Data Sheet

SO
D
523
PESD5V0X1UB
Ultra low capacitance unidirectional ESD protection diode
Rev. 1 — 15 February 2011
Product data sheet
1. Product profile
1.1 General description
Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diode in a
SOD523 (SC-79) ultra small and flat lead Surface-Mounted Device (SMD) plastic
package designed to protect one signal line from the damage caused by ESD and other
transients.
The combination of extremely low capacitance and ultra low clamping voltage makes the
device ideal for high-speed data line protection applications.
1.2 Features and benefits
 ESD protection of one line
 Ultra low diode capacitance
Cd = 0.95 pF
 Ultra low clamping voltage: VCL = 8 V
 Ultra low leakage current: IRM = 1 nA
 ESD protection up to 8 kV
 IEC 61000-4-2; level 4 (ESD)
 IEC 61000-4-5 (surge); IPP = 1.5 A
 AEC-Q101 qualified
1.3 Applications
 Computers and peripherals
 Audio and video equipment
 Cellular handsets and accessories
 10/100/1000 Mbit/s Ethernet
 Communication systems
 Portable electronics
 Subscriber Identity Module (SIM) card
protection
 USB, High-Definition Multimedia
Interface (HDMI), FireWire
 High-speed data lines
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VRWM
reverse standoff voltage
Cd
diode capacitance
Conditions
Min
Typ
Max
Unit
-
-
5.5
V
f = 1 MHz; VR = 0 V
-
0.95
1.1
pF
PESD5V0X1UB
NXP Semiconductors
Ultra low capacitance unidirectional ESD protection diode
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PESD5V0X1UB
Package
Name
Description
Version
SC-79
plastic surface-mounted package; 2 leads
SOD523
4. Marking
Table 4.
Marking codes
Type number
Marking code
PESD5V0X1UB
Y1
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
PESD5V0X1UB
Product data sheet
Symbol
Parameter
Conditions
IPP
peak pulse current
tp = 8/20 s
Min
Max
Unit
-
1.5
A
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
[1][2]
[1]
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2]
Measured from pin 1 to 2.
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Rev. 1 — 15 February 2011
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Ultra low capacitance unidirectional ESD protection diode
Table 6.
ESD maximum ratings
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
electrostatic
discharge voltage
VESD
[1][2]
IEC 61000-4-2
(contact discharge)
machine model
[2]
MIL-STD-883
(human body model)
[1]
Device stressed with ten non-repetitive ESD pulses.
[2]
Measured from pin 1 to 2.
Table 7.
Min
Max
Unit
-
8
kV
-
400
V
-
10
kV
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model)
> 4 kV
001aaa631
IPP
001aaa630
120
100 %
90 %
100 % IPP; 8 μs
IPP
(%)
80
e−t
50 % IPP; 20 μs
40
10 %
0
10
20
30
30 ns
40
t (μs)
Fig 1.
t
tr = 0.7 ns to 1 ns
0
60 ns
8/20 s pulse waveform according to
IEC 61000-4-5
PESD5V0X1UB
Product data sheet
Fig 2.
ESD pulse waveform according to
IEC 61000-4-2
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Rev. 1 — 15 February 2011
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Ultra low capacitance unidirectional ESD protection diode
6. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VRWM
reverse standoff
voltage
-
-
5.5
V
IRM
reverse leakage current VRWM = 5 V
-
1
100
nA
VBR
breakdown voltage
IR = 10 mA
5.8
7.5
10
V
Cd
diode capacitance
f = 1 MHz; VR = 0 V
1.1
pF
VCL
clamping voltage
IPP = 1.5 A
rdyn
dynamic resistance
IR = 10 A
-
0.95
[1][2]
-
8
-
V
[3]
-
0.25
-

[1]
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2]
Measured from pin 1 to 2.
[3]
Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse;
ANS/IESD STM5-1-2008.
I
006aac511
1.2
Cd
(pF)
1.1
1.0
−VCL −VBR −VRWM
0.9
V
−IRM
−IR
0.8
−
0.7
+
P-N
0.6
0.5
0.0
1.0
2.0
3.0
4.0
−IPP
5.0
VR (V)
006aaa407
f = 1 MHz; Tamb = 25 C
Fig 3.
Diode capacitance as a function of reverse
voltage; typical values
PESD5V0X1UB
Product data sheet
Fig 4.
V-I characteristics for a unidirectional
ESD protection diode
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Rev. 1 — 15 February 2011
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Ultra low capacitance unidirectional ESD protection diode
ESD TESTER
RZ
450 Ω
RG 223/U
50 Ω coax
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
50 Ω
CZ
DUT
(DEVICE
UNDER
TEST)
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
vertical scale = 10 V/div
horizontal scale = 10 ns/div
GND
GND
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
GND
GND
vertical scale = 10 V/div
horizontal scale = 10 ns/div
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
Fig 5.
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
006aac512
ESD clamping test setup and waveforms
PESD5V0X1UB
Product data sheet
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Rev. 1 — 15 February 2011
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Ultra low capacitance unidirectional ESD protection diode
7. Application information
The PESD5V0X1UB is designed for the protection of one unidirectional data or signal line
from the damage caused by ESD and surge pulses. The device may be used on lines
where the signal polarities are either positive or negative with respect to ground.
line to be protected
(positive signal polarity)
line to be protected
(negative signal polarity)
PESD5V0X1UB
PESD5V0X1UB
GND
GND
unidirectional protection of one line
006aac513
Fig 6.
Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESD5V0X1UB as close to the input terminal or connector as possible.
2. The path length between the PESD5V0X1UB and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PESD5V0X1UB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 February 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
Ultra low capacitance unidirectional ESD protection diode
9. Package outline
0.85
0.75
0.65
0.58
1
1.65 1.25
1.55 1.15
2
0.34
0.26
0.17
0.11
Dimensions in mm
Fig 7.
02-12-13
Package outline SOD523 (SC-79)
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
PESD5V0X1UB SOD523
[1]
Description
Packing quantity
3000
8000
10000
2 mm pitch, 8 mm tape and reel
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-135
For further information and the availability of packing methods, see Section 14.
11. Soldering
2.15
1.1
solder lands
solder resist
0.5 0.6
(2×) (2×)
1.2
solder paste
occupied area
0.7
(2×)
0.8
(2×)
Dimensions in mm
sod523_fr
Reflow soldering is the only recommended soldering method.
Fig 8.
PESD5V0X1UB
Product data sheet
Reflow soldering footprint SOD523 (SC-79)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 February 2011
© NXP B.V. 2011. All rights reserved.
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Ultra low capacitance unidirectional ESD protection diode
12. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESD5V0X1UB v.1
20110215
Product data sheet
-
-
PESD5V0X1UB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 February 2011
© NXP B.V. 2011. All rights reserved.
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Ultra low capacitance unidirectional ESD protection diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
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deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
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Notwithstanding any damages that customer might incur for any reason
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malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
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therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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construed as an offer to sell products that is open for acceptance or the grant,
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Suitability for use — NXP Semiconductors products are not designed,
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
PESD5V0X1UB
Product data sheet
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Ultra low capacitance unidirectional ESD protection diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PESD5V0X1UB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 February 2011
© NXP B.V. 2011. All rights reserved.
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Ultra low capacitance unidirectional ESD protection diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Quality information . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 February 2011
Document identifier: PESD5V0X1UB