1.5A, Low Voltage, Low Quiescent Current LDO Regulator Product Brief

MCP1727
1.5A, Low Voltage, Low Quiescent Current
LDO Regulator Product Brief
Features
Description
•
•
•
•
The MCP1727 is a 1.5A Low Dropout (LDO) linear
regulator that provides high current and low output
voltages in a very small package. The MCP1727
comes in a fixed (or adjustable) output voltage version,
with an output voltage range of 0.8V to 5.0V. The 1.5A
output current capability, combined with the low output
voltage capability, make the MCP1727 a good choice
for new sub-1.8V output voltage LDO applications that
have high current demands.
•
•
•
•
•
•
•
•
•
•
1.5A Output Current Capability
Input Operating Voltage Range: 2.3V to 6.0V
Adjustable Output Voltage Range: 0.8V to 5.0V
Standard Fixed Output Voltages:
- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
Other Fixed Output Voltage Options Available
Upon Request
Low Dropout Voltage: 330 mV Typical at 1.5A
Typical Output Voltage Tolerance: 0.4%
Stable with 1.0 µF Ceramic Output Capacitor
Fast response to Load Transients
Low Supply Current: 140 µA (typ)
Low Shutdown Supply Current: 0.1 µA (typ)
Adjustable Delay on Power Good Output
Short Circuit Current Limiting and
Overtemperature Protection
3x3 DFN-8 and SOIC-8 Package Options
The MCP1727 is stable using ceramic output
capacitors that inherently provide lower output noise
and reduce the size and cost of the entire regulator
solution. Only 1 µF of output capacitance is needed to
stabilize the LDO.
Using CMOS construction, the quiescent current
consumed by the MCP1727 is typically less than
140 µA over the entire input voltage range, making it
attractive for portable computing applications that
demand high output current. When shut down, the
quiescent current is reduced to less than 0.1 µA.
Applications
•
•
•
•
•
•
The scaled-down output voltage is internally monitored
and a power good (PWRGD) output is provided when
the output is within 92% of regulation (typical). An
external capacitor can be used on the CDELAY pin to
adjust the delay from 1 ms to 300 ms.
High-Speed Driver Chipset Power
Networking Backplane Cards
Notebook Computers
Network Interface Cards
Palmtop Computers
2.5V to 1.XV Regulators
The overtemperature and short circuit current-limiting
provide additional protection for the LDO during system
fault conditions.
Package Types
Adjustable (SOIC-8)
VIN 1
VIN 2
SHDN 3
GND 4
Fixed (SOIC-8)
8 VOUT
VIN 1
VIN 2
7 ADJ
6 CDELAY
SHDN 3
5 PWRGD
© 2006 Microchip Technology Inc.
GND 4
8 VOUT
7 Sense
6 CDELAY
5 PWRGD
Adjustable (3x3 DFN)
VIN 1
8
VOUT
VIN 2
7
ADJ
SHDN 3
6
CDELAY
GND 4
5
PWRGD
Preliminary
Fixed (3x3 DFN)
VIN 1
8
VOUT
VIN 2
7
Sense
SHDN 3
6
CDELAY
GND 4
5
PWRGD
DS21997A-page 1
MCP1727
Typical Application
MCP1727 Fixed Output Voltage
VIN = 2.3V to 2.8V
C1
4.7 µF
1
VIN
VOUT 8
2
VIN
Sense 7
3
SHDN CDELAY 6
4
GND
VOUT = 1.8V @ 1A
C2
1 µF
PWRGD 5
C3
1000 pF
On
R1
100 kΩ
Off
PWRGD
MCP1727 Adjustable Output Voltage
VIN = 2.3V to 2.8V
C1
4.7 µF
1
VIN
VOUT 8
2
VIN
ADJ 7
3
SHDN CDELAY 6
4
GND
VOUT = 1.2V @ 1A
R1
40 kΩ
R3
100 kΩ
PWRGD 5
On
C3
1000 pF
Off
C2
1 µF
R2
20 kΩ
PWRGD
DS21997A-page 2
Preliminary
© 2006 Microchip Technology Inc.
MCP1727
Functional Block Diagram - Adjustable Output
PMOS
VIN
VOUT
Undervoltage
Lock Out
(UVLO)
ISNS
Cf
Rf
SHDN
ADJ
Overtemperature
Sensing
+
Driver w/limit
and SHDN
EA
–
SHDN
VREF
V IN
SHDN
Reference
Soft-Start
Comp
TDELAY
PWRGD
GND
92% of VREF
© 2006 Microchip Technology Inc.
Preliminary
CDELAY
DS21997A-page 3
MCP1727
Functional Block Diagram - Fixed Output
PMOS
VIN
VOUT
Undervoltage
Lock Out
(UVLO)
ISNS
Cf
Rf
SHDN
Sense
Overtemperature
Sensing
+
Driver w/limit
and SHDN
EA
–
SHDN
VREF
V IN
SHDN
Reference
Soft-Start
Comp
TDELAY
PWRGD
GND
92% of VREF
DS21997A-page 4
Preliminary
CDELAY
© 2006 Microchip Technology Inc.
MCP1727
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings †
VIN ....................................................................................6.5V
Maximum Voltage on Any Pin .. (GND – 0.3V) to (VDD + 0.3)V
Maximum Power Dissipation......... Internally-Limited (Note 6)
Output Short Circuit Duration ................................ Continuous
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, TJ ........................... +150°C
ESD protection on all pins (HBM/MM) ........... ≥ 2 kV; ≥ 200V
AC-DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Input Operating Voltage
VIN
2.3
Input Quiescent Current
Iq
Input Quiescent Current for SHDN
Mode
Maximum Output Current
6.0
V
Note 1
—
140
220
µA
IL = 0 mA, VIN = Note 1,
VOUT = 0.8V to 5.0V
ISHDN
—
0.1
3
µA
SHDN = GND
IOUT
1.5
—
—
A
VIN = 2.3V to 6.0V
VR = 0.8V to 5.0V, Note 1
Line Regulation
ΔVOUT/
(VOUT x ΔVIN)
—
0.05
0.15
%/V
Load Regulation
ΔVOUT/VOUT
-1.0
±0.5
1.0
%
IOUT = 1 mA to 1.5A,
VIN = Note 1, (Note 4)
IOUT_SC
—
2.2
—
A
VIN = Note 1,
RLOAD < 0.1Ω, Peak
Current
Output Short Circuit Current
Units
Conditions
(Note 1) ≤ VIN ≤ 6V
Adjust Pin Characteristics (Adjustable Output Only)
Adjust Pin Reference Voltage
VADJ
0.402
0.410
0.418
V
VIN = 2.3V to VIN = 6.0V,
IOUT = 1 mA
Adjust Pin Leakage Current
IADJ
-10
±0.01
+10
nA
VIN = 6.0V,
VADJ = 0V to 6V
TCVOUT
—
40
—
ppm/°C
Adjust Temperature Coefficient
Note 3
Fixed-Output Characteristics (Fixed Output Only)
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX).
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
© 2006 Microchip Technology Inc.
Preliminary
DS21997A-page 5
MCP1727
AC-DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Voltage Regulation
Sym
Min
Typ
Max
Units
VOUT
VR - 2.5%
VR
±0.5%
VR + 2.5%
V
VIN-VOUT
—
330
525
mV
VPWRGD_VIN
1.0
—
6.0
V
1.2
—
6.0
Conditions
Note 2
Dropout Characteristics
Dropout Voltage
Note 5, IOUT = 1.5A,
VIN(MIN) = 2.3V
Power Good Characteristics
PWRGD Input Voltage Operating
Range
TA = +25°C
TA = -40°C to +125°C
For VIN < 2.3V,
ISINK = 100 µA
PWRGD Threshold Voltage
(Referenced to VOUT)
VPWRGD_TH
89
92
95
%VOUT
PWRGD Threshold Hysteresis
VPWRGD_HYS
1.0
2.0
3.0
%VOUT
PWRGD Output Voltage Low
VPWRGD_L
—
0.2
0.4
V
IPWRGD SINK = 1.2 mA,
VFB = 0V, CDELAY = GND
PWRGD Leakage
PWRGD_LK
—
1
—
nA
VPWRGD = VIN = 6.0V
PWRGD Time Delay
Falling Edge
Rising Edge
RPULLUP = 10 kΩ
TPG
—
—
10
30
55
ms
CDELAY = 0.01 µF
—
300
—
ms
CDELAY = 0.1 µF
TVDET-PWRGD
—
200
—
µs
VADJ or VSENSE =
VPWRGD_TH + 20 mV to
VPWRGD_TH - 20 mV
Logic High Input
VSHDN-HIGH
45
Logic Low Input
VSHDN-LOW
Detect Threshold to PWRGD Active
Time Delay
µs
CDELAY = OPEN
200
Shutdown Input
SHDN Input Leakage Current
SHDNILK
-0.1
±0.001
%VIN
VIN = 2.3V to 6.0V
15
%VIN
VIN = 2.3V to 6.0V
+0.1
µA
VIN = 6V, SHDN =VIN,
SHDN = GND
µs
SHDN = GND to VIN
VOUT = GND to 95% VR
AC Performance
Output Delay From SHDN
Note 1:
2:
3:
4:
5:
6:
7:
TOR
100
The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX).
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
DS21997A-page 6
Preliminary
© 2006 Microchip Technology Inc.
MCP1727
AC-DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
eN
—
2.0
—
µV/√Hz
IOUT = 500 mA, f = 1 kHz,
COUT = 10 µF (X7R
Ceramic), VOUT = 2.5V
Power Supply Ripple Rejection
Ratio
PSRR
—
60
—
dB
f = 100 Hz, COUT = 10 µF,
IOUT = 100 mA,
VINAC = 30 mV pk-pk,
CIN = 0 µF
Thermal Shutdown Temperature
TSD
—
150
—
°C
IOUT = 100 µA, VOUT =
1.8V, VIN = 2.8V
ΔTSD
—
10
—
°C
IOUT = 100 µA, VOUT =
1.8V, VIN = 2.8V
Output Noise
Thermal Shutdown Hysteresis
Note 1:
2:
3:
4:
5:
6:
7:
Conditions
The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX).
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 2.3V to 6.0V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
TJ
-40
—
+125
°C
Steady State
Transient
Temperature Ranges
Operating Junction Temperature Range
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 8LD 3x3 DFN
θJA
—
41
—
°C/W
4-Layer JC51-7
Standard Board with
vias
Thermal Resistance, 8LD SOIC
θJA
—
150
—
°C/W
4-Layer JC51-7
Standard Board
Thermal Package Resistances
© 2006 Microchip Technology Inc.
Preliminary
DS21997A-page 7
MCP1727
NOTES:
DS21997A-page 8
Preliminary
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
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and may be superseded by updates. It is your responsibility to
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© 2006 Microchip Technology Inc.
Preliminary
DS21997A-page 9
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02/16/06
DS21997A-page 10
Preliminary
© 2006 Microchip Technology Inc.
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