MCP1727 1.5A, Low Voltage, Low Quiescent Current LDO Regulator Product Brief Features Description • • • • The MCP1727 is a 1.5A Low Dropout (LDO) linear regulator that provides high current and low output voltages in a very small package. The MCP1727 comes in a fixed (or adjustable) output voltage version, with an output voltage range of 0.8V to 5.0V. The 1.5A output current capability, combined with the low output voltage capability, make the MCP1727 a good choice for new sub-1.8V output voltage LDO applications that have high current demands. • • • • • • • • • • 1.5A Output Current Capability Input Operating Voltage Range: 2.3V to 6.0V Adjustable Output Voltage Range: 0.8V to 5.0V Standard Fixed Output Voltages: - 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V Other Fixed Output Voltage Options Available Upon Request Low Dropout Voltage: 330 mV Typical at 1.5A Typical Output Voltage Tolerance: 0.4% Stable with 1.0 µF Ceramic Output Capacitor Fast response to Load Transients Low Supply Current: 140 µA (typ) Low Shutdown Supply Current: 0.1 µA (typ) Adjustable Delay on Power Good Output Short Circuit Current Limiting and Overtemperature Protection 3x3 DFN-8 and SOIC-8 Package Options The MCP1727 is stable using ceramic output capacitors that inherently provide lower output noise and reduce the size and cost of the entire regulator solution. Only 1 µF of output capacitance is needed to stabilize the LDO. Using CMOS construction, the quiescent current consumed by the MCP1727 is typically less than 140 µA over the entire input voltage range, making it attractive for portable computing applications that demand high output current. When shut down, the quiescent current is reduced to less than 0.1 µA. Applications • • • • • • The scaled-down output voltage is internally monitored and a power good (PWRGD) output is provided when the output is within 92% of regulation (typical). An external capacitor can be used on the CDELAY pin to adjust the delay from 1 ms to 300 ms. High-Speed Driver Chipset Power Networking Backplane Cards Notebook Computers Network Interface Cards Palmtop Computers 2.5V to 1.XV Regulators The overtemperature and short circuit current-limiting provide additional protection for the LDO during system fault conditions. Package Types Adjustable (SOIC-8) VIN 1 VIN 2 SHDN 3 GND 4 Fixed (SOIC-8) 8 VOUT VIN 1 VIN 2 7 ADJ 6 CDELAY SHDN 3 5 PWRGD © 2006 Microchip Technology Inc. GND 4 8 VOUT 7 Sense 6 CDELAY 5 PWRGD Adjustable (3x3 DFN) VIN 1 8 VOUT VIN 2 7 ADJ SHDN 3 6 CDELAY GND 4 5 PWRGD Preliminary Fixed (3x3 DFN) VIN 1 8 VOUT VIN 2 7 Sense SHDN 3 6 CDELAY GND 4 5 PWRGD DS21997A-page 1 MCP1727 Typical Application MCP1727 Fixed Output Voltage VIN = 2.3V to 2.8V C1 4.7 µF 1 VIN VOUT 8 2 VIN Sense 7 3 SHDN CDELAY 6 4 GND VOUT = 1.8V @ 1A C2 1 µF PWRGD 5 C3 1000 pF On R1 100 kΩ Off PWRGD MCP1727 Adjustable Output Voltage VIN = 2.3V to 2.8V C1 4.7 µF 1 VIN VOUT 8 2 VIN ADJ 7 3 SHDN CDELAY 6 4 GND VOUT = 1.2V @ 1A R1 40 kΩ R3 100 kΩ PWRGD 5 On C3 1000 pF Off C2 1 µF R2 20 kΩ PWRGD DS21997A-page 2 Preliminary © 2006 Microchip Technology Inc. MCP1727 Functional Block Diagram - Adjustable Output PMOS VIN VOUT Undervoltage Lock Out (UVLO) ISNS Cf Rf SHDN ADJ Overtemperature Sensing + Driver w/limit and SHDN EA – SHDN VREF V IN SHDN Reference Soft-Start Comp TDELAY PWRGD GND 92% of VREF © 2006 Microchip Technology Inc. Preliminary CDELAY DS21997A-page 3 MCP1727 Functional Block Diagram - Fixed Output PMOS VIN VOUT Undervoltage Lock Out (UVLO) ISNS Cf Rf SHDN Sense Overtemperature Sensing + Driver w/limit and SHDN EA – SHDN VREF V IN SHDN Reference Soft-Start Comp TDELAY PWRGD GND 92% of VREF DS21997A-page 4 Preliminary CDELAY © 2006 Microchip Technology Inc. MCP1727 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VIN ....................................................................................6.5V Maximum Voltage on Any Pin .. (GND – 0.3V) to (VDD + 0.3)V Maximum Power Dissipation......... Internally-Limited (Note 6) Output Short Circuit Duration ................................ Continuous Storage temperature .....................................-65°C to +150°C Maximum Junction Temperature, TJ ........................... +150°C ESD protection on all pins (HBM/MM) ........... ≥ 2 kV; ≥ 200V AC-DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C Parameters Sym Min Typ Max Input Operating Voltage VIN 2.3 Input Quiescent Current Iq Input Quiescent Current for SHDN Mode Maximum Output Current 6.0 V Note 1 — 140 220 µA IL = 0 mA, VIN = Note 1, VOUT = 0.8V to 5.0V ISHDN — 0.1 3 µA SHDN = GND IOUT 1.5 — — A VIN = 2.3V to 6.0V VR = 0.8V to 5.0V, Note 1 Line Regulation ΔVOUT/ (VOUT x ΔVIN) — 0.05 0.15 %/V Load Regulation ΔVOUT/VOUT -1.0 ±0.5 1.0 % IOUT = 1 mA to 1.5A, VIN = Note 1, (Note 4) IOUT_SC — 2.2 — A VIN = Note 1, RLOAD < 0.1Ω, Peak Current Output Short Circuit Current Units Conditions (Note 1) ≤ VIN ≤ 6V Adjust Pin Characteristics (Adjustable Output Only) Adjust Pin Reference Voltage VADJ 0.402 0.410 0.418 V VIN = 2.3V to VIN = 6.0V, IOUT = 1 mA Adjust Pin Leakage Current IADJ -10 ±0.01 +10 nA VIN = 6.0V, VADJ = 0V to 6V TCVOUT — 40 — ppm/°C Adjust Temperature Coefficient Note 3 Fixed-Output Characteristics (Fixed Output Only) Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX). VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1. TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the temperature range. VOUT-LOW is the lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above 150°C can impact device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. © 2006 Microchip Technology Inc. Preliminary DS21997A-page 5 MCP1727 AC-DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C Parameters Voltage Regulation Sym Min Typ Max Units VOUT VR - 2.5% VR ±0.5% VR + 2.5% V VIN-VOUT — 330 525 mV VPWRGD_VIN 1.0 — 6.0 V 1.2 — 6.0 Conditions Note 2 Dropout Characteristics Dropout Voltage Note 5, IOUT = 1.5A, VIN(MIN) = 2.3V Power Good Characteristics PWRGD Input Voltage Operating Range TA = +25°C TA = -40°C to +125°C For VIN < 2.3V, ISINK = 100 µA PWRGD Threshold Voltage (Referenced to VOUT) VPWRGD_TH 89 92 95 %VOUT PWRGD Threshold Hysteresis VPWRGD_HYS 1.0 2.0 3.0 %VOUT PWRGD Output Voltage Low VPWRGD_L — 0.2 0.4 V IPWRGD SINK = 1.2 mA, VFB = 0V, CDELAY = GND PWRGD Leakage PWRGD_LK — 1 — nA VPWRGD = VIN = 6.0V PWRGD Time Delay Falling Edge Rising Edge RPULLUP = 10 kΩ TPG — — 10 30 55 ms CDELAY = 0.01 µF — 300 — ms CDELAY = 0.1 µF TVDET-PWRGD — 200 — µs VADJ or VSENSE = VPWRGD_TH + 20 mV to VPWRGD_TH - 20 mV Logic High Input VSHDN-HIGH 45 Logic Low Input VSHDN-LOW Detect Threshold to PWRGD Active Time Delay µs CDELAY = OPEN 200 Shutdown Input SHDN Input Leakage Current SHDNILK -0.1 ±0.001 %VIN VIN = 2.3V to 6.0V 15 %VIN VIN = 2.3V to 6.0V +0.1 µA VIN = 6V, SHDN =VIN, SHDN = GND µs SHDN = GND to VIN VOUT = GND to 95% VR AC Performance Output Delay From SHDN Note 1: 2: 3: 4: 5: 6: 7: TOR 100 The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX). VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1. TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the temperature range. VOUT-LOW is the lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above 150°C can impact device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. DS21997A-page 6 Preliminary © 2006 Microchip Technology Inc. MCP1727 AC-DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C Parameters Sym Min Typ Max Units eN — 2.0 — µV/√Hz IOUT = 500 mA, f = 1 kHz, COUT = 10 µF (X7R Ceramic), VOUT = 2.5V Power Supply Ripple Rejection Ratio PSRR — 60 — dB f = 100 Hz, COUT = 10 µF, IOUT = 100 mA, VINAC = 30 mV pk-pk, CIN = 0 µF Thermal Shutdown Temperature TSD — 150 — °C IOUT = 100 µA, VOUT = 1.8V, VIN = 2.8V ΔTSD — 10 — °C IOUT = 100 µA, VOUT = 1.8V, VIN = 2.8V Output Noise Thermal Shutdown Hysteresis Note 1: 2: 3: 4: 5: 6: 7: Conditions The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX). VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1. TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the temperature range. VOUT-LOW is the lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above 150°C can impact device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 2.3V to 6.0V. Parameters Sym Min Typ Max Units Conditions TJ -40 — +125 °C Steady State Transient Temperature Ranges Operating Junction Temperature Range Maximum Junction Temperature TJ — — +150 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 8LD 3x3 DFN θJA — 41 — °C/W 4-Layer JC51-7 Standard Board with vias Thermal Resistance, 8LD SOIC θJA — 150 — °C/W 4-Layer JC51-7 Standard Board Thermal Package Resistances © 2006 Microchip Technology Inc. Preliminary DS21997A-page 7 MCP1727 NOTES: DS21997A-page 8 Preliminary © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. Preliminary DS21997A-page 9 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 02/16/06 DS21997A-page 10 Preliminary © 2006 Microchip Technology Inc.