Data Sheet

SO
T1
43
B
PRTR5V0U2AX
Ultra low capacitance double rail-to-rail ESD protection diode
Rev. 3 — 15 May 2012
Product data sheet
1. Product profile
1.1 General description
Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection diode in
a small SOT143B Surface-Mounted Device (SMD) plastic package.
The device is designed to protect two high-speed data lines or high-frequency signal lines
from the damage caused by ESD and other transients.
PRTR5V0U2AX integrates two ultra low capacitance rail-to-rail diodes and one additional
ESD protection diode to ensure signal line protection even if no supply voltage is
available.
1.2 Features and benefits








ESD protection of two high-speed data lines or high-frequency signal lines
Ultra low input/output to ground capacitance: C(I/O-GND) = 1.8 pF
ESD protection up to 12 kV
IEC 61000-4-2, level 4 (ESD)
Very low clamping voltage due to an integrated additional ESD protection diode
Very low reverse current
AEC-Q101 qualified
Small SMD plastic package
1.3 Applications
 USB 2.0 ports
 Digital Video Interface (DVI)
 High-Definition Multimedia
Interface (HDMI)
 Mobile phones
 Digital cameras
 WAN/LAN systems
 PC, notebooks, printers and other PC
peripherals
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
1.8
-
pF
Per channel
C(I/O-GND) input/output to ground
capacitance
f = 1 MHz;
V(I/O-GND) = 0 V
[1]
PRTR5V0U2AX
NXP Semiconductors
Ultra low capacitance double rail-to-rail ESD protection diode
Table 1.
Quick reference data …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
5.5
V
-
16
-
pF
Zener diode
VRWM
Csup
reverse standoff voltage
supply pin to ground
capacitance
[2]
f = 1 MHz;
VCC = 0 V
[1]
Measured from pin 2 and 3 to ground.
[2]
Measured from pin 4 to ground.
2. Pinning information
Table 2.
Pinning
Pin
Symbol
Description
1
GND
ground
2
I/O 1
input/output 1
3
I/O 2
input/output 2
4
VCC
supply voltage
Simplified outline
4
Graphic symbol
3
4
1
1
2
2
3
006aaa482
3. Ordering information
Table 3.
Ordering information
Type number
PRTR5V0U2AX
Package
Name
Description
Version
-
plastic surface-mounted package; 4 leads
SOT143B
4. Marking
Table 4.
Marking code[1]
PRTR5V0U2AX
*AE
[1]
PRTR5V0U2AX
Product data sheet
Marking codes
Type number
* = placeholder for manufacturing site code.
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Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Tamb
Tstg
Table 6.
Conditions
Min
Max
Unit
ambient temperature
40
+85
C
storage temperature
55
+125
C
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 12 kV (contact)
001aaa631
IPP
100 %
90 %
10 %
tr = 0.7 ns to 1 ns
t
30 ns
60 ns
Fig 1.
PRTR5V0U2AX
Product data sheet
ESD pulse waveform according to IEC 61000-4-2
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Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
6. Characteristics
Table 7.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per channel
VR = 3 V
[1]
-
<1
100
nA
C(I/O-GND) input/output to ground
capacitance
f = 1 MHz;
V(I/O-GND) = 0 V
[3]
-
1.8
-
pF
VF
IF = 1 mA
-
0.7
-
V
reverse current
IR
forward voltage
Zener diode
VRWM
VBR
Csup
[1]
reverse standoff voltage
-
-
5.5
V
breakdown voltage
[2]
6
-
9
V
supply pin to ground
capacitance
[2]
-
16
-
pF
f = 1 MHz;
VCC = 0 V
Measured from pin 2, 3 and 4 to ground
[2]
Measured from pin 4 to ground
[3]
Measured from pin 2 and 3 to ground
006aaa679
2.2
C(I/O-GND)
(pF)
2.0
1.8
1.6
1.4
1.2
0
1
2
3
4
5
V(I/O-GND) (V)
f = 1 MHz; Tamb = 25 C
Fig 2.
PRTR5V0U2AX
Product data sheet
Input/output to ground capacitance as a function of input/output to ground
voltage; typical values
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Ultra low capacitance double rail-to-rail ESD protection diode
ESD TESTER
Rd
450 Ω
Cs
IEC 61000-4-2 network
Cs = 150 pF; Rd = 330 Ω
DUT
Device
Under
Test
RG 223/U
50 Ω coax
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
50 Ω
PRTR5V0U2AX
vertical scale = 10 V/div
horizontal scale = 100 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped +8 kV ESD voltage waveform
(IEC 61000-4-2 network), pin I/O to GND
vertical scale = 10 A/div
horizontal scale = 15 ns/div
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
Fig 3.
vertical scale = 10 V/div
horizontal scale = 100 ns/div
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network), pin I/O to GND
006aaa680
ESD clamping test setup and waveforms
PRTR5V0U2AX
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
7. Application information
Handling data rates up to 480 Mbit/s, USB 2.0 interfaces require ESD protection devices
with an extremely low line capacitance in order to avoid signal distortion.
With a capacitance of only 1.8 pF, the NXP PRTR5V0U2AX offers IEC 61000-4-2, level 4
compliant ESD protection.
The PRTR5V0U2AX integrates two ultra-low capacitance rail-to-rail ESD protection
diodes and an additional ESD protection diode in a small 4-lead SOT143B package.
The additional ESD protection diode connected between ground and VCC prevents
charging of the supply.
To achieve the maximum ESD protection level, no additional external capacitors are
required.
USB controller
protected IC/device
common mode
choke
D+
D+
VBUS
D−
D−
GND
VBUS
006aaa485
Fig 4.
Application diagram: USB 2.0
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
PRTR5V0U2AX
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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NXP Semiconductors
Ultra low capacitance double rail-to-rail ESD protection diode
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
3.0
2.8
1.1
0.9
1.9
4
2.5
2.1
3
0.45
0.15
1.4
1.2
1
2
0.88
0.78
0.48
0.38
0.15
0.09
1.7
Dimensions in mm
Fig 5.
04-11-16
Package outline SOT143B
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
10000
PRTR5V0U2AX
SOT143B
4 mm pitch, 8 mm tape and reel
-215
-235
[1]
PRTR5V0U2AX
Product data sheet
For further information and the availability of packing methods, see Section 14.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
11. Soldering
3.25
0.6
(3×)
0.5
(3×)
1.9
solder lands
0.7 0.6
(3×) (3×)
solder resist
2
solder paste
3
occupied area
0.7 0.6
Dimensions in mm
0.75
0.95
0.9
1
Fig 6.
sot143b_fr
Reflow soldering footprint SOT143B
4.45
2.2
1.2
(3×)
1.425
(3×)
solder lands
solder resist
4.6
2.575
occupied area
Dimensions in mm
1.425
preferred transport direction during soldering
1
1.2
Fig 7.
PRTR5V0U2AX
Product data sheet
sot143b_fw
Wave soldering footprint SOT143B
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PRTR5V0U2AX v.3
20120515
Product data sheet
-
PRTR5V0U2AX v.2
Modifications:
•
•
•
•
•
•
Section 1 “Product profile”: editorial update
Section 4 “Marking”: updated
Section 6 “Characteristics”: editorial update; added condition to VF
Section 8.1 “Quality information”: added
Section 11 “Soldering”: added
Section 13 “Legal information”: updated
PRTR5V0U2AX v.2
20061221
Product data sheet
-
PRTR5V0U2AX v.1
PRTR5V0U2AX v.1
20060522
Product data sheet
-
-
PRTR5V0U2AX
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PRTR5V0U2AX
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PRTR5V0U2AX
Product data sheet
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Rev. 3 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
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Ultra low capacitance double rail-to-rail ESD protection diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 May 2012
Document identifier: PRTR5V0U2AX