8K/16K SPI EEPROM Migration

8K/16K SPI EEPROM Migration
Author:
Dragos Ciofu
Microchip Technology Inc.
INTRODUCTION
This migration document describes how to replace the
25XX080A/B or 25XX160A/B devices with newer
25XX080C/D and 25XX160C/D devices, respectively.
Note:
This device has been designed to perform to the parameters of its data sheet. It
has been tested to an electrical specification designed to determine its conformance with these parameters. Due to
process differences in the manufacture of
this device, this device may have different
performance characteristics than its earlier version. These differences may cause
this device to perform differently in your
application than the earlier version of this
device.
Current Part
Recommended
Newer Part
25AA080A
25AA080C
25LC080A
25LC080C
25AA160A
25AA160C
25LC160A
25LC160C
25AA080B
25AA080D
25LC080B
25LC080D
25AA160B
25AA160D
25LC160B
25LC160D
There are five topics addressed throughout this
document:
•
•
•
•
•
•
New package option
Absolute maximum ratings
DC characteristics
AC characteristics
AC Test conditions
Replacement considerations
NEW PACKAGE OPTION
With the C/D revision of both the 25XX080 and
25XX160 parts, a new package has been introduced:
• 8-Lead Plastic Dual Flat, No Lead Package (MN)
– 2 x 3x 0.75 mm Body TDFN, shown in Figure 1.
FIGURE 1:
TDFN PACKAGE
TDFN
(MN)
CS 1
SO 2
WP 3
VSS 4
Note:
8 VCC
7 HOLD
6 SCK
5 SI
For the most current package drawings,
please see the Microchip Packaging
Specification
located
at
http://
www.microchip.com/packaging.
A new option has been respectively added to the
Product Identification System where, apart from the
already available MS, P, SN and ST options, the new
MNY ordering option marking represents an 8-lead
2x3 mm TDFN package.
Microchip Technology is continuously improving the
fabrication process and the parts that are produced.
We recently introduced a new revision of the 25XX080
and the 25XX160 SPI Serial EEPROMs.
While the devices are very similar between revisions,
we recommend that you review the data sheets for
each device to see how these changes may apply to
your system requirements.
The transition from older A/B devices to newer C/D
devices also adds a higher density (smaller) package.
 2014 Microchip Technology Inc.
DS20005349A-page 1
ABSOLUTE MAXIMUM RATINGS
DC CHARACTERISTICS
The absolute maximum ratings have been adjusted for
VCC, with the lowering of the maximum value to 6.5V
from 7.0V. For the ambient temperature under bias
parameter, the low end of the range has been
increased to -40°C from -65°C.
When comparing DC Characteristics for the two revisions, please note that parameters ‘D001 – VIH1’ and
‘D002 – VIH2’ have been merged into the same parameter, ‘D001 – VIH1’. In accordance, the parameter numbers for the remaining parameters have been shifted by
one unit (i.e., ‘D011 – ICC Read’ becomes ‘D010 – ICC
Read’ in the data sheet for the new revision).
Parameter
Value for Newer
C/D Revision
Value for Older
A/B Revision
VCC
6.5V
7.0V
-40°C to +125°C
-65°C to +125°C
Ambient
temperature
under bias
TABLE 1:
The differences in DC Characteristics between the two
revisions are listed in Table 1.
DC CHARACTERISTICS
Parameter No.
Value for Newer C/D Revision
D001 – VIH1 and D002 – VIH2 merged
to D001 – VIH1
0.7 VCC to VCC+1
D003 – VIL1 becomes
D002 – VIL1
-0.3V to 0.3 VCC
D011 – ICC Read becomes
D010 – ICC Read
D0012 – ICC Write
VCC ≥ 2.7V
5 mA
5 mA
3 mA
VCC = 5.5V
VCC = 2.5V
Value for Older A/B Revision
2.0V to VCC + 1
0.7 VCC to VCC + 1
VCC ≥ 2.7V
VCC ≤ 2.7V
-0.3V to 0.8V
6 mA
3 mA, VCC = 5.5V
AC CHARACTERISTICS
For the AC Characteristics, the main differences
between the two revisions are the more relaxed CLK
Rise and Fall time specifications.
TABLE 2:
AC CHARACTERISTICS
Parameter No.
Value for Newer C/D Revision
Value for Older A/B Revision
7 – TR
2 μs
500 ns
8 – TF
2 μs
500 ns
Please note that for the C/D parts, the load capacitance
- CL (as presented in Table 1-3 in the data sheets) has
been specified as being CL = 50 pF.
DS20005349A-page 2
 2014 Microchip Technology Inc.
MIGRATION CONSIDERATIONS
There are no outstanding issues when migrating from
A/B to C/D revisions for the 25XX080 and 25XX160
parts. There are no PCB and assembly requirement
differences between revisions, if the package is
maintained. However, Microchip’s customers can opt
for the more compact TDFN option for the C/D
revisions.
The significance of the last letter (version) in the
product’s name remains consistent, where the lower
letter ‘C’ corresponds to a 16-byte page device and the
higher letter ‘D’ corresponds to a 32-byte page device.
The devices’ parameters remain similar throughout,
with a couple of exceptions due to continuous
improvement and characterization of Microchip’s parts.
The newly characterized parameters ensure reliability
for both the end user and integrators.
 2014 Microchip Technology Inc.
DS20005349A-page 3
NOTES:
DS20005349A-page 4
 2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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FITNESS FOR PURPOSE. Microchip disclaims all liability
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
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SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-735-6
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CERTIFIED BY DNV
== ISO/TS 16949 ==
 2014 Microchip Technology Inc.
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devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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and manufacture of development systems is ISO 9001:2000 certified.
DS20005349A-page 5
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