Data Sheet

PESDxS1UL series
Unidirectional ESD protection diodes
Rev. 3 — 25 October 2011
Product data sheet
1. Product profile
1.1 General description
Unidirectional ElectroStatic Discharge (ESD) protection diodes in a SOD882 leadless ultra
small Surface Mounted Device (SMD) plastic package designed to protect one signal line
from the damage caused by ESD and other transients.
1.2 Features and benefits





Ultra small SMD plastic package
ESD protection of one line
Max. peak pulse power: PPP = 150 W
Low clamping voltage: VCL = 20 V
AEC-Q101 qualified




Ultra low leakage current: IRM < 700 nA
ESD protection up to 30 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5; (surge); IPP up to 15 A
1.3 Applications
 Computers and peripherals
 Audio and video equipment
 Parallel ports
 Communication systems
 High-speed data lines
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VRWM
reverse standoff voltage
Conditions
Min
Typ
Max
Unit
PESD3V3S1UL
-
-
3.3
V
PESD5V0S1UL
-
-
5.0
V
PESD12VS1UL
-
-
12
V
PESD15VS1UL
-
-
15
V
-
-
24
V
PESD3V3S1UL
-
207
300
pF
PESD5V0S1UL
-
152
200
pF
PESD12VS1UL
-
38
75
pF
PESD15VS1UL
-
32
70
pF
PESD24VS1UL
-
23
50
pF
PESD24VS1UL
Cd
diode capacitance
f = 1 MHz; VR = 0 V
PESDxS1UL series
NXP Semiconductors
Unidirectional ESD protection diodes
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
1
2
2
sym035
Transparent
top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PESD3V3S1UL
Package
Name
Description
-
leadless ultra small plastic package; 2 terminals; SOD882
body 1.0  0.6  0.5 mm
PESD5V0S1UL
Version
PESD12VS1UL
PESD15VS1UL
PESD24VS1UL
4. Marking
Table 4.
PESDXS1UL_SER
Product data sheet
Marking codes
Type number
Marking code
PESD3V3S1UL
G1
PESD5V0S1UL
G2
PESD12VS1UL
G3
PESD15VS1UL
G4
PESD24VS1UL
G5
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Rev. 3 — 25 October 2011
© NXP B.V. 2011. All rights reserved.
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Unidirectional ESD protection diodes
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
PPP
peak pulse power
tp = 8/20 s
[1]
Min
Max
Unit
IPP
peak pulse current
tp = 8/20 s
[1]
-
150
W
PESD3V3S1UL
-
15
A
PESD5V0S1UL
-
15
A
PESD12VS1UL
-
5
A
PESD15VS1UL
-
5
A
PESD24VS1UL
-
3
A
Tj
junction temperature
-
150
C
Tamb
ambient temperature
65
+150
C
Tstg
storage temperature
65
+150
C
[1]
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
Table 6.
ESD maximum ratings
Symbol
Parameter
VESD
Conditions
Min
Max
Unit
PESD3V3S1UL
-
30
kV
PESD5V0S1UL
-
30
kV
PESD12VS1UL
-
30
kV
PESD15VS1UL
-
30
kV
PESD24VS1UL
-
23
kV
-
10
kV
electrostatic discharge voltage
PESDxS1UL series
[1]
Product data sheet
MIL-STD-883
(human body model)
Device stressed with ten non-repetitive ESD pulses.
Table 7.
PESDXS1UL_SER
IEC 61000-4-2
(contact discharge)
[1]
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3B (human body model)
> 8 kV
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Rev. 3 — 25 October 2011
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NXP Semiconductors
Unidirectional ESD protection diodes
001aaa631
IPP
001aaa630
120
100 %
90 %
100 % IPP; 8 μs
IPP
(%)
80
e−t
50 % IPP; 20 μs
40
10 %
0
10
20
30
30 ns
40
t (μs)
Fig 1.
t
tr = 0.7 ns to 1 ns
0
60 ns
8/20 s pulse waveform according to
IEC 61000-4-5
Fig 2.
ESD pulse waveform according to
IEC 61000-4-2
6. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified
Symbol
Parameter
Conditions
VRWM
reverse standoff voltage
PESD3V3S1UL
IRM
VBR
Product data sheet
Typ
Max
Unit
-
-
3.3
V
PESD5V0S1UL
-
-
5.0
V
PESD12VS1UL
-
-
12
V
PESD15VS1UL
-
-
15
V
PESD24VS1UL
-
-
24
V
reverse leakage current
PESD3V3S1UL
VRWM = 3.3 V
-
0.7
2
A
PESD5V0S1UL
VRWM = 5.0 V
-
0.1
1
A
PESD12VS1UL
VRWM = 12 V
-
<1
50
nA
PESD15VS1UL
VRWM = 15 V
-
<1
50
nA
PESD24VS1UL
VRWM = 24 V
-
<1
50
nA
5.2
5.6
6.0
V
breakdown voltage
IR = 5 mA
PESD3V3S1UL
PESDXS1UL_SER
Min
[1]
PESD5V0S1UL
6.4
6.8
7.2
V
PESD12VS1UL
14.7
15.0
15.3
V
PESD15VS1UL
17.6
18.0
18.4
V
PESD24VS1UL
26.5
27.0
27.5
V
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PESDxS1UL series
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Unidirectional ESD protection diodes
Table 8.
Characteristics …continued
Tamb = 25 C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Cd
diode capacitance
f = 1 MHz; VR = 0 V
PESD3V3S1UL
-
207
300
pF
PESD5V0S1UL
-
152
200
pF
PESD12VS1UL
-
38
75
pF
PESD15VS1UL
-
32
70
pF
-
23
50
pF
IPP = 1 A
-
-
8
V
IPP = 15 A
-
-
20
V
IPP = 1 A
-
-
9
V
IPP = 15 A
-
-
20
V
IPP = 1 A
-
-
19
V
IPP = 5 A
-
-
35
V
IPP = 1 A
-
-
23
V
IPP = 5 A
-
-
40
V
IPP = 1 A
-
-
36
V
IPP = 3 A
-
-
70
V
PESD3V3S1UL
IR = 1 mA
-
-
400

PESD5V0S1UL
IR = 1 mA
-
-
80

PESD12VS1UL
IR = 1 mA
-
-
200

PESD15VS1UL
IR = 1 mA
-
-
225

PESD24VS1UL
IR = 0.5 mA
-
-
300

PESD24VS1UL
VCL
PESD3V3S1UL
PESD5V0S1UL
PESD12VS1UL
PESD15VS1UL
PESD24VS1UL
rdif
PESDXS1UL_SER
Product data sheet
[2]
clamping voltage
differential resistance
[1]
Pulse test: tp  300 s; duty cycle  0.02.
[2]
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
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Rev. 3 — 25 October 2011
© NXP B.V. 2011. All rights reserved.
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PESDxS1UL series
NXP Semiconductors
Unidirectional ESD protection diodes
001aaa726
104
001aaa193
1.2
PPP
PPP
(W)
PPP(25°C)
103
0.8
102
0.4
10
102
10
1
0
103
0
tp (μs)
50
100
150
200
Tj (°C)
Tamb = 25 C
Fig 3.
Peak pulse power as a function of exponential
pulse duration; typical values
Fig 4.
001aaa727
240
Cd
(pF)
Relative variation of peak pulse power as a
function of junction temperature; typical
values
001aaa728
50
Cd
(pF)
200
40
160
30
(1)
120
20
(2)
(1)
(2)
80
10
40
(3)
0
0
1
2
3
4
5
0
5
10
15
VR (V)
20
25
VR (V)
f = 1 MHz; Tamb = 25 C
f = 1 MHz; Tamb = 25 C
(1) PESD3V3S1UL; VRWM = 3.3 V
(1) PESD12VS1UL; VRWM = 12 V
(2) PESD5V0S1UL; VRWM = 5.0 V
(2) PESD15VS1UL; VRWM = 15 V
(3) PESD24VS1UL; VRWM = 24 V
Fig 5.
Diode capacitance as a function of reverse
voltage; typical values
PESDXS1UL_SER
Product data sheet
Fig 6.
Diode capacitance as a function of reverse
voltage; typical values
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Unidirectional ESD protection diodes
I
001aaa729
10
IRM
IRM(25°C)
(1)
−VCL −VBR −VRWM
(2)
V
−IRM
−IR
1
−
+
P-N
10−1
−100
−50
−IPP
0
50
100
150
Tj (°C)
006aaa407
(1) PESD3V3S1UL; VRWM = 3.3 V
(2) PESD5V0S1UL; VRWM = 5.0 V
IR is less than 15 nA at 150 C for:
PESD12VS1UL; VRWM = 12 V
PESD15VS1UL; VRWM = 15 V
PESD24VS1UL; VRWM = 24 V
Fig 7.
Relative variation of reverse leakage current
as a function of junction temperature; typical
values
PESDXS1UL_SER
Product data sheet
Fig 8.
V-I characteristics for a unidirectional ESD
protection diode
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Unidirectional ESD protection diodes
ESD TESTER
450 Ω
Rd
RG 223/U
50 Ω coax
10×
ATTENUATOR
4 GHz DIGITAL
OSCILLOSCOPE
50 Ω
Cs
note 1
Note 1: IEC 61000-4-2 network
Cs = 150 pF; Rd = 330 Ω
D.U.T.
(DEVICE
UNDER
TEST)
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 20 V/div
horizontal scale = 50 ns/div
PESD24VS1UL
GND
PESD15VS1UL
GND
GND
PESD12VS1UL
GND
PESD5V0S1UL
GND
PESD3V3S1UL
GND
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
GND
GND
vertical scale = 10 V/div
horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div
unclamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
006aaa682
Fig 9.
ESD clamping test setup and waveforms
PESDXS1UL_SER
Product data sheet
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Unidirectional ESD protection diodes
7. Application information
The PESDxS1UL series is designed for protection of one unidirectional data line from the
damage caused by ESD and surge pulses. The PESDxS1UL series may be used on lines
where the signal polarities are either positive or negative with respect to ground. The
PESDxS1UL series provides a surge capability of 150 W for an 8/20 s waveform.
line to be protected
(positive signal polarity)
line to be protected
(negative signal polarity)
PESDxS1UL
PESDxS1UL
ground
ground
unidirectional protection of one line
006aaa681
Fig 10. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESDxS1UL as close to the input terminal or connector as possible.
2. The path length between the PESDxS1UL and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PESDXS1UL_SER
Product data sheet
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Rev. 3 — 25 October 2011
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PESDxS1UL series
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Unidirectional ESD protection diodes
9. Package outline
0.50
0.46
0.62
0.55
2
0.30
0.22
0.65
0.30
0.22
1.02
0.95
1
0.55
0.47
cathode marking on top side (if applicable)
Dimensions in mm
03-04-17
Fig 11. Package outline SOD882
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
10000
PESD3V3S1UL
SOD882
4 mm pitch, 8 mm tape and reel
-315
PESD5V0S1UL
PESD12VS1UL
PESD15VS1UL
PESD24VS1UL
[1]
PESDXS1UL_SER
Product data sheet
For further information and the availability of packing methods, see Section 14.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 25 October 2011
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Unidirectional ESD protection diodes
11. Soldering
1.3
0.7
R0.05 (8×)
solder lands
0.6 0.7 0.8
(2×) (2×) (2×)
0.9
solder resist
solder paste
occupied area
0.3
(2×)
Dimensions in mm
0.4
(2×)
0.5
(2×)
sod882_fr
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint SOD882
PESDXS1UL_SER
Product data sheet
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12. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESDXS1UL_SER v.3
20111025
Product data sheet
-
PESDXS1UL_SER v.2
Modifications:
•
•
•
•
•
•
Section 1.2 “Features and benefits”: updated
Table 7: updated
Table 8: added pulse conditions for breakdown voltage VBR
Section 8 “Test information”: added
Section 11 “Soldering”: added
Section 13 “Legal information”: updated
PESDXS1UL_SER v.2
20090820
Product data sheet
-
PESDXS1UL_SER v.1
PESDXS1UL_SER v.1
20060331
Product data sheet
-
-
PESDXS1UL_SER
Product data sheet
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13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
PESDXS1UL_SER
Product data sheet
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PESDxS1UL series
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PESDXS1UL_SER
Product data sheet
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Unidirectional ESD protection diodes
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 9
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 October 2011
Document identifier: PESDXS1UL_SER