Current
Thermal Shutdown and Current Limit Protections
Stable with a 4.7 mF Ceramic Output Capacitor
Available in UDFN6 3x3 mm Package
These are Pb−Free Devices
708
330
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
EN
1
6 IN
GND
2
5 OUT_s
N/C
3
4 OUT
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 8 of this data sheet.
VOUT = 3.3 V @ 1 A
IN
OUT
NCP708
CIN
1
UDFN6
CASE 517DD
PIN CONNECTION
Hard−Drives, SSDs
Servers, Networking Equipment
Telecom Equipment
Battery Powered Applications
VIN = 3.6 − 5.5 V
1
(Note: Microdot may be in either location)
Typical Applications
•
•
•
•
MARKING
DIAGRAM
A
L
Y
W
G
• Operating Input Voltage Range: 2.4 V to 5.5 V
• Fixed Output Voltage Option: 3.3 V
•
•
•
•
•
•
•
•
•
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SNS
EN
ON
GND
OFF
COUT
4.7 mF
Ceramic
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2015
December, 2015 − Rev. 2
1
Publication Order Number:
NCP708/D
NCP708
Figure 2. Simplified Internal Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
EN
2
GND
Power supply ground.
3
N/C
Not connected. This pin can be tied to ground to improve thermal dissipation.
4
OUT
Regulated output voltage. A minimum 4.7 mF ceramic capacitor is needed from this pin to ground to
assure stability.
5
OUT_S
6
IN
−
Exposed
Pad
Description
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator
into shutdown mode.
Output voltage sense connection. This pin should be connected to the output voltage rail.
Input pin. A small capacitor is needed from this pin to ground to assure stability.
This pad enhances thermal performance and is electrically connected to GND. It is recommended
that the exposed pad is connected to the ground plane on the board or otherwise left open.
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2
NCP708
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V
V
Enable Input
VEN
−0.3 V to VIN + 0.3 V
V
Output Short Circuit Duration
tSC
Indefinite
s
TJ(MAX)
150
°C
Input Voltage (Note 1)
Maximum Junction Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, WDFN6 3 x 3,
Thermal Resistance, Junction−to−Air
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3
Symbol
Value
Unit
RqJA
55
°C/W
NCP708
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.3 V
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 2.4 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless
otherwise noted. Typical values are at TJ = +25°C. (Note 3)
Test Conditions
Parameter
Symbol
Min
VIN
2.4
UVLO
1.2
3.25
Operating Input Voltage
Typ
Max
Unit
5.5
V
1.6
1.9
V
3.3
3.35
Undervoltage lock−out
VIN rising
Output Voltage Accuracy
VOUT + 0.3 V ≤ VIN ≤ 5.25 V, IOUT = 0 – 1 A
VOUT
Line Regulation
VOUT + 0.3 V ≤ VIN ≤ 5.25 V, IOUT = 10 mA
RegLINE
Load Regulation
IOUT = 0 mA to 1 A
Load Transient
Any 200 mA load step from IOUT = 10 mA to
1A or 10 mA to 1 A in 10 ms, COUT = 10 mF
Dropout voltage (Note 4)
IOUT = 1 A, VOUT(nom) = 3.3 V
VDO
220
Output Current Limit
VOUT = 90% VOUT(nom)
ICL
Quiescent current
IOUT = 0 mA
Ground current
IOUT = 1 A
Shutdown current
VEN ≤ 0 V, VIN = 2.0 to 5.5 V
Reverse Leakage Current
in Shutdown
VIN = 5.5 V, VOUT = VOUT(NOM),
VEN < 0.4 V
EN Pin High Threshold
EN Pin Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
EN Pin Input Current
VEN = 5.5 V
IEN
Turn−on Time
COUT = 4.7 mF,
from assertion EN pin to 98% Vout(nom)
tON
mV
RegLOAD
2
mV
TranLOAD
±60
mV
Output Noise Voltage
VOUT = 3.3 V, VIN = 3.6 V, IOUT = 0.1 A
f = 200 Hz to 100 kHz
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
mV
A
IQ
180
IGND
200
VEN_HI
VEN_LO
VIN = 3.8 V,
VOUT = 3.3 V
IOUT = 0.1 A
330
1.1
IREV
Power Supply Rejection Ratio
V
2
mA
230
mA
0.1
1
mA
1.5
5
mA
0.4
V
V
500
nA
0.9
100
ms
200
f = 1 kHz
PSRR
70
dB
VNOISE
100
mVrms
Temperature increasing from TJ = +25°C
TSD
160
°C
Temperature falling from TSD
TSDH
−
20
°C
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V.
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C.
2.0
3.35
VOUT−NOM = 3.3 V
3.33
3.32
3.31
3.30
3.29
3.28
3.27
3.26
3.25
−40
VIN = VOUT−NOM + 0.3 V to 4.5 V
VOUT−NOM = 3.3 V
1.5
LINE REGULATION (mV)
OUTPUT VOLTAGE (V)
3.34
1.0
0.5
0
−0.5
−1.0
−1.5
−20
0
20
40
60
80
100
−2.0
−40
120
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
Figure 4. Line Regulation vs. Temperature
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4
120
NCP708
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C.
5
275
VOUT−NOM = 3.3 V
VOUT = VOUT−NOM − 100 mV
250
DROPOUT VOLTAGE (mV)
LOAD REGULATION (mV)
4
3
2
1
0
−1
−2
−3
−4
−5
−40 −20
VOUT−NOM = 3.3 V
IOUT = 0 mA to 1000 mA
0
20
40
60
80
100
225
200
175
150
125
100
75
50
25
0
0
120
200
400
600
800
1000
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
Figure 5. Load Regulation vs. Temperature
Figure 6. Dropout Voltage vs. Output Current
220
190
QUIESCENT CURRENT (mA)
GROUND CURRENT (mA)
200
180
170
160
150
140
VOUT−NOM = 3.3 V
200
400
600
800
180
160
VOUT−NOM = 3.3 V
IOUT = 0 mA
140
120
−40
130
0
200
1000
0
20
40
60
80
100
120
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
Figure 7. Ground Current vs. Output Current
Figure 8. Quiescent Current vs. Temperature
200
1.0
VIN = 5.5 V
VOUT−NOM = 3.3 V
VEN = 0 V
SHUTDOWN CURRENT (mA)
0.9
QUIESCENT CURRENT (mA)
−20
190
180
170
160
VOUT−NOM = 3.3 V
IOUT = 0 mA
150
4.0
4.5
5.0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40
140
3.5
0.8
5.5
−20
0
20
40
60
80
100
120
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 9. Quiescent Current vs. Input Voltage
Figure 10. Shutdown Current vs. Temperature
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5
NCP708
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C.
2.1
1.9
1.7
1.5
VOUT−FORCED = 0 V
VOUT−NOM = 3.3 V
1.3
1.1
−40
ENABLE THRESHOLD VOLTAGE (V)
OUTPUT CURRENT LIMIT (A)
2.3
−20
0
20
40
60
80
100
2.1
1.9
1.7
1.5
VOUT−FORCED = VOUT−NOM − 0.1 V
VOUT−NOM = 3.3 V
1.3
1.1
−40
120
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 11. Short Circuit Current vs.
Temperature
Figure 12. Output Current Limit vs.
Temperature
0.9
120
0.5
VOUT−NOM = 3.3 V
ENABLE INPUT CURRENT (mA)
SHORT CIRCUIT CURRENT (A)
2.3
0.8
OFF −> ON
0.7
ON −> OFF
0.6
0.5
0.4
−40
−20
0
20
40
60
80
100
VOUT−NOM = 3.3 V
0.4
0.3
0.2
0.1
0
−40
120
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 13. Enable Threshold Voltage vs.
Temperature
Figure 14. Enable Input Current vs.
Temperature
120
90
VOUT−NOM = 3.3 V
80
50
40
30
20
10
0
4.6 V
500 mV/div
60
20 mV/div
PSRR (dB)
70
COUT = 4.7 mF X7R 0805
IOUT = 30 mA
VIN = 3.8 V
VOUT−NOM = 3.3 V
10
100
1K
10K
100K
tR = tF = 1 ms
VOUT
3.3 V
20 ms/div
1M
FREQUENCY (Hz)
Figure 15. Power Supply Rejection Ratio
Figure 16. Line Transient Response
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6
VIN
3.6 V
NCP708
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C.
IOUT
IIN
VIN
VOUT
VOUT
3.3 V
1 V/div
50 mV/div
500 mA/div
tR = tF = 1 ms
1 mA
VOUT−NOM = 3.3 V
50 mA/div
1000 mA
40 ms/div
2 ms/div
Figure 17. Load Transient Response
Figure 18. Turn−ON/OFF − VIN Driven (slow)
IIN
COUT is discharged just by
load resistance 250 Ohm
1 V/div
VOUT
100 mA/div
0V
VOUT−NOM = 3.3 V
IIN
Figure 19. Turn−ON/OFF − VIN Driven (fast)
Figure 20. Turn−ON/OFF − EN Driven
220
1.6
200
PD(MAX), 2 oz Cu 1.4
180
1.2
160
PD(MAX), 1 oz Cu 1.0
140
0.8
120
0.6
qJA, 1 oz Cu
100
80
qJA, 2 oz Cu
60
100
200
300
400
500
PCB COPPER AREA (mm2)
Figure 21. qJA and PD(MAX) vs. Copper Area
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7
600
0.4
0.2
0
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
1 ms/div
qJA, JUNCTION TO AMBIENT
THERMAL RESISTANCE (°C/W)
40 ms/div
0
VEN
VOUT
0V
1 V/div
3.3 V
0V
3.3 V
VIN
5.5 V
VOUT−NOM = 3.3 V
0.9 V
1 V/div
100 mA/div
VOUT−NOM = 3.3 V
NCP708
APPLICATIONS INFORMATION
Input Decoupling (Cin)
Thermal
A 4.7 mF capacitor either ceramic or tantalum is
recommended and should be connected as close as possible
to the pins of NCP708 device. Higher values and lower ESR
will improve the overall line transient response.
As power across the NCP708 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
This is stating that when the NCP708 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation.
The power dissipation across the device can be roughly
represented by the equation:
Output Decoupling (Cout)
The minimum decoupling value is 4.7 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors MLCC. If a
tantalum capacitor is used, and its ESR is large, the loop
oscillation may result. Larger values improve noise
rejection and PSRR.
P D + ǒV IN * V OUTǓ * I OUT [W]
Enable Operation
(eq. 1)
The maximum power dissipation depends on the thermal
resistance of the case and circuit board, the temperature
differential between the junction and ambient, PCB
orientation and the rate of air flow.
The maximum allowable power dissipation can be
calculated using the following equation:
The enable pin EN will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. If the enable is not used then the
pin should be connected to VIN.
Hints
P MAX + ǒT J * T AǓńq JA [W]
Please be sure the Vin and GND lines are sufficiently wide.
If their impedance is high, noise pickup or unstable
operation may result.
Set external components, especially the output capacitor,
as close as possible to the circuit.
The sense pin SNS trace is recommended to be kept as far
from noisy power traces as possible and as close to load as
possible.
(eq. 2)
Where (TJ − TA) is the temperature differential between
the junction and the surrounding environment and qJA is the
thermal resistance from the junction to the ambient.
Connecting the exposed pad and non connected pin 3 to
a large ground pad or plane helps to conduct away heat and
improves thermal relief.
ORDERING INFORMATION
Device
NCP708MU330TAG
Nominal Ooutput Voltage
Package
Shipping†
3.3 V
UDFN6 3 x 3
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
NCP708
PACKAGE DIMENSIONS
UDFN6 3x3, 0.95P
CASE 517DD
ISSUE O
A
D
L
L
B
L1
PIN 1
REFERENCE
2X
0.15 C
2X
DETAIL A
ÇÇÇ
ÇÇÇ
ÇÇÇ
0.15 C
ALTERNATE TERMINAL
CONSTRUCTIONS
E
NOTES:
5. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
6. CONTROLLING DIMENSION: MILLIMETERS.
7. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM THE TERMINAL TIP.
8. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÇÇ
ÇÇ
ÉÉ
EXPOSED Cu
TOP VIEW
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
DETAIL B
0.10 C
A
7X
0.08 C
(A3)
NOTE 4
SIDE VIEW
C
A1
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
6X
D2
DETAIL A
1
6X
L
PKG
OUTLINE
3
E2
K
6
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.30
2.50
3.00 BSC
1.55
1.75
0.95 BSC
0.28 REF
0.30
0.50
−−−
0.15
4
6X
b
e
0.10 C A B
BOTTOM VIEW
0.05 C
2.60
0.60
1.80
3.30
1
0.95
PITCH
0.45
NOTE 3
6X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NCP708/D
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