dsPIC30F6010 to dsPIC30F6010A dsPIC30F6010 to dsPIC30F6010A Migration Guidelines Note: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, the dsPIC30F6010A may have different performance characteristics than its earlier version, dsPIC30F6010. These differences may cause this device to perform differently in your application than the earlier version of this device. Note: You should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the oscillator mode may be required. GENERAL INFORMATION CODE COMPATIBILITY This document provides an overview of considerations for migrating from dsPIC30F6010 to dsPIC30F6010A devices. If you are undertaking this migration, it is recommended that you download data sheets and errata documents on these devices from our web site, www.microchip.com. For the most part, dsPIC30F code developed with the MPLAB® C30 C Compiler and MPLAB ASM30 Assembler is directly portable between the dsPIC30F6010 and dsPIC30F6010A devices. However, in some cases small changes may be required depending on which features have been enhanced. To migrate source code to the dsPIC30F6010A device, perform these two steps: Most errata for the dsPIC30F30F6010 Rev. B1/B2 silicon have been fixed in the dsPIC30F30F6010A Rev. A2 silicon. The specific device errata documents are listed here for reference: • dsPIC30F6010 Rev. B1 errata – DS80182 • dsPIC30F6010 Rev. B2 errata – DS80195 Appendix B of the “dsPIC30F30F6010A/6015 Data Sheet” (DS70150) provides device comparison summaries between dsPIC30F6010 and dsPIC30F6010A devices. Appendix C of the “dsPIC30F30F6010A/6015 Data Sheet” (DS70150) provides device migration information between dsPIC30F6010 and dsPIC30F6010A devices. Respective data sheets and errata documents for both devices are posted on Microchip’s web site, www.microchip.com. In most cases, code developed for the dsPIC30F6010 devices is directly portable to the dsPIC30F6010A devices, with the exceptions summarized in the “Peripherals” section. 1. 2. Include the appropriate dsPIC30F6010A device header (.h) and include (.inc) files in the source code files. Remove any work arounds implemented in source code or MPLAB C30 command line options for errata described in the “dsPIC30F6010 Rev. B2 Silicon Errata” (DS80195B) document. Note: See “Recommended Procedure for Migrating from dsPIC30F6010 to dsPIC30F6010A” on page 4. OSCILLATOR OPERATION Several oscillator modes have been added to the dsPIC30F6010A device: • FRC with x4, x8 and x16 PLL mode • HS/2 with x4, x8 and x16 PLL mode • HS/3 with x4, x8 and x16 PLL mode In support of the Fast RC Oscillator (FRC), the OSCTUN Special Function Register (SFR) has been added. This register includes six FRC tuning bits (TUN<5:0>). There are no code or operational compatibility issues to address for this new feature. © 2006 Microchip Technology Inc. DS70174B-page 1 dsPIC30F6010 to dsPIC30F6010A Another important change deals with the OSCCON SFR. Bits have been added to both the COSC and NOSC functional definitions. Use the dsPIC30F6010A device header and include files to achieve code portability with the OSCCON SFR. Note: Quadrature Encoder Interface (QEI) – The control bits in the DFLTCON SFR have changed to allow additional functionality. Refer to the “dsPIC30F Family Reference Manual” (DS70046) for additional details. Device Oscillator – The device oscillator feature set has been enhanced to provide additional flexibility. The new oscillator modes are presented in Section 21.0 “System Integration” of the “dsPIC30F6010A/6015 Data Sheet” (DS70150). In support of the Fast RC oscillator (FRC), the OSCTUN Special Function Register (SFR) has been added. This register includes six FRCs tuning bits (TUN<5:0>). The new oscillator modes are supported by use of the respective dsPIC30F6010A device header (.h), linker (.gld) and include (.inc) files in the source code files. Refer to the “dsPIC30F6010A/6015 Data Sheet” (DS70150) for more information. The following oscillator modes have been added: Oscillator operation should be verified to ensure that it starts and performs as expected. You may need to adjust the load capacitor and/or the oscillator mode to achieve the proper values. DEVICE CONFIGURATION REGISTERS In support of the new oscillator modes, the FOSC Configuration register has been modified. The dsPIC30F6010A device header and include files provide the updated bit field definitions and macros for the device Configuration registers. Please refer to these new macros when embedding specific device configuration information in the C and Assembler source files. • HS/2 x4, x8 and x16PLL mode • HS/3 x4, x8 and x16PLL mode • FRC x4, x8 and x16PLL mode ELECTRICAL CHARACTERISTICS PERIPHERALS Table 1 below presents a comparison of the operating MIPS vs. voltage between the dsPIC30F6010A and dsPIC30F6010 devices. Some peripheral changes have been made in regards to specific errata fixes and additional features. No new peripheral modules have been added. The dsPIC30F6010 and dsPIC30F6010A devices are designed using the same process technology. Therefore, the DC and AC electrical specifications are closely related. Exceptions to this are the Run, Idle and Sleep currents which should slightly improve. Consult the data sheets for further information. Low-Voltage Detect (LVD) – This module is not available on the dsPIC6010A device. Motor Control Pulse-Width Modulation (MCPWM) – An additional control bit has been added to the module to allow additional functionality. The Immediate Update Enable (IUE) control bit is added to the PWMCON2 SFR. Refer to the “dsPIC30F Family Reference Manual” (DS70046) for additional details. TABLE 1: OPERATING MIPS VS. VOLTAGE CHARACTERISTICS VDD Temp. Range (V) Range (°C) dsPIC30F6010A-30I Maximum MIPS dsPIC30F6010-30I dsPIC30F6010A-20E dsPIC30F6010-20E 4.5-5.5 -40 to +85 30 30 — — 4.5-5.5 -40 to +125 — — 20 20 3.0 to 3.6 -40 to +85 20 15 — — 3.0 to 3.6 -40 to +125 — — 15 10 2.5 to 3.0 -40 to +85 10 7.5 — — DS70174B-page 2 © 2006 Microchip Technology Inc. dsPIC30F6010 to dsPIC30F6010A PACKAGE MIGRATION CONSIDERATIONS MPLAB ICE 4000 supports the dsPIC30F601XA devices, however the operation of the MPLAB ICE 4000 tool is limited to dsPIC30F6010 functional operation, including all device errata listed in DS80195. The dsPIC30F6010 device is available in a 14mm x 14mm TQFP package. The dsPIC30F6010A device is available in the same 14mm x 14mm package, as well as a 12mm x 12mm package that offers additional space savings in the customer’s board. A Plug-In-Module (PIM) (MA30015) is available for the dsPIC30F6010A device. This PIM can replace the MA300013 PIM containing the dsPIC30F6010 device. The dsPIC30F6010A is supported by all development boards that support the dsPIC30F6010 device. These boards include the dsPICDEM™ MC1, dsPICDEM 1.1, and dsPICDEM 80-pin Starter Development Board. DEVELOPMENT TOOLS AND BOARDS Note: MPLAB IDE, MPLAB C30, MPLAB ICD 2 and MPLAB PM3 tools support both the dsPIC30F6010 and dsPIC30F6010A. See Table 2 below for information on version support. TABLE 2: When using the dsPIC30F6010A device on the dsPICDEM-MC1 motor control development board, the user must short resistors R37 and R40 to ensure reliable communication with the MPLAB ICD 2 in-circuit debugger. DEVELOPMENT TOOL DEVICE SUPPORT Device Support Development Tools dsPIC30F6010A MPLAB® dsPIC30F6010 IDE MPLAB IDE 7.21 or later All current releases MPLAB C30 MPLAB C30 1.32 or later MPLAB C30 1.10 and later MPLAB ICD 2 Programmer/Debugger Yes Yes MPLAB REAL ICE Emulator/Debugger Yes Yes MPLAB PM3 Device Programmer Yes Yes MPLAB ICE 4000 Yes(1) Yes(1) Note 1: MPLAB ICE 4000 supports the dsPIC30F601XA devices, however the operation of the MPLAB ICE 4000 tool is limited to dsPIC30F6010 functional operation, including all device errata listed in DS80195. © 2006 Microchip Technology Inc. DS70174B-page 3 dsPIC30F6010 to dsPIC30F6010A RECOMMENDED PROCEDURE FOR MIGRATING FROM dsPIC30F6010 TO dsPIC30F6010A Follow this process to migrate from the dsPIC30F6010 to the dsPIC30F6010A : Prepare 1. Carefully read “dsPIC30F6010A/6015 Rev A2 Silicon Errata” (DS80258) to ensure there is no errata that will constrain your ability to migrate from the dsPIC30F6010 to the dsPIC306010A. Recompile Software 2. 3. 4. 5. Reconfigure your MPLAB IDE workspace for the dsPIC30F6010A (MPLAB IDE > Configure > Select Device > dsPIC30F6010A) Replace Device Header files and Linker scripts (default file location c:\Program Files\MPLAB C30\Support\) Change Device Configuration bits as appropriate (MPLAB IDE > Configure > Configuration Bits) Remove software work arounds in your dsPIC30F6010 project that are not needed for dsPIC30F6010A silicon. If necessary, refer to “dsPIC30F6010 Rev. B1 Silicon Errata” (DS80182) and “dsPIC30F6010 Rev. B2 Silicon Errata” (DS80195) to help identify work around items. Note: APPLICATION LIBRARIES All advanced application libraries developed for the dsPIC30F6010 device are supported on the dsPIC30F6010A devices as well. REFERENCE DOCUMENTS The following documents are available on our web site, www.microchip.com, and are recommended reading: • • • • “dsPIC30F6010 Data Sheet” (DS70119) “dsPIC30F6010A/6015 Data Sheet” (DS70150) “dsPIC30F Family Reference Manual” (DS70046) “dsPIC30F6010 Rev. B1 Silicon Errata” (DS80182) • “dsPIC30F6010 Rev. B2 Silicon Errata” (DS80195) • “dsPIC30F6010A Rev. A2 Silicon Errata” (DS80258) To take advantage of new features added to dsPIC30F6010A devices, refer to Appendix B. “Device Comparisons” and Appendix C. “Migration from dsPIC30F6010 to dsPIC30F6010A” in the “dsPIC30F6010A/6015 Data Sheet” (DS70150). Set up Hardware 6. Solder a dsPIC30F6010A Rev. A2 device on your target board. The pins are compatible with the dsPIC30F6010, so no board level changes are required. Alternatively, use a dsPIC30F6010A PIM (MA300015) Test 7. Run your test programs. DS70174B-page 4 © 2006 Microchip Technology Inc. dsPIC30F6010 to dsPIC30F6010A APPENDIX A: REVISION HISTORY Revision A (March 2006) Original version of the document. Revision B (November 2006) This revision reflects these changes: • Adds MPLAB REAL ICE In-Circuit Emulator to development tools • Adds recommended procedure for migrating from dsPIC30F6010 to dsPIC30F6010A • Adds “dsPIC30F6010A Rev. A2 Silicon Errata” (DS80258) to Reference Documents © 2006 Microchip Technology Inc. DS70174B-page 5 dsPIC30F6010 to dsPIC30F6010A NOTES: DS70174B-page 6 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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