5962-11232

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
REV STATUS
REV
OF SHEETS
SHEET
PMIC N/A
PREPARED BY
Greg Cecil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
1
2
3
4
5
7
8
9
10
11
12
13
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
http://www.landandmaritime.dla.mil/
APPROVED BY
Charles F. Saffle
DRAWING APPROVAL DATE
14-03-26
REVISION LEVEL
MICROCIRCUIT, HYBRID, LINEAR, POSITIVE,
SWITCHING, VOLTAGE REGULATOR
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
6
1 OF
5962-11232
13
5962-E441-11
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\
R



RHA
designator
(see 1.2.1)
11232
01



Device
type
(see 1.2.2)
K



Device
class
designator
(see 1.2.3)
/
X



Case
outline
(see 1.2.4)
A



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type. The device type identify the circuit function as follows:
Device type
01
Generic number
MSK 5048RH
Circuit function
Radiation hardened, 3.5 A, switching voltage regulator
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Terminals
5
5
5
Package style
Single row flange, mount, straight leads, glass sealed
Single row flange, gull wing, glass sealed
Single row flange, leads formed down, glass sealed
SIZE
5962-11232
A
REVISION LEVEL
SHEET
2
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage (VIN) ..........................................................................
Output current (IOUT) ......................................................................
Sync pin voltage ............................................................................
Junction temperature (TJ) ..............................................................
Thermal resistance, junction-to-case at +125°C:
Forward switch ...........................................................................
Catch diode ................................................................................
Storage temperature range ............................................................
Lead temperature (soldering, 10 seconds) ....................................
+16 V dc
4A
7.0 V
+150°C
14.0°C/W
20.0°C/W
-65°C to +150°C
+300°C
1.4 Recommended operating conditions.
Input voltage range (VIN)................................................................
Case operating temperature range (TC).........................................
+4.5 V dc to +12.8 V dc
-55°C to +125°C
1.5 Radiation features. 2/ 3/
Maximum total dose available (dose rate ≤ 50-300 rads(Si)/s) ......
Maximum total dose available (dose rate ≤ 10 mrads(Si)/s) ..........
100 krads(Si) 4/
50 krads(Si) 5/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/
2/
3/
4/
5/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
See 4.3.5 for the manufacturer’s radiation hardness assurance analysis and testing.
Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. These device
types have not been characterized for displacement damage.
The device on this SMD has been high dose rate tested using condition A to 150 krads(Si) to ensure RHA designator level
“R” (100 krads(Si)), per test method 1019 of MIL-STD-883. This testing will be repeated after any design or process
changes that can affect RHA response.
This device has not been low dose rate tested, but a similar device, 5962-1123401, has been Low Dose Rate (LDR) tested
per method 1019 of MIL-STD-883 condition D for initial qualification. This device has not been characterized for Enhanced
Low Dose Rate Sensitivity (ELDRS). This device or a similar device will be low dose rate tested after any design or process
changes that can affect RHA response.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
3
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuits. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Feedback voltage
Conditions 1/ 2/ 3/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
VFB
1,2,3
Device
type
01
1
Post 100 Krad (Si)
Limits
Unit
Min
Max
1.19
1.23
1.17
1.24
V
Line regulation
VRLINE
4.3 V ≤ VIN ≤ 15 V
1,2,3
01
±0.5
%
Load regulation
VRLOAD
1 A ≤ IOUT ≤ 3 A
1,2,3
01
±1.0
%
Efficiency
EFF
1,2,3
01
Current limit 4/
ILIM
1,2,3
01
3.5
Switching frequency 5/
SF
4
01
460
540
5,6
440
560
4
410
540
Post 100 Krad (Si)
Synchronization range
6/
1/
2/
3/
4/
5/
6/
SYNC
580 kHz ≤ SYNC ≤ 1 MHz
7,8A,8B
75
%
A
01
kHz
PASS/
FAIL
The device on this SMD has been high dose rate tested using condition A to 150 krads(Si) to ensure RHA designator level
“R” (100 krads(Si)), per test method 1019 of MIL-STD-883. This testing will be repeated after any design or process
changes that can affect RHA response. This device has not been low dose rate tested, but a similar device, 5962-1123401,
has been Low Dose Rate (LDR) tested per method 1019 of MIL-STD-883 condition D for initial qualification. This device
has not been characterized for Enhanced Low Dose Rate Sensitivity (ELDRS). This device or a similar device will be low
dose rate tested after any design or process changes that can affect RHA response.
Unless otherwise specified, VIN = 5.0 V, VOUT = 2.5 V, and IOUT = 1.0 A.
Radiation end-point limits are as specified in Table II.
Output current limit function provides protection from transient overloads, but it may exceed the maximum continuous
rating. Continuous operation in current limit may damage the device.
Parameter shall be guaranteed to the limits specified for subgroups 5 and 6 for all lots not specifically tested.
Parameter shall be guaranteed to the limits specified for subgroups 8A and 8B for all lots not specifically tested.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
5
Case outline X.
Symbol
A
A1
A2
øb
D
E
E1
e
e1
L
L1
L2
øP
S1
Millimeters
Min
Max
--6.48
0.76
1.27
3.30
3.81
0.71
0.81
20.57
21.08
17.27
17.78
8.51
9.02
2.54 TYP
9.91
10.41
12.70
--13.34
13.84
2.74
3.25
3.81
4.31
3.68 REF
Inches
Min
Max
--.255
.030
.050
.130
.150
.028
.032
.810
.830
.680
.700
.335
.355
.100 TYP
.390
.410
.500
--.525
.545
.108
.128
.150
.170
.145 REF
NOTES:
1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound
units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Case outline X weight: 7.87 grams typical.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
6
Case outline Y.
Symbol
A
A1
A2
øb
D
E
E1
e
e1
L
L1
L2
L3
L4
øP
S1
Millimeters
Min
Max
--6.48
0.76
1.27
3.30
3.81
0.71
0.81
20.57
21.08
17.27
17.78
8.51
9.02
2.54 TYP
9.91
10.41
4.70
5.46
13.34
13.84
2.74
3.25
--6.47
11.43
11.94
3.81
4.31
3.68 REF
Inches
Min
Max
--.255
.030
.050
.130
.150
.028
.032
.810
.830
.680
.700
.335
.355
.100 TYP
.390
.410
.095
.115
.525
.545
.108
.128
--.255
.450
.470
.150
.170
.145 REF
NOTES:
1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound
units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Case outline Y weight: 7.87 grams typical.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
7
Case outline Z.
Symbol
A
A1
A2
øb
D
E
E1
e
e1
L
L1
L2
L3
øP
S1
Millimeters
Min
Max
--6.48
0.76
1.27
3.30
3.81
0.71
0.81
20.57
21.08
17.27
17.78
8.51
9.02
2.54 TYP
9.91
10.41
4.70
5.46
13.34
13.84
2.74
3.25
8.38
--3.81
4.31
3.68 REF
Inches
Min
Max
--.255
.030
.050
.130
.150
.028
.032
.810
.830
.680
.700
.335
.355
.100 TYP
.390
.410
.185
.215
.525
.545
.108
.128
.330
--.150
.170
.145 REF
NOTES:
1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound
units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Case outline Z weight: 7.87 grams typical.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
8
Device type
01
Case outlines
X, Y, and Z
Terminal number
Terminal symbol
1
VIN
2
FEEDBACK
3
VOUT
4
SYNC
5
COMP
Case
GND
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
9
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
1
Final electrical parameters
1*, 2, 3, 4, 5, 6, 7, 8A, 8B
Group A test requirements
1, 2, 3, 4, 5, 6, 7, 8A, 8B
Group C end-point electrical
parameters
1, 2, 3, 4, 7
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
1, 4, 7
* PDA applies to subgroup 1.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in method 1015 of MIL-STD-883.
(2)
TC = +125°C minimum.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
10
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in method 1005 of MIL-STD-883.
(2)
TC = +125°C minimum.
(3)
Test duration: 1,000 hours minimum as specified in 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA). RHA qualification is required for those devices with the RHA designator as
specified herein. See table IIIA and IIIB.
Table IIIA. Radiation Hardness Assurance Methods Table.
Worst Case Analysis Not Performed.
RHA
Method
Employed
Testing at rated
total dose of
100 krads(Si)
Element
Level
Hybrid
Device
Level
1.5X 1/
1.5X
End point electrical
tests after dose
Includes
Combines
Combines total
temperature temperature and
dose and
radiation effects displacement
effects
effects
NA
NA
NA
End-of-life Element Level Hybrid device
level
NA
TA = +25ºC
TA = +25ºC
1/ Elements tested only as part of the hybrid device, since there is only one microcircuit element in the device along with
passive elements and diodes. See 4.3.5.1.2.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
11
Table IIIB. Hybrid level and element level test table.
MS Kennedy
SMD 596211232
Hybrid Level
Testing
Radiation Test
Total Dose
Low Dose High Dose
ELDRS
Displacement
Rate
Rate (HDR) Characterization Damage (DD)
Tested
(1X)
Element Level
Testing
Bipolar Linear
or Mixed Signal
Neutron
Tested
(1.5X)
1X
1.5X
(hybrid level (hybrid level
test) 1/
test) 1/
Not
Tested
Not
Tested
Not
Tested
Not
Tested
1/ Elements tested only as part of the hybrid device, since there is only one microcircuit element in the device along with
passive elements and diodes. See 4.3.5.1.2.
4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA
designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be
specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved
plan and with MIL-PRF-38534, Appendix G.
a.
The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish
radiation test plans used to implement component lot qualification during procurement. Test plans and test reports
shall be filed and controlled in accordance with the manufacturer's configuration management system.
b.
The hybrid device manufacturer shall oversee component lot qualification, and monitor design changes for continued
compliance to RHA requirements.
4.3.5.1.1 Hybrid level radiation qualification.
4.3.5.1.1.1 Qualification by similarity. This device has been identified as “similar” to SMD 5962-11234 for the purpose of
performing representative testing.
4.3.5.1.1.2 Total ionizing dose irradiation testing.
4.3.5.1.1.2.1 High Dose Rate (HDR) testing: This device is characterized and tested initially, and after any design or process
changes which may affect the RHA response of the device type. This device is tested at (HDR) in accordance with condition A
of method 1019 of MIL-STD-883 to 150 krads(Si) using a sample size of 4 biased and 4 unbiased. 0.9900/90% statistics are
applied to the device parameter degradations for HDR in Table I herein.
4.3.5.1.1.2.2 Low Dose Rate (LDR) testing. A representative device 5962-1123401 has been LDR tested to condition D of
test method 1019 of MIL-STD-883 in a 16 pin flat pack (not the package in this SMD) to 50 krads(Si). Internal gas analysis
shows that the package in this SMD has negligible hydrogen. A minimum of 8 of these devices or representative devices (4 bias
and 4 unbiased) will be LDR tested after any design or process change that can affect RHA responses of this device.
0.9900/90% statistics are applied to the device parameter degradations for LDR in Table I herein, or in the SMD for the
representative device.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
12
4.3.5.1.2 Element level radiation qualification. Element are tested at the hybrid level since this device contains only one
microcircuit element along with passive elements and diodes.
4.3.5.2 Radiation lot acceptance. Each wafer lot of microcircuit elements shall be evaluated for acceptance in accordance
with the approved plan and MIL-PRF-38534 and herein.
4.3.5.2.1 Total Ionizing Dose. Every wafer lot of the microcircuit elements will be RLAT (Radiation Lot Acceptance Testing)
tested to 150 krads(Si) at hybrid level (in this device or a similar device) at HDR in accordance with condition A of method 1019
of MIL-STD-883. A minimum of 4 biased samples and 4 unbiased samples will be tested. 0.9900/90% statistics are applied to
the device parameter degradations which are compared against Table I herein or in the SMD for the similar device for lot
acceptance.
4.3.5.2.2 Technologies not being tested. Testing is not performed on diodes which the manufacturer considers to be
radiation hard.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-11232
A
REVISION LEVEL
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 14-03-26
Approved sources of supply for SMD 5962-11232 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information
bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962R1123201HXA
5962R1123201HXC
5962R1123201HYA
5962R1123201HYC
5962R1123201HZA
5962R1123201HZC
51651
51651
51651
51651
51651
51651
MSK 5048HRHS
MSK 5048HRHS
MSK 5048HRHGW
MSK 5048HRHGW
MSK 5048HRHD
MSK 5048HRHD
5962R1123201KXA
5962R1123201KXC
5962R1123201KYA
5962R1123201KYC
5962R1123201KZA
5962R1123201KZC
51651
51651
51651
51651
51651
51651
MSK 5048KRHS
MSK 5048KRHS
MSK 5048KRHGW
MSK 5048KRHGW
MSK 5048KRHD
MSK 5048KRHD
1/
2/
The lead finish shown for each PIN representing a hermetic
package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed
contact the Vendor to determine its availability.
Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
Vendor CAGE
number
51651
Vendor name
and address
M. S. Kennedy Corporation
4707 Dey Road
Liverpool, NY 13088
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.