A1225, A1227, A1229 Datasheet

A1225, A1227, and A1229
Hall Effect Latch for High Temperature Operation
Features and Benefits
Description
▪ Symmetrical switchpoints
▪ Superior temperature stability
▪ Operation from unregulated supply
▪ Open-drain 25 mA output
▪ Reverse Battery protection
▪ Activate with small, commercially available
permanent magnets
▪ Solid-state reliability
▪ Small size
▪ Resistant to physical stress
▪ Enhanced ESD structures result in 8 kV HBM ESD
performance without external protection components
▪ Internal protection circuits enable 40 V load dump
compliance without external protection components
These Hall-effect latches are extremely temperature-stable
and stress resistant sensor ICs especially suited for operation
over extended temperature ranges to 150°C. Superior hightemperature performance is made possible through a novel
Schmitt trigger circuit that maintains operate and release
point symmetry by compensating for temperature changes
in the Hall element. Additionally, internal compensation
provides magnetic switchpoints that become more sensitive
with temperature, hence offsetting the usual degradation of
the magnetic field with temperature. The symmetry capability
makes these devices ideal for use in pulse-counting applications
where duty cycle is an important parameter. The three basic
devices (A1225, A1227, and A1229) are identical except for
magnetic switchpoints.
Each device includes on a single silicon chip a voltage regulator,
Hall-voltage generator, temperature compensation circuit,
signal amplifier, Schmitt trigger, and a buffered open-drain
output to sink up to 25 mA. The on-board regulator permits
operation with supply voltages of 3.8 to 24 V.
Packages:
3-pin SIP
(suffix UA)
The first character of the part number suffix determines the
device operating temperature range. Suffix L is for –40°C to
150°C. Two package styles provide a magnetically optimized
package for most applications. Suffix LT is a miniature SOT89/
TO-243AA transistor package for surface-mount applications,
suffix UA is a three-lead ultra-mini-SIP. Both packages are lead
(Pb) free with 100% matte tin leadframe plating.
3-pin SOT89
(suffix LT)
Not to scale
Functional Block Diagram
Regulator
VCC
To All Subcircuits
Hall Chopping Logic
Clock / Logic
VOUT
AMP
Anti-aliasing
LP-Filter
Tuned Filter
GND
A1225-DS, Rev. 2
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Selection Guide
Packing*
Part Number
Package
A1225LLTTK-T
13-in. reel, 4000 pieces/reel
3-pin SOT89 surface mount
A1225LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1227LLTTK-T
13-in. reel, 4000 pieces/reel
3-pin SOT89 surface mount
A1227LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1229LLTTK-T
13-in. reel, 4000 pieces/reel
3-pin SOT89 surface mount
A1229LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
Ambient
Temperature, TA
BRP(min)
(G)
BOP(max)
(G)
–40°C to 150°C
–300
300
–40°C to 150°C
–175
175
–40°C to 150°C
–200
200
*Contact Allegro™ for additional packaging options.
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
Unit
Forward Supply Voltage
VCC
30
V
Reverse Supply Voltage
VRCC
–30
V
Output Off Voltage
VOUT
30
V
Reverse Output Voltage
VROUT
–0.5
V
Continuous Output Current
IOUT(SINK)
25
mA
–40 to 150
ºC
TJ(max)
165
ºC
Tstg
–65 to 170
ºC
Operating Ambient Temperature
TA
Maximum Junction Temperature
Storage Temperature
Range L
Pin-out Diagrams
Package LT
1
2
Package UA
Terminal List Table
Number
Name
Function
1
VCC
Input power supply
2
GND
Ground
3
VOUT
Output signal
3
1
2
3
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
ELECTRICAL CHARACTERISTICS Valid at TA = –40°C to 150°C, CBYPASS = 0.1 μF, VCC = 12 V; unless otherwise noted
Characteristics
Symbol
Test Conditions
Min.
Typ.1
Max.
Unit2
Electrical Characteristics
Supply Voltage
Supply Current
VCC
ICC
Operating; TJ ≤ 165°C
B < BRP (Output off)
3.8
–
–
24
V
6
mA
B > BOP (Output on)
–
–
6
mA
Supply Zener Voltage
VZ(sup)
ICC = 9 mA, TA = 25°C
28
–
–
V
Reverse Battery Current
IZ(sup)
VRCC = –28 V, TA = 25°C
–
–
–5
mA
–
–
12
μs
–
HIGH
–
–
–
400
–
kHz
Power-On Time3
tPO
Power-On State
POS
Chopping Frequency
fchop
B < BOP
Output Stage Characteristics
Output Saturation Voltage
Output Leakage Current
Output Rise
Time3,4
Output Fall Time3,4
Output Zener Voltage
IOUT = 20 mA
–
175
400
mV
IOFF
VOUT = 24 V, B < BRP
–
<1
10
μA
tr
RL= 820 Ω, CL= 20 pF
–
200
2000
ns
tf
RL= 820 Ω, CL= 20 pF
–
200
2000
ns
VZ(out)
IOUT = 3 mA, TA = 25°C
30
–
–
V
VOUT(sat)
Magnetic Characteristics
A1225
Operate Point
BOP
A1227
A1229
A1225
Release Point
BRP
A1227
A1229
A1225
Hysteresis (BOP – BRP)
BHYS
A1227
A1229
TA = 25°C
170
–
270
G
Over operating temperature range
140
–
300
G
50
–
150
G
TA = 25°C
Over operating temperature range
TA = 25°C
Over operating temperature range
50
–
175
G
100
–
180
G
80
–
200
G
TA = 25°C
–270
–
–170
G
Over operating temperature range
–300
–
–140
G
TA = 25°C
–150
–
–50
G
Over operating temperature range
–175
–
–50
G
TA = 25°C
–180
–
–100
G
Over operating temperature range
G
–200
–
–80
TA = 25°C
340
–
540
G
Over operating temperature range
280
–
600
G
300
G
–
350
G
TA = 25°C
100
Over operating temperature range
100
TA = 25°C
200
–
360
G
Over operating temperature range
160
–
400
G
1Typical
data are at TA = 25°C and VCC = 12 V, and are for design estimations only.
G (gauss) = 0.1 mT (millitesla).
3Minimum and maximum specifications verified by bench characterization and not guaranteed by Allegro final test.
4C = oscilloscope probe capacitance.
L
21
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions*
RθJA
Package Thermal Resistance
Value
Units
Package LT, 1-layer PCB with copper limited to solder pads
180
ºC/W
Package LT, 2-layer PCB with 0.94 in2 copper each side
78
ºC/W
Package UA, 1-layer PCB with copper limited to solder pads
165
ºC/W
*Additional thermal information available on Allegro website.
Maximum Allowable VCC (V)
Power Derating Curve
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
1-layer PCB, Package LT
(RθJA = 180 ºC/W)
1-layer PCB, Package UA
(RθJA = 165 ºC/W)
2-layer PCB, Package LT
(RθJA = 78 ºC/W)
VCC(min)
20
40
60
80
100
120
140
160
180
160
180
TA (ºC)
Power Dissipation, PD (m W)
Power Dissipation
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
2
(R -lay
θJ
A
er
= PC
78 B
ºC , Pa
/W ck
) ag
1-la
(R yer P
CB
θJA =
165 , Pac
1-la
ºC/ kage
W)
(R yer P
UA
CB
θJA =
180 , Pac
ºC/ kage
W)
LT
20
40
60
e
LT
80
100
120
Temperature (°C)
140
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Characteristic Performance
A1225, A1227, and A1229 Electrical Characteristics
Average Supply Current (On) versus Ambient Temperature
Average Supply Current (On) versus Supply Voltage
6.0
6.0
5.5
5.5
5.0
5.0
4.5
4.0
VCC (V)
3.5
3.8
4.5
12
24
3.0
2.5
2.0
ICC(av) (mA)
ICC(av) (mA)
4.5
4.0
–40
3.0
25
2.5
2.0
1.5
1.5
1.0
1.0
0.5
0.5
150
0
0
- 60
TA (°C)
3.5
- 40
- 20
0
20
40
60
80
2
100 120 140 160
6
10
TA (°C)
Average Supply Current (Off) versus Ambient Temperature
5.5
5.5
5.0
5.0
VCC (V)
4.0
3.5
3.8
4.5
12
24
3.0
2.5
2.0
ICC(av) (mA)
ICC(av) (mA)
26
4.5
4.5
4.0
TA (°C)
3.5
–40
3.0
25
2.5
2.0
1.5
1.5
1.0
1.0
0.5
0.5
150
0
0
- 40
- 20
0
20
40
60
80
2
100 120 140 160
6
10
TA (°C)
14
18
22
26
VCC (V)
Average Output Saturation Voltage versus Supply Voltage
Average Output Saturation Voltage versus Ambient Temperature
300
300
250
250
200
VCC (V)
3.8
4.5
12
24
150
100
VOUT(sat) (mV)
VOUT(sat) (mV)
22
Average Supply Current (Off) versus Supply Voltage
6.0
200
TA (°C)
–40
150
25
100
150
50
50
0
0
- 60
18
VCC (V)
6.0
- 60
14
- 40
- 20
0
20
40
60
TA (°C)
80
100 120 140 160
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
A1225 Magnetic Characteristics
Operate Point versus Ambient Temperature
Operate Point versus Supply Voltage
300
300
280
280
260
VCC (V)
240
3.8
12
24
220
200
BOP (G)
BOP (G)
260
–40
220
25
150
200
180
180
160
160
140
- 60 - 40 - 20
TA (°C)
240
140
0
20
40
60
80 100 120 140 160
2
6
10
TA (°C)
22
26
Release Point versus Supply Voltage
- 140
-140
- 160
-160
- 180
-180
- 200
VCC (V)
- 220
3.8
12
24
- 240
BRP (G)
BRP (G)
18
VCC (V)
Release Point versus Ambient Temperature
-200
TA (°C)
-220
–40
25
-240
150
- 260
-260
- 280
-280
- 300
-300
- 60 - 40 - 20
0
20
40
60
80 100 120 140 160
2
6
10
TA (°C)
18
22
Switchpoint Hysteresis versus Supply Voltage
600
560
560
520
520
480
VCC (V)
440
3.8
12
24
400
BHYS (G)
600
480
TA (°C)
440
–40
25
400
360
360
320
320
280
- 60 - 40 - 20
14
VCC (V)
Switchpoint Hysteresis versus Ambient Temperature
BHYS (G)
14
150
280
0
20
40
60
TA (°C)
80 100 120 140 160
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
A1227 Magnetic Characteristics
Operate Point versus Ambient Temperature
Operate Point versus Supply Voltage
175
175
163
163
150
150
VCC (V)
125
3.8
12
24
113
100
138
BOP (G)
BOP (G)
138
–40
113
25
100
150
88
88
75
75
63
63
50
- 60 - 40 - 20
TA (°C)
125
50
0
20
40
60
80 100 120 140 160
2
6
10
TA (°C)
22
26
Release Point versus Supply Voltage
-50
-50
-63
-63
-75
-75
-88
-100
VCC (V)
-113
3.8
12
24
-125
-138
BRP (G)
-88
BRP (G)
18
VCC (V)
Release Point versus Ambient Temperature
-100
TA (°C)
-113
–40
-125
25
-138
150
-150
-150
-163
-163
-175
-175
- 60 - 40 - 20
0
20
40
60
2
80 100 120 140 160
6
10
TA (°C)
18
22
26
Switchpoint Hysteresis versus Supply Voltage
350
350
325
325
300
300
275
VCC (V)
225
3.8
12
24
200
175
BHYS (G)
275
250
250
TA (°C)
225
–40
150
125
20
40
60
TA (°C)
80 100 120 140 160
150
175
125
0
25
200
150
100
- 60 - 40 - 20
14
VCC (V)
Switchpoint Hysteresis versus Ambient Temperature
BHYS (G)
14
100
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
A1229 Magnetic Characteristics
Operate Point versus Ambient Temperature
Operate Point versus Supply Voltage
200
200
190
190
180
180
170
170
VCC (V)
150
3.8
12
24
140
130
120
160
BOP (G)
BOP (G)
160
TA (°C)
150
–40
140
25
130
150
120
110
110
100
100
90
90
80
- 60 - 40 - 20
80
0
20
40
60
80 100 120 140
2
6
10
TA (°C)
Release Point versus Ambient Temperature
22
26
Release Point versus Supply Voltage
-80
- 90
-90
- 100
- 100
- 110
- 110
- 120
VCC (V)
- 130
3.8
12
24
- 140
- 150
- 160
BRP (G)
BRP (G)
18
VCC (V)
- 80
- 120
- 130
TA (°C)
- 140
–40
- 150
25
- 160
150
- 170
- 170
- 180
- 180
- 190
- 190
- 200
- 60 - 40 - 20
- 200
0
20
40
60
80 100 120 140
2
6
10
TA (°C)
380
380
360
360
340
340
320
300
VCC (V)
280
3.8
12
24
260
240
BHYS (G)
400
TA (°C)
280
–40
260
25
240
150
220
200
180
180
160
- 60 - 40 - 20
160
40
60
26
300
200
TA (°C)
22
320
220
20
18
Switchpoint Hysteresis versus Supply Voltage
400
0
14
VCC (V)
Switchpoint Hysteresis versus Ambient Temperature
BHYS (G)
14
80 100 120 140 160
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Functional Description and Application Information
Switching Behavior
The output of the A1225, A1227, and A1229 devices switches
low (turns on) when a magnetic field perpendicular to the Hall
element exceeds the operate point threshold, BOP (see figure 1).
After turn-on, the output is capable of sinking 25 mA and the
output voltage is VOUT(sat). Notice that the device latches; that is,
a south pole of sufficient strength towards the branded surface
of the device turns the device on, and the device remains on with
removal of the south pole.
Application Information
The simplest form of magnet that will operate these devices is a
ring magnet, as shown in figure 2. Other methods of operation
are possible.
In three-wire applications the device output is connected through
a pull-up resistor to the supply pin or separate battery voltage
(figure 3). Switching of the output signal indicates sufficient
change of the magnetic field.
When the magnetic field is reduced below the release point, BRP ,
the device output goes high (turns off). The difference between
the magnetic operate point and release point is the hysteresis,
BHYS, of the device. This built-in hysteresis allows clean switching of the output, even in the presence of external mechanical
vibration and electrical noise.
When the device is powered-on in the hysteresis range, less than
BOP and higher than BRP, the device output goes high. The correct
output state is attained after the first excursion beyond BOP or
BRP .
V+
VOUT
Figure 2. Typical magnetic target configuration using a ring magnet
Switch to Low
Switch to High
VCC
RPULLUP
VOUT(sat)
BOP
B–
BRP
0
VPULLUP
V+
A122x
B+
VOUT
VCC
CBYPASS
GND
Device
Output
CL
(Optional)
BHYS
Figure 1. Output switching characteristics
Figure 3. Typical 3-wire application circuit
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Chopper Stabilization Technique
When using Hall-effect technology, a limiting factor for
switchpoint accuracy is the small signal voltage developed across
the Hall element. This voltage is disproportionally small relative
to the offset that can be produced at the output of the Hall sensor IC. This makes it difficult to process the signal while maintaining an accurate, reliable output over the specified operating
temperature and voltage ranges. Chopper stabilization is a unique
approach used to minimize Hall offset on the chip. Allegro
employs a patented technique to remove key sources of the output drift induced by thermal and mechanical stresses. This offset
reduction technique is based on a signal modulation-demodulation process. The undesired offset signal is separated from the
magnetic field-induced signal in the frequency domain, through
modulation. The subsequent demodulation acts as a modulation
process for the offset, causing the magnetic field-induced signal
to recover its original spectrum at base band, while the DC offset
becomes a high-frequency signal. The magnetic-sourced signal
then can pass through a low-pass filter, while the modulated DC
offset is suppressed. In addition to the removal of the thermal and
stress related offset, this novel technique also reduces the amount
of thermal noise in the Hall sensor IC while completely removing
the modulated residue resulting from the chopper operation. The
chopper stabilization technique uses a high-frequency sampling
clock. For the demodulation process, a sample-and-hold technique is used. This high-frequency operation allows a greater
sampling rate, which results in higher accuracy and faster signalprocessing capability. This approach desensitizes the chip to the
effects of thermal and mechanical stresses, and produces devices
that have extremely stable quiescent Hall output voltages and
precise recoverability after temperature cycling. This technique
is made possible through the use of a BiCMOS process, which
allows the use of low-offset, low-noise amplifiers in combination
with high-density logic integration and sample-and-hold circuits.
Regulator
Clock/Logic
Hall Element
Amp
Anti-Aliasing
LP Filter
Tuned
Filter
Figure 4. Chopper stabilization technique
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Package LT 3-Pin SOT-89
+0.13
4.47 –0.08
1.73 ±0.10
2.50
2.00
+0.03
0.41 –0.06
E
2.24
B
D
0.38 MIN
0.80
E
6° REF
1.14
+0.10
4.14 –0.20
+0.03
2.57 –0.28
2.16 REF
2.60
Parting Line
4.60
1.20
10° REF
1
2
3
1.04 ±0.15
10° REF
1.50
C
Branded Face
Basic pads for low-stress, not self-aligning
Additional pad for low-stress, self-aligning
Additional area for IPC reference layout
+0.15
1.45 –0.05
+0.05
0.43 –0.07
0.70
PCB Layout Reference View
+0.05
0.51 –0.07
NN
2X 1.50 NOM
1
A
Standard Branding Reference View
= Supplier emblem
N = Last two digits of device part number
Updated package drawing only. Allegro package assembly tooling has not changed.
For Reference Only; not for tooling use (reference DWG-9064)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
Branding scale and appearance at supplier discretion
B
Gate and tie bar burr area
C
Reference land pattern layout;
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances
D Active Area Depth, 0.77 mm
E Hall element; not to scale
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Package UA 3-Pin SIP
+0.08
4.09 –0.05
45°
B
C
E
2.04
1.52 ±0.05
1.44 E
Mold Ejector
Pin Indent
+0.08
3.02 –0.05
E
Branded
Face
NN
45°
1
2.16
MAX
D Standard Branding Reference View
= Supplier emblem
N = Last two digits of device part number
0.79 REF
A
0.51
REF
1
2
3
+0.03
0.41 –0.06
15.75 ±0.51
For Reference Only; not for tooling use (reference DWG-9049)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar pro
Exact case and lead configuration at supplier discretion within l
A
Dambar removal protrusion (6X)
B Gate burr area
C Active Area Depth, 0.50 mm REF
+0.05
0.43 –0.07
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
1.27 NOM
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
A1225, A1227
and A1229
Hall Effect Latch for High Temperature Operation
Revision History
Revision
Revision Date
Rev. 2
May 8, 2013
Description of Revision
Update product offerings, editorial correction to
IZ(sup)
Copyright ©2009-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
13