Data Sheet

PESD1FLEX
FlexRay bus ESD protection diode
Rev. 02 — 15 February 2008
Product data sheet
1. Product profile
1.1 General description
PESD1FLEX in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic
package designed to protect two automotive FlexRay bus lines from the damage caused
by ElectroStatic Discharge (ESD) and other transients.
1.2 Features
n Due to the integrated diode structure only one small SOT23 package is needed to
protect two FlexRay bus lines
n Max. peak pulse power: PPP = 200 W at tp = 8/20 µs
n Low clamping voltage: VCL = 40 V at IPP = 1 A
n Ultra low leakage current: IRM < 1 nA
n Typ. diode capacitance matching: ∆Cd/Cd = 0.1 %
n ESD protection up to 23 kV
n IEC 61000-4-2, level 4 (ESD)
n IEC 61000-4-5 (surge); IPP = 3 A at tp = 8/20 µs
n Small SMD plastic package
1.3 Applications
n FlexRay bus protection
n Automotive applications
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
24
V
-
11
17
pF
Per diode
VRWM
reverse standoff voltage
Cd
diode capacitance
f = 5 MHz; VR = 0 V
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode 1
2
cathode 2
3
common cathode
Simplified outline
Symbol
3
1
3
1
2
2
006aaa155
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PESD1FLEX
-
plastic surface-mounted package; 3 leads
SOT23
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PESD1FLEX
ZJ*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
PPP
peak pulse power
tp = 8/20 µs
[1][2]
-
200
W
IPP
peak pulse current
tp = 8/20 µs
[1][2]
-
3
A
Per diode
Per device
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2]
Measured from pin 1 to 3 or 2 to 3.
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
2 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
Table 6.
ESD maximum ratings
Symbol
Parameter
Conditions
electrostatic discharge voltage
IEC 61000-4-2
(contact discharge)
Min
Max
Unit
-
23
kV
-
10
kV
Per diode
VESD
[1][2]
MIL-STD-883 (human
body model)
[1]
Device stressed with ten non-repetitive ESD pulses.
[2]
Measured from pin 1 to 3 or 2 to 3.
Table 7.
ESD standards compliance
Standard
Conditions
Per diode
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model)
> 4 kV
001aaa631
001aaa630
120
IPP
100 %
90 %
100 % IPP; 8 µs
IPP
(%)
80
e−t
50 % IPP; 20 µs
40
10 %
t
tr = 0.7 ns to 1 ns
0
0
10
20
30
30 ns
40
t (µs)
Fig 1. 8/20 µs pulse waveform according to
IEC 61000-4-5
60 ns
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
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PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
6. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per diode
VRWM
reverse standoff voltage
-
-
24
V
IRM
reverse leakage current
VRWM = 24 V
-
<1
50
nA
VBR
breakdown voltage
IR = 5 mA
25.4
27.8
30.3
V
Cd
diode capacitance
f = 5 MHz; VR = 0 V
-
11
17
pF
-
0.1
-
%
-
0.1
-
%
∆Cd/Cd
diode capacitance
matching
[1]
f = 5 MHz; VR = 0 V
f = 5 MHz; VR = 2.5 V
VCL
rdif
[2][3]
clamping voltage
differential resistance
IPP = 1 A
-
-
40
V
IPP = 3 A
-
-
70
V
IR = 1 mA
-
-
300
Ω
[1]
∆Cd is the difference of the capacitance measured between pin 1 and pin 3 and the capacitance measured
between pin 2 and pin 3.
[2]
Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[3]
Measured from pin 1 to 3 or 2 to 3.
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
4 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
006aaa257
104
001aaa193
1.2
PPP
PPP
(W)
PPP(25°C)
103
0.8
102
0.4
10
1
102
10
103
104
0
0
50
100
150
t p (µs)
200
Tj (°C)
Tamb = 25 °C
Fig 3. Peak pulse power as a function of exponential
pulse duration; typical values
Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical values
006aaa258
20
IPP
Cd
(pF)
16
12
−VCL −VBR −VRWM
IR
IRM
−IRM
−IR
8
4
VRWM VBR VCL
−
0
0
5
10
15
20
+
−IPP
25
VR (V)
006aaa676
f = 5 MHz; Tamb = 25 °C
Fig 5. Diode capacitance as a function of reverse
voltage; typical values
Fig 6. V-I characteristics for a bidirectional ESD
protection diode
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
5 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
ESD TESTER
RZ
450 Ω
4 GHz DIGITAL
OSCILLOSCOPE
RG 223/U
50 Ω coax
10×
ATTENUATOR
50 Ω
CZ
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
D.U.T.
(Device
Under
Test)
vertical scale = 20 V/div; horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div
GND
GND
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
vertical scale = 20 V/div; horizontal scale = 50 ns/div
GND
GND
vertical scale = 200 V/div
horizontal scale = 50 ns/div
unclamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
006aaa259
Fig 7. ESD clamping test setup and waveforms
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
6 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
7. Application information
The PESD1FLEX is designed for the protection of two automotive FlexRay data lines from
the damage caused by ESD and surge pulses. The device supports a FlexRay data rate
of 10 Mbit/s. The PESD1FLEX provides a surge capability of up to 200 W per line for an
8/20 µs waveform.
BM
common
mode choke
(optional)
FlexRay
bus
RT/2
FlexRay
TRANSCEIVER
RT/2
BP
CG
2
1
PESD1FLEX
3
006aab053
Fig 8. Typical application: ESD protection of two automotive FlexRay bus lines
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESD1FLEX as close to the input terminal or connector as possible.
2. The path length between the PESD1FLEX and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
7 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
8. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
1.9
0.48
0.38
Dimensions in mm
0.15
0.09
04-11-04
Fig 9. Package outline SOT23 (TO-236AB)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PESD1FLEX
[1]
Package
SOT23
Description
4 mm pitch, 8 mm tape and reel
3000
10000
-215
-235
For further information and the availability of packing methods, see Section 13.
PESD1FLEX_2
Product data sheet
Packing quantity
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
8 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
10. Soldering
2.90
2.50
0.85
2
1
solder lands
1.30
3.00
2.70
0.85
solder resist
solder paste
3
occupied area
0.60
(3x)
Dimensions in mm
0.50 (3x)
0.60 (3x)
1.00
3.30
sot023
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
Dimensions in mm
2.80
preferred transport direction during soldering
4.50
sot023
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
9 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESD1FLEX_2
20080215
Product data sheet
-
PESD1FLEX_1
Modifications:
PESD1FLEX_1
•
•
Section 1.2 “Features”: list item for diode capacitance matching added
Table 8 “Characteristics”: ∆Cd/Cd diode capacitance matching added
20070521
Product data sheet
PESD1FLEX_2
Product data sheet
-
-
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
10 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
PESD1FLEX_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 15 February 2008
11 of 12
PESD1FLEX
NXP Semiconductors
FlexRay bus ESD protection diode
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 February 2008
Document identifier: PESD1FLEX_2
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