bs80xCv100.pdf

BS801C/02C/04C/06C/08C
Touch Key
Features
· Operating voltage: 2.2V~5.5V
· Output type: Level-hold or Toggle
· Ultra low current: 3.0mA at 3V
· One-key or Any-key State
· Auto-calibration
· Key State Mode set by pins or serial command
· High reliability touch detections
· Open drain NMOS output
· High PSRR
· Key status monitored using pins or serial bus
General Description
The BS801C/02C/04C/06C/08C are a range of 1 to 8
key touch key devices which can detect human body
contact using external touch pads. The high level of device integration enable applications to be implemented
with a minimum number of external components.
Special internal circuitry is also employed to ensure
excellent power noise rejection to reduce the possibility
of false detections, increasing the touch switch application reliability under adverse environmental conditions.
With auto-calibration, low operating current and a low
power one-key operating state, this range of touch key
devices provides a simple and effective means of implementing touch switches in a wide variety of applications.
The BS804C and BS808C are equipped with a One-line
serial interface to allow easy communication with an external MCU for device setup and for touch pin monitoring purposes.
Selection Table
Operating Current at 3V
One-Key
State
Any-key
State
Key
Output
Type
Package
Serial
Interface
1-Key
3.0mA
¾
Level-Hold
or Toggle
SOT23-6
¾
BS802C
2-Key
¾
5.0mA
Level-Hold
or Toggle
8SOP
¾
¾
8SOP
BS804C
4-Key
Level-Hold
or Toggle
16NSOP
Level-Hold
16NSOP
¾
¾
16NSOP
Ö
Level-Hold
20SOP/SSOP
¾
Part. No.
Touch
Keys
BS801C
3.0mA
8.0mA
BS806C
6-Key
3.0mA
14.0mA
BS808C
8-Key
3.0mA
18.0mA
Rev. 1.00
1
Ö
Auto
Calibration
Ö
December 2, 2009
BS801C/02C/04C/06C/08C
Pin Assignment
V D D
5
L H F
6
C re f
4
T o p V ie w
2
1
3
K o u t V S S K e y
K e y 0
1
1 6
K o u t0
K e y 1
2
1 5
K o u t1
K e y 2
3
1 4
K o u t2
K e y 3
4
1 3
K o u t3
K e y 0
1
8
C re f
K e y 1
1
8
K e y 0
C re f
5
1 2
S C D
K o u t1
2
7
K e y 1
K e y 2
2
7
S C D
V S S
6
1 1
V D D
K o u t0
3
6
V D D
K e y 3
3
6
V D D
N C
7
1 0
O K W
V S S
4
5
L H F
C re f
4
5
V S S
N C
8
9
L H F
B S 8 0 2 C
8 S O P -A
B S 8 0 1 C
S O T 2 3 -6 -A
B S 8 0 4 C
8 S O P -A
B S 8 0 4 C
1 6 N S O P -A
K e y 0
1
2 0
K o u t0
K e y 1
2
1 9
K o u t1
K e y 0
1
1 6
K o u t0
K e y 0
1
1 6
K e y 2
K e y 2
3
1 8
K o u t2
K e y 1
2
1 5
K o u t1
K e y 1
2
1 5
K e y 3
K e y 3
4
1 7
K o u t3
K e y 2
3
1 4
K o u t2
K e y 4
3
1 4
N C
K e y 4
5
1 6
K o u t4
K e y 3
4
1 3
K o u t3
K e y 5
4
1 3
N C
K e y 5
6
1 5
K o u t5
K e y 4
5
1 2
K o u t4
K e y 6
5
1 2
N C
K e y 6
7
1 4
K o u t6
K e y 5
6
1 1
K o u t5
K e y 7
6
1 1
S C D
K e y 7
8
1 3
K o u t7
C re f
7
1 0
V D D
C re f
7
1 0
V D D
C re f
9
1 2
V D D
V S S
8
9
O K W
N C
8
9
V S S
V S S
1 0
1 1
O K W
B S 8 0 6 C
1 6 N S O P -A
B S 8 0 8 C
1 6 N S O P -A
B S 8 0 8 C
2 0 S O P -A /S S O P -A
Pin Description
The pins in the following table are common to all devices.
Pin Name
Key0~Keyn
Kout0~Koutn
I/O
Input
Description
Touch key n input. These pins are connected to the external touch key.
Output Touch key n output pin.
Touch key reference capacitor input - value range of 0pF to 10pF - higher capacitance values result in higher sensitivities.
Cref
Input
VSS
¾
Negative power supply, ground
VDD
¾
Positive power supply
The following table shows device specific pins.
Pin Name
I/O
Device
Description
OKW
Input
BS804C
BS806C
BS808C
Selects One-key State or Any-key State.
Pin condition is read during power-up. The logic status of this pin must not be
changed after power-on. After power-on this pin¢s function can be overridden
by a serial command on relevant devices. Pin connected to an internal
pull-high resistor. Internal circuitry ensures that this pull high resistor will not
consume current even if the input is low.
Open: One-key State using key0 only
Low: Any-Key State
SCD
Input/
Output
BS804C
BS808C
Serial bus pin used to communicate with an external MCU. The external MCU
can read the BS804C or BS808C touch key status and also send commands
to the device via this pin.
BS801C
BS802C
BS804C
Selects Key Output Type
Pin condition is read during power-up. The logic status of this pin must not be
changed after power-on. After power-on this pin¢s function can be overridden
by a serial command on relevant devices. Pin connected to an internal
pull-high resistor. Internal circuitry ensures that this pull high resistor will not
consume current even if the input is low.
Open: Level-Hold output
Low: Toggle output
LHF
Note:
Input
It is important that the logic level of the OKW and LHF pins do not change state after power-on.
Rev. 1.00
2
December 2, 2009
BS801C/02C/04C/06C/08C
Absolute Maximum Ratings
Supply Voltage ..........................VSS-0.3V to VSS+6.0V
Storage Temperature ...........................-50°C to 125°C
Input Voltage .............................VSS-0.3V to VDD+0.3V
IOL Total ................................................................80mA
Total Power Dissipation .....................................500mW
Operating Temperature ..........................-40°C to 85°C
IOH Total..............................................................-80mA
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
BS801C
Ta=25°C
Test Conditions
Symbol
Parameter
VDD
Conditions
¾
Min.
Typ.
Max.
Unit
2.2
¾
5.5
V
¾
3
6
mA
VDD
Operating Voltage
¾
IDD
Operating Current
3V
VIH
Input High Voltage
¾
¾
0.7VDD
¾
VDD
V
VIL
Input Low Voltage
¾
¾
0
¾
0.3VDD
V
IOL
Sink Current
3V
VOL=0.1VDD
4
8
¾
mA
RPH
Pull-high Resistance
3V
¾
20
60
100
kW
No load
BS802C
Ta=25°C
Test Conditions
Symbol
Parameter
VDD
Conditions
¾
Min.
Typ.
Max.
Unit
2.2
¾
5.5
V
¾
5
10
mA
VDD
Operating Voltage
¾
IDD
Operating Current
3V
VIH
Input High Voltage
¾
¾
0.7VDD
¾
VDD
V
VIL
Input Low Voltage
¾
¾
0
¾
0.3VDD
V
IOL
Sink Current
3V
VOL=0.1VDD
4
8
¾
mA
RPH
Pull-high Resistance
3V
¾
20
60
100
kW
Rev. 1.00
No load
3
December 2, 2009
BS801C/02C/04C/06C/08C
BS804C
Symbol
Ta=25°C
Parameter
Test Conditions
VDD
Conditions
¾
Min.
Typ.
Max.
Unit
2.2
¾
5.5
V
¾
3.0
6.0
mA
8.0
16.0
mA
VDD
Operating Voltage
¾
IDD1
Operating Current One-key State
3V
No load
IDD2
Operating Current Any-Key State
3V
No load
VIH
Input High Voltage
¾
¾
0.7VDD
¾
VDD
V
VIL
Input Low Voltage
¾
¾
0
¾
0.3VDD
V
IOL
Sink Current
3V
4
8
¾
mA
RPH
Pull-high Resistance
3V
20
60
100
kW
VOL=0.1VDD
¾
BS806C
Symbol
Ta=25°C
Parameter
Test Conditions
VDD
Conditions
¾
Min.
Typ.
Max.
Unit
2.2
¾
5.5
V
¾
3.0
6.0
mA
14.0
28.0
mA
VDD
Operating Voltage
¾
IDD1
Operating Current One-key State
3V
No load
IDD2
Operating Current Any-Key State
3V
No load
VIH
Input High Voltage
¾
¾
0.7VDD
¾
VDD
V
VIL
Input Low Voltage
¾
¾
0
¾
0.3VDD
V
IOL
Sink Current
3V
4
8
¾
mA
RPH
Pull-high Resistance
3V
20
60
100
kW
VOL=0.1VDD
¾
BS808C
Symbol
Ta=25°C
Parameter
Test Conditions
VDD
Conditions
¾
VDD
Operating Voltage
¾
IDD1
Operating Current One-key State
3V
No load
IDD2
Operating Current Any-Key State
3V
No load
VIH
Input High Voltage
¾
VIL
Input Low Voltage
¾
IOL
Sink Current
3V
RPH
Pull-high Resistance
3V
Rev. 1.00
Typ.
Max.
Unit
2.2
¾
5.5
V
¾
3.0
6.0
mA
18.0
36.0
mA
¾
0.7VDD
¾
VDD
V
¾
0
¾
0.3VDD
V
VOL=0.1VDD
¾
4
Min.
4
8
¾
mA
20
60
100
kW
December 2, 2009
BS801C/02C/04C/06C/08C
A.C. Characteristics
Ta=25°C
Test Conditions
Symbol
Parameter
VDD
Conditions
Min.
Typ.
Max.
Unit
fSCD
SCD Clock
3V
¾
10.4
13.0
15.6
kHz
fKRT
Key Response Time
3V
¾
75
100
125
ms
tKH
Maximum Key Hold Time
3V
¾
30
40
50
s
tCAL
Auto-Calibration Period
3V
¾
1.8
2.5
3.2
s
Functional Description
actions are detected on any Key input, then the device
will revert to the One-key State.
Introduction
This range of BS80xC touch key devices offer an easy
and reliable means of implementing touch switch functions in a range of applications. A single external capacitor is the only external component required for most
applications while a single line serial bus offers convenient communication with an external MCU.
The advantage of choosing the One-key State over the
Any-key State is that it will result in lower power consumption as only one key remains active. The logic status of the OKW pin is only read when the device powers
up and will determine the operating state of the device
after power-on. For the BS804C and BS808C devices,
this power-on state can be overridden later by sending
the appropriate command to the device on its SCD pin.
The logic level on the OKW pin must not be changed after power on. Internal circuitry ensures that the internal
pull-high resistor on the OKW pin will not consume current after power-on.
Device Operation State
There are two operating states known as the One-key
State and the Any-key State. Devices with an OKW pin,
namely the BS804C, BS806C and BS808C, can operate in either the One-key State or the Any-key State.
When these devices are powered up, the condition of
the OKW pin will be automatically read. If the OKW pin is
low then the device will enter the Any-key State and if
the pin is floating the device will enter the One-key
State. As the BS801C and BS802C devices do not have
an OKW pin they will always operate in the Any-key
State.
OKW Open
OKW Low
BS804C
BS806C
BS808C
One-key
State
Any-key
State
The logic status of the OKW pin is read when the device
powers up. The logic level on this pin must not be
changed after power on. Internal circuitry ensures that
the internal pull-high resistor on the OKW pin will not
consume current.
In the Any-key State, as the name suggests all of the
Keyn touch inputs will be active, however in the One-key
State only Key0 will be active. After power up if the
BS804C, BS806C and BS808C device enters the
One-key State then touching any Key other than Key0
will have no effect. If a touch action is however detected
on Key0, then the device will enter the Any-key State
and operate normally with all keys active. However,
within a timer period of around 20 seconds, if no touch
Rev. 1.00
Part No.
5
Part No.
Any-key On Time in
One-key State
BS804C
BS806C
BS808C
Approx 20 secs
December 2, 2009
BS801C/02C/04C/06C/08C
Touch Key Outputs
mands to the touch key device. The serial interface allows three functions to be implemented, two are initiated
by the external MCU and one by the BS80xC.
All Kout pins have NMOS structures to allow easy interfacing to external devices with different operating voltages. The BS801C, BS802 and BS804C devices can
have their outputs configured to operate with either
Level-Hold or Toggle type. The output type is determined by the status of the LHF pin which is read during
power-on. The logic level on this pin must not be
changed after power on. Internal circuitry ensures that
the internal pull-high resistor on the LHF pin will not
consume current. The BS806C and BS808C only have
Level-Hold output types.
Part No.
LHF
BS801C
BS802C
BS804C
Open
BS806C
BS808C
¾
Low
SCD Command
Direction
Wake-up or Interrupt
MCU
BS804C/BS808C ® MCU
Step1: MCU send command
MCU ® BS804C/BS808C
Read Touch Key
Status
Step2: MCU read key status
BS804C/BS808C ® MCU
Send command to
BS804C/BS808C
Kout Type
MCU ® BS804C/BS808C
SCD Function Summary
Level-Hold
· BS804C/BS808C Wakes-up or Interrupts MCU
Toggle
When any of the touch keys change state, a pulse will
be generated by the BS804C/BS808C device which
can be used to wake up or to interrupt an external
MCU. The MCU must ensure that its pin connected to
the SCD pin is setup as an input to receive this pulse.
The pulse width generated by the device is equal to a
tSCD/2 period where tSCD is about 76ms.
Level-Hold
Serial Interface - SCD
Both the BS804C and BS808C are equipped with a single line serial interface on the SCD pin, allowing for easy
interfacing to an external MCU.
tS
This single line interface allows communication in both
directions between the touch key device and the external
MCU. Using this interface, the external MCU can serially
read the status of the touch keys at any time. The Serial
interface also allows the external MCU to send com-
B S 8 0 4 C
B S 8 0 8 C
C D
I/P
O /P
S C D
/2
IN T
o r
I/O
M C U
Wake-up/Interrupt Pulse to MCU
P o w e r O n
O n e -K e y S ta te
Y
O K W
O K W
O p e n ?
N
K e y 0 O n ?
lo w
A n y -K e y S ta te
N
A n y -K e y
O n ?
R e tu rn to
O n e -K e y S ta te
E n a b le K e y 0 O u tp u t
N
Y
E n a b le K e y n O u tp u t
Y
A n y -K e y o n
w ith in 2 0 s e c . ?
N
Y
E n a b le K e y n O u tp u t
BS804C, BS806C and BS808C Operating Flow
Rev. 1.00
6
December 2, 2009
BS801C/02C/04C/06C/08C
· MCU reads the touch key status
command from the MCU. Any command sent to the
device from the MCU will override the original power
on configuration setup.
The MCU can send a command to the BS804C/
BS808C device to request the touch key status. The
protocol for reading the touch key status is as follows:
¨
The external MCU takes control of the SCD line and
first sends three rising edge pulses or more to the
BS804C/BS808C within a time of about 152ms.
¨
The MCU then changes its I/O pin to an input.
¨
The BS804C/BS808C device will then pull the SCD
line low, then high, the timings are given by synchronise period. This allows the MCU to synchronise itself for the data transfer.
¨
N u m b e r o f p u ls e s
w ith in 4 tS C D
s e ts o p e r a tin g m o d e
S C D L in e
fro m M C U
For the BS804C, the data format is D0~D3.
-
For the BS808C, the data format is D0~D7.
¨
The MCU can then read the key status taking care
to read the data in the centre of the transmitted data
pulse.
¨
After the last data bit is transferred the BS804C/
BS808C device will return its SCD pin to an input
state.
4 tS
N o te : T A > 8 tS
C D
C D
P e r io d s
SCD Device Setup
The desired Operating Mode to be setup depends
upon the number of pulses received by BS804C/
BS808C within a time period, 4 tSCD, as shown in the
table. After the programming clock cycles have been
transmitted and the SCD line returns high, the device
will return to normal operation.
Clock Pulses
The timings associated with the above protocol can be
described in multiples of the SCD clock periods. The
SCD clock period is about about 76ms.
A certain time is required for the MCU to transmit three
or more pulses to inform the device that it desires to
read the key status. After this time has elapsed the device will then transmit the data bits, D0~Dn.
Operating Mode
0~2
Set by external pin
3~6
For test purposes
7~10
One-Key state
11~14
For test purposes
>15
Any-Key state
BS804C and BS808C SCD Commands
Note that the MCU must transmits these pulses within 4
tSCD.
Device
Time
BS804C
22 tSCD
Maximum Key On Duration Time
BS808C
38 tSCD
To minimise the possibility of unintentional switch detections, such as undesired objects covering the sense
electrodes, the devices includes a Maximum Key-On
duration time function. To implement this function the
devices include an internal timer, which starts running
after each switch detection. If the key on time of a touch
key exceeds a value of about 40 seconds, then the device will be reset to its power-on condition and initiate a
new auto calibration. The output will then remain inactive until the next switch detection.
Key Status Read Total Time
Each bit of transmitted data corresponds directly to a
touch input key. Therefore the status of touch key Key0
is represented by D0, Key1 by D1 and so on. A ²low² bit
means that a touch has been detected, a ²high² bit
means no touch has been detected.
Pin
Data Bit
Key0
D0
Key1
D1
:
:
:
:
Keyn
Dn
Dn Value
Auto-calibration Function
1: Key Off
The devices include a full auto-calibration function
which will be initiated after the device is powered-on. In
addition to the power-on calibration, if no switch detection has been made for more than about 2.5 seconds
then a further calibration procedure will be carried out.
The calibration is applied independently to each channel on the devices. By implementing this feature,
changes in the touch key environmental conditions are
automatically catered for dynamically.
0: Key On
· MCU sends commands to BS804C/BS808C device
The MCU can send commands along the SCD line to
setup the device in different Operating State. To do
this the externally connected MCU takes control of the
SCD line, first forcing it low and holding it low for a
time of greater than 8 tSCD cycles. This action will temporarily disable the device and enable it to receive the
Rev. 1.00
n
T A
The BS804C/BS808C device will then transmit its
key status, given by D0~Dn
-
2
1
7
December 2, 2009
BS801C/02C/04C/06C/08C
M C U a s In p u t,
d e v ic e a s In p u t
M C U a s O u tp u t,
d e v ic e a s In p u t
M C U
a s In p u t, d e v ic e a s O u tp u t
S y n c h r o n is e
S C D
D 0
2 tS
C D
tS
C D
L e a d C lo c k
2 tS
2 tS
C D
C D
tS
2 tS
C D
D 1
tS
C D
C D
tS
C D
2 tS
D n
C D
tS
C D
K e y S ta tu s
S y n c P e r io d
D e v ic e
T o u c h S w itc h D a ta L e n g th
D a ta F o rm a t
B S 8 0 4 C
4 b its
D 0 ~ D 3
B S 8 0 8 C
8 b its
D 0 ~ D 7
SCD Pin Touch Key Status Request
Sensitivity Adjustment
· Touch key pad size
The sensitivity of the switch is a very important consideration in most applications whose requirements will vary
according to the user application. The user should
therefore be aware of the factors which will affect the
overall sensitivity of their touch key application. Factors
to take into consideration include the electrode size and
the capacitance of the connection lines from the electrode to the BS80xC device. Therefore the sensitivity
will vary according to the actual PCB layout and design.
An external capacitor, Cs, connected to the Cref pin, is
used to set the overall sensitivity of all pins. Some of the
most important factors affecting sensitivity are the following:
Larger touch key sizes will increase sensitivity and of
course vice-versa, small electrode sizes will decrease
sensitivity.
· Touch key pad insulating panel thickness
A thinner panel will result in higher sensitivity and of
course thicker panels will result in a lower sensitivities.
· Touch key pad insulating panel material
The choice of the dielectric material for the panel will influence the sensitivity. Materials with higher dielectric
constants will result in higher sensitivities and lower dielectric constants will result in lower sensitivities.
Touch
Key
· Cref capacitor value - Cs
The purpose of the Cs capacitor is to allow for adjustment of touch key sensitivity and power noise rejection. The optimal choice of sensitivity and power noise
rejection will be obtained when the value of the Cs capacitor is equivalent to the touch pad capacitance,
however the value can still be changed to obtain the
required sensitivity value. Higher Cs values will result
in higher levels of sensitivity. Recommended values
for Cs are between 0pF and 10pF.
Rev. 1.00
Key
Cs
0pF~
10pF
8
Cref
December 2, 2009
BS801C/02C/04C/06C/08C
Application Circuit
VDD
Touch
Key
Key
VDD
0.1uF
Cref
Cs
0pF~
10pF
R
VDD
Kout
LHF
VSS
BS801C
VDD
Touch
Key0
Key0
Touch
Key1
Key1
VDD
0.1uF
R
VDD
Cref
Cs
0pF~
10pF
Kout0
R
VDD
LHF
Kout1
VSS
BS802C
VDD
Touch
Key0
.
.
.
Touch
Key3
Cs
0pF~
10pF
Key0
.
.
.
Key3
VDD
Cref
SCD
0.1uF
MCU
INTB or
Port
R
VDD
Kout0
LHF
OKW
.
.
.
Kout3
R
VDD
VSS
BS804C
Note:
If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the application circuit is not required.
Rev. 1.00
9
December 2, 2009
BS801C/02C/04C/06C/08C
VDD
Touch
Key0
.
.
.
Touch
Key5
Key0
.
.
.
VDD
0.1uF
R
Key5
Cref
Cs
0pF~
10pF
VDD
Kout0
.
.
.
R
VDD
Kout5
OKW
VSS
BS806C
VDD
Touch
Key0
.
.
.
Touch
Key7
Key0
.
.
.
Key7
VDD
MCU
0.1uF
INTB or
Port
SCD
R
Cs
0pF~
10pF
VDD
Cref
Kout0
.
.
OKW
R
VDD
Kout7
VSS
BS808C
Note:
If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the application circuit is not required.
Rev. 1.00
10
December 2, 2009
BS801C/02C/04C/06C/08C
Package Information
8-pin SOP (150mil) Outline Dimensions
5
8
A
B
4
1
C
C '
G
H
D
E
a
F
· MS-012
Symbol
Rev. 1.00
Dimensions in mil
Min.
Nom.
Max.
A
228
¾
244
B
150
¾
157
C
12
¾
20
C¢
188
¾
197
D
¾
¾
69
E
¾
50
¾
F
4
¾
10
G
16
¾
50
H
7
¾
10
a
0°
¾
8°
11
December 2, 2009
BS801C/02C/04C/06C/08C
16-pin NSOP (150mil) Outline Dimensions
1 6
A
9
B
8
1
C
C '
G
H
D
E
a
F
· MS-012
Symbol
Rev. 1.00
Dimensions in mil
Min.
Nom.
Max.
A
228
¾
244
B
150
¾
157
C
12
¾
20
C¢
386
¾
394
D
¾
¾
69
E
¾
50
¾
F
4
¾
10
G
16
¾
50
H
7
¾
10
a
0°
¾
8°
12
December 2, 2009
BS801C/02C/04C/06C/08C
20-pin SOP (300mil) Outline Dimensions
1 1
2 0
A
B
1
1 0
C
C '
G
H
D
E
a
F
· MS-013
Symbol
Rev. 1.00
Dimensions in mil
Min.
Nom.
Max.
A
393
¾
419
B
256
¾
300
C
12
¾
20
C¢
496
¾
512
D
¾
¾
104
E
¾
50
¾
F
4
¾
12
G
16
¾
50
H
8
¾
13
a
0°
¾
8°
13
December 2, 2009
BS801C/02C/04C/06C/08C
20-pin SSOP (150mil) Outline Dimensions
1 1
2 0
A
B
1
1 0
C
C '
G
H
D
E
Symbol
Rev. 1.00
a
F
Dimensions in mil
Min.
Nom.
Max.
A
228
¾
244
B
150
¾
158
C
8
¾
12
C¢
335
¾
347
D
49
¾
65
E
¾
25
¾
F
4
¾
10
G
15
¾
50
H
7
¾
10
a
0°
¾
8°
14
December 2, 2009
BS801C/02C/04C/06C/08C
6-pin SOT23-6 Outline Dimensions
D
C
L
H
E
q
e
A
A 2
b
Symbol
Dimensions in mm
Min.
Nom.
Max.
1.0
¾
1.3
A1
¾
¾
0.1
A2
0.7
¾
0.9
A
Rev. 1.00
A 1
b
0.35
¾
0.50
C
0.1
¾
0.25
D
2.7
¾
3.1
E
1.4
¾
1.8
e
¾
1.9
¾
H
2.6
¾
3.0
L
0.37
¾
¾
q
1°
¾
9°
15
December 2, 2009
BS801C/02C/04C/06C/08C
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 8N
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
13.0
+0.5/-0.2
2.0±0.5
12.8
+0.3/-0.2
18.2±0.2
SOP 16N (150mil)
Symbol
Description
A
Reel Outer Diameter
B
Reel Inner Diameter
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 1.00
Dimensions in mm
330.0±1.0
100.0±1.5
13.0
+0.5/-0.2
2.0±0.5
16.8
+0.3/-0.2
22.2±0.2
16
December 2, 2009
BS801C/02C/04C/06C/08C
SOP 20W
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
13.0
+0.5/-0.2
2.0±0.5
24.8
+0.3/-0.2
30.2±0.2
SSOP 20S (150mil)
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
13.0
+0.5/-0.2
2.0±0.5
16.8
+0.3/-0.2
22.2±0.2
SOT23-6
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
178.0±1.0
B
Reel Inner Diameter
62.0±1.0
C
Spindle Hole Diameter
13.0±0.2
D
Key Slit Width
2.50±0.25
T1
Space Between Flange
8.4
T2
Reel Thickness
11.4
Rev. 1.00
17
+1.5/-0.0
+1.5/-0.0
December 2, 2009
BS801C/02C/04C/06C/08C
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
C
D 1
B 0
P
K 0
A 0
R e e l H o le
IC
p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
SOP 8N
Symbol
Description
Dimensions in mm
12.0
+0.3/-0.1
W
Carrier Tape Width
P
Cavity Pitch
8.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
5.5±0.1
D
Perforation Diameter
D1
Cavity Hole Diameter
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.4±0.1
B0
Cavity Width
5.2±0.1
K0
Cavity Depth
2.1±0.1
t
Carrier Tape Thickness
C
Cover Tape Width
1.55±0.1
1.50
+0.25/-0.00
0.30±0.05
9.3±0.1
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16.0±0.3
P
Cavity Pitch
8.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
D
Perforation Diameter
1.55
+0.10/-0.00
D1
Cavity Hole Diameter
1.50
+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.5±0.1
B0
Cavity Width
10.3±0.1
K0
Cavity Depth
2.1±0.1
7.5±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.00
18
December 2, 2009
BS801C/02C/04C/06C/08C
SOP 20W
Symbol
Description
Dimensions in mm
24.0
+0.3/-0.1
W
Carrier Tape Width
P
Cavity Pitch
12.0±0.1
E
Perforation Position
1.75±0.10
F
Cavity to Perforation (Width Direction)
11.5±0.1
D
Perforation Diameter
1.5
D1
Cavity Hole Diameter
1.50
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.8±0.1
B0
Cavity Width
13.3±0.1
K0
Cavity Depth
3.2±0.1
+0.1/-0.0
+0.25/-0.00
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
21.3±0.1
SSOP 20S (150mil)
Symbol
Description
Dimensions in mm
16.0
+0.3/-0.1
W
Carrier Tape Width
P
Cavity Pitch
E
Perforation Position
F
Cavity to Perforation (Width Direction)
D
Perforation Diameter
1.5
D1
Cavity Hole Diameter
1.50
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.5±0.1
B0
Cavity Width
9.0±0.1
K0
Cavity Depth
2.3±0.1
8.0±0.1
1.75±0.10
7.5±0.1
+0.1/-0.0
+0.25/-0.00
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.00
19
December 2, 2009
BS801C/02C/04C/06C/08C
SOT23-6
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
8.0±0.3
P
Cavity Pitch
4.0±0.1
E
Perforation Position
1.75±0.10
F
Cavity to Perforation (Width Direction)
3.50±0.05
D
Perforation Diameter
1.5
+0.1/-0.0
D1
Cavity Hole Diameter
1.5
+0.1/-0.0
P0
Perforation Pitch
P1
Cavity to Perforation (Length Direction)
2.00±0.05
A0
Cavity Length
3.15±0.10
B0
Cavity Width
3.2±0.1
K0
Cavity Depth
1.4±0.1
t
Carrier Tape Thickness
C
Cover Tape Width
Rev. 1.00
4.0±0.1
0.20±0.03
5.3±0.1
20
December 2, 2009
BS801C/02C/04C/06C/08C
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor (China) Inc. (Dongguan Sales Office)
Building No. 10, Xinzhu Court, (No. 1 Headquarters), 4 Cuizhu Road, Songshan Lake, Dongguan, China 523808
Tel: 86-769-2626-1300
Fax: 86-769-2626-1311
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538, USA
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright Ó 2009 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.00
21
December 2, 2009
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