A1101, A1102, A1103, A1104, and A1106 Datasheet

A1101, A1102, A1103, A1104, and A1106
Continuous-Time Switch Family
FEATURES AND BENEFITS
DESCRIPTION
• AEC-Q100 automotive qualified
• Continuous-time operation
□□ Fast power-on time
□□ Low noise
• Stable operation over full operating temperature range
• Reverse battery protection
• Solid-state reliability
• Factory-programmed at end-of-line for optimum
performance
• Robust EMC performance
• High ESD rating
• Regulator stability without a bypass capacitor
Packages:
3-pin SOT23W (suffix LH)
The Allegro™ A1101-A1104 and A1106 Hall-effect switches
are next generation replacements for the popular Allegro
312x and 314x lines of unipolar switches. The A110x family,
produced with BiCMOS technology, consists of devices that
feature fast power-on time and low-noise operation. Device
programming is performed after packaging, to ensure increased
switchpoint accuracy by eliminating offsets that can be induced
by package stress. Unique Hall element geometries and lowoffset amplifiers help to minimize noise and to reduce the
residual offset voltage normally caused by device overmolding,
temperature excursions, and thermal stress.
The A1101-A1104 and A1106 Hall-effect switches include
the following on a single silicon chip: voltage regulator, Hallvoltage generator, small-signal amplifier, Schmitt trigger, and
NMOS output transistor. The integrated voltage regulator
permits operation from 3.8 to 24 V. The extensive on-board
protection circuitry makes possible a ±30 V absolute maximum
voltage rating for superior protection in automotive and
industrial motor commutation applications, without adding
external components. All devices in the family are identical
except for magnetic switchpoint levels.
3-pin SIP (suffix UA)
The small geometries of the BiCMOS process allow these
devices to be provided in ultrasmall packages. The package
styles available provide magnetically optimized solutions for
most applications. Package LH is an SOT23W, a miniature lowprofile surface-mount package, while package UA is a three-lead
ultramini SIP for through-hole mounting. Each package is lead
(Pb) free, with 100% matte-tin-plated leadframes.
LH: A1101, A1102,
A1103, A1104, and
A1106
Not to scale
UA: A1101,
A1102, A1103,
and A1104
UA: A1106
VCC
To all subcircuits
Regulator
VOUT
Amp
Gain
Offset
Trim
Control
GND
Functional Block Diagram
A1101-DS, Rev. 16
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
SPECIFICATIONS
Selection Guide
Part Number
Packing*
Mounting
Ambient, TA
A1101ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1101ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1101EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1101LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1101LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1101LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1102ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1102ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1102EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1102LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1102LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1102LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1103ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1103ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1103LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1103LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1103LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1104EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
BRP (Min)
BOP (Max)
10
175
60
245
150
355
25
450
160
430
–40ºC to 85ºC
–40ºC to
150ºC
–40ºC to 85ºC
–40ºC to
150ºC
–40ºC to 85ºC
–40ºC to
150ºC
–40ºC to 85ºC
A1104LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1104LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1104LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1106EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
–40ºC to
150ºC
–40ºC to 85ºC
A1106LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1106LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1106LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
–40ºC to
150ºC
*Contact Allegro for additional packing options.
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
Units
Supply Voltage
VCC
30
V
Reverse Supply Voltage
VRCC
–30
V
V
Output Off Voltage
VOUT
30
Reverse Output Voltage
VROUT
–0.5
V
IOUTSINK
25
mA
Output Current
Magnetic Flux Density
B
Unlimited
G
Range E
–40 to 85
ºC
Range L
Operating Ambient Temperature
TA
–40 to 150
ºC
Maximum Junction Temperature
TJ(max)
165
ºC
Tstg
–65 to 170
ºC
Storage Temperature
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise
noted
Characteristic
Symbol
Supply Voltage1
Output Leakage Current
Output On Voltage
Min.
Typ.
Max.
Units
VCC
Operating, TJ < 165°C
3.8
–
24
V
IOUTOFF
VOUT = 24 V, B < BRP
–
–
10
µA
VOUT(SAT)
IOUT = 20 mA, B > BOP
–
215
400
mV
Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or B < BRP
–5G
–
–
4
µs
tr
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF
–
–
400
ns
tf
Power-On Time2
Test Conditions
tPO
Output Rise Time3
Output Fall Time3
Supply Current
Reverse Battery Current
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF
–
–
400
ns
ICCON
B > BOP
–
4.1
7.5
mA
ICCOFF
B < BRP
–
3.8
7.5
mA
VRCC = –30 V
–
–
–10
mA
ICC = 10.5 mA; TA = 25°C
32
–
–
V
–
–
10.5
mA
IRCC
Supply Zener Clamp Voltage
VZ
IZ
VZ = 32 V; TA = 25°C
Supply Zener Current4
1 Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
slew rates greater than 250 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value.
CC(max)
+ 3 mA.
DEVICE QUALIFICATION PROGRAM
Contact Allegro for information.
EMC (ELECTROMAGNETIC COMPATABILITY) REQUIREMENTS
GND
Contact Allegro for information.
2
VOUT
1
Package LH
2
3
VOUT
1
VCC
3
GND
CC
3 C =oscilloscope probe capacitance.
S
4 Maximum current limit is equal to the maximum I
VCC
2 For V
Package UA, 3-pin SIP
Terminal List
Number
Package LH
Package UA
1
1
2
3
3
2
Name
Description
VCC
VOUT
GND
Connects power supply to chip
Output from circuit
Ground
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
MAGNETIC OPERATING CHARACTERISTICS1: over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic
Symbol
Test Conditions
A1101
A1102
Operate Point
BOP
A1103
A1104
A1106
A1101
A1102
Release Point
BRP
A1103
A1104
A1106
A1101
A1102
Hysteresis
BHYS
A1103
A1104
A1106
Min.
Typ.
Max.
Units
TA = 25°C
50
100
160
G
Operating Temperature Range
30
100
175
G
TA = 25°C
130
180
230
G
Operating Temperature Range
115
180
245
G
TA = 25°C
220
280
340
G
Operating Temperature Range
205
280
355
G
TA = 25°C
70
–
350
G
Operating Temperature Range
35
–
450
G
TA = 25°C
280
340
400
G
Operating Temperature Range
260
340
430
G
TA = 25°C
10
45
130
G
Operating Temperature Range
10
45
145
G
TA = 25°C
75
125
175
G
Operating Temperature Range
60
125
190
G
TA = 25°C
165
225
285
G
Operating Temperature Range
150
225
300
G
TA = 25°C
50
–
330
G
Operating Temperature Range
25
–
430
G
TA = 25°C
180
240
300
G
Operating Temperature Range
160
240
330
G
TA = 25°C
20
55
80
G
Operating Temperature Range
20
55
80
G
TA = 25°C
30
55
80
G
Operating Temperature Range
30
55
80
G
TA = 25°C
30
55
80
G
Operating Temperature Range
30
55
80
G
TA = 25°C
20
55
–
G
Operating Temperature Range
20
55
–
G
TA = 25°C
70
105
140
G
Operating Temperature Range
70
105
140
G
1 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields. This so-called alge-
braic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated by the absolute value of B, and the
sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but opposite polarity).
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
THERMAL CHARACTERISTICS: may require derating at maximum conditions; see application information
Characteristic
Symbol
Test Conditions
Package LH, 1-layer PCB with copper limited to solder pads
Package Thermal Resistance
Package LH, 2-layer PCB with 0.463
connected by thermal vias
RθJA
in.2
of copper area each side
Maximum Allowable VCC (V)
Package UA, 1-layer PCB with copper limited to solder pads
Value
Units
228
ºC/W
110
ºC/W
165
ºC/W
Power Derating Curve
TJ(max) = 165ºC; ICC = ICC(max)
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
Package LH, 2-layer PCB
(RθJA = 110 ºC/W)
Package UA, 1-layer PCB
(RθJA = 165 ºC/W)
Package LH, 1-layer PCB
(RθJA = 228 ºC/W)
20
40
60
80
100
VCC(min)
120
140
160
180
Power Dissipation, PD (mW)
Temperature
(ºC)
Power Dissipation
versus Ambient
Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
Pa
(R cka
ge
θJ
A =
L
11 H, 2
0 º -la
Pac
C/ ye
W
(R kage
) r PC
UA
θJA =
B
,
165 1-la
ºC/ yer
W)
PC
B
Pac
k
(R age LH
,
θJA =
228 1-laye
ºC/W r PC
B
)
20
40
60
80
100
120
Temperature (°C)
140
160
180
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
CHARACTERISTIC DATA
Supply Current (On) versus Ambient Temperature
Supply Current (On) versus Supply Voltage
(A1101/02/03/04/06)
(A1101/02/03/04/06)
8.0
8.0
7.0
7.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCON (mA)
ICCON (mA)
6.0
6.0
TA (°C)
5.0
–40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
0
0
–50
0
50
TA (°C)
100
150
0
5
20
25
Supply Current (Off) versus Supply Voltage
(A1101/02/03/04/06)
(A1101/02/03/04/06)
8.0
7.0
7.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCOFF (mA)
8.0
6.0
ICCOFF (mA)
15
VCC (V)
Supply Current (Off) versus Ambient Temperature
6.0
TA (°C)
5.0
–40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
0
0
–50
0
50
TA (°C)
100
0
150
5
10
15
20
25
VCC (V)
Output Voltage (On) versus Ambient Temperature
Output Voltage (On) versus Supply Voltage
(A1101/02/03/04/06)
(A1101/02/03/04/06)
400
400
350
350
300
300
250
VCC (V)
200
24
3.8
150
VOUT(SAT) (mV)
VOUT(SAT) (mV)
10
–40
25
150
200
150
100
100
50
50
0
TA (°C)
250
0
–50
0
50
TA (°C)
100
150
0
5
10
15
20
25
VCC (V)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
FUNCTIONAL DESCRIPTION
OPERATION
The output of these devices switches low (turns on) when a
magnetic field (south polarity) perpendicular to the Hall element
exceeds the operate point threshold, BOP. After turn-on, the output
is capable of sinking 25 mA and the output voltage is VOUT(SAT).
When the magnetic field is reduced below the release point,
BRP , the device output goes high (turns off). The difference in
the magnetic operate and release points is the hysteresis, Bhys, of
the device. This built-in hysteresis allows clean switching of the
output, even in the presence of external mechanical vibration and
electrical noise.
Powering-on the device in the hysteresis region, less than BOP and
higher than BRP, allows an indeterminate output state. The correct
state is attained after the first excursion beyond BOP or BRP.
time devices typically require programming after packaging to
tighten magnetic parameter distributions. In contrast, chopperstabilized switches employ an offset cancellation technique on
the chip that eliminates these offsets without the need for afterpackaging programming. The tradeoff is a longer settling time and
reduced frequency response as a result of the chopper-stabilization offset cancellation algorithm.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery management is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they are
the clear choice for such applications.
CONTINUOUS-TIME BENEFITS
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Continuous-time devices, such as the A110x family, offer the fast- Sensing Using Dynamic Quadrature Offset Cancellation and
est available power-on settling time and frequency response. Due Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
to offsets generated during the IC packaging process, continuous- Track-and-Hold Signal Demodulator.
(A)
(B)
VS
V+
A110x
BOP
B– 0
RL
VOUT
Output
GND
VOUT(SAT)
BRP
VOUT
0
VCC
Switch to Low
Switch to High
VCC
B+
BHYS
Figure 1: Switching Behavior of Unipolar Switches
On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the B– direction indicates decreasing
south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when using a circuit such as that
shown in Panel B.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
ADDITIONAL APPLICATIONS INFORMATION
Extensive applications information for Hall-effect devices is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Hall-Effect Devices: Guidelines for Designing Subassemblies
Using Hall-Effect Devices, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and ThroughHole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
1
2
3
4
5
VCC
t
VOUT
t
Output Sampled
tPO(max)
Figure 2: Continuous-Time Application, B < BRP
This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power. Position 1, power is applied to the
device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max). The case shown is where
the correct output state is HIGH . Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is valid, a control unit
reads the output. Position 5, power is removed from the device.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
POWER DERATING
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems Web site.)
The Package Thermal Resistance, RθJA, is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD. PD = VIN × IIN ΔT = PD × RθJA TJ = TA + ΔT
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 4 mA, and RθJA = 140 °C/W, then:
(2)
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RθJA and TA.
Example: Reliability for VCC at TA = 150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically: RθJA = 165°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and
ICC(max) = 7.5 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
ΔTmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = ΔTmax ÷ RθJA = 15°C ÷ 165 °C/W = 91 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 91 mW ÷ 7.5 mA = 12.1 V
(1) The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable
operation between VCC(est) and VCC(max) requires enhanced
(3)
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
PD = VCC × ICC = 12 V × 4 mA = 48 mW
ΔT = PD × RθJA = 48 mW × 140 °C/W = 7°C
TJ = TA + ΔT = 25°C + 7°C = 32°C
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
CUSTOMER PACKAGE DRAWING
For Reference Only – Not for Tooling Use
(Reference DWG-2840)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.12
2.98 –0.08
D
1.49
4° ±4°
A
3
+0.020
0.180 –0.053
0.96
D
+0.19
1.91 –0.06
+0.10
2.90 –0.20
2.40
0.70
D
0.25 MIN
1.00
2
1
0.55 REF
0.25 BSC
0.95
Seating Plane
Branded Face
Gauge Plane
B
PCB Layout Reference View
8X 10°
REF
1.00 ±0.13
A1101, A1102,
A1103, A1104,
and A1106
NNT
+0.10
0.05 –0.05
0.95 BSC
0.40 ±0.10
N = Last three digits of device part number
T = Temperature Code (Letter)
A Active Area Depth, 0.28 mm
B Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads;
adjust as necessary to meet application process requirements and PCB layout tolerances
C Branding scale and appearance at supplier discretion
A1101, A1102,
A1103, A1104,
and A1106
NNN
D Hall elements, not to scale
N = Last three digits of device part number
C
Standard Branding Reference View
Figure 3: Package LH, 3-Pin (SOT-23W)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
For Reference Only – Not for Tooling Use
(Reference DWG-9049)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
45°
B
+0.08
4.09
–0.05
1.52 ±0.05
E
2.04
C
2 X 10°
1.44 E
E
Mold Ejector
Pin Indent
+0.08
3.02
–0.05
45°
Branded
Face
2.16 MAX
0.51 REF
A
1
2
0.79 REF
3
0.43
+0.05
–0.07
0.41
+0.03
–0.06
1.27 NOM
NNT
15.75 ±0.25
1
D
Standard Branding Reference View
= Supplier emblem
N = Last three digits of device part number
T = Temperature code
A
Dambar removal protrusion (6X)
B
Gate and tie bar burr area
C
Active Area Depth, 0.50 mm REF
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
Figure 4: Package UA, 3-Pin SIP
(A1101, A1102, A1103, and A1104)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
For Reference Only – Not for Tooling Use
(Reference DWG-9013)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
45°
B
4.09
+0.08
–0.05
1.52 ±0.05
E
2.04
C
2 X 10°
1.44 E
3.02
E
Mold Ejector
Pin Indent
+0.08
–0.05
45°
Branded
Face
A
1.02 MAX
0.79 REF
1
2
3
0.43
+0.05
–0.07
0.41
+0.03
–0.06
1.27 NOM
NNN
14.99 ±0.25
1
D
Standard Branding Reference View
= Supplier emblem
N = Last three digits of device part number
A
Dambar removal protrusion (6X)
B
Gate and tie bar burr area
C
Active Area Depth, 0.50 mm REF
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
Figure 5: Package UA, 3-Pin SIP
(A1106)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Revision History
Revision
Revision Date
14
May 29, 2012
15
January 1, 2015
16
September 30, 2015
Description of Revision
Add A1106 UA package drawing
Added the LX option to Selection Guide
Corrected LH package Active Area Depth value and LH package branding; added AEC-Q100
qualification under Features and Benefits
Copyright ©2015, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
13
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