dsPIC30F6011A/6012A/6013A/6014A Migration Guidelines Note: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. Note: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the oscillator mode may be required. GENERAL INFORMATION CODE COMPATIBILITY This document provides an overview of considerations for migrating from dsPIC30F6011/6012/6013/6014 devices (referred to as dsPIC30F601X devices) to dsPIC30F6011A/6012A/6013A/6014A devices (referred to as dsPIC30F601XA devices). If you are undertaking this migration, it is recommended that you download data sheets and errata documents on these devices from www.microchip.com. For the most part, dsPIC30F code developed with the MPLAB® C30 C Compiler and MPLAB ASM30 Assembler is directly portable between the dsPIC30F601X and dsPIC30F601XA devices. However, in some cases small changes may be required depending on which features have been enhanced. To migrate source code to a dsPIC30F601XA device, perform these two steps: Most errata for the dsPIC30F6011/6012/6013/6014 Rev. B2 silicon have been fixed in the dsPIC30F6011A/ 6012A/6013A/6014A Rev. A2 silicon. 1. The specific device errata documents include: 2. • “dsPIC30F6011/6012/6013/6014 Rev. B2 Silicon Errata” (DS80198) • “dsPIC30F6011A/6012A/6013A/6014A Rev. A2 Silicon Errata” (DS80242) Include the appropriate dsPIC30F601XA device header (.h) and include (.inc) files in the source code files. Remove any work arounds implemented in source code or MPLAB C30 command line options for errata described in “dsPIC30F6011/ 6012/6013/6014 Rev. B2 Silicon Errata” (DS80198). Appendix B of the “dsPIC30F6011A/6012A/6013A/ 6014A Data Sheet” (DS70143) provides device comparison summaries between dsPIC30F601X and dsPIC30F601XA devices. Appendix C of the “dsPIC30F6011A/6012A/6013A/ 6014A Data Sheet” (DS70143) provides device migration information between dsPIC30F601X and dsPIC30F601XA devices. Code developed for the dsPIC30F601X devices should be directly portable to the dsPIC30F601XA devices, with the exception of the DCI errata fix. See “Peripherals” for more information. © 2006 Microchip Technology Inc. DS70176B-page 1 PERIPHERALS OSCILLATOR OPERATION The peripheral set for the dsPIC30F601X and dsPIC30F601XA devices is the same. Some peripheral changes have been made with regard to specific errata fixes and additional features. No new peripheral modules have been added. The device oscillator feature set has been enhanced to provide additional flexibility. New oscillator modes are supported by using the respective dsPIC30F601XA device header (.h), linker (.gld) and include (.inc) files in the source code files. The DCI codec interface peripheral has undergone a specific errata fix that affects Slave mode operation only. The work around called out in the “dsPIC30F6011/ 6012/6013/6014 Rev. B2 Silicon Errata” (DS80198) document, specifically item 12, is no longer required. In addition, the internal Fast RC (FRC) oscillator tuning bits have been moved from the OSCCON Special Function Register (SFR) to the new OSCTUN SFR. DS70176B-page 2 These oscillator modes have been added: • HS/2 x4, x8 and x16 PLL • HS/3 x4, x8 and x16 PLL • FRC x4, x8 and x16 PLL © 2006 Microchip Technology Inc. ELECTRICAL CHARACTERISTICS Table 1 presents a comparison of the operating MIPS versus voltage between the dsPIC30F601X and dsPIC30F601XA devices. The dsPIC30F601X and dsPIC30F601XA devices are designed using the same process technology. Therefore, the DC and AC electrical specifications yield the consistent operational functionality. However, Run, Idle and Sleep currents should slightly improve. Consult the data sheets for further information. TABLE 1: OPERATING MIPS VS. VOLTAGE CHARACTERISTICS Maximum MIPS VDD Range Temp Range 30F601XA-30I 30F601X-30I 30F601XA-20E 30F601X-20E 4.5-5.5V -40°C to 85°C 30 30 — — 4.5-5.5V -40°C to 125°C — — 20 20 3.0-3.6V -40°C to 85°C 20 15 — — 3.0-3.6V -40°C to 125°C — — 15 10 2.5-3.0V -40°C to 85°C 10 7.5 — — © 2006 Microchip Technology Inc. DS70176B-page 3 PACKAGE MIGRATION CONSIDERATIONS 64-pin TQFP Package Primary device programming pins, PGC and PGD, for dsPIC30F6011A and dsPIC30F6012A devices have been moved relative to the original pin locations on the dsPIC30F6011 and dsPIC30F6012 devices. Pins PGC and PGD are the only programming pins and support In-Circuit Serial Programming™ (ICSP™). Pins PGC and PGD were located on AN1/RB1 and AN0/RB0, respectively, on the dsPIC30F6011 and dsPIC30F6012 devices. These pins are now located on AN6/RB6 and AN7/RB7, respectively, on the dsPIC30F6011A and dsPIC30F6012A devices. The customer must consider this change if existing signals are interfaced on pins AN6/RB6 and AN7/RB7. Please consult the “A” device pin diagrams and Appendix C of the data sheet for additional information on this change. If a dsPIC30F6012A is to be used with a dsPIC30F6012-based 64-pin Plug-in-Module (PIM), the following minor modification is required to support programming and debugging: 3. 4. Jumper PGC pin between AN1/RB1 to AN6/RB6 Jumper PGD pin between AN0/RB0 to AN7/RB7 If analog or other circuit signals are present on the new pins, some basic isolation is required to support programming and debugging. 80-pin TQFP Package No changes have been made to the primary programming pin locations, PGC and PGD, on the dsPIC30F6013A and dsPIC30F6014A devices. DS70176B-page 4 © 2006 Microchip Technology Inc. DEVELOPMENT TOOLS AND BOARDS MPLAB IDE, MPLAB C30, MPLAB ICD 2 and MPLAB PM3 tools support both the dsPIC30F601X and dsPIC30F601XA devices. MPLAB ICE 4000 supports both dsPIC30F601X and dsPIC30F601XA devices. However, support for dsPIC30F601XA devices must consider the operational characteristics of “dsPIC30F6011/6012/6013/ 6014 Rev. B2 Silicon Errata” (DS80198). Development boards supporting the dsPIC30F601X devices fully support the new dsPIC30F601XA silicon. Device support is handled with specific PIMs. PIMs to support dsPIC30F6014A devices (Part No. MA300014) can be ordered on http://microchipdirect.com/. See Table 2 below for information on version support. TABLE 2: DEVELOPMENT TOOLS DEVICE SUPPORT Device Support Development Tools MPLAB® IDE MPLAB C30 MPLAB ICD 2 Programmer/Debugger dsPIC30F601XA dsPIC30F601X MPLAB IDE 7.21 or later All current releases MPLAB C30 1.32 or later MPLAB C30 1.10 and later Yes Yes MPLAB REAL ICE Emulator/Debugger Yes Yes MPLAB PM 3 Device Programmer Yes Yes MPLAB ICE 4000 Yes* Yes * See qualification above for operational use of MPLAB ICE 4000 with dsPIC30F601X. © 2006 Microchip Technology Inc. DS70176B-page 5 MIGRATION PROCEDURE Figure 1 illustrates a recommended process for migrating from dsPIC30F601X to 601XA devices. FIGURE 1: RECOMMENDED MIGRATION PROCESS Thoroughly Review Reference Documents. Are there new features that can enhance my application? See Appendix B of “dsPIC30F6011A/6012A/6013A/6014A Data Sheet” (DS70143) for device comparisons. See Appendix C of “dsPIC30F6011A/6012A/6013A/6014A Data Sheet” (DS70143) for device migration information. Can I eliminate any software work arounds no longer needed? Carefully review errata documents (see Reference Documents). Determine Device Pin Compatibility From To Pin Hardware Modification Required Compatible dsPIC30F6011 dsPIC30F6011A No dsPIC30F6012 dsPIC30F6012A No Move PGC & PGD to Pins 17 & 18 Move PGC & PGD to Pins 17 & 18 dsPIC30F6013 dsPIC30F6013A Yes None dsPIC30F6014 dsPIC30F6014A Yes None Modify pin connections, if necessary (see Table above). Set Up Hardware Solder the “A” device onto the target board 1. Recompile Software using MPLAB® IDE v7.21 (or later) MPLAB C30 v1.32 (or later) 2. 3. 4. Reconfigure workspace for “A” device (MPLAB IDE>Configure>Select Device>dsPIC30F601XA) Replace Device Header files and Linker scripts (c:\Program Files\MPLAB C30\Support\) Change device configuration bits (MPLAB IDE>Configure>Configuration Bits) Remove work arounds no longer needed with new “A” device Reprogram Device, Test and Run Application DS70176B-page 6 © 2006 Microchip Technology Inc. APPLICATION LIBRARIES All Advanced Application Libraries developed for the dsPIC30F601X devices support the dsPIC30F601XA devices. REFERENCE DOCUMENTS The following documents are available on our web site, www.microchip.com, and are recommended reading: • “dsPIC30F6011/6012/6013/6014 Data Sheet” (DS70117) • “dsPIC30F6011A/6012A/6013A/6014A Data Sheet” (DS70150) • “dsPIC30F Family Reference Manual” (DS70046) • “dsPIC30F6011/6012/6013/6014 Rev. B1 Silicon Errata” (DS80182) • “dsPIC30F6011A/6012A/6013A/6014A Rev. B2 Silicon Errata” (DS80195) • “dsPIC30F6011A/6012A/6013A/6014A Rev. A2 Silicon Errata” (DS80258) © 2006 Microchip Technology Inc. DS70176B-page 7 APPENDIX A: REVISION HISTORY Original (November 2005) Original version of the document (DS91096A). Revision A (January 2006) Document recategorized as a Migration document and given a new document number (DS70176A). Revision B (November 2006) This revision reflects these changes: • Adds code compatibility information. • Describes move of FRC oscillator tuning bits from OSCCON SFR to OSCTUN SFR. • Adds MPLAB REAL ICE In-Circuit Emulator to development tools • Adds recommended procedure for migrating from dsPIC30F601X to dsPIC30F601XA devices • Adds Reference Documents DS70176B-page 8 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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