751DT

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−16 NB MISSING PIN 2
CASE 751DT
ISSUE O
DATE 18 OCT 2013
SCALE 1:1
NOTE 5
D
A
16
2X
9
0.10 C D
F
E
0.20 C
2X 4 TIPS
E1
1
8
B
NOTE 4
L2
15X b
NOTE 5
0.25
TOP VIEW
L
DETAIL A
M
C A-B D
2X
0.10 C A-B
0.10 C
D
DETAIL A
0.10 C
e
A
C
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT
SEATING
PLANE
END VIEW
15X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE PROTRUSION SHALL BE 0.10 mm IN EXCESS OF
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS
NOTE 6
OR GATE BURRS SHALL NOT EXCEED 0.25 mm PER SIDE.
DIMENSIONS D AND E ARE DETERMINED AT DATUM F.
A1
5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING
PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
C SEATING
MILLIMETERS
PLANE
DIM MIN
MAX
A
1.35
1.75
A1
0.10
0.25
b
0.35
0.49
c
0.17
0.25
D
9.80
10.00
E
6.00 BSC
E1
3.90 BSC
e
1.27 BSC
L
0.40
1.27
0.203 BSC
L2
GENERIC
MARKING DIAGRAM*
16
XXXXXXXXXX
AWLYWWG
1.52
16
1
9
7.00
8
1
1.27
PITCH
15X
0.60
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON77479F
ON SEMICONDUCTOR STANDARD
http://onsemi.com
SOIC−16 NB MISSING PIN 2 1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON77479F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED TO PRODUCTION. REQ. BY C. TAN.
DATE
18 OCT 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. O
Case Outline Number:
751DT
Similar pages